JPH0662756U - Thin coil holding mechanism - Google Patents

Abstract

(57) [Abstract] [Purpose] Even if the substrate has a concave structure, the warpage phenomenon can be eliminated and a large number of coil turns can be obtained. [Structure] A substrate made of molded resin is formed with recesses for inserting a plurality of coils, and a wiring pattern for connecting the coils is arranged on the substrate. And the substrate 20,
21 are formed on both sides of the connection pattern 23, and recesses 22 are formed in both the substrates 20 and 21, respectively.
The thin coil 22 is inserted and arranged in the unit 2. [Effect] The warpage phenomenon that tends to occur on both sides is canceled out, and the flatness of the substrate can be maintained. Furthermore, since the thin coils are inserted and arranged in the recesses formed in both substrates, the number of coils can be doubled and the number of coil turns can be increased.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a thin coil holding mechanism for holding a thin coil arranged in a stator of a flat-opposed brushless motor, for example.

[0002]

[Prior art]

 A holding substrate of this type of thin coil is used for a stator of a flat-opposed brushless motor, and is constituted by arranging a plurality of flat thin coils configured for two-phase or three-phase driving on the substrate. ing. Then, the thin coils are excited by supplying a predetermined phase current to each of them, and the drive magnet of the rotor, which is opposed to the thin coils in a plane, is rotationally biased.

An example of the thin coil holding mechanism will be described. In FIG. 3, a plurality of recesses 4 are formed in the circumferential direction at regular intervals on the upper surface side of a substrate 8 made of a molding resin, and the bottom of each recess 4 contains the coil 3 inside. A contact land 6 is formed so as to be opposed to the peripheral surface. Further, a wiring pattern 7 is integrally provided on the lower surface side of the substrate 8 as shown in FIG. 4, and the coil 3 is attached to each of the recesses 4 by a method such as adhesion or press fitting.

In the coil 3, a copper foil having an insulating layer laminated on the surface thereof is wound around a core a predetermined number of times with an adhesive interposed, and after the adhesive is cured, the core is pulled out, It is obtained by cutting it with a predetermined width (0.4 to 1.0 mm). The coil 3 formed by this method is thin and has a high space factor. A sheet coil may be used as this type of coil.

Further, since the coil 3 is formed by winding copper foil, the terminals are located on the side surface of the central hole and the outer peripheral surface. Therefore, when the coil 3 is mounted on the molded substrate 8 and connected, the wiring pattern 7 to be described later is provided beforehand on the lower surface side of the substrate 8. That is, when the coil 3 is inserted and arranged in the concave portion 4 on the substrate 8, the winding end portion of the outer peripheral surface of the coil 3 is in contact with the outer peripheral surface of the concave portion 4, and the winding start portion of the side surface of the central hole portion of the coil 3 is , Touches the bonding land 6 protruding from the bottom surface of the recess 4.

Therefore, when the coil 3 is inserted and arranged in the concave portion 4 of the substrate 8 as shown in FIG. 3, the terminals of the wiring pattern 7 are formed so as to be located on the outer peripheral surface of the concave portion 4 and the bonding land 6. Keep it. Reference numeral 7a indicates a terminal of the connection pattern 7 formed on the joining land 6, and 7b indicates a terminal of the connection pattern 7 formed on the outer periphery of the recess 4. According to the connection pattern 7 as described above, the six coils are connected in a three-phase form.

In the connection pattern 7, the pattern plate for connecting the coil 3, the terminals 7a and 7b, the lead terminal 9 and the like are formed by punching a thin metal plate by stamping or the like. . Then, it is formed by inserting resin from one surface side of the connection pattern 7, and at the time of this molding, the plurality of coil-shaped recesses 4 are simultaneously formed. In FIG. 4, a printed layer 10 on which a coil pattern such as an F G coil or a PG coil is formed by printing is provided on the surface of the connection pattern 7. The print layer 10 does not necessarily have to be provided.

[0008]

[Problems to be solved by the device]

 However, in the above holding mechanism, the concave portion is formed on the upper surface side of the substrate, and the wiring pattern is integrally provided on the lower surface side of the substrate, and the coil is inserted into each concave portion. Therefore, when the coil is inserted and arranged in each recess, there is a problem that a curved warp phenomenon occurs on the side of the connection pattern as shown in FIG. In particular, this tendency occurs remarkably when heat is accumulated inside the recess when the coil is inserted into the recess and molded. Therefore, when the drive magnet is opposed to the upper surface of the coil, it may cause contact failure with the drive magnet.

The present invention has been made in order to solve such problems, and a thin coil which can eliminate the warp phenomenon even when the substrate has a recess structure and can obtain a large number of coil turns. An object is to provide a holding mechanism.

