JPH0671544A - Grinding abrasive method - Google Patents

Grinding abrasive method

Info

Publication number
JPH0671544A
JPH0671544A JP25064492A JP25064492A JPH0671544A JP H0671544 A JPH0671544 A JP H0671544A JP 25064492 A JP25064492 A JP 25064492A JP 25064492 A JP25064492 A JP 25064492A JP H0671544 A JPH0671544 A JP H0671544A
Authority
JP
Japan
Prior art keywords
grinding
polishing
grindstone
abrasive
wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25064492A
Other languages
Japanese (ja)
Inventor
Manabu Tomitani
学 富谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP25064492A priority Critical patent/JPH0671544A/en
Publication of JPH0671544A publication Critical patent/JPH0671544A/en
Pending legal-status Critical Current

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  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

PURPOSE:To provide a grinding abrasive method in which a working--capacity of the grinding wheel is not lowered at all even if a lot of workpieces are ground in succession. CONSTITUTION:An oxidizing aqueous working fluid 2 is poured on a grinding abrasive wheel 1 made up of using organic high molecular matter as a bonding material, and then grinding and polishing are carried out as grinding this grinding abrasive wheel 1 and a work part 3 jointly. This working fluid 2 consisting of an oxidizing aqueous solution oxidizes a bonding agent of this abrasive wheel 1, having its bonding force lowered. The bonding agent lowered in this bonding force falls off together with abrasive grains in a state of being dulled and clogged, produced on a surface of the abrasive wheel 1. With this constitution, this wheel 1 is subjected to dressing, maintaining its working capacity.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、セラミック,ガラス等
を研削研磨加工する研削研磨方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grinding and polishing method for grinding and polishing ceramics, glass and the like.

【0002】[0002]

【従来の技術】セラミック,ガラス等を精密研削研磨加
工する砥石としては、有機高分子物質を結合材としたレ
ジノイド砥石やゴム砥石があり、従来、これらの砥石を
用いて研削研磨を行なう際には、加工液に水が用いられ
ていた。特公昭60−13793号公報には、酸化ジル
コニウム、酸化セリウム又はべん柄の少なくとも1種か
らなるガラス鏡面仕上げ用研磨材を含有した多孔質飽和
ポリエステル樹脂より成る成形体の単一もしくは複数個
を相互に間隔をもたせてそれらの一端部を皿体面に固着
してなる研磨皿を使用し、水又は切削油を注ぎながらガ
ラス面を研磨するガラス研磨方法が開示されている。
2. Description of the Related Art As grindstones for precision grinding and polishing of ceramics, glass, etc., there are resinoid grindstones and rubber grindstones that use organic polymer as a binder. Conventionally, when grinding and polishing using these grindstones Used water as the working fluid. Japanese Examined Patent Publication No. 60-13793 discloses that a single or a plurality of molded bodies made of a porous saturated polyester resin containing a glass mirror-finishing abrasive made of at least one of zirconium oxide, cerium oxide and bevel pattern are mutually bonded. There is disclosed a glass polishing method of polishing a glass surface while pouring water or cutting oil using a polishing plate having one end thereof fixed to a plate body surface with a space therebetween.

【0003】[0003]

【発明が解決しようとする課題】上記従来の研磨方法で
光学ガラスの研磨加工を行なったところ、砥粒の先端が
過度に摩減、平坦化する目つぶれや、砥石の表面に被加
工物の切り屑が付着し排出できなくなる目詰まりの現象
が生じた。この目つぶれや目詰まりの現象が生じると加
工能力が低下する。そのため、多数個の光学ガラスを連
続して研磨加工した際、図3の破線で示すように、累積
加工数が増加するのに従って、被加工物の減磨耗(研磨
量)が減少する加工能力の低下が生じた。本発明は、上
記従来技術の問題点に鑑みなされたもので、多数個の被
加工物に対して連続して研削研磨加工を行なっても加工
能力が低下せず、安定した加工能力を維持することがで
きる研削研磨方法を提供することを目的とする。
When the optical glass is polished by the above-mentioned conventional polishing method, the tips of the abrasive grains are excessively worn and flattened, and the surface of the grindstone is crushed. There was a phenomenon of clogging that prevented chips from adhering to the chips. If this phenomenon of crushing or clogging occurs, the processing capability will decrease. Therefore, when a large number of optical glasses are continuously subjected to polishing, as shown by the broken line in FIG. 3, as the cumulative number of processing increases, the wear reduction (polishing amount) of the workpiece decreases. A drop has occurred. The present invention has been made in view of the above-mentioned problems of the prior art, and maintains a stable processing ability without lowering the processing ability even if a large number of workpieces are continuously ground and polished. It is an object of the present invention to provide a grinding / polishing method capable of performing the polishing.

