JPH0671657A - Method and apparatus for removing optical disk base plate - Google Patents

Abstract

PURPOSE:To shorten the time to remove an optical disk base plate and to strengthen the adsorption force required to remove the plate in the method and apparatus for removing the optical disk base plate. CONSTITUTION:A robot moves a handling base plate 10 close to an optical disk base plate P so that the two plates face each other. Compressed air A is fed between a movable mold 1 and the optical disk base plate P, and an ejector pin 2 presses the optical disk base plate P to both seal rings 11, 12 of the handling base plate 10. Thus both seal rings 11, 12 contact the optical disk base plate P excluding its signal recording area Pf. The air Al in the space corresponding to the signal recording area Pf, that is a space S, is discharged from a discharge port 14, so that the handling base plate 10 adsorbs the optical disk base plate P. In this state, a robot moves the handling base plate 10 to the right to remove the optical disk plate P from the movable mold 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for taking out an optical disk substrate made of resin from a mold.

[0002]

2. Description of the Related Art An optical disk substrate is injection-molded by supplying a molten resin to a cavity formed between a fixed mold and a movable mold, cooling and solidifying the resin, and then separating the movable mold from the fixed mold. Manufactured by. Conventionally, the optical disk substrate has been taken out from the movable mold as follows.

In FIG. 2, the optical disc substrate P has a through hole Pa in the center, and a signal recording area Pf is formed in a portion other than the outer peripheral portion Po and the inner peripheral portion Pi. The molded optical disk substrate P includes a movable mold 1 and an optical disk substrate P.
Pressed by the pressurized air A supplied between and the projecting pin 2 provided on the movable mold 1, the abutment pad 3 is brought into contact and the negative pressure is applied. The suction pad 3 is attached to a hand of a robot (not shown), and the optical disk substrate P
Is taken out of the movable mold 1.

By the way, as shown in FIG. 3, a reflective film C is vapor-deposited on the signal recording area Pf of the optical disk substrate P, and the laser beam B incident on the optical disk substrate P is reflected by the reflective film C. Therefore, the signal recording area Pf
And if a small foreign matter adheres to the back surface of the device, a read or write error may occur. Therefore, conventionally, pits and grooves are not formed in FIG.
The suction pad 3 is in contact with the inner peripheral portion Pi of the.

[0005]

However, in recent years, in consideration of portability, optical discs tend to be downsized,
Optical discs smaller than 3.5 inches, for example 2.5 inches, have been developed, and further development and commercialization of optical discs of about 2 inches or 1.5 inches are expected. In this way, when the optical disc is made small, the signal recording area Pf
Area becomes smaller and the storage capacity becomes smaller. Therefore, it is necessary to expand the signal recording area Pf toward the inner peripheral portion Pi and the outer peripheral portion Po of the optical disc substrate P to secure the storage capacity of the optical disc, which reduces the adsorption area of the adsorption pad 3.

As described above, when the suction area is small, the suction pad 3 is used for the purpose of obtaining a large suction force with a small suction area.
Since it is necessary to increase the negative pressure of, it takes a long time until the negative pressure becomes high, and therefore the take-out time is long. Therefore, the molding cycle time becomes long and the productivity is lowered.

Further, even if the negative pressure of about 0.3 atm is conventionally set to about 0.1 atm, the attracting force does not become so large even though it takes time, so that ,
The optical disk substrate P may be dropped.

The present invention has been made in view of the above problems, and it is an object of the present invention to provide a method and apparatus for taking out an optical disk substrate, in which the taking-out time is short and the attraction force at the time of taking-out is large.

[0009]

In order to achieve the above object, the method of the present invention is such that a seal member is brought into contact with a portion other than a signal recording area of an optical disk substrate so that air in a portion corresponding to the signal recording area is aerated. Is ejected, the optical disc substrate is adsorbed and the optical disc substrate is taken out.

Further, according to the present invention, the inner and outer peripheral portions of the signal recording area of the optical disk substrate are
The first and second seal rings that are in contact with each other are fixed to the optical disk substrate, and a discharge hole for discharging air is opened in the space surrounded by the pair of seal rings.

