JPH0670952B2 - Projection exposure device - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a projection exposure apparatus, and more particularly, to aligning an original plate and an object to be exposed with respect to a projection optical system after aligning the original plate and the object to be exposed. The present invention relates to a scanning type projection exposure apparatus that transfers an image of an original onto an object to be exposed by integrally scanning.

Such an exposure apparatus is, for example, an exposure apparatus using a projection type optical system for manufacturing a semiconductor circuit element such as IC, LSI, VLSI, etc., and transfers a circuit pattern image of a mask onto a wafer with high accuracy. Used for.

[Prior Art] A device that integrally moves a mask and a wafer with respect to a fixed projection optical system, and irradiates and scans a slit-shaped light onto the mask through the projection optical system to expose the mask pattern onto the wafer. In general, in general, a coordinate system of a structure in which a mask and a wafer are carried and integrally moved (hereinafter referred to as a carriage) in the scanning direction y-axis and its orthogonal direction x-axis, and an axis y ′ in the horizontal plane of the projection optical system. When the axis and the coordinate system of the x'axis at right angles to the axis are deviated in the rotational direction (angle θ), image plane distortion occurs, and the mask pattern is tilted by 2θ with respect to the xy axis coordinate system on the wafer. Transcribed.

As a method for solving such a drawback, Japanese Patent Laid-Open No. 60-14082
No. 6 discloses that the image plane distortion is measured when the carriage is previously positioned at a plurality of positions on the y-axis, and the scanning plane exposure is performed while adjusting the attitude of the carriage to transfer the image plane distortion. Correcting is disclosed.

Then, the following two types of methods are disclosed as a procedure for correcting the image surface distortion, that is, measuring and adjusting the inclination of the optical axis of the projection optical system and the carriage scanning axis and the transfer magnification (hereinafter, simply referred to as measurement and adjustment). Has been done.

(1) Perform measurement using a standard mask and standard wafer,
After the measurement, the mask and wafer in the actual process are used. These standard masks and standard wafers are not used for actual printing, but are used only for measurement.

(2) Using a mask and a wafer in an actual process, measurement is performed each time alignment and printing are performed (see the lower left column, lines 13 to 18 of the same, page 2).

[Problems to be Solved by the Invention] Of the above two methods, the method (1) has an error (manufacturing error) in mask production between masks in an actual process and a standard mask, and the error is Since it differs for each process, it is necessary to correct the error for each process. On the other hand, according to the method (2), these drawbacks are solved, but there is a drawback that the throughput is lowered because the measurement is performed every time. The method (1) has a further drawback that it takes time because the mask and the wafer have to be exchanged.

The present invention has been made in view of the above-mentioned drawbacks of the prior art, and an object thereof is to provide a projection exposure apparatus with higher accuracy and higher throughput.

[Means for Solving the Problems] In the present invention, by moving a carriage mechanism, which integrally carries an original plate and an object to be exposed, along a guide mechanism, an image of the original plate is transferred via a projection optical system. In an exposure device that transfers to an exposed body, the carriage mechanism is moved before the transfer to detect a change in the positional deviation between the original plate and the exposed object at each position, and the carriage mechanism detects the change in the positional deviation during the transfer. When the image of the original plate is transferred to each of the group of exposed members while the posture is adjusted for correction, only a part of the group of exposed members is moved to the position before the transfer. The displacement of the carriage mechanism is adjusted during transfer and the posture of the carriage mechanism during transfer is adjusted based on the amount of displacement change detected for some of the exposed objects. I am trying to carry out the adjustment.

[Operations and Effects] Therefore, according to the present invention, the coordinate system of the y-axis in the scanning direction of the carriage mechanism and the x-axis in the perpendicular direction thereof, and the axis y ′ axis in the horizontal plane of the projection optical system and the x′-axis in the perpendicular direction thereof. Rotational deviation θ from the coordinate system and transfer magnification error are detected before transfer,
At the time of transfer, since the carriage mechanism is moved while adjusting the posture to perform exposure, it is possible to suppress the image surface distortion due to the rotation deviation θ and the transfer magnification error. Further, when detecting the above-mentioned rotation deviation, etc., the original plate in the actual process and the exposed object are used, and the standard original plate and the exposed object are not used.Therefore, it is necessary to correct the manufacturing error between the original plate in the actual process and the standard original plate. In addition, the throughput is not reduced by exchanging the original plate and the exposed body. further,
For one group, for example, one lot of exposed objects, the rotation deviation and the like are detected only for some exposed objects.
There is no reduction in throughput at this point. The exposed objects in one lot have similar habits such as image surface distortion, and if the rotational deviation is detected for only some exposed objects, the rotational deviation due to the carriage mechanism and the guide mechanism will be preceded. It is also possible to correct an overlay (alignment) error due to image plane distortion or the like generated in the process.