【0004】[0004]

【課題を解決するための手段】上記目的を達成するため
に、本発明の研削研磨方法は、図1の概念図で示すよう
に、有機高分子物質を結合材とした研削研磨砥石1に酸
化性水溶液からなる加工液2を掛けつつ、研削研磨砥石
1と被研削研磨材3とをする合わせて被研削研磨材3を
加工することとした。
In order to achieve the above object, the grinding and polishing method of the present invention, as shown in the conceptual diagram of FIG. 1, oxidizes a grinding and polishing grindstone 1 using an organic polymer as a binder. It was decided to grind the grinding / polishing grindstone 1 and the grinding material 3 to be grinded, and to grind the grinding material 3 to be grinded while sprinkling the processing liquid 2 consisting of the aqueous solution.

【0005】[0005]

【作用】上記構成によれば、研削研磨加工の際に、有機
高分子物質を結合材とする研削研磨砥石1と被研削研磨
材3をすり合わせる研削研磨砥石1のすり合わせ面1a
に酸化性水溶液からなる加工液2を掛けると、研削研磨
砥石1の結合剤が酸化されて結合力が低下する。結合力
の低下した結合剤は、その表面が研削研磨加工中に崩れ
落ち、ドレッシングされる。このドレッシング作用によ
り、研削研磨砥石1の表面の目つぶれや目詰まりを起こ
した砥粒が、結合剤の結合力の低下と共に脱落し、新し
い研削研磨面が表れ自生される。そして、このドレッシ
ング作用は、加工液2が供給されている間、常に行なわ
れる。
According to the above construction, the grinding surface 1a of the grinding / polishing wheel 1 for grinding the grinding / polishing grindstone 1 using the organic polymer as a binder and the material to be ground 3 is ground during the grinding / polishing process.
When the working fluid 2 consisting of an oxidizing aqueous solution is applied to the above, the binding agent of the grinding and polishing whetstone 1 is oxidized and the binding force is reduced. The surface of the binding agent having the reduced binding force collapses during dressing and polishing and is dressed. By this dressing action, the abrasive grains that have caused the surface of the grinding / polishing grindstone 1 to be crushed or clogged fall off with a decrease in the binding force of the binder, and a new grinding / polishing surface appears and grows naturally. And this dressing action is always performed while the processing liquid 2 is supplied.

【0006】上記加工液2である酸化性水溶液は、相手
に酸素を与える能力を有する液体で、化学で一般に酸化
剤と呼ばれる物質を水で溶解した水溶液である。この酸
化性水溶液は、酸素原子を放出する能力を有し、放出さ
れた酸素原子は、他の物質と非常に反応し易いため、結
合剤である有機高分子物質と酸化性水溶液とが接触する
と、有機高分子物質に酸化反応が生じる。この酸化反応
は、有機高分子物質の炭素原子や水素原子と酸素原子と
が反応して生じる化学反応で、炭素原子との反応ではC
=O結合を生じ、水素原子との反応ではH−O−H結合
を生じる。有機高分子内の炭素原子は、長い炭素鎖でつ
ながれており、有機高分子の重合によって硬化している
物質は、この炭素鎖が複雑に絡み合って硬質を保ってい
る。しかし、酸化反応により長い炭素鎖中の炭素とが反
応して、炭素鎖が短く切断されると、複雑に絡み合った
炭素鎖が解かれ、炭素鎖によって硬度を保っていた有機
高分子物質も結合力が低下し、硬度が弱まる。
The oxidizing aqueous solution which is the above-mentioned working liquid 2 is a liquid having the ability to give oxygen to the other party and is an aqueous solution in which a substance generally called an oxidizer in chemistry is dissolved in water. This oxidizing aqueous solution has the ability to release oxygen atoms, and since the released oxygen atoms are very likely to react with other substances, when the organic polymer substance as a binder comes into contact with the oxidizing aqueous solution, , An organic polymer substance undergoes an oxidation reaction. This oxidation reaction is a chemical reaction that occurs when an oxygen atom and a carbon atom or a hydrogen atom of an organic polymer substance react, and a carbon atom causes a C
═O bond is formed, and a reaction with a hydrogen atom forms an H—O—H bond. The carbon atoms in the organic polymer are linked by long carbon chains, and in the substance cured by the polymerization of the organic polymer, the carbon chains are intricately entangled with each other to maintain hardness. However, when the carbon chain in the long carbon chain reacts due to the oxidation reaction and the carbon chain is cut short, the intricately entangled carbon chain is released, and the organic polymer substance that has maintained hardness by the carbon chain also binds. The strength decreases and the hardness weakens.