[0010]

[Means for Solving the Problems]

 The present invention provides a coil holding mechanism in which a recess for inserting each of a plurality of coils is formed in a substrate made of molded resin, and a connection pattern for connecting the coils is arranged on the substrate. It is characterized in that it is formed on both sides of the wiring pattern, and that recesses are formed in both of these substrates, and the coil is inserted and arranged in these recesses.

[0011]

[Action]

 The substrates are formed on both sides of the wiring pattern, and when the coils are inserted and arranged in the recesses formed in both the substrates, the warping phenomenon that occurs on both sides is offset and the flatness of the substrates is maintained. Furthermore, since the coils are inserted and arranged in the recesses formed in both substrates, the number of coils is doubled and the number of coil turns is increased.

[0012]

【Example】

 An embodiment of a thin coil holding mechanism according to the present invention will be described below with reference to the drawings. In FIG. 1, substrates 20 and 21 made of molded resin have connection patterns for connecting the thin coil 22 formed on both sides of the substrate 23. Recesses 24 and 25 are formed in these substrates 20 and 21, respectively. , 25, the thin coil 22 is inserted and arranged.

That is, the substrates 20 and 21 formed of the molding resin are provided with a plurality of recesses 24 and 25 facing outward and formed at a plurality of positions in the circumferential direction at regular intervals. At the bottom of each of the recesses 24 and 25, a bonding land (not shown) is formed so as to be opposed to the inner peripheral surface of the thin coil 22 as in the above-described example. Further, a connection pattern 23 is integrally provided between the two substrates 20 and 21, and the thin coil 22 is attached to the recesses 24 and 25 of the two substrates 20 and 21 by a method such as bonding or press fitting. It is attached.

The thin coil 22 is the same as the above-mentioned coil, but the thickness of each thin coil 22 is preferably 2 minutes if the overall axial dimension of the substrates 20 and 21 is reduced. The thickness of 1 is good. Also, in each of the thin coils 22 described above, the winding end portion of the outer peripheral surface is in contact with the outer peripheral surface of the recessed portions 24 and 25, and the winding start portion of the side surface of the central hole portion projects on the bottom surfaces of the recessed portions 24 and 25. It is formed so as to be in contact with the bonding land. Further, each terminal of the connection pattern 23 for connecting each thin coil 22 is formed so as to project to both the substrates 20 and 21 side. A lead terminal 26 is formed integrally with the connection pattern 23 and is led out to the outside.

As described above, when the substrates 20 and 21 in which the recesses 24 and 25 are formed on both sides of the connection pattern 23 are formed, if the substrates 20 and 21 have the same thickness, warpage in both directions is possible. Since the phenomena occur in the same way, the two cancel each other out, and the warpage phenomenon as a whole is suppressed. In some cases, the thicknesses of the substrates 20 and 21 may be made different and the thickness of the thin coil 22 may be made different, but even in this case, the warpage phenomenon can be reduced.

It should be noted that the above-described embodiment is merely an example, and the shapes of both substrates and the recess, and the shape of the thin coil inserted and arranged in the recess are arbitrarily changed according to the specifications of the motor used. You may. Further, the shape of the connection pattern can be variously changed within a range not departing from the gist of the present invention, such as appropriately setting.

[0017]

[Effect of device]

 As is clear from the above description, according to the thin coil holding mechanism of the present invention, the substrates are formed on both sides of the wiring pattern, and the coils are inserted and arranged in the recesses formed in both the substrates. Therefore, the warping phenomenon that is likely to occur on both sides is offset, and the flatness of the substrate can be maintained. Further, since the thin coils are inserted and arranged in the recesses formed in both substrates, there is an advantage that the number of coils can be doubled and the number of coil turns can be increased.

[0018]

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a holding mechanism for a thin coil according to the present invention.

FIG. 2 is a perspective view showing a conventional thin coil holding mechanism.

FIG. 3 is a back view showing the back surface of the holding mechanism.

FIG. 4 is a cross-sectional view showing the same holding mechanism.

FIG. 5 is a cross-sectional view showing a state of a warpage phenomenon as above.

[Explanation of symbols]

 20, 21 Substrate 22 Thin coil 23 Connection pattern 24, 25 Recess

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Katsuya Moriyama 14-888 Ako, Komagane-shi, Nagano Sanko Seiki Seisakusho Co., Ltd. Komagane factory (72) Inventor Isa Kitamura 14-888 Ako, Komagane-shi, Nagano Co., Ltd. Sankyo Seiki Seisakusho Komagane Factory

Claims (1)

[Scope of utility model registration request] 1. A coil holding mechanism in which a recess for inserting a plurality of coils is formed in a substrate made of molded resin, and a connection pattern for connecting the coils is arranged on the substrate, wherein the substrate is A holding substrate for a thin coil, which is formed on both sides of a wiring pattern, and has concave portions formed in both of the substrates, and the coil is inserted and arranged in the concave portions.