[Embodiment] FIG. 1 is a schematic configuration diagram of a reflection projection type exposure apparatus according to an embodiment of the present invention, in which condenser lenses are sequentially arranged along an optical path of a laser beam 1 emitted from a laser light source 60. 61,
A polygon mirror 62 is arranged.

Here, the laser light source 60, the condenser lens 61, and the polygon mirror 62, which are arranged in a direction orthogonal to the drawing (X direction), are shown rotated by 90 ° about the Z axis. Laser light
Is scanned in the X direction by the rotation of the polygon mirror 62.

Along the optical path of the laser light 1 reflected by the polygon mirror 62, the f / θ characteristic lens 63, a split prism 76 for splitting the laser light 1 into two in the X direction in order, and two half mirrors
64 (one is in the X direction perpendicular to the plane of the drawing, not shown, the same applies below), two objective lenses 65, a mask 66 having accurate alignment marks 101 (described later) at a plurality of locations, a reflection type projection optical system 67 , Accurate alignment marks on multiple places 10
A wafer 68 having 2 (described later) is arranged.

The mask 66 and the wafer 68 are integrally carried by a carriage 72, and the carriage 72 can be moved in the Y direction shown in the drawing along a fluid bearing guide 78 by a carriage driving mechanism 77. When the circuit pattern of the mask 66 is exposed on the wafer 68, it is illuminated by a slit-shaped light source (not shown) extending in the X direction from above the mask 66, and the carriage 72 moves.

Light reflected from the mask 66, the projection optical system 67, and the wafer 68 is reflected by the two half mirrors 64, and two condenser lenses 69 and two photoelectric conversion elements 70 are arranged along the optical path of the reflected light. The output of the photoelectric conversion element 70 is an arithmetic processing circuit.
Mask applied based on the output of photoelectric conversion element 70 applied to 71
The relative positional relationship between the 66 and the wafer 68 is detected, and the magnification and the tilt amount of the optical axis of the projection optical system 67 and the carriage scanning axis are calculated by a calculation formula described later, and the carriage drive mechanism 77,
The control valves 79 and 80 are controlled to adjust the tilt and magnification of the optical axis of the projection optical system 67 and the carriage scanning axis.

The arithmetic processing circuit 71 includes a central processing unit (CPU) 81 that controls the operation of the arithmetic processing circuit 71, a ROM 82 that stores a program of an operation sequence of the CPU 81, a RAM 83 that stores arithmetic processing data, and a photoelectric conversion element 70. A mark measurement circuit 84 that measures the distance between the marks on the mask 66 and the wafer 68 based on the output, a carriage drive circuit 85 that controls the carriage drive mechanism 77, drive data that sets the arithmetic processing data by converting it from a digital value to an analog value. A set circuit 86, a control valve drive circuit 87 for driving the control valves 79, 80,
And an input / output interface 88 and the like.

91 is a switch for setting the measurement and adjustment mode, 92 is a repeat measurement number input switch, 90 is these switches 91, 92
Is an operation panel to which is attached. Switch 91,9
2 is connected to the input / output interface 88 of the arithmetic processing circuit 71 so that the states of the switches 91 and 92 can be input to the CPU 81.

FIG. 2 is a schematic sectional view of the carriage 67 and the guide 78 of FIG. 1 as viewed from the left hand.

The arm 25 is levitated on the guide member 78 via an air bearing as a levitating element. 31 is an air bearing pad. This pad is connected to a high-pressure air source (not shown) to let out high-pressure air. The right arm 25 is provided with six pads vertically and horizontally, and the left arm is provided with two pads vertically.
Pads are provided. That is, the right air bearing forms an omnidirectional restraint bearing, and the left air bearing forms a vertical restraint bearing. Therefore, the left air bearing has lower rigidity in both the up-down direction and the left-right direction than the right air bearing. 50
Is a spherical seat provided on the left arm.

FIG. 3A is an alignment mark used for the mask 66 and the wafer 68, and includes patterns 101a, 101b, 101c, 101d.
The alignment mark 101 formed of the mask 66 is formed on the mask 66, and the alignment mark 102 formed of the patterns 102a and 102b.
Are formed on the wafer 68. Actually, as shown in FIG. 4, similar alignment marks are formed at 12 positions respectively. In FIG. 4, reference numerals 103 and 104 are visual alignment marks. One of the alignment marks 103 and 104 is formed on the mask 66 and the other is formed on the wafer 68.