[0011]

According to the present invention, since the seal member is brought into contact with the portion other than the signal recording area to discharge the air in the portion corresponding to the wide signal recording area, the area where the negative pressure acts becomes remarkably large.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1A, a stamper 5 is fixed to a movable mold 1 by a mounting mold 4. A cylindrical protruding pin 2 is slidably provided in the center of the movable mold 1 as shown in FIG. A pressure air passage 6 for supplying the pressure air A between the stamper 5 and the optical disk substrate P is provided on the outer circumference of the projecting pin 2.

A disk-shaped handling substrate 10 attached to a robot hand (not shown) faces the optical disc substrate P. The handling substrate 10 has first and second seal rings (seal members) 1
1, 12 are mounted and fixed in the groove 13. The first and second seal rings 11 and 12 are made of, for example, annular silicon rubber, and contact the inner peripheral portion Pi and the outer peripheral portion Po of the signal recording area Pf of the optical disc substrate P, respectively. This pair of seal rings 1
An exhaust hole 14 is opened in the space S surrounded by 1 and 12. The exhaust hole 14 communicates with a vacuum exhaust device (not shown) and exhausts the air A1 in the space S. Note that other configurations are similar to those of the conventional example of FIG. 2, and the same portions or corresponding portions are denoted by the same reference numerals and detailed description thereof will be omitted.

Next, a method of taking out the optical disk substrate P will be described. After molding the optical disk substrate P, the movable mold 1
Is separated from a fixed mold (not shown). Then, as shown in FIG. 1A, the robot makes the handling substrate 10 face the optical disc substrate P so as to approach it. Then, Figure 1
As shown in (b), the pressurized air A is supplied between the movable mold 1 and the optical disc substrate P, and the projecting pin 2 is caused to project so that the optical disc substrate P is sealed by both the seal rings 11 and 12 of the handling substrate 10. Press on. By this pressing, both seal rings 11 and 12 contact the portion of the optical disc substrate P other than the signal recording area Pf. After this pressing, the air corresponding to the signal recording area Pf, that is, the air A in the space S
1 is discharged from the exhaust hole 14. By this ejection, the handling substrate 10 adsorbs the optical disc substrate P, and in this adsorbed state, the robot moves the handling substrate 10 to the right side and takes out the optical disc substrate P from the movable mold 1.

In the above structure, the wide signal recording surface Pf
Since the air A1 in the space S of the portion corresponding to is discharged, the area where negative pressure acts is significantly large. Therefore, a large adsorption force can be obtained at a low pressure. Therefore, since it is not necessary to make the space S have a high negative pressure, the take-out time is shortened and the suction force is increased, so that there is no possibility of dropping the optical disk substrate P.

When the present inventor conducted a test on a 2.5-inch optical disk, it took 3 seconds or more to take out with a conventional suction pad, but with the method of this embodiment,
I was able to take it out in about 1.5 seconds.

[0017]

As described above, according to the present invention, the seal member is brought into contact with a portion other than the signal recording area to expel the air in the portion corresponding to the wide signal recording area. The working area is significantly increased. Therefore, the suction force at the time of taking out becomes large and the taking out time becomes short.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an optical disk substrate take-out device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a conventional optical disk substrate take-out device.

FIG. 3 is an enlarged cross-sectional view of an optical disc.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... (movable) mold, 10 ... Handling substrate, 11 ... 1st seal ring, 12 ... 2nd seal ring, 14 ...
Exhaust holes, A1 ... Air, P ... Optical disk substrate, Pf ... Signal recording area, Pi ... Inner peripheral portion, Po ... Outer peripheral portion, S ... Space.

Claims (2)

[Claims] 1. A method of taking out an optical disk substrate from a mold, wherein a seal member is brought into contact with a portion other than the signal recording area of the optical disk substrate, and air in a portion corresponding to the signal recording area is discharged. Thus, the optical disk substrate take-out method for sucking the optical disk substrate and taking out the optical disk substrate. 2. An optical disk substrate take-out device for taking out an optical disk substrate having a through hole in the center and a signal recording area formed in a portion other than the vicinity of the outer periphery and the inner periphery from a mold, and a handling substrate facing the optical disc substrate. A first seal ring fixed to the handling substrate and contacting an inner peripheral portion of the optical disc substrate with respect to the signal recording region, and a first seal ring fixed to the handling substrate and contacting an outer peripheral portion of the optical disc substrate with respect to the signal recording region. A device for taking out an optical disk substrate having a second seal ring and an exhaust hole which is opened in a space surrounded by the pair of seal rings and discharges air in the space.