JPH0671427A - Brazing method for tial - Google Patents

Brazing method for tial

Info

Publication number
JPH0671427A
JPH0671427A JP24869592A JP24869592A JPH0671427A JP H0671427 A JPH0671427 A JP H0671427A JP 24869592 A JP24869592 A JP 24869592A JP 24869592 A JP24869592 A JP 24869592A JP H0671427 A JPH0671427 A JP H0671427A
Authority
JP
Japan
Prior art keywords
tial
brazing
pure
base
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24869592A
Other languages
Japanese (ja)
Inventor
Sadahiko Hirayama
貞彦 平山
Tadahiro Washizu
忠弘 鷲津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IHI Corp
Original Assignee
IHI Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IHI Corp filed Critical IHI Corp
Priority to JP24869592A priority Critical patent/JPH0671427A/en
Publication of JPH0671427A publication Critical patent/JPH0671427A/en
Pending legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To prevent generation of an oxide film on TiAl joining interface by sandwiching a brazing filler metal on the surface of two sheets of base metals with applying pure Ni plating and joining with heating both base metals to the prescribed temp. CONSTITUTION:A base metal is formed with applying a pure Ni plating 2 on the surface of TiAl, sandwiching a brazing filler metal 3 between both base metals, both base metals are heated in vacuum furnace to be joined, unloading from furnace after cooled in furnace. In this TiAl brazing method brazability is improved, and its storage term is made longer as compared to conventional one, by applying Ni plating or Ni coating by PVD process on the joining interface of TiAl to suppress generation of Al oxide film.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はろう付の改良を図ること
ができるTiAlのろう付方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TiAl brazing method capable of improving brazing.

【0002】[0002]

【従来の技術】TiAlはAlの含有量が約35%と極
めて高く、ろう付しようとする接合界面にAlの酸化皮
膜が発生してろう付性を悪化する。
2. Description of the Related Art TiAl has an extremely high Al content of about 35%, and an Al oxide film is formed at the joint interface to be brazed, which deteriorates the brazing property.

【0003】従って、従来、ろう付け前の前処理でTi
Alの接合界面を酸洗浄又はエメリー研磨を施し次いで
ろう付を行う方法が用いられている。
Therefore, in the prior art, Ti was used as a pretreatment before brazing.
A method is used in which the Al bonding interface is subjected to acid cleaning or emery polishing and then brazing.

【0004】[0004]

【発明が解決しようとする課題】前処理からろう付の実
施までの保管時間は経験的に約6時間以内にキープする
必要があるとされている。しかしながら、上記の方法に
よる実際の製品の製作工程では保管時間を6時間以内に
キープすることは困難で、実用的でないという問題があ
る。
The storage time from pretreatment to brazing is empirically required to be kept within about 6 hours. However, it is difficult to keep the storage time within 6 hours in the actual manufacturing process of the product by the above method, which is not practical.

【0005】[0005]

【発明の目的】本発明はTiAlの接合界面に酸化皮膜
が発生するのを防止しろう付性を改良することを目的と
する。
An object of the present invention is to prevent the formation of an oxide film at the joint interface of TiAl and improve the brazing property.

【0006】[0006]

【研究結果による知見】上記した問題点を解決すべく本
発明者らは、TiAlに付着可能な金属で且つ表面に酸
化皮膜が形成されにくく熱処理を行った際に酸化皮膜が
分解され易い金属について鋭意研究の結果、NiはTi
Alに付着可能で且つ酸化皮膜が形成されにくい性質を
備えているという知見を得るに至った。
[Findings from Research Results] In order to solve the above-mentioned problems, the inventors of the present invention have identified a metal that can adhere to TiAl and that is hard to form an oxide film on the surface and is easily decomposed when heat-treated. As a result of earnest research, Ni is Ti
We have come to the knowledge that it has the property of being capable of adhering to Al and being hard to form an oxide film.

【0007】[0007]

【課題を解決するための手段】本発明のうち第1の手段
はTiAlの表面を酸洗浄後純Niメッキを施して母材
を形成し、2枚の母材の純Niメッキを施した面間にろ
う材を挾み、真空下において両母材を所定の温度に加熱
し、接合するものであり、第2の手段はTiAlの表面
にプラズマ溶接によりNiコーティングを施して母材を
形成し、2枚の母材の純Niメッキを施した面間にろう
材を挾み、真空下において両母材を所定の温度に加熱
し、接合するものである。
According to a first means of the present invention, the surface of TiAl is cleaned with an acid and then plated with pure Ni to form a base material, and two surfaces of the base material are plated with pure Ni. A brazing filler metal is sandwiched between them, and both base metals are heated to a predetermined temperature under vacuum to bond them. The second means is to form a base metal by applying Ni coating to the surface of TiAl by plasma welding. A brazing material is sandwiched between two surfaces of a base material plated with pure Ni, and both base materials are heated to a predetermined temperature under vacuum to bond them.

