JPH0654370U - display - Google Patents

Abstract

(57) [Abstract] [Purpose] It is an object of the present invention to provide a display suitable for mass production and capable of displaying high-quality images. [Constitution] LE having a plurality of LED light emitting parts 520
The D array chip 502 is an LED driver IC 503.
The transparent substrate 501 provided with a and 503b is overlaid and pressure-bonded. As a result, the LED array chip 5
02 side lands 521a and 521b and the transparent substrate 501
The lands 531a and 531b on the side are connected via bumps 523. Lands 521a and 521b are metal wiring 5
22 is connected to the LED light emitting section 520 via
31a and 531b are connected to the LED driver ICs 503a and 503b through metal wirings 532a and 532b. In this way, without wire bonding
The LED light emitting unit 520 and the LED driver ICs 503a and 503b are connected in a single pressure bonding step.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a display, and more particularly to a small display mounted on, for example, the head of a user and displaying an image within the visual field of the user.

[0002]

[Prior art]

 For example, JP-A-2-42476, JP-A-2-51121, and JP-A-2-63379 disclose techniques relating to a head-mounted compact display. The head-mounted display disclosed in these publications reflects an LED array chip in which a plurality of LED (light emitting diode) elements each capable of independently emitting light are arranged, and light from each LED element. It is provided with a mirror, a scanning device for repetitively moving the mirror within the field of view of the user, and a mounting tool for mounting the LED array chip, the mirror, and the scanning device on the head of the user. . Then, when the mirror moves, each LED element is caused to emit light independently to generate a substantially flat two-dimensional virtual image, which can be observed by the user.

The above-described head-mounted display is developed by Reflection Technology Co., Massachusetts, USA, and has already been commercialized. The product commercialized by Reflection Technology uses TPM8160 manufactured by Telefunken as a module including an LED array chip and its peripheral circuits (LED driver etc.) (see JP-A-2-42476, page 6). (See bottom left column). The TPM8160 was originally developed as a module for an LED printer, and is not suitable for a display application in which a human directly views an image. Therefore, the conventional head-mounted display equipped with the TPM8160 has various problems. Hereinafter, this problem will be described in detail.

[0004]

FIG. 19 is a plan view showing the configuration of the TPM 8160, and FIG. 20 is a front view thereof. As shown in FIGS. 19 and 20, the LED array chip 2 is fixed to the central portion of the upper surface of the circuit board 1. Further, on the upper surface of the circuit board 1, the LED array chips 2 and LED driver ICs 3a and 3b, which are arranged at a predetermined interval, are fixed. On the upper surface of the LED array chip 2, a plurality of LED light emitting parts 20 are arranged at substantially constant intervals on a straight line extending along the longitudinal direction of the LED array chip 2. Every other LED light emitting portion 20 is connected to a corresponding bonding pad 21a via a metal wiring 22 such as aluminum. Further, the remaining LED light emitting parts 20 are connected to the corresponding bonding pads 21b via metal wirings 22, respectively.

On the other hand, bonding pads 31a are provided on the upper surface of the LED driver IC 3a at positions corresponding to the respective bonding pads 21a. Similarly, a bonding pad 31b is provided on the upper surface of the LED driver IC 3b at a position corresponding to each bonding pad 21b. Each of the LED driver ICs 3a and 3b includes a drive circuit for driving each LED light emitting section 20 to emit light. The bonding pad 31a is connected to the drive circuit in the LED driver IC 3a, and the bonding pad 31b is connected to the drive circuit in the LED driver IC 3b. The bonding pad 21a of the LED array chip 2 is connected to the bonding pad 31a of the LED driver IC 3a via the bonding wire 4a such as gold. Similarly, the bonding pad 21b of the LED array chip 2 is connected to the bonding pad 31b of the LED driver IC 3b via the bonding wire 4b such as gold.