【0007】[0007]

【実施例1】図2は、本発明の実施例1を示す正面図
で、被研磨物である光学ガラス(φ20×t6)4を保
持治具5で保持して、図示を省略した研磨機に取り付け
た貼付け治具6に固定した研磨用レジンボンド(φ34
×t10)7に当接し、レジンボンド砥石7の表面(光
学ガラス4とのすり合わせ面)に加工液8を掛けつつ、
レジンボンド砥石7を回転するとともに光学ガラス4を
レジンボンド砥石7の回転軸に対し垂直に揺動してすり
合わせながら、以下の加工条件で研磨加工を行なった。
この時、加工液8は、加工中から加工終了後も常に掛け
続けた。
Embodiment 1 FIG. 2 is a front view showing Embodiment 1 of the present invention, in which an optical glass (φ20 × t6) 4 which is an object to be polished is held by a holding jig 5 and a polishing machine (not shown) is shown. The resin bond for polishing (φ34
Xt10) 7 is abutted on the surface of the resin bond grindstone 7 (a surface to be ground with the optical glass 4),
Polishing was performed under the following processing conditions while rotating the resin bond grindstone 7 and oscillating the optical glass 4 perpendicularly to the rotation axis of the resin bond grindstone 7 for rubbing.
At this time, the working liquid 8 was continuously applied during and after the processing.

【0008】被研磨物:光学ガラスBK7 研磨砥石:フェノール樹脂を結合剤とし酸化セリウム系
研磨材よりまるレジンボンド砥石 樹脂:研磨材=40:60(体積比),研磨材の粒径1
μm 加工径 :過酸化水素水(H2 2 )20%水溶液、供
給量1リットル/分、液温25℃ 研磨機 :オスカータイプ、垂直荷重2Kgf,下軸回
転数500rpm 研磨時間:3分間 研磨数 :100個
Object to be polished: Optical glass BK7 Polishing grindstone: Resin bond grindstone made of cerium oxide-based abrasive with phenol resin as binder Resin: Abrasive = 40:60 (volume ratio), abrasive particle size 1
μm Processing diameter: Hydrogen peroxide solution (H 2 O 2 ) 20% aqueous solution, supply amount 1 liter / min, liquid temperature 25 ° C. Polishing machine: Oscar type, vertical load 2 Kgf, lower shaft rotation speed 500 rpm Polishing time: 3 minutes polishing Number: 100

【0009】本実施例の研磨方法により光学ガラス10
0個を加工した結果の累積加工数と1個当たりの被研磨
物の減磨量の関係を図3のグラフに示す。比較例とし
て、加工液8以外は同じ加工条件で、加工液に水道水を
用いて研磨加工を行なった結果を破線で併記する。減磨
量の測定にはマイクロメータを用いた。図3によれば、
比較例では、累積加工数が5個を超えた時点から被研磨
物の減磨量が減少し、累積加工数が20個以上では初期
の減磨量の5分の2に減少する加工能力の低下が見られ
たが、本実施例の研磨方法では累積加工数が増加しても
被研磨物の減磨量は全く減少せず、加工能力の低下は生
じなかった。
The optical glass 10 is produced by the polishing method of this embodiment.
The graph of FIG. 3 shows the relationship between the cumulative number of processed zero pieces and the amount of reduction of the object to be polished. As a comparative example, the results of polishing using tap water as the processing liquid under the same processing conditions except for the processing liquid 8 are also shown by broken lines. A micrometer was used to measure the amount of abrasion loss. According to FIG.
In the comparative example, the amount of abrasion of the object to be polished decreases from the time when the cumulative number of machining exceeds 5, and when the cumulative number of machining is 20 or more, it decreases to 2/5 of the initial amount of abrasion. Although a decrease was observed, the polishing method of the present example did not reduce the amount of abrasion of the object to be polished at all even if the cumulative number of processes increased, and the processing ability did not decrease.

【0010】また、本実施例の研磨方法により加工した
光学ガラスの表面を20倍の倍率の光学顕微鏡を用いて
目視で検査したが、加工した100個の全数にキズは認
められなかった。さらに、本実施例では、加工液として
過酸化水素水を用いたため、分解しても水と酸素になり
環境に悪影響を与えることがない。
Further, the surface of the optical glass processed by the polishing method of this embodiment was visually inspected using an optical microscope with a magnification of 20 times, but no scratches were found on all 100 processed glass. Furthermore, in this embodiment, since hydrogen peroxide solution is used as the working fluid, even if it is decomposed, it becomes water and oxygen and does not adversely affect the environment.

【0011】なお、研磨砥石及び被加工物の大きさや、
研磨機の垂直荷重、下軸回転数の条件により研磨砥石表
面に生じる目詰まりや目つぶれの生成速度が異なるた
め、それらに応じて加工液の供給量や濃度を適宜変化さ
せてもよい。本実施例では、フェノール樹脂を結合剤と
したレジンボンド砥石を用いた場合を説明したが、他に
もポリイミド樹脂、ポリエステル樹脂、エポキシ樹脂を
結合剤としたレジンボンド砥石、あるいはポリアクリル
ゴム、ウレタンゴム、多硫化ゴム、スチレンゴムを結合
材としたラバーボンド砥石を用いて実施することがで
き、これらの砥石を用いた場合にあっても本実施例と同
様の効果を奏することが確認された。
The size of the grinding wheel and the work piece,
Since the generation rate of clogging or crushing that occurs on the surface of the polishing grindstone differs depending on the conditions of the vertical load of the polishing machine and the rotational speed of the lower shaft, the supply amount and concentration of the working liquid may be appropriately changed depending on the conditions. In this embodiment, the case where the resin bond grindstone using the phenol resin as the binder is used is explained, but in addition, the resin bond grindstone using the polyimide resin, the polyester resin, the epoxy resin as the binder, or the polyacrylic rubber, the urethane. It was confirmed that the rubber, polysulfide rubber, and rubber-bonded grindstones using styrene rubber as a binder can be used, and that the same effect as that of this embodiment can be obtained even when these grindstones are used. .

