JPH065650A - Wire bonding device - Google Patents
Wire bonding deviceInfo
- Publication number
- JPH065650A JPH065650A JP4182945A JP18294592A JPH065650A JP H065650 A JPH065650 A JP H065650A JP 4182945 A JP4182945 A JP 4182945A JP 18294592 A JP18294592 A JP 18294592A JP H065650 A JPH065650 A JP H065650A
- Authority
- JP
- Japan
- Prior art keywords
- ball
- discharge
- ball diameter
- diameter
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ワイヤボンディング装
置に関し、特にキャピラリ先端から突出したワイヤとト
ーチ電極との間の放電により形成されるボールの大きさ
を制御し得るワイヤボンディング装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus, and more particularly to a wire bonding apparatus capable of controlling the size of a ball formed by discharge between a wire protruding from the tip of a capillary and a torch electrode.
【０００２】[0002]
【従来の技術】ワイヤボンディング装置にあっては、キ
ャピラリ先端から突出したワイヤとトーチ電極との間で
放電を生じさせてワイヤ先端にボールを形成し、このボ
ールを半導体ペレットの電極に接合後、ワイヤを導出さ
せつつキャピラリをリードフレームのリード上に移動さ
せ、そしてリード上にワイヤを接合することにて、電極
とリードとを電気的に接続する。2. Description of the Related Art In a wire bonding apparatus, a discharge is generated between a wire protruding from the tip of a capillary and a torch electrode to form a ball at the wire tip, and after the ball is bonded to an electrode of a semiconductor pellet, The electrode and the lead are electrically connected by moving the capillary onto the lead of the lead frame while pulling out the wire and bonding the wire onto the lead.
【０００３】ところで、放電によって形成されるボール
の大きさは、ボンディング状態の良否に多大な影響を与
える。すなわち形成されたボール径が所望する所定ボー
ル径より小さい場合、電極とワイヤとの間に充分な接合
力が得られずにボンディング不良となり、逆に所定ボー
ル径より大きい場合、ボンディング時にキャピラリによ
って押し潰されたボールが電極からはみ出し、ショート
不良の原因となる。By the way, the size of the ball formed by the discharge has a great influence on the quality of the bonding state. That is, if the formed ball diameter is smaller than the desired predetermined ball diameter, sufficient bonding force cannot be obtained between the electrode and the wire, resulting in defective bonding. Conversely, if the formed ball diameter is larger than the predetermined ball diameter, it is pushed by the capillary during bonding. The crushed ball will stick out from the electrode and cause a short circuit defect.
【０００４】そこで従来は、放電によって形成されるボ
ール径が設定した所定ボール径になるように、放電条件
を次のようにして設定していた。Therefore, conventionally, the discharge condition is set as follows so that the diameter of the ball formed by the discharge becomes the set predetermined ball diameter.
【０００５】まず任意の放電条件によりワイヤとトーチ
電極との間に放電を生じさせ、ワイヤ先端にボールを形
成する。次にこのボールを作業者がピンセットを用いて
摘み出し、顕微鏡まで移送して検査台上に載置する。作
業者はここで顕微鏡の視野内に刻まれた目盛りを頼りに
ボール径を測定し、所定ボール径との差を求める。次に
求めた差に基づき、この差を補正するように放電条件の
修正をマニュアルで行なう。そして修正後の放電条件で
ワイヤ先端に再度ボールを形成し、上記と同様な手順に
てボール径の測定を行なう。そして、測定結果が許容値
内にあれば放電条件の設定作業を終了するが、許容値か
ら外れた場合には、許容値内となるまでこの作業を繰り
返す。First, a discharge is generated between the wire and the torch electrode under arbitrary discharge conditions to form a ball at the tip of the wire. Next, an operator picks up this ball using tweezers, transfers it to the microscope, and places it on the inspection table. Here, the operator measures the ball diameter by relying on the scale marked in the field of view of the microscope, and obtains the difference from the predetermined ball diameter. Next, based on the obtained difference, the discharge condition is manually corrected so as to correct this difference. Then, a ball is formed again at the tip of the wire under the corrected discharge conditions, and the ball diameter is measured by the same procedure as above. Then, if the measurement result is within the allowable value, the discharge condition setting operation is ended, but if the measured result is outside the allowable value, this operation is repeated until it is within the allowable value.