FIG. 21 is a diagram showing a schematic configuration of an optical system of a conventional head-mounted display equipped with the TPM8160. In FIG. 21, the light L1 emitted from the LED light emitting section 20 of the LED array chip 2 is given to the mirror 6 via the lens 5 and reflected by the mirror 6. The light reflected by the mirror 6 enters the eyes 7 of the user. When the LED light emitting section 20 is selectively emitted and the mirror 6 is reciprocally rotated within the range of the user's visual field, a two-dimensional image is captured by the user's eyes due to an afterimage phenomenon. This principle is almost the same as the raster operation in the CRT display. That is, the CRT display shows the scanning screen imaged on the cathode ray tube, but the display device of FIG. 21 is different only in that the scanning screen image is formed on the human retina.

By the way, a part of the light emitted from the LED light emitting section 20 is reflected by the bonding wires 4a and 4b to become irregular reflection light L2. The diffusely reflected light L2 enters the eyes 7 of the user via the lens 5 and the mirror 6. Such irregularly reflected light L2 has a lower intensity than the direct light L1 and therefore causes almost no problem in the printer. However, the human eye is incomparably higher in sensitivity than the photoconductor of a printer, so even a small amount of diffusely reflected light is annoying. As a result, there is a problem in that the image to be originally displayed is obscured by the irregular reflection light L2 and becomes difficult to see.

In order to solve the above problems, as shown in FIG. 22, a mask M for light shielding (a slit is provided at a position facing the LED light emitting section 20) is provided on the LED array chip 2. It is conceivable that the diffused reflected light L2 is less likely to enter the lens 5 by disposing the above described) or laying the bonding wire 4a, 4b at an angle α 1. However, such a method increases the number of parts, complicates the process, and increases the cost of the product.

Further, in the conventional display, the LED array chip 2 and the LED driver ICs 3a and 3b are connected by wire bonding, but even if the current highest speed bonding machine is used, one wire is used. Bonding takes 0.18 seconds. For example, if an LED array chip having 256 LED light emitting parts arranged side by side is made, it takes 46 seconds only for the wire bonding work. Therefore, the conventional display device has a problem that it takes a long time to manufacture, and it is not suitable for an application such as a game device, which is required to be inexpensive and mass-produced.

Therefore, an object of the present invention is to provide a display which can display a high quality image and is excellent in mass productivity.

[0011]

[Means for Solving the Problems]

 The invention according to claim 1 is a small-sized display that displays an image in the field of view of a user, and is capable of independently and selectively displaying a plurality of light-emitting elements arranged in a predetermined manner. , A mirror that reflects the light emitted from each light-emitting element of the light-emitting module toward the user's eyes, and the mirror is repeatedly moved over a predetermined range of motion, thereby substantially 2 in the field of view of the user. The light emitting module is provided with a plurality of light emitting elements arranged in a predetermined method and each of which emits light independently and selectively, and a mirror driving unit for forming an image spreading in the dimension direction. A first substrate provided with a plurality of individually connected first lands, a drive circuit for driving the light emitting element, and a plurality of second substrates individually connected to respective output terminals of the drive circuit. La And a second substrate having a light transmitting portion at least in part, and the first substrate and the second substrate are stacked so that each light emitting element faces the light transmitting portion. It is characterized in that the first land and the second land are pressure-bonded via the bumps.

A second aspect of the present invention is the device according to the first aspect, wherein the first land and the light emitting element are separated from each other by a sufficient separation distance so that the diffused reflected light of the first land is reduced to a predetermined value or less. It is characterized by being.

According to a third aspect of the invention, in the invention according to the first aspect, the edge portion of the first land on the side close to the light emitting element is shaped so that the diffused reflected light does not go to the light transmitting portion. It is characterized by being formed.

According to a fourth aspect of the present invention, in the first aspect of the present invention, each first land and each light emitting element are connected by a plurality of wirings, and each wiring is adjacent to a light emitting element. It is characterized in that it is arranged at a position that blocks the optical path between the children.

A fifth aspect of the invention is the device according to the first aspect, characterized in that an antireflection film is formed on the surface of the second substrate facing the first substrate.

The invention according to claim 6 is the device according to claim 1, wherein the second substrate is provided with a light-shielding mask pattern on a surface opposite to a surface facing the first substrate, The black pattern is characterized in that a slit is formed at a position corresponding to the arrangement position of the light emitting elements to allow light to pass therethrough.

