JPH0672275U - Curing device - Google Patents

Abstract

(57) [Summary] [Object] The present invention aims to prevent a decrease in the concentration of nitrogen gas in the apparatus. [Structure] An upper curtain portion (30A) having a lower end hanging downward from a substrate transfer level on the side of a transfer port (28) for transferring a printed circuit board (2) to a downstream side device, and an upper end thereof above the substrate transfer level. Lower curtain part (31
With A), leakage of nitrogen gas and entry of outside air are prevented.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention heats the printed circuit board supplied from the upstream side device by the transfer means and transfers it to the downstream side device to heat the substrate in a nitrogen gas atmosphere to bond the electronic components mounted on the substrate. Soldering is used to prevent leakage of the nitrogen gas to the outside of the equipment and decrease of the nitrogen gas concentration due to the ingress of outside air. The present invention relates to a curing device provided with a curtain portion and a lower curtain portion.

[0002]

[Prior art]

 Generally, the concentration of nitrogen gas in the curing apparatus is lowered by nitrogen gas leaking from the inlet and outlet of the substrate during operation, or the outside air entering. Therefore, it has been proposed to provide an upper curtain portion and a lower curtain portion in each of the receiving port and the delivering port, leaving a space through which a substrate can pass.

However, the curtain must be provided with a space left so that the substrate does not hit the substrate in order to prevent the curtain from hitting the substrate and the components already mounted on the substrate from being displaced. There was a decline.

[0004]

[Problems to be solved by the device]

 Therefore, it is an object of the present invention to prevent the concentration of nitrogen gas in the device from decreasing.

[0005]

[Means for Solving the Problems]

 In view of this, the present invention heats the printed circuit board supplied from the upstream side device by the transfer means and transfers it to the downstream side device to heat the substrate in a nitrogen gas atmosphere so that the electronic components mounted on the substrate are provided. Adhesive or soldering is used to prevent the nitrogen gas from leaking out of the equipment and the outside air from entering the upper curtain and lower curtain, leaving a space for the substrate to pass through at each of the substrate's inlet and outlet. And a lower end of the upper curtain part on the delivery port side is hung below the substrate transfer level and an upper end of the lower curtain part is erected above the substrate transfer level. The upper curtain part and the lower curtain part are installed so as not to form a space.

[0006]

[Action]

 With the above configuration, the upper curtain part whose lower end hangs below the substrate transfer level at the delivery port side of the substrate, and the lower curtain part which has its upper end erected above the substrate transfer level are used to generate nitrogen gas. Leakage and entry of outside air are prevented.

[0007]

【Example】

 Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. (1) is a curing apparatus main body, which is composed of a preliminary heating zone (P), a main heating zone (H) and a cooling zone (C). In the pre-heating zone (P) and the main heating zone (H), a plurality of heater devices (4) are installed above and below with a conveyer (3) for conveying the printed circuit board (2) interposed therebetween. In the heater device (4), a rectangular hole (7) is opened in the upper surface of a box (6) on which a heater (5) is laid, and a fan (8) is provided above the hole (7). Is installed, and a cover (9) is provided so as to cover above the fan (8).

Further, a set of cooling devices (11) is installed in the upper and lower parts of the cooling zone (C). In the cooling device (11), a rectangular hole (15) is opened in the upper surface of a box (14) having an outlet (13) in the bottom surface (12), and a fan (1) is provided above the hole (15). 6) is installed, and a cover (17) is provided so as to cover above the fan (16), and the cover (17) is an opening serving as a suction port (18) on the side surface of the box (14). Is bent so as to form. The inlet (18) is flush with the outlet (13).

Reference numeral (20) denotes a nitrogen gas supply nozzle installed in a desired box body (6), which is connected to a nitrogen gas supply source (not shown). The conveyor (3) is a pair of conveyors having claws (not shown) that support the side surface of the substrate (2), and the substrate (via a drive sprocket (22) and a driven sprocket (23) by a drive source (not shown). 2) is conveyed while being placed. Although not shown, a solder paste is applied to the substrate (2) by a screen printing machine, and an ultraviolet curing adhesive is applied by an adhesive applying device, on which a chip-shaped electronic component is temporarily fixed, for example. There is.