The measurement and adjustment operations in the above configuration will be described. Referring to FIG. 1, a laser beam 1 emitted from a laser light source 60 is scanned by a polygon mirror 62 and is split into two in the X direction by a split prism 76. The two split lights pass through the half mirror 64 and travel toward the mask 66 and the like. The alignment mark 101 on the mask 66 and the alignment mark 102 on the wafer 68 are scanned by the laser light 1 through the optical system 67, and the scattered light from the marks 101 and 102 is scanned by the half mirror 64.
Where a part is reflected in the direction of the two photoelectric conversion elements 70. Alignment mark 101 on mask 66 and wafer 6
The alignment mark 102 of 8 and the alignment mark 102 of the mask 66 are superimposed on each other as shown in FIG.
The alignment mark 102a of the wafer 68 is present between 101a and 101b, the alignment mark 102b is located between the alignment marks 101c and 101d, and the laser beam 1 is scanned in the scanning direction A (X direction) from left to right. . And photoelectric conversion element 70
Indicates that the laser beam of FIG.
Pulsed light is detected at a position intersecting with 102, and an output voltage having a waveform as shown in FIG. 3B is generated. W ₁ ,
W ₂ , ..., W ₅ is the interval between pulse signals,
In the mark measuring circuit 84 of 71, this time interval W ₁ , W ₂ , ..., W ₅
Is measured to obtain the misalignment between the mask 66 and the wafer 68.

That is, when the deviation in the x direction in FIG. 3 (a) is Δx and the deviation in the y direction is Δy, Δx = (W ₁ −W ₂ + W ₄ −W ₅ ) / 4 ... (1) Δy = ( −W ₁ + W ₂ + W ₄ −W ₅ ) / 4 ……… (2). In the matched state, since W ₁ = W ₂ = W ₄ = W ₅ , both Δx and Δy are zero.

As shown in FIG. 4, the distance between the mask 66 and the wafer 68 in the x direction
Two alignment marks 101 and 102 separated by C ₁ are measured respectively, and the amount of misalignment is calculated by the equations (1) and (2).
The lateral (X direction) magnification Mx is given by the following equation, where the right-side mark displacement amount R ₁ is (Δx _R1 , Δy _R1 ) and the left-side mark displacement amount L ₁ is (Δx _L1 , Δy _L1 ).

Further, the alignment marks 101 and 102 at two positions separated by the distance D _{1 in the} Y direction are measured, and the alignment deviation amount R ₂ of the right mark is (Δx _R2 , Δy _R2 ) and the alignment deviation amount L ₂ of the left mark is (Δ
x _L2 , Δy _L2 ), the vertical (Y direction) magnification My is given by the following equation.

These calculations are performed by the CPU 81 of the calculation processing circuit 71.

FIG. 5 shows the relationship between the x ′ axis and the y ′ axis in the horizontal plane of the optical system 67 and the scanning direction y axis and the x axis of the carriage 72. In this case, image plane distortion occurs due to the angle θ formed by the x ′, y ′ axes of the optical system 67 and the scanning axes x, y. Arrows 51 in FIG. 5 indicate the direction and magnitude of transfer distortion at intervals of 10 mm on the transfer surface. At this time, the L-shaped pattern 52 as shown in FIG. 6 (a) is an image of the optical system 67, which is horizontally inverted on the wafer as shown in FIG. 6 (b), and is in the y-axis direction. The image of the pattern is inclined by the angle 2θ from the y ′ axis.

Next, returning to FIG. 4, the measurement of the angle θ will be described.

Two sets of alignment marks 101 and 102 in the lower part of the drawing in the X direction
When the laser light 1 is scanned in the direction A shown in the drawing such that the two are located on the optical axes of the two objective lenses 65, the two photoelectric conversion elements 70 and the arithmetic processing circuit 71 detect the matching state, and Matching deviation Δx _L1 , Δy _L1 , right deviation Δx
_R1 and Δy _R1 are obtained. Then, in response to a command from the arithmetic processing circuit 71, the carriage 72 is moved to Y via the carriage driving mechanism 77.
The distance D _{1 in the} direction, scan the laser beam 1 in the direction B in the drawing, and measure the alignment state of the other alignment marks 101 and 102. Similarly, the deviation amounts Δx _L2 , Δy _L2 , Δx _R2 , and Δy _R2
To get Here, the shift angle θx between the left and right of the alignment marks 101 and 102, which are separated by the distance C _{1 in} the X direction of the mask 66 and the wafer 68, is approximately represented by the following equation.