The invention according to claim 7 is the device according to claim 1, characterized in that a through hole is formed in the second substrate at a position facing the light emitting element.

The invention according to claim 8 is the device according to claim 1, wherein the edge portion of the second land on the side close to the light emitting element is shaped so that the diffused reflected light does not go to the light transmitting portion. It is characterized by being formed.

[0019]

[Action]

 In the invention according to claim 1, each light emitting element and its drive circuit are connected by pressing the first land and the second land through the bumps. This simplifies the connection process and is suitable for mass production. In addition, since no bonding wire is used, diffused reflected light is reduced and a high quality image can be displayed.

According to the second aspect of the present invention, the diffused light of the first land is reduced to a predetermined value or less by sufficiently separating the first land and the light emitting element. As a result, diffused reflection light is further reduced, and a higher quality image can be displayed.

In the invention according to claim 3, the edge portion of the first land on the side close to the light emitting element is formed in a shape such that the diffused reflection light does not go to the light transmitting portion. The irregularly reflected light from the land 1 is prevented from being mixed into the image to be originally displayed.

According to the fourth aspect of the invention, the first land and the light emitting element are arranged adjacent to each other by arranging the wiring connecting the first land and the light emitting element at a position that blocks an optical path between the adjacent light emitting elements. Leakage light is prevented from occurring between the light emitting elements.

In the invention according to claim 5, by forming an antireflection film on the second substrate, irregular reflection on the second substrate is prevented, and as a result, irregularly reflected light should be displayed originally. It is prevented from mixing in the image.

In the invention according to claim 6, a mask pattern is formed on the second substrate to prevent unnecessary diffused reflected light from passing through the second substrate.

In the invention according to claim 7, by forming the through hole at a position facing the light emitting element of the second substrate, it is possible to prevent irregular reflection light from being generated on the second substrate.

In the invention according to claim 8, the edge portion of the second land on the side close to the light emitting element is formed in a shape such that the diffused reflection light does not go to the light transmitting portion. The diffused reflected light from the land 2 is prevented from being mixed into the image to be originally displayed.

[0027]

FIG. 1 shows a head-mounted display and a display system using the same according to an embodiment of the present invention. In FIG. 1, a head-mounted display 100 is mounted around a user's head 200. This head-mounted display 100 includes a head-mounted member 101, a support member 102 that is rotatably supported by the head-mounted member 101 and projects forward, and a hinge joint 103, 104. A box 105 supported by the tip of the support member 102 is included. The box 105 is positioned at a position facing the eyes of the user by adjusting the turning angle of the support member 102 and / or by adjusting the bending angle of the hinge joints 103, 104. To be done. A small display device (see FIG. 2) described later is housed inside the box 105. The box 105 completely surrounds the outer circumference of this small display device, and ambient light around the user is allowed to leak into the inside of the box 105 from other parts except one opening (not shown). This is completely prevented and the virtual image generated by the small display device can be observed through this one opening.

The small display device housed inside the box 105 is connected to an external remote signal source 300 via an electric cable or a fiber optic cable 106 that passes through the hollow portion of the support member 102 so as to be capable of transmitting data. There is. The small display device is provided with a power signal, a data signal, a timing signal and a control signal necessary for driving a display device from a remote signal source 300. The head-mounted display 100 as described above is used as a display for an electronic game device, for example. In this case, as the remote signal source 300, a video game machine that outputs image and audio data for games is used. Incidentally, more detailed configurations and operations of this type of head-mounted display and a display system using the same are described in JP-A-2-63379 and JP-A-2-42476. Therefore, in order to simplify the description, detailed description will not be repeated here.

FIG. 2 shows a specific embodiment of a small display device that is housed inside the box 105 of FIG. 1 and generates a raster image for displaying information. In addition, Japanese Patent Publication No. 2-121121 discloses the configuration and operation of this type of small display device in detail. Therefore, in this embodiment, the parts common to the small-sized display device disclosed in Japanese Patent Application Laid-Open No. 2-51121 will not be described in detail for the sake of simplifying the description, and the characteristic parts of this embodiment will be described in detail below. To do.