(25) and (26) are inside the curing apparatus main body (1) from the nitrogen gas supply nozzle (20) immediately downstream of the receiving port (27) of the substrate and immediately upstream of the receiving port (28). This is a labyrinth zone provided to prevent the leakage of nitrogen gas supplied to the plant and the ingress of outside air. The labyrinth zone (25) is an upper curtain part (made of a heat-resistant film that is hung from above so as to surround the conveyor (3) leaving a space through which the substrate (2) conveyed by the conveyor (3) can pass. 30) and an appropriate number of lower curtain portions (31) provided upright from below, the substrate (2) is transported without hitting the curtain portions (30) and (31).

Further, the labyrinth zone (26) does not form a space through which the upper curtain portion (30A) and the lower curtain portion (31A) cannot pass without coming into contact with the substrate (2) conveyed by the conveyor (3). Thus, an appropriate number is provided. That is, the upper curtain part (30A) is hung so that its lower end is lower than the carrying level by the conveyor (3), and the lower curtain part (31A) is erected so that its upper end is above the carrying level. They are installed alternately at predetermined intervals.

On the side of the receiving port (27), the component is only temporarily fixed to the substrate (2) with an adhesive or solder paste, so that when the component hits the curtain part (30), (31) Since there is a fear that the curtains will be displaced, the curtains (30), (31) are installed leaving a space through which the curtains (30), (31) can pass without coming into contact with the substrate (2). ing.

At the delivery port (28) side, the adhesive or solder paste has already hardened and the component has been adhered to the substrate (2), so that the component can be placed on the curtain (30A) and (31A). Since there is no risk of misalignment, it is not necessary to form a space. The lower end of the upper curtain part (30A) and the upper end of the lower curtain part (31A) are installed so as to exceed the transfer level.

The operation will be described below. Nitrogen gas is supplied from the nitrogen gas supply nozzle (20) to the inside of the curing apparatus main body (1) to create a nitrogen gas atmosphere. The substrate (2) supplied from the upstream device is the lower end of the upper curtain part (30) and the upper end of the lower curtain part (31) of the labyrinth zone (25) provided immediately downstream of the receiving port (27). The curtain units (30) and (31) are sequentially conveyed in the curing apparatus main body (1) via a conveyor (3) without contacting the curtain units (30) and (31) with a space therebetween. At this time, the substrate (2) is heated in the preheating zone (P) and the main heating zone (H) to melt the solder paste. Subsequently, the components are bonded to the substrate (2) by being cooled in the cooling zone (C).

The substrate (2) has an upper curtain portion (30A) in which the lower end of a labyrinth zone (26) provided immediately upstream of the delivery port (28) is hung below the substrate transfer level. , The upper curtain portion (30 A) (the back surface of the substrate (2) while preventing the leakage of nitrogen gas, the ingress of outside air, etc. by the lower curtain portion (31 A) whose upper end is erected above the substrate transfer level. Also, when the parts are mounted, the parts are transferred to the outside of the curing apparatus main body (1) while applying the parts to the upper curtain part (30A) and the lower curtain part (31A). At this time, since the solder paste has already hardened and the component has been bonded to the substrate (2), the component will not be displaced even if the curtain portions (30A) and (31A) hit.

The upper curtain section (30) (30A) and the lower curtain section (31) (31A) may be provided in the receiving port (27) and the receiving port (28), respectively, one above and one below.

[0017]

[Effect of device]

 As described above, according to the present invention, it is possible to prevent the concentration of nitrogen gas from decreasing.

[Brief description of drawings]

FIG. 1 is a sectional view of a curing device. (1) Curing device main body (2) Printed circuit board (3) Conveyor (20) Nitrogen gas supply nozzle (25) Labyrinth zone (26) Labyrinth zone (27) Reception port (28) Delivery port (30) Upper curtain part ( 30A) Upper curtain part (31) Lower curtain part (31A) Lower curtain part

Claims (1)

[Scope of utility model registration request] 1. A printed circuit board supplied from an upstream side device is heated by a transfer means while being transferred to a downstream side device to heat the substrate in a nitrogen gas atmosphere to bond electronic components mounted on the substrate. Soldering is used to prevent leakage of the nitrogen gas to the outside of the equipment and decrease in nitrogen gas concentration due to ingress of outside air, leaving a space through which the board can pass through at the board inlet and the board transfer port. In a curing device having a curtain portion and a lower curtain portion, a lower end of the upper curtain portion on the delivery port side is hung below a substrate transfer level and an upper end of the lower curtain portion is above a substrate transfer level. A curing device characterized in that an upper curtain part and a lower curtain part are installed so as to stand upright on each other so as not to form a space.