【０００６】[0006]
【発明が解決しようとする課題】ところが上記した放電
条件の設定作業にあっては、ボール径が許容値内となる
まで、通常数回にわたるボール径の測定及び放電条件の
修正が必要であり、その度に作業者がピンセットを用い
てボールを摘み出し、ワイヤボンディング装置とは別装
置である顕微鏡でボール径の測定を行なうという非効率
的な作業を強いられていた。このため放電条件の設定に
多大な時間を要し、円滑なボンディング作業の妨げとな
っていた。However, in the above-mentioned discharge condition setting work, it is usually necessary to measure the ball diameter several times and correct the discharge condition until the ball diameter falls within the allowable value. Each time, the operator picked up the ball using tweezers and was forced to perform the inefficient work of measuring the ball diameter with a microscope which is a device different from the wire bonding device. Therefore, it takes a lot of time to set the discharge conditions, which hinders smooth bonding work.
【０００７】本発明は、迅速に放電条件設定が行なえる
ワイヤボンディング装置を提供することを目的とする。It is an object of the present invention to provide a wire bonding apparatus that can quickly set discharge conditions.
【０００８】[0008]
【課題を解決するための手段】本発明は、トーチ電極を
有し、このトーチ電極とキャピラリ先端より突出したワ
イヤとの間で放電を生じさせ、前記ワイヤの先端にボー
ルを形成するワイヤボンディング装置において、ａ．前
記放電によって形成されたボールの径を測定するボール
径測定手段と、ｂ．所望する所定ボール径を記憶する記
憶手段と、ｃ．前記ボール径測定手段が測定したボール
径と前記記憶手段に記憶された所定ボール径とを比較す
る比較手段と、ｄ．この比較手段における比較結果に基
づき、次回放電時、前記測定したボール径が前記所定ボ
ール径に近づく方向に、形成されるボール径の大小の要
因となる、放電時に印加する電流、放電時間、前記キャ
ピラリ先端からの前記ワイヤの突出長の少なくとも１つ
を修正する放電条件設定手段と、を設けるようにしたも
のである。According to the present invention, there is provided a wire bonding apparatus having a torch electrode, which causes a discharge between the torch electrode and a wire protruding from the tip of the capillary to form a ball at the tip of the wire. At a. Ball diameter measuring means for measuring the diameter of the ball formed by the discharge; b. Storage means for storing a desired predetermined ball diameter, c. Comparing means for comparing the ball diameter measured by the ball diameter measuring means with a predetermined ball diameter stored in the storage means; d. Based on the comparison result by the comparison means, at the time of the next discharge, in the direction in which the measured ball diameter approaches the predetermined ball diameter, it becomes a factor of the size of the formed ball diameter, the current applied during discharge, the discharge time, the Discharge condition setting means for correcting at least one of the protruding lengths of the wires from the tip of the capillary.
【０００９】[0009]
【作用】本発明によれば、放電によって形成されたボー
ルの径がボール径測定手段によって測定され、この測定
値と記憶手段に記憶された所定ボール径とが比較手段で
比較される。そして放電条件設定手段は、比較手段の比
較結果に基づき、次回放電時に、前記測定したボール径
が所定ボール径に近づく方向に、放電時に印加する電
流、放電時間、前記キャピラリ先端からの前記ワイヤの
突出長の少なくとも１つを修正する。According to the present invention, the diameter of the ball formed by the discharge is measured by the ball diameter measuring means, and this measured value is compared with the predetermined ball diameter stored in the storage means. Then, the discharge condition setting means, based on the comparison result of the comparison means, at the time of the next discharge, in the direction in which the measured ball diameter approaches the predetermined ball diameter, the current applied during discharge, the discharge time, the wire from the tip of the capillary. Modify at least one of the overhang lengths.
【００１０】[0010]
【実施例】本発明の第１実施例を図１乃至図３を用いて
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS.
【００１１】図１は本発明の第１実施例であるワイヤボ
ンディング装置の構成図、図２は図１に示したワイヤボ
ンディング装置におけるボール径の測定状態を示す図、
図３はボール径の測定手順を示す図である。FIG. 1 is a block diagram of a wire bonding apparatus according to a first embodiment of the present invention, and FIG. 2 is a view showing a ball diameter measurement state in the wire bonding apparatus shown in FIG.
FIG. 3 is a diagram showing a procedure for measuring the ball diameter.