In FIG. 2, the miniature display device includes a base 400 on which the various optical components that make up the miniature display device are mounted. A header block 401 is attached to one end of the base 400, and the LED device 500, which is a feature of this embodiment, is attached to the inside of the header block 401. The LED device 500 includes a plurality of LED elements arranged in a straight line. The light emitted from the LED device 500 is projected through a mirror 405 by an optical system including a housing 404 in which lenses 402 and 403 are mounted. According to the principle described in Japanese Patent Laid-Open No. 2-121121, this lens system projects a magnified virtual image of the LED device 500 via the mirror 405.

As described in Japanese Patent Application Laid-Open No. 2-51121 mentioned above, the mirror 405 is vibrated by an electromechanical drive motor (not shown). This oscillation of mirror 405 creates a raster image based on LED device 500.

FIG. 3 shows a configuration of the LED device 500 shown in FIG. 2 and a manufacturing method thereof. FIG. 4 shows the LED formation surface of the LED array chip 502 shown in FIG. FIG. 5 shows a cross section taken along line AA of the LED array chip 502 shown in FIG. FIG. 6 shows the upper surface of the transparent substrate 501 shown in FIG. Hereinafter, the LED device 500, which is a feature of this embodiment, will be described with reference to FIGS. 3 to 6.

In FIG. 4, in the central portion of the upper surface of the LED array chip 502, a plurality of LED light emitting portions 520 are arranged at substantially regular intervals on a straight line extending along the longitudinal direction of the LED array chip 502. . Every other LED light emitting section 20 is connected to a corresponding land 521a via a metal wiring 522 such as aluminum. Moreover, the remaining LED light emitting portions 520 are connected to the corresponding lands 521b via the metal wiring 522. The lands 521a and 521b are made of a metal material such as aluminum. In addition, a conductive bump 523 is provided on each of the lands 521a and 521b. A conductive material such as gold or solder is used for the bumps 523, and a conductive paste or a conductive adhesive is used for the connection materials 533a and 533b.

As shown in FIG. 5, the LED array chip 502 includes an N-type gallium arsenide (GaAs) substrate 524 having a thickness of about 400 μm. An N-type mixed crystal ratio changing layer 525 having a thickness of about 50 μm is formed on the gallium arsenide substrate 524. The mixed crystal ratio change layer 525 is formed on the arsenic substrate 524 by vapor-phase growth of gallium arsenide phosphide (GaAsP) while gradually increasing the proportion of phosphorus (P). An N-type constant mixed crystal ratio layer 526 having a thickness of about 10 μm is formed on the mixed crystal ratio changing layer 525. The constant mixed crystal ratio layer 526 is formed on the mixed crystal ratio changing layer 525 by vapor phase growth of gallium arsenide phosphide with a constant phosphorus ratio. By changing the ratio of arsenic (As) and phosphorus in the constant mixed crystal ratio layer 526, the emission color of the LED changes from light red to red to infrared. For example, to emit red light having a wavelength of 660 nm, the ratio of arsenic to phosphorus is about 6: 4. A silicon nitride (Si ₃ N ₄ ) film 527 is selectively formed on the mixed crystal ratio constant layer 526. On the surface of the constant mixed crystal ratio layer 526, a P-type impurity such as zinc (Zn) is diffused into a portion not masked by the silicon nitride film 527. As a result, a P-type impurity diffusion layer is formed near the surface of the constant mixed crystal ratio layer 526. This P-type impurity diffusion layer becomes the LED light emitting section 520. Further, metal wirings 522, lands 521a and 521b are formed by photoetching on predetermined portions on each LED light emitting section 520 and on the silicon nitride film 527. Further, a common electrode 528 made of gold (Au) or the like is formed on the back surface of the gallium arsenide substrate 524.