【0012】さらに、加工液である酸化性水溶液として
は、過酸化水素水の他に、過マンガン酸ナトリウム、ク
ロム酸カリウム、ニクロム酸カリウム、ペルオクソ酸化
ナトリウム、ペルオクソ硫酸、ペルオクソ硝酸、塩素
酸、臭素酸、ヨウ素酸を用いて実施でき、これらの酸化
性水溶液を用いた場合にあっても本実施例と同様な作
用、効果が得られた。但し、過マンガン酸ナトリウム、
ニクロム酸カリウム、ヨウ素酸は重金属を含むため、廃
液の際に重金属用の処理をして廃液する必要がある。
Further, as an oxidizing aqueous solution which is a working liquid, in addition to hydrogen peroxide solution, sodium permanganate, potassium chromate, potassium dichromate, sodium peroxooxide, peroxosulfuric acid, peroxonitric acid, chloric acid, bromine are used. It can be carried out using an acid or iodic acid, and even when these oxidizing aqueous solutions are used, the same action and effect as in the present embodiment can be obtained. However, sodium permanganate,
Since potassium dichromate and iodic acid contain heavy metals, it is necessary to treat the heavy metals before they are discharged.

【0013】また、被研磨物にセラミックを用いた場合
にあっても、本実施例と同様な作用、効果が得られた。
本実施例と同じ加工条件でセラミックを研磨したとこ
ろ、光学ガラスを研磨した時に比べて単位時間当たりの
被加工物の減磨重が5分の1に減少したものの、100
個加工しても累積被加工物の減磨量は減少することがな
かった。
Further, even when a ceramic is used for the object to be polished, the same action and effect as in this embodiment can be obtained.
When the ceramic was polished under the same processing conditions as in the present example, the polishing weight of the workpiece per unit time was reduced to one fifth compared to when the optical glass was polished, but it was 100%.
Even when individual machining was performed, the cumulative amount of abrasion reduction of the workpiece did not decrease.

【0014】さらに、本実施例の研磨方法で研削砥石を
用いて研削加工したところ、被加工物の減磨量が全く減
少せず、本実施例と同様な作用、効果が得られた。その
ときの加工条件を以下に示す。但し、本実施例と同一の
部分は省略する。 研削砥石:ポリイミド樹脂とダイヤモンド砥粒によりな
るレジンボンド砥粒、 集中度100、粒度♯800 研磨機 :オスカータイプ、垂直荷重4Kgf、下軸回
転数650rpm 研削数 :200個
Furthermore, when the grinding method of this embodiment was used to perform grinding using a grinding wheel, the amount of abrasion of the work piece was not reduced at all, and the same action and effect as in this embodiment were obtained. The processing conditions at that time are shown below. However, the same parts as in this embodiment are omitted. Grinding wheel: Resin bond abrasives made of polyimide resin and diamond abrasives, Concentration 100, Grain # 800 Polisher: Oscar type, vertical load 4Kgf, lower shaft speed 650rpm Grinding number: 200

【0015】[0015]