θx = (1 / 2C) ・ (Δy _L1 −Δy _R1 + Δy _L2 −Δy _R2 ) ... (5) Further, the alignment mark 10 is separated by the distance D _{1 in the} Y direction.
The vertical shift angle θy of 1, 102 is approximately represented by the following equation.

θy = (1 / 2D) · (ΔX _R1 −ΔX _L1 −ΔX _R2 −ΔX _L2 ) ... (6) These calculations are performed by the arithmetic processing circuit 71, and the control valve 79 is set to reduce this deviation angle. Adjust while the carriage is moving to eliminate transfer distortion error. The amount to be adjusted is θ = (θy−θx) · 1/2 (7), and θx is a misalignment component and a component in which the optical axis and the scanning axis are not parallel in the horizontal plane.

If the angle θ to be adjusted is obtained at a plurality of positions, the transfer distortion error can be solved more accurately.

7 (a), (b) and (c) are views showing another embodiment of the mechanism for adjusting the posture of the carriage according to the present invention, (a) being a front view and (b) being (a). ) E-E 'and F-
FIG. 3C is a side sectional view of a portion sandwiched by line F ′, and FIG. 7C is a plan view of FIG. Reference numeral 11 denotes a slide (moving table) which moves in the X direction in the figure, which is floated in the Z direction in the figure by four gas supply pads 13a, 13a ', 13b, 13b' with respect to a fixed guide 12. Reference numerals 14a, 14a ', 14b and 14b' are four minute displacement members which are respectively interposed between the slide 11 and the pads 13a, 13a ', 13b and 13b'. The members 14a, 14a ', 14b, 14
As b ', a piezoelectric element or a diaphragm member that expands and contracts by fluid pressure is used. 15a, 15a ', 15b, 15b' are four gas supply pads for restraining the slide 11 in the Y direction in the figure. 16a, 16a ', 16b, 16b' are four minute displacement members, which are respectively interposed between the slide 11 and the pads 15a, 15a ', 15b, 15b'.

8 (a) and (b) and FIGS. 9 (a) and (b),
FIG. 3 is a diagram exaggerating the behavior of the moving table during pitching and yawing, respectively, (a) shows the case where the control of the present invention is not performed, and (b) shows the case where the control is performed.

First, a method of controlling the attitude of the moving table during pitching will be described with reference to FIG. Table 11
The position in the straight-ahead direction and the straight-ahead accuracy are measured, and if there is an accuracy error, the position in the straight-ahead direction of the table 11 and the amount to be corrected are measured and calculated by the photoelectric detection element 70 and the arithmetic processing circuit 71. Then, in the actual control, the position of the table 11 in the straight traveling direction is detected by a position detector (not shown), and the amount to be corrected at that position is adjusted by the minute displacement members 14a, 14b, 14b, while the table 11 is moving. By controlling 14b ', the accuracy error measured in advance is corrected.

In FIG. 8 (a), the distance d ₁ between the pad and the guide 12 is constant unless the weight of the moving part such as a slide and the air supply pressure to the gas supply pads 13a, 13b, 13a ′, 13b ′ change. Therefore, the slide 11 makes a convex movement along the convex guide 12. Therefore, a pitching accuracy error of an angle of θ ₁ occurs. In FIG. 8 (b) for performing the control of the present invention, first, for example, the minute displacement members 14b, 14b 'attached to the rear pads 13b, 13b' so as to keep the distance between the pad and the guide at d ₁ at the movement start position. And the members 14b, 14b 'are contracted as they come closer to the center of movement, and after passing the center of movement, the minute displacement members 14a, 14a' attached to the front pads 13a, 13a 'are extended, thereby pitching. Attitude control is performed so that the accuracy error θ ₁ becomes zero.

When the shape of the guide 12 is concave, the method of controlling the minute displacement member performed when the guide 12 is convex (contraction and extension)
It should be obvious that the procedure can be reversed. Therefore, when the guide 12 has an uneven shape, it goes without saying that the above-described control methods for the convex shape and the concave shape may be combined.