As shown in FIG. 6, on the upper surface of the transparent substrate 501 made of glass or the like, the LED driver IC 503a is fixed near the left end and the LED driver IC 503b is fixed near the right end. Each output end of the LED driver IC 503a is connected to the corresponding land 531a via a metal wiring 532a such as aluminum. Further, each output end of the LED driver IC 503b is connected to the corresponding land 531b via a metal wiring 532b such as aluminum. The arrangement interval between the lands 531a matches the arrangement interval of the lands 521a shown in FIG. The arrangement interval between the lands 531b is the same as the arrangement interval of the lands 521b shown in FIG. Furthermore, the distance between the lands 531a and 531b matches the distance between the lands 521a and 521b shown in FIG.

As shown in FIG. 3, the LED array chip 502 is placed on the transparent substrate 501 with the surface on which the LED light emitting section 520 is formed facing down. After that, the LED array chip 502 is pressure-bonded and fixed to the transparent substrate 501. At this time, the bumps 523 on the lands 521a are crushed between the lands 521a and the lands 531a, so that the lands 521a and the lands 531a are electrically connected to each other. Similarly, the bumps 523 on the lands 521b are crushed between the lands 521b and the lands 531b, so that the lands 521b and the lands 531b are electrically connected to each other. In the LED device 500 completed by the pressure-bonding step, the light emitted from each LED light emitting section 520 passes through the transparent substrate 501 and goes toward the lens system.

As described above, since the LED device 500 in this embodiment is formed by the so-called face down bonding method, the connection between the LED array chip 502 and the LED driver ICs 503a and 503b is performed by one pressure bonding step. Can be done in. Therefore, the manufacturing time can be significantly shortened, and it is suitable for applications such as electronic game machines that require low cost and mass productivity. Further, since the LED device 500 in the present embodiment does not use the bonding wire that causes diffuse reflection, the diffused reflected light incident on the lens system is reduced and a high quality image can be displayed.

FIG. 7 shows a preferred arrangement example of the lands 521 a and 521 b in the LED array chip 502. As shown by the dotted line in FIG. 7, in the LED array chip used in the conventional TPM8160 (see FIG. 19), the distance between each land and the LED emitting portion was short (about 0.188 mm). Therefore, diffuse reflection occurs at the front edge portion E1 of each land, deteriorating the quality of the displayed image. On the other hand, in the LED array chip of FIG. 7, the lands 531a and 531b and the LED light emitting section 520 are sufficiently separated from each other. As a result, it is possible to reduce the diffused reflection that occurs at the front end edge portion E2 of each land 531a, 531b to the extent that it does not affect the display image. According to the experiment, it has been confirmed that if the distance between each of the lands 531a and 531b and the LED light emitting section 520 is set to about 0.39 mm, the irregular reflection light can be reduced to a negligible level.

FIG. 8 shows four preferable shape examples of the lands 521 a and 521 b in the LED array chip 502. The common feature of the four lands shown in FIGS. 8A to 8D is that the front edge portions of the lands 521a and 521b (sides connected to the metal wiring 522) are arranged in the LED light emitting section 520. That is, it is formed not to be parallel to, but to have a predetermined inclination (preferably an inclination of 45 degrees). In other words, in order to reduce the area of each land 521a, 521b close to the LED light emitting part 520, the front edge portion of each land 521a, 521b is inclined or circular so as not to contact the metal wiring 522 at right angles. It is formed in an arc shape. As a result, diffused reflection light generated at the front edge portions of the lands 521a and 521b is emitted substantially parallel to the arrangement direction of the LED light emitting parts 520 and does not enter the lens system. The front end edge portions of the lands 521a and 521b may be formed in a straight line shape or an arc shape.

By the way, as shown in FIG. 4 and FIG. 5, when the metal wiring 522 is arranged so as to pass through the center of the LED light emitting section 520, crosstalk occurs between the adjacent LED light emitting sections 520. There was a point. For example, if one of the two LED light emitting parts 520 adjacent to each other emits light and the other LED light emitting part turns off, the light emitted from the one LED light emitting part is the direct lens system. And is also diffusely reflected by the metal wiring 522 arranged on the other adjacent LED light emitting portion. Then, this irregularly reflected light enters the lens system. Therefore, the other LED light emitting part is displayed as if it is shining light even though it is off. As a result, the image is blurred. Such a problem is solved by devising the arrangement position of the metal wiring 522. Hereinafter, some examples of ideas will be described.