【００１２】図１において、ワイヤボンディング装置１
は、前工程にて半導体ペレット２がマウントされたリー
ドフレーム３を搬送案内する一対のガイドレール４を有
し、このガイドレール４の側方にはガイドレール４の搬
送方向及びそれと直交する方向に移動自在のＸＹテーブ
ル５が配置され、このＸＹテーブル５上にボンディング
ヘッド６が載置されている。ボンディングヘッド６に
は、ワイヤ７を挿通するキャピラリ８を先端部に装着し
たボンディングアーム９と、トーチ電極１０とが支持さ
れる。このボンディングアーム９は、不図示のアーム駆
動機構により上下動させられ、またトーチ電極１０は、
放電時、不図示のトーチ駆動機構によりその先端部がキ
ャピラリ８の直下に位置させられるようになっており、
後述の制御装置１４の制御下で作動する放電条件設定部
１１が接続される。なお本実施例において放電条件設定
部１１は、トーチ電極１０とワイヤ７間での放電時に流
れる電流を制御するものである。またボンディングヘッ
ド６には、カメラ１２が固定支持される。このカメラ１
２は、キャピラリ８の上方に位置されてリードフレーム
３上を撮像可能とされ、公知のごとくボンディング点の
位置ずれの検出に用いられるとともに、後述するように
ワイヤ先端に形成されたボール７ａの径測定にも用いら
れる。そしてカメラ１２からの画像信号は画像処理部１
３で処理され、制御装置１４を介して、モニタ１５に表
示されるようになっている。制御装置１４は、記憶部１
６、演算部１７及び操作パネル１８を有し、記憶部１６
には所望する所定ボール径（以下所定ボール径という）
とその許容値が予め設定される。また制御装置１４は、
ＸＹテーブル５、ボンディングヘッド６に駆動信号を送
り、その動作制御を行なう。In FIG. 1, a wire bonding apparatus 1
Has a pair of guide rails 4 that guide and guide the lead frame 3 on which the semiconductor pellets 2 are mounted in the previous step. To the side of the guide rails 4, there are a guide direction of the guide rails 4 and a direction orthogonal thereto. A movable XY table 5 is arranged, and a bonding head 6 is placed on the XY table 5. The bonding head 6 supports a bonding arm 9 having a capillary 8 for inserting a wire 7 at its tip and a torch electrode 10. The bonding arm 9 is moved up and down by an arm driving mechanism (not shown), and the torch electrode 10 is
At the time of discharge, the tip portion of the torch drive mechanism is positioned directly below the capillary 8 by a torch drive mechanism (not shown).
A discharge condition setting unit 11 that operates under the control of a control device 14 described later is connected. In the present embodiment, the discharge condition setting unit 11 controls the current flowing between the torch electrode 10 and the wire 7 during discharge. A camera 12 is fixedly supported on the bonding head 6. This camera 1
2 is located above the capillary 8 and is capable of capturing an image on the lead frame 3, and is used for detecting the displacement of the bonding point as is well known, and the diameter of the ball 7a formed at the tip of the wire is described later. Also used for measurement. The image signal from the camera 12 is the image processing unit 1
3 and is displayed on the monitor 15 via the control device 14. The control device 14 includes the storage unit 1.
6, a calculation unit 17 and an operation panel 18, and a storage unit 16
Is the desired prescribed ball diameter (hereinafter referred to as the prescribed ball diameter)
And its allowable value are set in advance. Further, the control device 14
A drive signal is sent to the XY table 5 and the bonding head 6 to control the operation thereof.
【００１３】次に作動について説明すると、放電により
所定ボール径のボールを形成するため、放電条件の設定
作業が次の手順で行なわれる。 （ａ）経験値などに基づいて任意の放電条件を操作パネ
ル１８により設定し、ワイヤ７とトーチ電極１０との間
に放電を生じさせ、ワイヤ７の先端にボール７ａを形成
する。 （ｂ）ピンセットなどを用いてボール７ａが形成された
ワイヤ７をキャピラリ８の先端より少し繰り出して横に
曲げ、この状態でキャピラリ８を下動させ、図２に示す
ようにリードフレーム３上の不要部位に捨てボンディン
グする。 （ｃ）操作パネル１８に設けられた不図示のチェスマン
を操作してＸＹテーブル５を移動させ、カメラ１２をボ
ール７ａ上に移動させる。ここでカメラ１２はボール７
ａを撮像する。そして撮像されたボール７ａの画像は画
像処理部１３で処理され、モニタ１５に表示される。ま
たモニタ１５の画面には、カメラ１２の視野中心を示す
レチクルＲ（図３参照）も同時に表示される。 （ｄ）チェスマンを操作してカメラ１２を移動させ、レ
チクルＲをまずボール画像の−Ｘ方向の端辺Ａに合わ
せ、操作パネル１８に設けた不図示のポイント指定ボタ
ンを押圧する。この後、再度チェスマンを操作すること
にて、レチクルＲをボール画像の＋Ｘ方向の端辺Ｂに合
わせ、ポイント指定ボタンを押圧する。Next, the operation will be described. In order to form a ball having a predetermined ball diameter by electric discharge, the work of setting the electric discharge condition is performed in the following procedure. (A) An arbitrary discharge condition is set by the operation panel 18 based on an empirical value or the like to cause discharge between the wire 7 and the torch electrode 10 to form a ball 7a at the tip of the wire 7. (B) Using a tweezers or the like, the wire 7 on which the ball 7a is formed is slightly extended from the tip of the capillary 8 and bent laterally. In this state, the capillary 8 is moved downward, and as shown in FIG. Discard and bond to unnecessary parts. (C) A chessman (not shown) provided on the operation panel 18 is operated to move the XY table 5, and the camera 12 is moved onto the ball 7a. Here the camera 12 is the ball 7
Image a. Then, the imaged image of the ball 7 a is processed by the image processing unit 13 and displayed on the monitor 15. A reticle R (see FIG. 3) indicating the center of the visual field of the camera 12 is also displayed on the screen of the monitor 15. (D) The chessman is operated to move the camera 12, the reticle R is first aligned with the edge A in the −X direction of the ball image, and a point designation button (not shown) provided on the operation panel 18 is pressed. Then, by operating the chessman again, the reticle R is aligned with the edge side B in the + X direction of the ball image, and the point designation button is pressed.