【実施例2】本実施例の研磨方法は、酸化性の水溶液を
砥石に掛ける時間を減らし、ドレッシングによる砥石の
減耗を抑えることで、上記実施例1の効果に経済的な効
果を付加したもので、加工液に酸化性水溶液と水の2種
類を用い、各々を交互に掛けることで酸化性水溶液の砥
石に供給する時間と量を必要最小限にして研磨加工を行
なった。図4は、本発明の実施例2を示す正面図で、被
研磨物である研磨面が凹形状の光学ガラス(φ7×t
1.1×R25)10を保持治具11で保持して、図示
を省略した研磨機に取り付けた貼付け治具12に固定し
た研磨用ラバーボンド砥石(φ11×R25)13とす
り合わせ、ラバーボンド砥石13の表面に加工液14を
掛けつつ、ラバーボンド砥石13を回転するとともに光
学ガラス10をラバーボンド砥石12の回転軸に対し垂
直に揺動させ、35秒の加工時間で研磨加工を行なっ
た。加工液14には、酸化性水溶液14aと水14bと
の2種類を用い、35秒の研磨時間のうち、最初の10
秒間だけ酸化性水溶液14aを掛け、その以外の時間は
水14bを掛けた。そして、この35秒間の研磨加工を
繰り返し行い、2種類の加工液14をラバーボンド砥石
13の表面に交互に掛けながら研磨加工を行なった。
[Embodiment 2] The polishing method of this embodiment adds an economical effect to the effect of Embodiment 1 by reducing the time for which an oxidizing aqueous solution is applied to the grindstone and suppressing the wear of the grindstone due to dressing. Then, two kinds of the oxidizing solution and water were used as the working liquid, and by alternately applying each of them, the polishing process was performed while the time and the amount of supplying the oxidizing solution to the grindstone were minimized. FIG. 4 is a front view showing a second embodiment of the present invention, in which an optical glass (φ7 × t) having a concave polishing surface as an object to be polished is used.
1.1 × R25) 10 is held by a holding jig 11 and rubbed with a polishing rubber bond grindstone (φ11 × R25) 13 fixed to a sticking jig 12 attached to a grinder (not shown), and a rubber bond grindstone While the processing liquid 14 was sprinkled on the surface of 13 and the rubber bond grindstone 13 was rotated, the optical glass 10 was oscillated perpendicularly to the rotation axis of the rubber bond grindstone 12, and polishing processing was performed in a processing time of 35 seconds. Two kinds of oxidizing solution 14a and water 14b are used as the working liquid 14, and the first 10 of the polishing time of 35 seconds are used.
The oxidizing aqueous solution 14a was applied for only one second, and water 14b was applied for the rest of the time. Then, the polishing process was repeated for 35 seconds, and the polishing process was performed while alternately applying the two types of processing liquids 14 to the surface of the rubber bond grindstone 13.

【0016】本実施例の研磨加工の加工条件を以下に示
す。 被研磨物:光学ガラスSK11 研磨砥石:多硫化ゴムを結合材とし酸化ジルコニウム系
研磨材よりなるラバーボンド砥石 樹脂:研磨材=40:60(体積比)研磨材粒径1μm 加工液 :ペルオクソ炭酸ナトリウム(Na 2 3
10%水溶液及び水、供給量0.5リットル/分、液温
25℃ 研磨材 :オスカータイプ、垂直荷重2Kgf、下軸回
転数500rpm 研磨時間:35秒 研磨数 :100個 本実施例の研磨方法により、光学ガラス10を100個
加工した後、砥石13の減耗量をマイクロメータで測定
したところ、砥石13の減耗量は29μmであった。同
じ加工条件で加工液14に酸化性水溶液14aのみを用
いて研磨加工したところ、砥石13の減耗量は60μm
であったため、本実施例では砥石13の減耗量を約5割
以上も削減でき、経済的な効果をも得ることができた。
さらに、実施例1と同様に、砥粒の目詰まりや目つぶれ
による加工能力の低下は見られなかった。また、本実施
例と同様に研削加工を行なったところ、研磨加工と同様
な作用、効果を得ることができた。
The processing conditions of the polishing process of this embodiment are shown below. Workpiece: Optical glass SK11 Polishing grindstone: Rubber bond grindstone made of zirconium oxide-based abrasive with polysulfide rubber as a binder Resin: Abrasive = 40: 60 (volume ratio) Abrasive particle size 1 μm Working fluid: Sodium peroxocarbonate (N a C 2 O 3 )
10% aqueous solution and water, supply rate 0.5 liter / min, liquid temperature 25 ° C. Abrasive: Oscar type, vertical load 2 Kgf, lower shaft rotation speed 500 rpm Polishing time: 35 seconds Polishing number: 100 pieces Polishing method of this embodiment When 100 pieces of the optical glass 10 were processed, the abrasion loss of the grindstone 13 was measured with a micrometer, and the abrasion loss of the grindstone 13 was 29 μm. When the polishing liquid 14 was polished using only the oxidizing aqueous solution 14a under the same processing conditions, the abrasion loss of the grindstone 13 was 60 μm.
Therefore, in this embodiment, the amount of wear of the grindstone 13 can be reduced by about 50% or more, and the economical effect can be obtained.
Further, as in Example 1, no decrease in processing ability due to clogging or crushing of abrasive grains was observed. Further, when the grinding process was performed in the same manner as in this example, the same action and effect as the polishing process could be obtained.

【0017】[0017]

【発明の効果】以上のように、本発明の研削研磨方法に
あっては、加工液に酸化性水溶液を用い、有機高分子物
質を結合剤とした研削研磨砥石をドレッシングしている
ため、砥石の目つぶれや目詰まりによる加工能力の低下
を解消することができ、多数個を連続して研削、研磨加
工しても累積加工数が増加するに従って生じる加工能力
の低下が見られなくなり、安定した加工能力を得ること
ができる。
As described above, according to the grinding / polishing method of the present invention, since an oxidizing aqueous solution is used as a working liquid and a grinding / polishing grindstone having an organic polymer substance as a binder is dressed, the grindstone It is possible to eliminate the deterioration of the processing capacity due to the crushing and clogging of the machine, and even if a large number of pieces are continuously ground and polished, the deterioration of the processing capacity that occurs as the cumulative number of processing increases is not seen and it is stable. Processing ability can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の研削研磨方法を概念的に示す斜視図で
ある。
FIG. 1 is a perspective view conceptually showing a grinding and polishing method of the present invention.

