JPH0658986A - Semiconductor test system - Google Patents

Abstract

PURPOSE:To realize a semiconductor test system being employed in the final test of semiconductor IC in which the type of IC or IC socket can be altered without requiring positional adjustment of IC detecting sensor. CONSTITUTION:In the semiconductor test system comprising at least a handler measuring section 10 to be connected with a test head, and a measuring board 8 having an IC socket 2 and being employed in final test of a semiconductor IC 1, an optical fiber 12 for detecting presence/absence of the IC 1 at the handler measuring section 10 is disposed on the IC socket 2 side.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor tester used in a final test of a semiconductor IC. More specifically, the present invention relates to a semiconductor test apparatus that has a sensor for detecting the presence or absence of an IC on an IC socket in a measuring section and can prevent a handling error.

In order to measure the electrical characteristics of a conventional IC in the final test process, a semiconductor test apparatus as shown in FIG. 3 is used, and a measuring section of the IC measuring apparatus (hereinafter referred to as IC tester) 31. The IC is supplied to and mounted on the IC socket 2 provided in the above by a handling device (hereinafter referred to as a handler) 33, and measurement is performed. Particularly in recent years, the number of SMD type (surface mount type) ICs 1 as shown in FIG. 4 has increased, and when measuring this, the method of pressing the SMDIC against the contactor 3 on the IC socket 2 in the figure is used. It is common.

As a handling method for supplying / removing the SMD type IC to / from the IC socket, a vacuum suction method is usually used. The vacuum adsorption method is
Although it has various advantages such as a simple mechanism, on the other hand, there is a high rate of handling mistakes in the IC due to a decrease in the suction force due to wear and dirt of the components, or the IC being caught in the IC socket.

In particular, if the IC is left unhandled on the IC socket due to a handling error, it is necessary to equip a sensor for checking whether or not the IC is present on the IC socket in order to determine that the handler is abnormal. There is. However, the handling part and the heating mechanism are becoming more and more complicated because the measuring part of the handler is compatible with various types, and IC sockets also have various shapes depending on the type, so stable detection is possible at the above-mentioned location. Equipped with a sensor that can do is a very difficult task. Therefore, there are not many handlers equipped with a sensor that can confirm the presence or absence of an IC at the IC socket. In addition, even if they are equipped, most of them are not efficient in operation due to limited product types and frequent adjustments.

In the case of a handler that is not equipped with the above-mentioned confirmation sensor, the operator visually confirms and releases it when a handling error occurs. However, the measuring unit is complicated and difficult to see, so the operator mistakenly makes a mistake. The handler may be restarted without removing the IC from the IC socket. Then, the handler supplies the IC to be measured next to the IC socket, and thus the measurement is performed in a state where two ICs are overlapped on the IC socket, which causes destruction of the IC and leakage of the unmeasured IC. . Such a problem is I
In order to secure the reliability of C, it must be prevented beforehand.

[0006]

2. Description of the Related Art FIG. 5 shows an IC in a conventional IC socket section.
The presence / absence detection method is shown. Normally, as the structure of the measuring unit, the IC socket 2 is attached to the measuring board 8 via an adapter such as a socket base 9, and these become one jig, and the test head 3 of the IC tester
It is attached to 2. The IC socket 2 mounted on the test head 32 is docked with the IC socket 2 so that the IC socket 2 and the IC socket 2 fit into the measurement unit 10 of the handler. Then, the presence or absence of the IC 1 in the IC socket portion is detected by the sensor 12 attached to the measuring portion 10 of the handler.

[0007]

In the above-mentioned conventional IC presence / absence detection method, the position of the sensor 12 must be adjusted when the shape and height of the IC socket 2 and the thickness of the IC vary depending on the type. Since the sensor 12 is located inside the measurement unit 10 of the handler, the mechanism becomes complicated due to the interaction with the handling mechanism and the adjustment of the sensor 12 becomes difficult. Stable operation cannot be expected.

The present invention is intended to realize a semiconductor test apparatus which does not require adjustment of the position of the IC detection sensor when changing the product type, regardless of the type of IC or IC socket.

[0009]

According to the semiconductor test apparatus of the present invention, the handler measuring section 10, the measuring board 8 attached to the test head, and the socket board 9 are mounted on the measuring board. IC socket 2 and the socket 2
An optical fiber sensor 12 for detecting whether or not there is an IC 1 above, and in a semiconductor test apparatus used for a final test of a semiconductor IC, the optical fiber sensor 12 is provided on the IC socket 2 side. It is characterized by

In addition to the above, the optical fibers 5 and 5'of the optical fiber sensor 12 are further relayed without contact with the optical fibers 4 and 4 '. In addition to that, the optical fibers 4 and 4'after the relay are fixed to the handler measuring section 10 side. By adopting this configuration, it is possible to obtain a semiconductor test apparatus that does not require adjustment of the position of the IC detection sensor when changing the product type, regardless of the type of IC or IC socket.

[0011]

In the present invention, as shown in FIG. 1, the light emitting portion 12a and the light receiving portion 12b of the optical fiber sensor 12 are directly mounted on the IC socket 2 provided on the side of the measurement board. If the light reaches the light receiving portion 12b, there is no IC on the IC socket 2, and if the light is blocked, I
It is determined that C exists. Further, when the product type is switched, the optical fiber sensor 12 is replaced together with the measurement board 8 while being mounted on the IC socket 2, so that it is not necessary to adjust the position of the optical fiber sensor 12 with respect to the IC socket 2 one by one. Further, since the optical fiber is non-contact relayed, only the necessary amount of optical fiber is added to the measurement board 8 side, so that the mechanism is not complicated.