【００１４】ところで記憶部１６には、ポイント指定ボ
タンの押圧時におけるＸＹテーブル５の位置座標がそれ
ぞれ記憶される。そして２回目の位置合わせが終了する
と、演算部１７においては、端辺Ａ、Ｂの座標に基づい
て両者間の距離ｘ、すなわちボール径を算出し、さらに
算出されたボール径と記憶部１４に予め記憶された設定
ボール径との差並びにこの差が許容範囲内かどうかを判
定する。なおこの差並びに判定結果はモニタ１５に表示
される。また演算部１７にてこの差が許容範囲外である
ことが判定されると、制御装置１４は、この差に応じた
信号を放電条件設定部１１に発し、放電条件設定部１１
においては、この制御装置１４からの信号に基づき次回
放電時における放電条件を修正する。本実施例では、算
出されたボール径が設定ボール径より小さかった場合に
は、次回放電時における放電電流を増加させ、逆に、算
出されたボール径が設定ボール径より大きかった場合に
は、次回放電時における放電電流を減少させるように制
御する。つまり次回放電時、今回測定したボール径が所
定ボール径に近づく方向に放電条件を修正する。 （ｅ）修正された放電電流にて再度ボールを形成し、形
成されたボールの径と設定ボール径と差が許容範囲内と
なるまで、上記（ｂ）から（ｄ）の手順を繰り返す。By the way, the storage unit 16 stores the position coordinates of the XY table 5 when the point designation button is pressed. When the second alignment is completed, the calculation unit 17 calculates the distance x between the two sides, that is, the ball diameter, based on the coordinates of the end sides A and B, and the calculated ball diameter and the storage unit 14 are stored. The difference between the preset ball diameter stored in advance and whether the difference is within the allowable range or not are determined. The difference and the determination result are displayed on the monitor 15. When the calculation unit 17 determines that this difference is outside the allowable range, the control device 14 issues a signal according to this difference to the discharge condition setting unit 11 and the discharge condition setting unit 11
In step 1, the discharge condition for the next discharge is corrected based on the signal from the control device 14. In the present embodiment, when the calculated ball diameter is smaller than the set ball diameter, the discharge current at the next discharge is increased, and conversely, when the calculated ball diameter is larger than the set ball diameter, The control is performed so as to reduce the discharge current at the time of the next discharge. That is, at the time of the next discharge, the discharge condition is corrected so that the ball diameter measured this time approaches the predetermined ball diameter. (E) The ball is formed again with the corrected discharge current, and the above steps (b) to (d) are repeated until the difference between the formed ball diameter and the set ball diameter is within the allowable range.
【００１５】以上の手順で放電条件（実施例では放電電
流）の設定作業が終了すると、公知技術を用いてボンデ
ィング位置に位置付けられたリードフレーム３上のペレ
ット２並びにリードにおけるボンディング点の位置ずれ
がカメラ１２によりそれぞれ検出され、このずれの補正
がなされてワイヤボンディング動作が行なわれる。When the discharge condition (discharge current in the embodiment) setting operation is completed by the above procedure, the displacement of the bonding point on the pellet 2 and the lead 2 on the lead frame 3 positioned at the bonding position by using a known technique. Each of them is detected by the camera 12, the deviation is corrected, and the wire bonding operation is performed.