9 to 12 show some examples of preferable arrangement positions of the metal wiring 522 in the LED array chip 502. In FIG. 9, the metal wiring 522 is arranged so as to cover at least one of the two sides facing each other between the adjacent rectangular LED light emitting sections 520. The height of the metal wiring 522 is higher than the height of the LED light emitting section 520. Therefore, the metal wiring 522 interposed between the adjacent LED light emitting portions 520 blocks the leaked light between the adjacent LED light emitting portions 520 and prevents crosstalk.

In FIG. 10, similar to FIG. 9, the metal wiring 522 is arranged so as to cover one of the two sides facing each other between the adjacent LED light emitting units 520. Further, in FIG. 10, the metal wiring 522 is arranged so as to be extended in an L shape along one side orthogonal to the facing sides between the LED light emitting units 520. As a result, since the four sides of every other LED light emitting section 520 are surrounded by the metal wiring 522, the leakage light between the adjacent LED light emitting sections 520 is greatly reduced compared to that shown in FIG. Or you can stop.

In FIG. 11, the metal wiring 522 is arranged so as to cover one side of each LED light emitting section 520 and surround two sides orthogonal to this one side. Therefore, the leakage light between the adjacent LED light emitting units 520 can be significantly reduced or prevented as compared with those shown in FIGS. 9 and 10.

In FIG. 12, the metal wiring 522 is arranged so as to cover one side of each LED light emitting section 520 and surround the remaining three sides. Therefore, the leaked light between the adjacent LED light emitting parts 520 can be almost completely prevented.

FIG. 13 shows an embodiment in which the embodiment of FIG. 7 and the embodiment of FIG. 9 are combined. Further, FIG. 14 shows an embodiment in which the embodiment of FIG. 8A and the embodiment of FIG. 9 are combined. As described above, by appropriately combining the embodiments shown in FIGS. 7 to 12, irregularly reflected light can be more reliably prevented, and a higher quality image can be displayed.

Although the embodiments shown in FIGS. 7 to 12 are intended to prevent diffused reflection light by devising the configuration of the LED array chip 502, it is also possible to devise the configuration on the transparent substrate 501 side. Diffuse reflected light can be prevented. Hereinafter, some of such embodiments will be described.

FIG. 15 shows another preferred embodiment of the LED device 500. In FIG. 15, an antireflection coating film 511 is formed on the upper surface of the transparent substrate 501. The antireflection coating film 511 is formed by stacking multiple layers of dielectrics having a thickness on the order of the wavelength of light, and has a property of significantly reducing reflected light. That is, the reflected light at the interface between the air and the antireflection coating film 511 is canceled by the reflected light at the interface between the transparent substrate 501 and the antireflection coating film 511. By providing such an antireflection coating film 511, it is possible to prevent light from being reflected on the upper surface of the transparent substrate 501, and as a result, the reflected light from the upper surface of the transparent substrate 501 is again reflected by the metal wiring 522 and the lands 521a and 521b. It is prevented from being scattered and reflected and entering the lens system. A mask pattern 512 is formed on the lower surface of the transparent substrate 501 by a method such as printing. The mask pattern 512 has a slit 512a formed at a position facing the LED light emitting section 520. Usually, most of the light passing through the slit 512a is the direct light from the LED light emitting section 520, and the diffused reflection light from the metal wiring 522 and the lands 521a and 521b reaches the portion other than the slit 512a. Therefore, by providing the mask pattern 512, it is possible to prevent unnecessary irregularly reflected light from passing through the transparent substrate 501.