[0012]

FIG. 1 is a diagram showing an embodiment of the present invention. In the figure, 32 is a test head, 10 is a handler measuring unit, and 11 is a suction arm capable of sucking and moving the SMD type IC 1. And the measurement board 8 is attached to the stet head 32.
Is attached to the measurement board 8, and a socket base 9 on which the IC socket 2 is mounted is attached to the measurement board 8. Also IC
A light emitting portion 12a and a light receiving portion 12b of an optical fiber sensor 12 for detecting whether or not an IC is present on the socket 2 are attached to the socket 2 so as to face each other. Further, the optical fibers 5, which are emitted from the light emitting portion 12a and the light receiving portion 12b,
The tip of 5'is fixed to one end of the socket base 9 by a fixing bracket 6.

A guide hole 13 is provided in the handler measuring section 10, and a guide pin 14 provided in the socket base 9 can be fitted to position the IC socket 2 with respect to the handler measuring section 10. It is like this. An amplifier 7 is attached to the handler measuring unit 10, and one ends of the optical fibers 4 and 4 ′ for emitting and receiving light emitted from the amplifier 7 are connected to the optical fibers 5 and 5 ′ fixed to the socket base 9. It faces each other and is fixed by a fixing member 6 '. A condenser lens 15 is arranged at the end of each optical fiber 4, 4 ', 5, 5'.

The operation of this embodiment thus constructed will be described with reference to FIGS. 1 and 2. First, as shown in FIG. 1, in a state where the handler measuring unit 10 and the IC socket 2 are docked, after confirming that the optical fiber sensor 12 has no IC on the IC socket 2, the suction arm 11
The IC 1 is fitted in the socket 2. The characteristics of the IC 1 fitted in the socket 2 are inspected by the IC tester via the test head 32.

Next, the function of the optical fiber sensor will be described with reference to FIG. In FIG. 2A, the detection light emitted from the amplifier 7 is transmitted through the optical fiber 4 on the amplifier side and the optical fiber 5 on the light emitting portion side as indicated by the arrow, and detected from the bending lens provided in the light emitting portion 12a at the tip. Irradiate toward the object. When there is no detection object, the light reaches the light receiving portion 12b,
It is transmitted through the optical fibers 5'and 4'on the light receiving side, taken into the amplifier 7, and converted into an electric signal. When there is a detection object, the light is blocked by the detection object and does not reach the light receiving unit 12b. As a result, the presence or absence of an IC on the IC socket is detected.

The problem here is that the optical fibers 4 and 5 are
Between the optical fibers 5'and 4'in a non-contact state, the detection light is transmitted in the non-contact state as shown in FIG. The detection light emitted from the optical fiber 4 is diffused, and a sufficient amount of light cannot be transmitted to the optical fiber 5. At the same time, the diffused detection light is reflected by surrounding parts, and this reflected light is reflected by the light receiving portion side. The optical fiber receives the light, resulting in erroneous detection.
Therefore, in this embodiment, as shown in FIG. 2A, the condenser lenses 15 are respectively provided at the ends of the optical fibers 4, 4'and 5, 5 '.
By mounting the light source, the light is condensed as shown in FIG.

In this embodiment described above, the optical fiber sensor 12 for detecting the presence or absence of the IC on the socket 2 is attached to the socket 2 side, so that the optical fiber sensor 12 is fixed to the socket 2 when the type is changed. Since the measurement board 8 is replaced as it is, it is not necessary to adjust the optical fiber sensor 12 each time. Further, since the amplifier 7 side of the optical fiber sensor 12 is fixed to the handler measuring unit 10 and the light is transmitted in a contactless manner during that period, the connection of the signal line or the like between the measuring board 8 and the handler becomes unnecessary at all. Conversion of the measurement board 8 becomes extremely easy.

[0018]

According to the present invention, highly accurate and reliable detection can be performed in the method of checking the presence / absence of an IC in the measuring section. As a result, the reliability of the IC can be improved and the operating rate of the device can be improved.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is a diagram for explaining the operation principle of the sensor in the example of the present invention.

FIG. 3 is a diagram showing a conventional semiconductor test apparatus.

FIG. 4 is a diagram showing a conventional SMD type IC and an IC socket.

FIG. 5 is a diagram for explaining a conventional IC presence / absence detection method.

[Explanation of symbols]

 1 ... SMD type IC 2 ... IC socket 3 ... Contactor 4, 4 ', 5, 5' ... Optical fiber 6, 6 '... Fixing metal fitting 7 ... Amplifier 8 ... Measuring board 9 ... Socket stand 10 ... Handler measuring part 11 ... Adsorption arm 12 ... Optical fiber sensor 12a ... Light emitting part 12b ... Light receiving part 13 ... Guide hole 14 ... Guide pin 15 ... Condensing lens

Claims (3)

[Claims] 1. A handler measuring unit (10), a measuring board (8) attached to a test head, an IC socket (2) mounted on the measuring board via a socket base (9), and the socket. (2) An optical fiber sensor (12) for detecting whether or not the IC (1) is present, and a semiconductor test device used for a final test of a semiconductor IC, comprising: ) Is provided on the IC socket (2) side. 2. An optical fiber (4, 4 ') at the tip of the optical fiber (5, 5') of the optical fiber sensor (12).
2. The semiconductor test device according to claim 1, wherein the semiconductor test device is relayed in a non-contact manner. 3. The semiconductor test apparatus according to claim 1, wherein the optical fiber (4, 4 ') after the relay is fixed to the handler measuring section (10) side.