【００１６】上記実施例によれば、リードフレーム３上
の不要部分に捨てボンディングし、この捨てボンディン
グされたワイヤ７に形成されているボール７ａを、ワイ
ヤボンディング装置１が備えるカメラ１２にて撮像し、
このカメラ１２が取り込んだ画像を利用してボール７ａ
の径を測定するものであるため、従来のように形成され
たボール７ａを顕微鏡などの別装置に移し換える手間が
なくなり、迅速にボール径を測定することができる。According to the above-described embodiment, the unnecessary bonding on the lead frame 3 is discarded and the ball 7a formed on the discarded bonded wire 7 is imaged by the camera 12 of the wire bonding apparatus 1. ,
The image captured by this camera 12 is used for the ball 7a.
Since the diameter of the ball 7 is measured, it is possible to quickly measure the diameter of the ball 7a without the trouble of transferring the formed ball 7a to another device such as a microscope.
【００１７】またボール径の測定は、モニタ１５に映し
出されたボール７ａの画像にレチクルＲを合わせること
によって行なわれるため、顕微鏡の視野内に刻まれた目
盛りを頼りに測定する場合に比べ、ボール径を正確に測
定することができ、ひいては、放電条件の確実な設定が
行なえる。Further, since the ball diameter is measured by aligning the reticle R with the image of the ball 7a displayed on the monitor 15, the ball diameter is smaller than that when the scale is engraved in the visual field of the microscope. The diameter can be measured accurately, and the discharge conditions can be set reliably.
【００１８】さらに、上記実施例の演算部１７において
は、ボール７ａの径の測定結果を記憶部１６に記憶され
ている設定ボール径と比較して両者の差を求め、この差
が許容範囲内かどうかを判定し、許容範囲外の場合、制
御装置１４は、この差に応じた信号を放電条件設定部１
１に発し、放電条件設定部１１においては、この制御装
置１４からの信号に基づき放電条件を修正するものであ
る。従って、今回形成されたボール径が許容範囲外の場
合、次回形成されるボール径が今回形成されたボールの
径に比べてより所定ボール径に近付くよう放電条件が自
動修正され、これにより放電条件設定作業の迅速化が図
れる。Further, in the arithmetic unit 17 of the above embodiment, the measurement result of the diameter of the ball 7a is compared with the set ball diameter stored in the storage unit 16 to obtain the difference between the two, and this difference is within the allowable range. If it is outside the allowable range, the control device 14 outputs a signal according to this difference to the discharge condition setting unit 1
1, the discharge condition setting unit 11 corrects the discharge condition based on the signal from the control device 14. Therefore, if the diameter of the ball formed this time is out of the allowable range, the discharge condition is automatically corrected so that the diameter of the ball formed next time will be closer to the predetermined ball diameter than the diameter of the ball formed this time. The setting work can be speeded up.
【００１９】なお上記実施例のように、１つのカメラ１
２をボール径測定用と、ペレット並びにリードにおける
ボンディング点の位置ずれ検出用とに兼用する場合、カ
メラ１２に倍率可変手段を設け、ボール径測定時におけ
るカメラ倍率を高倍率になるように設定するとよい。As in the above embodiment, one camera 1
When 2 is used both for measuring the ball diameter and for detecting the displacement of the bonding point on the pellet and the lead, the camera 12 is provided with a magnification varying means and the camera magnification at the time of ball diameter measurement is set to a high magnification. Good.
【００２０】また上記実施例においては、モニタ１５上
のレチクルＲを作業者が手動操作で移動させることにて
ボール径の測定を行なったが、カメラ１２によって撮像
された画像を画像処理部１３で２値化処理、あるいは多
値化処理を行ない、公知の自動認識手段を用いてボール
径を自動測定するようにしてもよい。このような手段を
用いると、ボール７ａの径測定に人的操作が加わらなく
なり、ボール７ａの径測定がより正確に行なえる。In the above embodiment, the ball diameter is measured by the operator manually moving the reticle R on the monitor 15, but the image picked up by the camera 12 is processed by the image processing unit 13. The ball diameter may be automatically measured using a known automatic recognition means by performing binarization processing or multi-value conversion processing. If such a means is used, no human operation is added to the diameter measurement of the ball 7a, and the diameter measurement of the ball 7a can be performed more accurately.
【００２１】さらに上記実施例においては、放電条件と
して、放電時の電流を修正するものであったが、これに
代えて、放電時間を修正するものであっても良く、さら
には放電に先立ちキャピラリ先端からのワイヤの突出長
を修正するものであっても良い。このワイヤの突出長
は、クランパの上下動により修正することができる。Further, in the above embodiment, the discharge condition is to correct the current at the time of discharge, but instead of this, the discharge time may be modified, and further, the capillary is discharged prior to discharge. It is also possible to correct the protruding length of the wire from the tip. The protruding length of this wire can be corrected by the vertical movement of the clamper.