Next, a method of controlling the attitude of the moving table during yawing will be described with reference to FIG. The figure shows a case where the guide 12 is curved to the right with respect to the straight traveling direction. Fig. 9 (a)
In the above, as long as the supply pressure to the gas supply pads 15a, 15b, 15a ′, 15b ′ does not change, the distance between the pads and the guide 12
Since d ₁ ′ is kept constant, the slide 11 moves along the shape of the guide 12. Therefore, a yawing accuracy error of θ ₁ ′ occurs. In FIG. 9 (b) in which the control of the present invention is performed, first, for example, a minute displacement member is used to keep the distance between the pad and the guide at the movement start position d '.
16a ′, 16b are extended and the member 1
By contracting 6a 'and 16b and extending the minute displacement members 16a and 16b' after passing the center of movement, attitude control is performed so that the yawing accuracy error θ ₁ ′ becomes zero.

Further, when the guide 12 is curved to the left with respect to the straight traveling direction, it is clear that the minute displacement member may be controlled in the opposite manner to the above case. Of course, it is only necessary to combine the control methods.

In the apparatus of FIG. 1, the switches 91 and 92 of the operation unit 90 can be used to set various operations for measuring and adjusting the transfer error between the mask and the wafer.

FIG. 10 is an explanatory diagram of the measurement / adjustment mode in the apparatus of FIG. Mode 1 is a conventional example and is described in the above-mentioned JP-A-60-1.
Similar to the device of No. 40826, this is a mode in which the amount of deviation is measured for each alignment and adjustment is made for each print. Modes 2 and 3 are designed to increase the throughput as compared to mode 1. In mode 2, only the first wafer is measured for misalignment during alignment, and adjustment is performed during printing. The data of the first sheet from the next wafer is stored in the memory, and the adjustment is performed using this data. As compared with the mode 1, the throughput is improved because the amount of deviation is measured once.

In mode 3, the amount of deviation is measured for each alignment by the number of times set by the switch 92 for setting the number of times of measurement, and adjustment is made for each printing. For each subsequent wafer, the average value of the data of the wafers measured one by one is calculated, and adjustment is performed according to the data. In this mode 3, by averaging the wafer data, the variation in the data for each wafer can be averaged, and thus the variation in the measured value can be suppressed.

These measurement / adjustment modes can be selected by switching the switch 91. The operation of the arithmetic processing circuit 71 shown in FIG. 1 will be described below.

The mark measuring circuit 84 of the arithmetic processing circuit 71 is a photoelectric conversion element 70.
Connected to the output of FIG. 3, the alignment mark intervals W _{1 to} W ₅ shown in FIG. 3B are measured, and the measured amount is calculated by the above-mentioned arithmetic expression and stored in the RAM 83. At the time of adjustment, the control valve is set in the drive data set circuit 86 based on this stored data.
By inputting the drive data of 79, 80, the control valve drive circuit 87 drives the control valves 79, 80 to control the attitude of the carriage 72.

The carriage drive circuit 85 drives the carriage drive mechanism 77.

This measurement and adjustment operation is controlled by the CPU 81 executing the operation sequence stored in the ROM 82.

The ROM 82 has an operation sequence in which the measurement / adjustment mode can be changed by the mode setting switch 91.

FIG. 11 is a flowchart showing that the measurement / adjustment operation is changed by the mode setting switch 91. Less than,
The operation will be described with reference to the flowchart. This operation is performed under the control of the CPU 81.

First, the setting state of the mode changeover switch 91 is input. If the setting is mode 1, the measurement and adjustment in mode 1 shown in FIG. 10 are performed. If it is Mode 2, measure and adjust Mode 2 in Fig. 10.

In mode 3, the repeat count input switch 92
Input the set value of and perform the measurement and adjustment of mode 3 in FIG.

In this way, the number of wafers to be measured in each mode and mode 3 shown in FIG. 10 is set.

As described above, according to this embodiment, since the transfer error is adjusted by using the actual mask and wafer, the measurement / adjustment mode can be selected by the switch.
By selecting the adjusting means depending on the wafer or process difference, it is possible to prevent the accuracy of the transfer error adjustment from being degraded. For example, when the alignment error (measurement error) is large, the averaging operation in mode 3 is effective. Also,
If the measurement stability is good depending on the wafer, the mode 2
The throughput can be improved by measuring only the first wafer in the lot by using, and then using the stored measurement data.

By allowing the measurement / adjustment mode to be selected depending on the process, the device can be effectively used.

[Modification of Embodiment] In the above-described embodiment, the method of actually using the mask and the wafer, that is, the measurement / adjustment mode is switched by a switch. However, the measurement data is automatically (automatically) or manually (manually) operated. It can be switched. That is, it is possible to prepare a manually set data circuit and manually set the adjustment amount by visually observing the alignment mark pattern in a wafer or process in which there are many alignment mark measurement errors.