【図2】本発明の実施例1を示す正面図である。FIG. 2 is a front view showing the first embodiment of the present invention.

【図3】本発明の実施例1と従来技術における加工能力
の比較を示すグラフ図である。
FIG. 3 is a graph showing a comparison of processing capabilities between Example 1 of the present invention and a conventional technique.

【図4】本発明実施例2を示す正面図である。FIG. 4 is a front view showing a second embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 研削研磨砥石 2 加工液 3 被研削研磨材 4,10 光学ガラス 7 レジンボンド砥石 8 加工液(酸化性水溶液) 13 ラバーボンド砥石 14 加工液 14a 酸化性水溶液 14b 水 DESCRIPTION OF SYMBOLS 1 Grinding / polishing whetstone 2 Working fluid 3 Grinding abrasive material 4,10 Optical glass 7 Resin bond grindstone 8 Working fluid (oxidative aqueous solution) 13 Rubber bond grindstone 14 Working fluid 14a Oxidizing aqueous solution 14b Water

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成5年9月17日[Submission date] September 17, 1993

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0002[Name of item to be corrected] 0002

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0002】[0002]

【従来の技術】セラミック,ガラス等を精密研削研磨加
工する砥石としては、有機高分子物質を結合材としたレ
ジノイド砥石やゴム砥石があり、従来、これらの砥石を
用いて研削研磨を行なう際には、加工液に水が用いられ
ていた。特公昭60−13793号公報には、酸化ジル
コニウム、酸化セリウム又はべん柄の少なくとも1種か
らなるガラス鏡面仕上げ用研磨材を含有した多孔質
和ポリエステル樹脂より成る成形体の単一もしくは複数
個を相互に間隔をもたせてそれらの一端部を皿体面に固
着してなる研磨皿を使用し、水又は切削油を注ぎながら
ガラス面を研磨するガラス研磨方法が開示されている。
2. Description of the Related Art As grindstones for precision grinding and polishing of ceramics, glass, etc., there are resinoid grindstones and rubber grindstones that use organic polymer as a binder. Conventionally, when grinding and polishing using these grindstones Used water as the working fluid. Japanese Examined Patent Publication No. 60-13793 discloses a molded article made of a porous unsaturated polyester resin containing a glass mirror-finishing abrasive made of at least one of zirconium oxide, cerium oxide and bevel pattern. A glass polishing method is disclosed in which one or a plurality of glass plates are spaced from each other and one end thereof is fixed to a plate body surface, and a glass surface is ground while pouring water or cutting oil.

【手続補正2】[Procedure Amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0004[Correction target item name] 0004

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0004】[0004]

【課題を解決するための手段】上記目的を達成するため
に、本発明の研削研磨方法は、図1の概念図で示すよう
に、有機高分子物質を結合とした研削研磨砥石1に酸
化性水溶液からなる加工液2を掛けつつ、研削研磨砥石
1と被研削研磨材3とをする合わせて被研削研磨材3を
加工することとした。
To achieve the above object, according to the Invention The grinding polishing method of the present invention, as shown in the conceptual diagram of FIG. 1, oxide grinding grindstone 1 in which the organic polymeric material and a binder It was decided to grind the grinding / polishing grindstone 1 and the grinding material 3 to be grinded, and to grind the grinding material 3 to be grinded while sprinkling the processing liquid 2 consisting of the aqueous solution.

【手続補正3】[Procedure 3]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0005[Name of item to be corrected] 0005

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0005】[0005]

【作用】上記構成によれば、研削研磨加工の際に、有機
高分子物質を結合とする研削研磨砥石1と被研削研磨
材3をすり合わせる研削研磨砥石1のすり合わせ面1a
に酸化性水溶液からなる加工液2を掛けると、研削研磨
砥石1の結合剤が酸化されて結合力が低下する。結合力
の低下した結合剤は、その表面が研削研磨加工中に崩れ
落ち、ドレッシングされる。このドレッシング作用によ
り、研削研磨砥石1の表面の目つぶれや目詰まりを起こ
した砥粒が、結合剤の結合力の低下と共に脱落し、新し
い研削研磨面が表れ自生される。そして、このドレッシ
ング作用は、加工液2が供給されている間、常に行なわ
れる。
According to the above construction, the grinding surface 1a of the grinding / polishing wheel 1 for rubbing the grinding / polishing wheel 1 using the organic polymer as a binder and the abrasive material 3 to be ground during the grinding / polishing process
When the working fluid 2 consisting of an oxidizing aqueous solution is applied to the above, the binding agent of the grinding and polishing whetstone 1 is oxidized and the binding force is reduced. The surface of the binding agent having the reduced binding force collapses during dressing and polishing and is dressed. By this dressing action, the abrasive grains that have caused the surface of the grinding / polishing grindstone 1 to be crushed or clogged fall off with a decrease in the binding force of the binder, and a new grinding / polishing surface appears and grows naturally. And this dressing action is always performed while the processing liquid 2 is supplied.

