JPH0662546U - Heat sink for semiconductor element - Google Patents

Abstract

(57) [Abstract] [Purpose] A radiator in which a large number of heat dissipation pieces are erected on the side surface of a substrate, and a flat surface of a predetermined size is provided in a part of the surface including the end surface of the heat dissipation piece. Provide a radiator. A plurality of heat dissipating fins arranged in parallel on one side surface of the extruded mold material substrate 1 are separated along the extruding direction, and an upper surface is provided at an end portion of the plurality of dissipative heat dissipation pieces 2 in the separation heat dissipating piece 2. The flat plate member 3 is fixed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a radiator used for cooling ICs and other semiconductor elements.

[0002]

[Prior art]

 Conventionally, as a radiator used for cooling ICs and other semiconductor elements, a radiator having a structure in which a large number of heat radiating columns or heat radiating pieces are erected on the side surface of the substrate is known. When blowing air for cooling, the direction of the air does not matter and a high heat dissipation effect is obtained.

In the heat radiator having such a structure, an aluminum alloy plate is forged to form a large number of heat radiation columns, or a heat radiation fin of an aluminum alloy extruded die is cut in a direction perpendicular to the extrusion direction. By doing so, the continuous radiating fins are separated to produce a large number of radiating pieces.

[0004]

[Problems to be solved by the device]

 In the radiator as described above, there are cases where it is desired to form a flat surface in a part of the surface including the end surface of the heat dissipation column or the heat dissipation piece. For example, when mounting a radiator on a device, it is necessary to provide a vacuum suction surface by an assembly robot, or when printing and displaying the model name of a semiconductor element mounted on the radiator.

When manufacturing a radiator by forging to form such a flat surface, it is necessary to increase the thickness of any one of the radiation columns and secure a required area on the end face. It will be good.

However, since the forging process further restricts the standing density of the heat dissipation columns, there is a problem in that the required number of heat dissipation columns cannot be provided in terms of heat dissipation performance.

When manufacturing a radiator of this type from an extruded mold material, the thickness of the heat dissipation fins for forming the heat dissipation piece must be increased. There is a problem that the heat radiating piece is not provided.

[0008]

[Means for solving the problem]

 The present invention has been made in view of the above problems, and is a radiator in which a large number of heat dissipation pieces are erected on the side surface of a substrate, and a part of the surface including the end surface of the heat dissipation piece is It is intended to provide a radiator having a structure in which a flat surface of a predetermined size is provided.

In the radiator of the present invention which achieves such an object, a plurality of heat radiation fins arranged in parallel on one side surface of a substrate made of extruded material are separated along the extrusion direction, and a plurality of separated heat dissipation pieces are provided. It is characterized in that a plate member having a flat upper surface is fixed to the end portion of the separate heat dissipation piece.

The plate member may be a box body having an opening at the bottom, and fitted and fixed to the end portions of the plurality of separated heat dissipation pieces. Further, it is also possible to use a mold material in which grooves are formed on the lower surface at the same intervals as the heat radiation fins, and the grooves are fitted and fixed to the ends of the separate heat radiation pieces.

The fixing can be performed by a mechanical caulking structure, or by means of adhesion or brazing.

[0012]

[Action]

 According to the radiator of the present invention, the standing density required for the radiator can be secured, and the radiator can be provided with the flat surface as the suction surface or the display surface.

[0013]

【Example】

 FIG. 1 shows a radiator according to an embodiment of the present invention, in which a large number of heat radiating pieces 2, 2 are erected in a grid pattern on the upper surface of a rectangular substrate 1. Of the large number of heat dissipation pieces 2, 2, the opening side of a plate member 3 formed of a rectangular box with an open lower part is fitted to the ends of the heat dissipation pieces 2, 2 at the central portion. The outer surface of the bottom plate of the constructed box body is a square flat surface 4.

The radiator of the above embodiment is manufactured as shown in FIGS. 2 (a), 2 (b) and 2 (c). That is, as shown in (b), the extruded mold material 6 made of aluminum alloy, in which the heat radiation fins 5 and 5 are arranged side by side on the upper surface of the substrate 1 shown in (a), is cut into a predetermined length and released. Grooves 8 and 8 are formed in the heat fins 5 and 5 in a direction perpendicular to the extrusion direction (the direction of arrow 7 in (a)) by cutting, and the heat radiation fins 5 and 5 are separated into the heat dissipation pieces 2 and 2. The heat dissipating member 9 is used. Next, as shown in (c), the plate member 3 made of a rectangular box formed by molding an aluminum alloy plate is fitted to the heat radiating pieces 2 and 2 in the central portion of the heat radiating member 9. .

The plate member 3 and the heat dissipating pieces 2 and 2 may be fitted and fixed by mechanical caulking with the inner dimension of the plate member 3 being smaller than the outer dimension of the heat dissipating pieces 2 and 2. However, the plate member may be fixed with an adhesive, or the plate member may be molded from a brazing sheet and fixed to the heat radiating pieces 2 and 2 by brazing.

The plate member 3 can also be an aluminum alloy mold material as shown in FIG. The plate member 3 is a mold member having a flat surface 4 on the upper surface and grooves 10 and 10 formed on the lower surface at the same intervals as the heat radiation fins 5 to match the thickness of the heat radiation fins 5. , Cut into a predetermined length, align the grooves 10, 10 with the heat dissipation pieces 2, 2 of the heat dissipation member 9, and fit them. In this case, the heat dissipating piece 2 and the plate member 3 may be fixed to each other by caulking, bonding, or brazing.

The shape and size of the flat surface 4 of the plate member 3 are not limited to those in the embodiment, and are set according to the purpose of installing the flat surface 4. Further, the installation position may be the central portion of the heat dissipation member 9 or another portion such as an edge portion. The flat surface 4 can be made white or black by alumite processing.

Further, the heat dissipating fins 5 for separating the heat dissipating pieces 2 were separated by cutting the groove 8 in a direction perpendicular to the extruding direction, but the cutting direction of the groove 8 is limited to the right angle to the extruding direction. Not a thing. If the radiating fins 5 are cut in a direction that forms an angle with the extruding direction, the radiation fins 5 can be separated along the extruding direction.

[0019]

[Effect of device]

 As described above, according to the present invention, there is provided a radiator having a high heat dissipation performance and having a flat surface that can be used as a suction surface or a print display surface in the surface including the end surface of the heat dissipation piece. There is an effect

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention.

2A is a perspective view of a mold material used in the embodiment, FIG. 2B is a plan view of a heat dissipation portion manufactured from the mold material, and FIG. 2C is an enlarged cross-sectional view of a portion to which a plate member is fixed.

FIG. 3 is an enlarged sectional view of a portion of a plate member according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Heat dissipation piece 3 Plate member 4 Flat surface 5 Heat dissipation fin 6 Extruded material 8 Groove 9 Heat dissipation member 10 Groove

Claims (3)

[Scope of utility model registration request] 1. A plurality of heat dissipating fins arranged in parallel on one side surface of an extruded material substrate are separated along the extruding direction, and the upper surface of the separating heat dissipating piece is flat at the end portions of the plurality of separating heat dissipating pieces. A heat sink for a semiconductor element, characterized in that a plate member is fixed. 2. The plate member is a box body having a lower opening, and is fitted to the end portions of the plurality of separated heat radiation pieces.
A heat sink for a semiconductor device as described above. 3. The semiconductor device according to claim 1, wherein the plate member is a mold member having a groove formed on the lower surface at the same intervals as the heat radiation fins, and the groove is fitted to an end of the separate heat radiation piece. Radiator.