【００２２】また上記第１の実施例において、ボール７
ａを水平方向から撮像可能な位置にカメラ１２を固定す
るようにしてもよい。このような構成にすれば、キャピ
ラリ８の先端に保持された状態のボール７ａを撮像する
ことができるので、ボール径の測定時間が短縮できる。Further, in the first embodiment, the ball 7
The camera 12 may be fixed at a position where a can be imaged in the horizontal direction. With such a configuration, the ball 7a held at the tip of the capillary 8 can be imaged, so that the ball diameter measurement time can be shortened.
【００２３】次に本発明の第２実施例について、図を用
いて説明する。Next, a second embodiment of the present invention will be described with reference to the drawings.
【００２４】図４は本発明の第２実施例であるワイヤボ
ンディング装置の構成図、図５は図４の要部を示す斜視
図、図６は図４に示したワイヤボンディング装置におけ
るボール径の測定状態を示す図である。なお、第１実施
例における同一部品には同一符号を付しその説明は省略
する。FIG. 4 is a block diagram of a wire bonding apparatus according to a second embodiment of the present invention, FIG. 5 is a perspective view showing a main part of FIG. 4, and FIG. 6 shows a ball diameter of the wire bonding apparatus shown in FIG. It is a figure which shows a measurement state. The same parts in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.
【００２５】この第２実施例が、先に説明した第１実施
例と相違する点は、第１実施例ではボンディングヘッド
６に固定支持されたカメラ１２を用いてボール７ａの径
を測定したのに対して、本実施例においては、このカメ
ラ１２とは別の測定装置２１を、ワイヤボンディング装
置２０が備えるキャピラリ８の可動範囲内に設けたこと
である。この測定装置２１は、例えば半導体レーザ光Ｌ
を用いる方式の透過型検出器であって、一方のガイドレ
ール４上に対向配置される投光部２２並びに受光部２３
を有し、投光部２２から発射されるレーザ光の照射面積
と、受光部２３にて受光するレーザ光の受光面積とから
両者間に位置する物体の大きさ（投影面積）を求めるこ
とができるものである。なおこの実施例において、投光
部２２は、その照射断面形状が円形であり、またこの投
光部２２および受光部２３は、それぞれ制御装置１４に
接続される。The second embodiment differs from the first embodiment described above in that the diameter of the ball 7a is measured by using the camera 12 fixedly supported by the bonding head 6 in the first embodiment. On the other hand, in the present embodiment, the measuring device 21 different from the camera 12 is provided within the movable range of the capillary 8 included in the wire bonding device 20. This measuring device 21 is, for example, a semiconductor laser light L.
Is a transmissive detector of a system using a light emitting unit 22 and a light receiving unit 23, which are arranged to face each other on one guide rail 4.
And the size (projection area) of the object located between them can be determined from the irradiation area of the laser light emitted from the light projecting section 22 and the light receiving area of the laser light received by the light receiving section 23. It is possible. In this embodiment, the light projecting section 22 has a circular irradiation cross-sectional shape, and the light projecting section 22 and the light receiving section 23 are each connected to the control device 14.
【００２６】このワイヤボンディング装置２０におい
て、放電条件の設定作業は次のようにして行なわれる。 （ａ）任意の放電条件によりワイヤ７とトーチ電極１０
との間に放電を生じさせ、ワイヤ７の先端にボール７ａ
を形成する。そして、不図示のクランパを解放するとと
もにワイヤ７にバックテンションを作用させてボール７
ａをキャピラリ８の先端に接触させ、その後、クランパ
を閉じる。 （ｂ）操作パネル１８に設けられた不図示のボール径測
定ボタンの操作によりキャピラリ８は測定位置に移動
し、形成されたボール７ａを、投光部２２と受光部２３
との間に位置させる。 （ｃ）この位置において、投光部２２からのレーザ光Ｌ
の照射面積と受光部２３における受光面積とに基づき、
ボール７ａによるレーザ光Ｌの遮光面積、すなわちボー
ル７ａの投影面積Ｔが測定される。なお図６に示すよう
に、投光部２２と受光部２３の間には、ボール７ａに加
えてキャピラリ８の先端部も位置するため、このキャピ
ラリ８の先端部によってもレーザ光Ｌが遮光される。そ
こでボール７ａの投影面積Ｔの測定に当たっては、キャ
ピラリ８が測定位置に位置したときのこのキャピラリ８
によるレーザ光Ｌの遮光面積Ｓを予め求めて記憶部１６
に設定しておき、演算部１７におけるボール７ａの投影
面積算出時に、このキャピラリ８による遮光面積Ｓを減
じるようにする。 （ｄ）演算部１７においては、（ｃ）にて求められたボ
ール７ａの投影面積Ｔから、ボール７ａの径を算出し、
設定ボール径と比較し、その差を求める。そしてその差
が許容値から外れていた場合には、第１実施例と同様に
して放電条件の修正が行なわれ、再度ボール形成が行な
われる。なおこの場合、一度形成されたボールは、捨て
ボンディングなどによりキャピラリ８の先端からは取り
去られ、キャピラリ８の先端には新たにワイヤが繰り出
される状態で再度のボール形成が行なわれる。In the wire bonding apparatus 20, the work of setting the discharge condition is performed as follows. (A) Wire 7 and torch electrode 10 under arbitrary discharge conditions
A discharge is generated between the ball 7a and the ball 7a at the tip of the wire 7.