【手続補正4】[Procedure amendment 4]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0006[Correction target item name] 0006

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0006】上記加工液2である酸化性水溶液は、相手
に酸素を与える能力を有する液体で、化学で一般に酸化
剤と呼ばれる物質を水で溶解した水溶液である。この酸
化性水溶液は、酸素原子を放出する能力を有し、放出さ
れた酸素原子は、他の物質と非常に反応し易いため、結
合剤である有機高分子物質と酸化性水溶液とが接触する
と、有機高分子物質に酸化反応が生じる。この酸化反応
は、有機高分子物質の炭素原子や水素原子と酸素原子と
が反応して生じる化学反応で、炭素原子との反応ではC
=O結合を生じ、水素原子との反応ではH−O−H結合
を生じる。有機高分子内の炭素原子は、長い炭素鎖でつ
ながれており、有機高分子の重合によって硬化している
物質は、この炭素鎖が複雑に絡み合って硬質を保ってい
る。しかし、酸化反応により長い炭素鎖中の炭素と酸素
とが反応して、炭素鎖が短く切断されると、複雑に絡み
合った炭素鎖が解かれ、炭素鎖によって硬度を保ってい
た有機高分子物質も結合力が低下し、硬度が弱まる。
The oxidizing aqueous solution which is the above-mentioned working liquid 2 is a liquid having the ability to give oxygen to the other party and is an aqueous solution in which a substance generally called an oxidizer in chemistry is dissolved in water. This oxidizing aqueous solution has the ability to release oxygen atoms, and since the released oxygen atoms are very likely to react with other substances, when the organic polymer substance as a binder comes into contact with the oxidizing aqueous solution, , An organic polymer substance undergoes an oxidation reaction. This oxidation reaction is a chemical reaction that occurs when an oxygen atom and a carbon atom or a hydrogen atom of an organic polymer substance react, and a carbon atom causes a C
═O bond is formed, and a reaction with a hydrogen atom forms an H—O—H bond. The carbon atoms in the organic polymer are linked by long carbon chains, and in the substance cured by the polymerization of the organic polymer, the carbon chains are intricately entangled with each other to maintain hardness. However, due to the oxidation reaction, carbon and oxygen in the long carbon chain
When and react with each other and the carbon chain is cut short, the intricately entangled carbon chain is unraveled, and the organic polymer substance that has maintained the hardness due to the carbon chain also has a lower binding force and the hardness is weakened.

【手続補正5】[Procedure Amendment 5]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0009[Correction target item name] 0009

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0009】本実施例の研磨方法により光学ガラス10
0個を加工した結果の累積加工数と1個当たりの被研磨
物の減耗量の関係を図3のグラフに示す。比較例とし
て、加工液8以外は同じ加工条件で、加工液に水道水を
用いて研磨加工を行なった結果を破線で併記する。減耗
の測定にはマイクロメータを用いた。図3によれば、
比較例では、累積加工数が5個を超えた時点から被研磨
物の減磨量が減少し、累積加工数が20個以上では初期
の減磨量の5分の2に減少する加工能力の低下が見られ
たが、本実施例の研磨方法では累積加工数が増加しても
被研磨物の減耗量は全く減少せず、加工能力の低下は生
じなかった。
The optical glass 10 is produced by the polishing method of this embodiment.
The graph of FIG. 3 shows the relationship between the cumulative number of processed zero pieces and the amount of wear of the object to be polished per piece. As a comparative example, the results of polishing using tap water as the processing liquid under the same processing conditions except for the processing liquid 8 are also shown by broken lines. Wear and tear
A micrometer was used to measure the amount . According to FIG.
In the comparative example, the amount of abrasion of the object to be polished decreases from the time when the cumulative number of machining exceeds 5, and when the cumulative number of machining is 20 or more, it decreases to 2/5 of the initial amount of abrasion. Although a decrease was observed, the polishing method of the present example did not decrease the amount of wear of the object to be polished at all even if the cumulative number of processes increased, and did not cause a decrease in processing ability.

【手続補正6】[Procedure correction 6]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0013[Correction target item name] 0013

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0013】また、被研磨物にセラミックを用いた場合
にあっても、本実施例と同様な作用、効果が得られた。
本実施例と同じ加工条件でセラミックを研磨したとこ
ろ、光学ガラスを研磨した時に比べて単位時間当たりの
被加工物の減耗量が5分の1に減少したものの、100
個加工しても累積被加工物の減耗量は減少することがな
かった。
Further, even when a ceramic is used for the object to be polished, the same action and effect as in this embodiment can be obtained.
When the ceramic was polished under the same processing conditions as in the present example, the amount of wear of the work piece per unit time was reduced to 1/5 as compared with the case where the optical glass was polished.
Even if individual machining was performed, the amount of accumulated work wear did not decrease.