【0008】[0008]

【作用】前処理としてTiAlの表面の接合界面にNi
メッキを施すか或いはPVD法によりNiコーティング
を施したので、Alの酸化皮膜の発生を抑制して、ろう
付性が改良される。
[Function] As a pretreatment, Ni is applied to the bonding interface on the surface of TiAl.
Since the plating is applied or the Ni coating is applied by the PVD method, the generation of an Al oxide film is suppressed and the brazing property is improved.

【0009】[0009]

【実施例】以下、本発明によるTiAlのろう付方法に
ついて説明する。
The method for brazing TiAl according to the present invention will be described below.

【0010】図1は本発明の一実施例を示す。FIG. 1 shows an embodiment of the present invention.

【0011】本実施例においては、TiAl1の表面に
厚さ5〜10μmの純Niメッキ2を施して母材を形成
し、両母材間に厚さ50〜100μmのろう材3(チタ
ンベース40%、ジルコニウム20%、ニッケル20
%、銅20%で構成されるT−2020)を挾み、真空
度1.33×10ー2Pa以下の炉内で10分間、930
℃の温度に加熱して両母材を接合し、500〜600℃
まで炉冷し、約150℃で炉外へ取り出す。接合後のT
iAlの引張強度は147Nであった。
In this embodiment, a base material is formed by applying pure Ni plating 2 having a thickness of 5 to 10 μm on the surface of TiAl 1, and a brazing material 3 (titanium base 40 having a thickness of 50 to 100 μm) between the base materials. %, Zirconium 20%, nickel 20
%, With 20% of copper sandwiched the configured T-2020), the degree of vacuum 1.33 × 10 over 2 Pa or less in the furnace for 10 minutes, 930
Heated to a temperature of ℃ to join both base materials, 500 to 600 ℃
The furnace is cooled to about 150 ° C. and taken out of the furnace. T after joining
The tensile strength of iAl was 147N.

【0012】図2は、本実施例であるNiメッキを施し
たものとNiメッキのない従来のものとのろう付性に及
ぼす保持時間の影響を比較したものである。
FIG. 2 compares the effect of holding time on the brazability between the Ni-plated product of this embodiment and the conventional Ni-plated product.

【0013】図で明らかなように前処理からろう付まで
の保持時間が6時間までは従来のものも、本発明のもの
も共にろう付性に影響はなかったが、保持時間が2〜3
日経過の段階では従来のものはろう付性が低下したのに
対し本発明のものはろう付性は低下しなかった。
As is apparent from the figure, neither the conventional one nor the present invention has an effect on the brazing property when the holding time from pretreatment to brazing is up to 6 hours, but the holding time is 2 to 3
In the course of the day, the brazing property of the conventional one decreased, whereas the brazing property of the present invention did not decrease.

【0014】図3は本発明の他の実施例を示す。FIG. 3 shows another embodiment of the present invention.

【0015】本実施例においてはTiAl1の表面にP
VD法により厚さ約5μmのNiコーティング4を施し
て母材を形成し、両母材間に図1の実施例と同様のろう
材3を挾み、図1の実施例と同様の条件で両母材を加熱
し、接合する。
In this embodiment, P is formed on the surface of TiAl1.
A base material is formed by applying a Ni coating 4 having a thickness of about 5 μm by the VD method, and a brazing material 3 similar to that of the embodiment of FIG. 1 is sandwiched between the base materials, and the same conditions as those of the embodiment of FIG. 1 are used. Both base materials are heated and joined.

【0016】[0016]

【発明の効果】上記した本発明のTiAlのろう付方法
においては、TiAlの接合界面にNiメッキを施すか
或いはPVD法によりNiコーティングを施したので、
Alの酸化皮膜の発生を抑制してろう付性が改良される
とともに保管期間も従来のものに比べて長くすることが
できる。
In the above-described TiAl brazing method of the present invention, since the NiAl joint interface is plated with Ni or the PVD method is used for Ni coating,
The generation of an Al oxide film is suppressed to improve the brazing property, and the storage period can be extended as compared with the conventional one.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のTiAlのろう付方法の一実施例を示
す縦断面図である。
FIG. 1 is a vertical sectional view showing an embodiment of a TiAl brazing method of the present invention.

【図2】本発明のNiメッキを施したものと従来のNi
メッキを施さないものとのろう付性に及ぼす保持時間の
影響についての比較を示す図である。
FIG. 2 shows the Ni-plated product of the present invention and a conventional Ni product.
It is a figure which shows the comparison about the influence of the holding time on the brazability with what is not plated.

【図3】本発明のTiAlのろう付方法の他の実施例を
示す縦断面図である。
FIG. 3 is a vertical sectional view showing another embodiment of the TiAl brazing method of the present invention.