Also, in addition to the operation sequence that automatically measures the deviation amount by alignment and automatically adjusts at the time of baking, if the baking operation is performed after the switch is pressed,
After the deviation amount is measured, the adjustment condition can be confirmed by inputting the adjustment data and attaching a sequence for confirming whether or not the deviation amount is correctly corrected.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a reflection projection type exposure apparatus according to an embodiment of the present invention, FIG. 2 is a schematic sectional view of a carriage mechanism of FIG. 1, and FIG. 3 is an alignment mark of a mask and a wafer. And FIG. 1 is an explanatory view showing the relationship between the photoelectric conversion element output and FIG. 1, FIG. 4 is a top view in which a mask and a wafer are superposed, and FIG. 5 is an explanatory view of a mask image transfer error on a wafer. FIG. 7 is an explanatory diagram of a transfer image from a mask to a wafer, FIGS. 7 to 9 are explanatory diagrams of a carriage adjustment mechanism, and FIG. 10 is an explanatory diagram of measurement / adjustment mode of the apparatus of FIG.
FIG. 11 is a flow chart showing the operation of the apparatus shown in FIG. 11: table, 12: guide, 13a, 13a ′, 13b, 13b ′, 15a, 15a ′, 15b, 15b ′: gas supply pad, 14a, 14a ′, 14b, 14b ′, 16a, 16a ′, 16b, 16b ′: Micro displacement member, 66: Mask, 67: Reflective projection optical system, 68: Wafer, 70: Photoelectric conversion element, 71: Arithmetic processing circuit, 72: Carriage mechanism, 77: Carriage drive mechanism, 78: Fluid bearing guide , 79, 80: Control valve, 81: Central processing unit (CPU), 83: RAM, 84: Mark measuring circuit, 85: Carriage drive circuit, 87: Control valve drive circuit, 101, 102: Alignment mark.

Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H01L 21/68 F 8418-4M

Claims (7)

[Claims] 1. A carriage mechanism for carrying an original plate and an object to be exposed and moving them along a guide mechanism to integrally scan the original plate and the object to be exposed with respect to a projection optical system, the original plate and the object to be exposed. Position detecting means for detecting the alignment state with the exposed body through the projection optical system, the carriage mechanism is positioned at each of a plurality of positions on the moving path, and the carriage is output based on the output of the position detecting means at that time. An arithmetic processing means for calculating the attitude adjustment amount at each position of the mechanism, a means for adjusting the attitude of the carriage mechanism based on the attitude adjustment amount, and an image of the original plate for each of the group of exposed members. At the time of transferring, the carriage mechanism is moved while performing the posture adjustment, and the posture adjustment amount calculation is performed for the exposed objects up to a predetermined number from the beginning and then the transfer is performed. A sequence control means for executing copying, and for executing the transfer on the basis of the attitude adjustment amount calculated for the predetermined number of exposed objects without executing the attitude adjustment amount calculation for the remaining exposed objects. And a projection exposure apparatus. 2. An original plate and an object to be exposed are a mask and a wafer for manufacturing a semiconductor circuit element.
The projection exposure apparatus according to the item. 3. An alignment mark is formed on each of the mask and the wafer at three or more places, and the position detecting means detects the alignment state between the corresponding alignment marks of the mask and the wafer. The projection exposure apparatus according to item 2 above. 4. A plurality of or a plurality of sets of the alignment marks are formed along a moving direction of the carriage mechanism, and the arithmetic processing means sequentially forms the alignment marks of each or each set of the projection optical system. 4. The projection exposure apparatus according to claim 3, wherein the position adjustment amount is calculated by sending the output of the position detection means to a predetermined position in the projection field of the above. 5. The sequence control means includes key input means for setting the number of exposed objects for performing posture adjustment amount calculation before the transfer, according to any one of claims 1 to 4.
The projection exposure apparatus according to any one of items 1 to 7. 6. The sequence control means switches the measurement / adjustment mode for switching the number of exposed objects for performing posture adjustment amount calculation before the transfer to 1, the number set by the key input means, and the total number. Claim 5 including means
The projection exposure apparatus according to the item. 7. The sequence control means includes a manual / automatic mode switching means for switching between a manual mode for manually inputting the posture adjustment amount and an automatic mode for automatically calculating by the arithmetic processing means. The projection exposure apparatus according to item 6 above.