【手続補正7】[Procedure Amendment 7]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0014[Correction target item name] 0014

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0014】さらに、本実施例の研磨方法で研削砥石を
用いて研削加工したところ、被加工物の減耗量が全く減
少せず、本実施例と同様な作用、効果が得られた。その
ときの加工条件を以下に示す。但し、本実施例と同一の
部分は省略する。 研削砥石:ポリイミド樹脂とダイヤモンド砥粒によりな
るレジンボンド砥粒、 集中度100、粒度#800 研磨機 :オスカータイプ、垂直荷重4Kgf、下軸回
転数650rpm 研削数 :200個
Further, when the grinding method of this embodiment was used to perform grinding using a grinding wheel, the amount of wear of the work piece was not reduced at all, and the same action and effect as in this embodiment were obtained. The processing conditions at that time are shown below. However, the same parts as in this embodiment are omitted. Grinding wheel: Resin bond abrasives made of polyimide resin and diamond abrasives, Concentration 100, Grain # 800 Polisher: Oscar type, vertical load 4Kgf, lower shaft rotation 650rpm Grinding number: 200

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 有機高分子物質を結合剤とした研削研磨
砥石に加工液を掛けつつ研削研磨砥石と被研削研磨材と
をすり合わせて被研削研磨材を加工する研削研磨方法に
おいて、前記加工液が酸化性水溶液であることを特徴と
する研削研磨方法。
1. A grinding / polishing method for processing a grinding / polishing material by rubbing a grinding / polishing grindstone with an abrasive to be ground while polishing the grinding / polishing grindstone using an organic polymer as a binder. Is an oxidizing aqueous solution.
JP25064492A 1992-08-26 1992-08-26 Grinding abrasive method Pending JPH0671544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25064492A JPH0671544A (en) 1992-08-26 1992-08-26 Grinding abrasive method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25064492A JPH0671544A (en) 1992-08-26 1992-08-26 Grinding abrasive method

Publications (1)

Publication Number Publication Date
JPH0671544A true JPH0671544A (en) 1994-03-15

Family

ID=17210930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25064492A Pending JPH0671544A (en) 1992-08-26 1992-08-26 Grinding abrasive method

Country Status (1)

Country Link
JP (1) JPH0671544A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998029217A1 (en) * 1997-01-03 1998-07-09 Minnesota Mining And Manufacturing Company Method and article for the production of optical quality surfaces on glass
US5888119A (en) * 1997-03-07 1999-03-30 Minnesota Mining And Manufacturing Company Method for providing a clear surface finish on glass
US5910471A (en) * 1997-03-07 1999-06-08 Minnesota Mining And Manufacturing Company Abrasive article for providing a clear surface finish on glass
US6231629B1 (en) 1997-03-07 2001-05-15 3M Innovative Properties Company Abrasive article for providing a clear surface finish on glass
US6261435B1 (en) 1997-10-21 2001-07-17 Nihon Techno Kabushiki Kaisha Plating method
CN105817976A (en) * 2016-03-23 2016-08-03 大连理工大学 Efficient ultraprecise grinding method for nanometer depth damaged layer

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998029217A1 (en) * 1997-01-03 1998-07-09 Minnesota Mining And Manufacturing Company Method and article for the production of optical quality surfaces on glass
US5876268A (en) * 1997-01-03 1999-03-02 Minnesota Mining And Manufacturing Company Method and article for the production of optical quality surfaces on glass
US5989111A (en) * 1997-01-03 1999-11-23 3M Innovative Properties Company Method and article for the production of optical quality surfaces on glass
US6155910A (en) * 1997-01-03 2000-12-05 3M Innovative Properties Company Method and article for the production of optical quality surfaces on glass
US5888119A (en) * 1997-03-07 1999-03-30 Minnesota Mining And Manufacturing Company Method for providing a clear surface finish on glass
US5910471A (en) * 1997-03-07 1999-06-08 Minnesota Mining And Manufacturing Company Abrasive article for providing a clear surface finish on glass
US6110015A (en) * 1997-03-07 2000-08-29 3M Innovative Properties Company Method for providing a clear surface finish on glass
US6231629B1 (en) 1997-03-07 2001-05-15 3M Innovative Properties Company Abrasive article for providing a clear surface finish on glass
US6261435B1 (en) 1997-10-21 2001-07-17 Nihon Techno Kabushiki Kaisha Plating method
CN105817976A (en) * 2016-03-23 2016-08-03 大连理工大学 Efficient ultraprecise grinding method for nanometer depth damaged layer

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