To form. Then, the clamper (not shown) is released and back tension is applied to the wire 7 so that the ball 7
The a is brought into contact with the tip of the capillary 8, and then the clamper is closed. (B) The capillary 8 is moved to the measurement position by operating a ball diameter measurement button (not shown) provided on the operation panel 18, and the formed ball 7a is projected onto the light projecting section 22 and the light receiving section 23.
Located between and. (C) At this position, the laser light L from the light projecting unit 22
Based on the irradiation area of and the light receiving area of the light receiving unit 23,
The light shielding area of the laser light L by the ball 7a, that is, the projected area T of the ball 7a is measured. As shown in FIG. 6, since the tip of the capillary 8 is located between the light projecting portion 22 and the light receiving portion 23 in addition to the ball 7a, the laser light L is also blocked by the tip of the capillary 8. It Therefore, when measuring the projected area T of the ball 7a, the capillary 8 when the capillary 8 is located at the measurement position is used.
The light shielding area S of the laser light L by
Is set so that the light-shielding area S by the capillary 8 is reduced when the projected area of the ball 7a is calculated by the calculation unit 17. (D) In the calculation unit 17, the diameter of the ball 7a is calculated from the projected area T of the ball 7a obtained in (c),
Compare with the set ball diameter and find the difference. If the difference is out of the allowable value, the discharge condition is corrected in the same manner as in the first embodiment, and the ball is formed again. In this case, the ball once formed is removed from the tip of the capillary 8 by discarding bonding or the like, and the ball is formed again at the tip of the capillary 8 while a new wire is being drawn out.
【００２７】この第２実施例によれば、ワイヤ７の先端
に形成されたボール７ａの径測定を、ガイドレール４上
に設置された測定装置２１によって行なっているので、
第１実施例のように作業者による作業を特に必要とせ
ず、より迅速にボール７ａの直径を測定、並びに放電条
件設定が行なえる。According to this second embodiment, since the diameter of the ball 7a formed at the tip of the wire 7 is measured by the measuring device 21 installed on the guide rail 4,
Unlike the first embodiment, the work of the operator is not particularly required, and the diameter of the ball 7a can be measured and the discharge condition can be set more quickly.
【００２８】また、ボール７ａの径測定が測定装置２１
にて自動的に行なわれることから、ボール７ａの径測定
が個人差を生じることなく行なえるので、正確な放電条
件の設定を行なうことが可能となる。。The measuring device 21 measures the diameter of the ball 7a.
Since the diameter of the ball 7a can be measured automatically without any individual difference, accurate discharge conditions can be set. .
【００２９】なお上記第２の実施例においては、投光部
２２におけるレーザ光Ｌの照射断面形状を円形とした例
を用いて説明したが、例えば図７に示すように、レーザ
光Ｌの断面形状を線状としてもよい。この場合、ボール
７ａの部分を投光部２２ａと受光部２３ａとの間の上方
から徐々に下降させると、受光部２３ａによって検出さ
れるレーザ光Ｌの遮光長さは、最初は増大し、ボール７
ａ中央部の通過時に最大値に達し、その後徐々に減少す
る傾向を示す。そこで受光部２３ａの遮光長さの最大値
をもってボール径とするものである。The second embodiment has been described by using an example in which the irradiation cross section of the laser beam L in the light projecting section 22 is circular, but as shown in FIG. 7, for example, the cross section of the laser beam L is shown. The shape may be linear. In this case, when the portion of the ball 7a is gradually lowered from above between the light projecting portion 22a and the light receiving portion 23a, the light blocking length of the laser light L detected by the light receiving portion 23a initially increases, and the ball 7
a) The maximum value is reached when passing through the central part, and then it tends to gradually decrease. Therefore, the maximum value of the light shielding length of the light receiving portion 23a is used as the ball diameter.
【００３０】[0030]
【発明の効果】本発明によれば、迅速に放電条件設定を
行なうことができる。According to the present invention, discharge conditions can be set quickly.