FIG. 16 shows yet another preferred embodiment of the LED device 500. Note that FIG. 16A shows a cross section of such an LED device 500, and FIG. 16B shows the upper surface of the transparent substrate 501. In FIG. 16, a transparent substrate 501 has a through hole 501a formed at a position facing the LED light emitting section 520. When such a through hole 501a is not provided, the light reflected on the lower surface of the transparent substrate 501 is diffusely reflected again by the metal wiring 522 and the lands 521a and 521b and enters the lens system. If the through-hole 501a is provided as described above, it is possible to effectively prevent diffused reflection light that enters the lens system through such a path. When the through hole 501a as described above is provided in the substrate 501, the substrate 501 does not need to be transparent and may be made of an opaque material.

FIG. 17 shows yet another preferred embodiment of the LED device 500. In FIG. 17, the front edge portions of the lands 531a and 531b are formed by laying them at a predetermined angle (preferably 45 degrees) in a vertical plane orthogonal to the transparent substrate 501. As a result, the diffusely reflected light from the front edge portions of the lands 531a and 531b goes substantially vertically upward, and does not go toward the LED light emitting section 520. Therefore, such diffused reflection light can be prevented from passing through the transparent substrate 501 and entering the lens system.

FIG. 18 shows another embodiment of the head mounted display of the present invention. In this example, two display systems are used to observe the information provided in a three-dimensional (stereoscopic) format. In this embodiment, the boxes 105a and 105b contain small display devices as shown in FIG.

In the above embodiment, a monochromatic display is shown, but the present invention can of course be applied to a multicolor display. Further, the present invention is applicable not only to electronic game devices but also to all electronic devices that need to display images. Further, in the above embodiment, the head-mounted display is shown, but the invention can be applied to a stationary display.

[0052]

[Effect of device]

 According to the invention of claim 1, each light emitting element and its driving circuit are connected by crimping the first land and the second land through the bump, so that the connection process is simplified. Can be converted. Therefore, the manufacturing time is shortened, which is suitable for mass production. In addition, since no bonding wire is used, diffused reflected light is reduced and a high quality image can be displayed.

According to the second aspect of the invention, the diffused reflected light of the first land is reduced to a predetermined value or less by sufficiently separating the first land and the light emitting element. Therefore, the diffused reflection light can be further reduced, and as a result, a higher quality image can be displayed.

According to the third aspect of the invention, the edge portion of the first land on the side close to the light emitting element is formed in such a shape that the diffused reflection light does not go to the light transmitting portion. It is possible to prevent the irregularly reflected light of the land 1 from being mixed into the image to be originally displayed.

According to the fourth aspect of the present invention, the wiring that connects the first land and the light emitting element is arranged at a position that blocks the optical path between the adjacent light emitting elements. Moreover, it is possible to prevent leakage of light between adjacent light emitting elements, and as a result, it is possible to display a high-quality image.

According to the invention of claim 5, since the antireflection film is formed on the second substrate, irregular reflection on the second substrate can be prevented, and as a result, irregularly reflected light is an image that should be originally displayed. It can be prevented from being mixed in.

According to the invention of claim 6, since the mask pattern is formed on the second substrate, it is possible to prevent unnecessary irregularly reflected light from passing through the second substrate.

According to the invention of claim 7, since the through hole is formed at a position facing the light emitting element of the second substrate, it is possible to prevent irregular reflection from occurring on the second substrate.

According to the invention of claim 8, the edge portion of the second land on the side close to the light emitting element is formed in such a shape that the diffused reflection light does not go to the light transmitting portion. It is possible to prevent the diffusely reflected light of the land 2 from being mixed into the image to be originally displayed.

[Brief description of drawings]

FIG. 1 is a diagram showing a head-mounted display according to an embodiment of the present invention and a display system using the same.

FIG. 2 is a diagram showing a specific example of a small display device that is housed inside a box 105 of FIG. 1 and generates a raster image for displaying information.

3A and 3B are diagrams showing a configuration of the LED device 500 shown in FIG. 2 and a manufacturing method thereof.

4 is an LED of the LED array chip 502 shown in FIG.
It is a figure which shows a formation surface.

5 is a line A- of the LED array chip 502 shown in FIG.
It is sectional drawing which follows A.

FIG. 6 is a top view of a transparent substrate 501 shown in FIG.

FIG. 7 is a land 52 in the LED array chip 502.
It is a figure which shows the preferable example of arrangement | positioning of 1a and 521b.