【符号の説明】[Explanation of symbols]

1 TiAl 2 純Niメッキ 3 ろう材 4 Niコーティング 1 TiAl 2 Pure Ni plating 3 Brazing material 4 Ni coating

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C23C 18/32 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location C23C 18/32

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 TiAlの表面を酸洗浄後純Niメッキ
を施して母材を形成し、2枚の母材の純Niメッキを施
した面間にろう材を挾み、真空下において両母材を所定
の温度に加熱し、接合することを特徴とするTiAlの
ろう付方法。
1. A surface of TiAl is cleaned with an acid and then plated with pure Ni to form a base material, and a brazing material is sandwiched between the surfaces of the two base materials plated with pure Ni. A brazing method of TiAl, characterized in that the materials are heated to a predetermined temperature and joined.
【請求項2】 TiAlの表面にPVD(Physic
al VaporDeposition)法(物理蒸着
法)によりNiコーティングを施して母材を形成し、2
枚の母材の純Niメッキを施した面間にろう材を挾み、
真空下において両母材を所定の温度に加熱し、接合する
ことを特徴とするTiAlのろう付方法。
2. PVD (Physic) on the surface of TiAl
The Ni coating is applied by the al Vapor Deposition method (physical vapor deposition method) to form the base material, and 2
A brazing filler metal is sandwiched between the surfaces of the base materials that have been plated with pure Ni,
A brazing method of TiAl, characterized in that both base materials are heated to a predetermined temperature under vacuum and joined.
JP24869592A 1992-08-25 1992-08-25 Brazing method for tial Pending JPH0671427A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24869592A JPH0671427A (en) 1992-08-25 1992-08-25 Brazing method for tial

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24869592A JPH0671427A (en) 1992-08-25 1992-08-25 Brazing method for tial

Publications (1)

Publication Number Publication Date
JPH0671427A true JPH0671427A (en) 1994-03-15

Family

ID=17181964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24869592A Pending JPH0671427A (en) 1992-08-25 1992-08-25 Brazing method for tial

Country Status (1)

Country Link
JP (1) JPH0671427A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007296546A (en) * 2006-04-28 2007-11-15 Toyota Central Res & Dev Lab Inc Soldering method
US7749614B2 (en) * 2003-07-25 2010-07-06 Onera (Office National D'etudes Et De Recherches Aerospatiales) Method of brazing a Ti-Al alloy
CN105537750A (en) * 2016-01-20 2016-05-04 天津大学 High-strength connection process for copper-niobium rodlike metals under non-vacuum low-pressure condition
KR20180010301A (en) * 2015-12-23 2018-01-30 희성정밀 주식회사 Cooling plate producing method for battery stack of electric vehicle and cooling plate by the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7749614B2 (en) * 2003-07-25 2010-07-06 Onera (Office National D'etudes Et De Recherches Aerospatiales) Method of brazing a Ti-Al alloy
JP2007296546A (en) * 2006-04-28 2007-11-15 Toyota Central Res & Dev Lab Inc Soldering method
JP4675821B2 (en) * 2006-04-28 2011-04-27 株式会社豊田中央研究所 Brazing method
KR20180010301A (en) * 2015-12-23 2018-01-30 희성정밀 주식회사 Cooling plate producing method for battery stack of electric vehicle and cooling plate by the same
CN105537750A (en) * 2016-01-20 2016-05-04 天津大学 High-strength connection process for copper-niobium rodlike metals under non-vacuum low-pressure condition

Similar Documents

Publication Publication Date Title
US2473712A (en) Procedure for making multiply metal stock
US4988035A (en) Method of liquid phase diffusion bonding of metal bodies
JPH07504945A (en) Method for joining sputter target backing plate assemblies and assemblies produced thereby
JP2999760B2 (en) Method for producing beryllium-copper alloy HIP joint and HIP joint
JP2007301606A (en) Method for joining dissimilar metals by resistance spot welding and joined structure
JPH0671427A (en) Brazing method for tial
JPH11106904A (en) Production of sputtering target
JP2018172740A (en) Sputtering target-backing plate conjugate, and production method thereof
JPH0959770A (en) Target for sputtering and its production
JPS62124083A (en) Diffused junction method
JPH10280137A (en) Production of sputtering target
JP2002224882A (en) Au/sn composite foil and au/sn alloy foil as well as brazing filler metal formed by using the same, method of manufacturing au/sn composite foil, method of manufacturing au/sn alloy foil and method of joining brazing filler metal,
JPH0867978A (en) Method for soldering target for sputtering
US20040134776A1 (en) Assemblies comprising molybdenum and aluminum; and methods of utilizing interlayers in forming target/backing plate assemblies
US4706872A (en) Method of bonding columbium to nickel and nickel based alloys using low bonding pressures and temperatures
JP4615746B2 (en) Titanium target assembly for sputtering and manufacturing method thereof
JPS58185761A (en) Diffusion bonding method for material comprising aluminum mainly
JP4519981B2 (en) Solid phase diffusion bonding sputtering target assembly and manufacturing method thereof
JP3629578B2 (en) Ti-based material and Cu-based bonding method
JP4331370B2 (en) Method for manufacturing HIP joined body of beryllium and copper alloy and HIP joined body
JPH0355232B2 (en)
JPS63112095A (en) Material and method for joining graphite to metallic material
JPS6030593A (en) Joining method of different kind of material
JP2854619B2 (en) Joining method
JP2731444B2 (en) Joining method of aluminum or aluminum alloy and stainless steel