【図１】本発明の第１実施例であるワイヤボンディング
装置の構成図である。FIG. 1 is a configuration diagram of a wire bonding apparatus that is a first embodiment of the present invention.
【図２】図１に示したワイヤボンディング装置における
ボール径の測定状態を示す図である。FIG. 2 is a diagram showing a ball diameter measurement state in the wire bonding apparatus shown in FIG.
【図３】ボール径の測定手順を示す図である。FIG. 3 is a diagram showing a procedure for measuring a ball diameter.
【図４】本発明の第２実施例であるワイヤボンディング
装置の構成図である。FIG. 4 is a configuration diagram of a wire bonding apparatus that is a second embodiment of the present invention.
【図５】図４の要部を示す斜視図である。5 is a perspective view showing a main part of FIG. 4. FIG.
【図６】図４に示したワイヤボンディング装置における
ボール径の測定状態を示す図である。6 is a diagram showing a ball diameter measurement state in the wire bonding apparatus shown in FIG.
【図７】第２実施例の変形例を示す斜視図である。FIG. 7 is a perspective view showing a modified example of the second embodiment.
１ ワイヤボンディング装置 ２ 半導体ペレット ３ リードフレーム ７ ワイヤ ７ａ ボール ８ キャピラリ １０ トーチ電極 １１ 放電条件設定部 １２ カメラ １３ 画像処理部 １４ 制御装置 １５ モニタ １６ 記憶部 １７ 演算部 ２０ ワイヤボンディング装置 ２１ 測定装置 ２２ 投光部 ２３ 受光部 1 Wire Bonding Device 2 Semiconductor Pellet 3 Lead Frame 7 Wire 7a Ball 8 Capillary 10 Torch Electrode 11 Discharge Condition Setting Unit 12 Camera 13 Image Processing Unit 14 Control Device 15 Monitor 16 Storage Unit 17 Computing Unit 20 Wire Bonding Device 21 Measuring Device 22 Projection Light section 23 Light receiving section
Claims (1)
ャピラリ先端より突出したワイヤとの間で放電を生じさ
せ、前記ワイヤの先端にボールを形成するワイヤボンデ
ィング装置において、 ａ．前記放電によって形成されたボールの径を測定する
ボール径測定手段と、 ｂ．所望する所定ボール径を記憶する記憶手段と、 ｃ．前記ボール径測定手段が測定したボール径と前記記
憶手段に記憶された所定ボール径とを比較する比較手段
と、 ｄ．この比較手段における比較結果に基づき、次回放電
時、前記測定したボール径が前記所定ボール径に近づく
方向に、形成されるボール径の大小の要因となる、放電
時に印加する電流、放電時間、前記キャピラリ先端から
の前記ワイヤの突出長の少なくとも１つを修正する放電
条件設定手段と、 を設けたことを特徴とするワイヤボンディング装置。1. A wire bonding apparatus having a torch electrode, wherein a discharge is generated between the torch electrode and a wire projecting from the tip of the capillary to form a ball at the tip of the wire. Ball diameter measuring means for measuring the diameter of the ball formed by the discharge; b. Storage means for storing a desired predetermined ball diameter, c. Comparing means for comparing the ball diameter measured by the ball diameter measuring means with a predetermined ball diameter stored in the storing means; d. Based on the comparison result by the comparison means, at the time of the next discharge, in the direction in which the measured ball diameter approaches the predetermined ball diameter, it becomes a factor of the size of the formed ball diameter, the current applied during discharge, the discharge time, the A wire bonding apparatus, comprising: discharge condition setting means for correcting at least one of the protruding lengths of the wires from the tip of the capillary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18294592A JP3192761B2 (en) | 1992-06-17 | 1992-06-17 | Wire bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18294592A JP3192761B2 (en) | 1992-06-17 | 1992-06-17 | Wire bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH065650A true JPH065650A (en) | 1994-01-14 |
| JP3192761B2 JP3192761B2 (en) | 2001-07-30 |
Family
ID=16127114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18294592A Expired - Fee Related JP3192761B2 (en) | 1992-06-17 | 1992-06-17 | Wire bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3192761B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022162716A1 (en) * | 2021-01-26 | 2022-08-04 | 株式会社新川 | Wire bonding device, method of controlling wire bonding device, and control program for wire bonding device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5426000B2 (en) * | 2012-11-16 | 2014-02-26 | 株式会社新川 | Wire bonding apparatus and wire bonding method |
-
1992
- 1992-06-17 JP JP18294592A patent/JP3192761B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022162716A1 (en) * | 2021-01-26 | 2022-08-04 | 株式会社新川 | Wire bonding device, method of controlling wire bonding device, and control program for wire bonding device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3192761B2 (en) | 2001-07-30 |
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