FIG. 8 is a land 52 in the LED array chip 502.
It is a figure which shows the preferable example of a shape of 1a and 521b.

FIG. 9 is a metal wiring 5 in the LED array chip 502.
It is a figure which shows an example of the preferable arrangement | positioning position of 22.

FIG. 10 is a diagram showing another example of a preferable arrangement position of the metal wiring 522 in the LED array chip 502.

FIG. 11 is a diagram showing still another example of a preferable arrangement position of the metal wiring 522 in the LED array chip 502.

FIG. 12 is a diagram showing still another example of a preferable arrangement position of the metal wiring 522 in the LED array chip 502.

13 is a diagram showing an embodiment in which the embodiment shown in FIG. 7 and the embodiment shown in FIG. 9 are combined.

14 is a diagram showing an embodiment in which the embodiment shown in FIG. 8 and the embodiment shown in FIG. 9 are combined.

FIG. 15 illustrates another preferred embodiment of LED device 500.

16 is a diagram showing still another preferred embodiment of the LED device 500. FIG.

FIG. 17 is a diagram showing yet another preferred embodiment of the LED device 500.

FIG. 18 is a view showing a head-mounted display according to another embodiment of the present invention.

FIG. 19 is a plan view of a conventional LED module.

FIG. 20 is a front view of a conventional LED module.

FIG. 21 is a diagram showing a schematic configuration of an optical system of a head-mounted display equipped with a conventional LED module.

FIG. 22 is one of the problems in the conventional LED module.
It is a figure for demonstrating the method of canceling one.

[Explanation of symbols]

 100: Head-mounted display 300: Remote signal source 402, 403: Lens 405: Mirror 500: LED device 501: Transparent substrate 501a: Through hole 502: LED array chip 503a, 503b: LED driver IC 520: LED light emitting part 521a , 521b, 531a, 531b: Lands 522, 532a, 532b: Metal wiring 523: Bumps 511: Antireflection coating 512: Mask pattern

Claims (8)

[Scope of utility model registration request] 1. A small-sized display for displaying an image in the field of view of a user, which is capable of independently and selectively displaying a plurality of light-emitting elements arranged in a predetermined manner, said light-emitting module A mirror that reflects the light emitted from each light emitting element of the module toward the user's eye, and the mirror is repeatedly moved over a predetermined range of motion, thereby substantially two-dimensionally within the field of view of the user. A light emitting module is provided with a plurality of light emitting elements which are arranged in a predetermined method and each of which is independently and selectively in a light emitting state, and each of the light emitting elements. A first substrate provided with a plurality of first lands connected to each other, a drive circuit for driving the light emitting element, and a plurality of second circuits individually connected to respective output ends of the drive circuit. La And a second substrate having a light transmitting portion in at least a part thereof, wherein the first substrate and the second substrate are arranged such that each light emitting element faces the light transmitting portion. A display, wherein the display is overlapped and the first land and the second land are pressure-bonded to each other via bumps. 2. The first land and the light emitting element are separated by a sufficient distance so that the diffused reflection light of the first land is reduced to a predetermined value or less. The display according to item 1. 3. The edge portion of the first land on the side close to the light emitting element is formed in a shape such that the diffused reflected light does not go to the light transmitting portion. The display according to 1. 4. Each of the first lands and each of the light emitting elements are connected by a plurality of wirings, and each wiring is arranged at a position that blocks an optical path between adjacent light emitting elements. Display according to claim 1, characterized in that 5. The display according to claim 1, wherein an antireflection film is formed on a surface of the second substrate facing the first substrate. 6. A light-shielding mask pattern is formed on the surface of the second substrate opposite to the surface facing the first substrate, and the mask pattern has an array of the light-emitting elements. The display according to claim 1, wherein a slit for transmitting light is formed at a position corresponding to the position. 7. A through hole is formed in the second substrate at a position facing the light emitting element,
The display according to claim 1. 8. The edge portion of the second land on the side close to the light emitting element is formed in a shape such that the diffused reflected light does not go to the light transmitting portion. The display according to 1.