JPH0653921B2 - Vertical type mechanical device - Google Patents

Description

Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a vertical plating apparatus configured so that a wire to be plated passes in a substantially vertical direction.

[Technical Background of the Invention and Problems Thereof] In general, black copper sulfide is formed by free sulfur in insulating rubber on a copper wire coated with rubber insulation or a copper wire soldered. In order to prevent this or improve workability during soldering, tin plating is performed.

Conventionally, as such a tin plating device on a copper wire, a horizontal tin plating device as shown in FIG. 3 has been generally used.

This tin plating apparatus 1 is normally used in a wire drawing line by being connected in tandem with a wire drawing softening machine 2.

As shown in FIGS. 3 and 4, this tin plating apparatus has copper wire passage holes 1b and 1b facing each other at eccentric positions at both ends of a horizontally arranged cylindrical main body 1a, and The cylindrical body 1a is configured to be rotated by the piston 1d of the fluid cylinder 1c around the copper wire passage holes 1b and 1b. The + symbol is the center of rotation.

The cylindrical main body 1a is
As shown by the dotted line in FIG. 3, the piston 1d of the fluid cylinder 1c is lowered and the copper wire passage holes 1b, 1b are filled with molten tin 5.
It is arranged to be located above the liquid level F.

During the plating operation, the copper wire 6 drawn by the wire-drawing softening machine 2 is fixed to the winding machine 4 through the cylindrical body 1a and the water cooling tank 3 so that it can be wound up. Molten tin 5 is filled in the cylindrical main body 1a until it is located slightly below the copper wire passage holes 1b, 1b.

After this, wire drawing work is started, and when the working conditions are stabilized, the piston 1d of the fluid cylinder 1c is raised, and along with this, as shown by the solid line in FIG.
a is rotated and the positions of the copper wire passage holes 1b and 1b are the molten tin 5
The position is lower than the liquid level F of.

The copper wire 6 drawn by the wire drawing softener 2 and softened is guided to the inlet side guide rolls 7 and 8 and introduced into the cylindrical main body 1a, passes through the molten tin 5 and is plated with tin on its surface. Is applied. The copper wire 6 that has passed through the cylindrical main body 1 a is cooled in the water cooling tank 3, then guided to the outlet side guide rolls 9 and 10 and wound up by the winding machine 4.

When stopping the plating operation, each device is stopped in the reverse order of the above.

By the way, in such a horizontal tin plating apparatus, since the copper wire horizontally passes through the molten tin, the tin plating layer of the copper wire leaving the tin plating apparatus moves downward by its own weight, and the lower side of the tin plating layer becomes thicker. was there.

In addition, since the copper wire pass line horizontally passes through the shallow part of the molten tin, the convection area of the molten tin becomes large and the amount of tin oxide generated increases, and the tin oxide floating on the surface of the molten tin is entrained. However, there is a drawback that defective plating is likely to occur.

Furthermore, since the immersion length of the copper wire in the tin plating device is uniquely determined by the length of the cylindrical body, the resistance of molten tin is relative to the wire diameter in the case of a thin copper wire. Therefore, there is a problem that the copper wire winding speed cannot be increased and the productivity is lowered.

Furthermore, since two copper wire passage holes 1b and 1b in the horizontal direction of the cylindrical main body 1 require dies, it takes time to wire the wires, and since the heat dissipation area is large, power consumption is large, and water cooling Since the tank is also horizontal, there is a drawback that it requires a large installation area.

The inventors of the present invention previously invented a continuous wire drawing vertical type tin plating apparatus which solved such a difficulty and applied for a patent (Japanese Patent Application No.
9-250262) (Japanese Patent Laid-Open No. 61-127856).

As shown in FIG. 5, this vertical tin plating apparatus has a two-tank type tin plating tank 14 having a molten tin storage portion 11, a molten tin immersion portion 12 and a molten tin communication portion 13 for communicating these at the bottom side surfaces. And this two tank type tin plating tank 1
4, a support device 15 for tiltably supporting the molten tin communication portion 13 at the bottom of the molten tin communication portion 13 by a hinge 15a, and a molten tin storage portion 11
The main part of the tilting device 16 is composed of a fluid cylinder 16b having a working end of a piston 16a fixed to the bottom of the tilting device 16. 17 is a wire drawing softener, 18 is a water cooling tank,
19 is a winder. A heater 20 is provided inside the two-tank tin plating tank 14 to heat the tin so that the tin is kept in a molten state.

In the vertical tin plating apparatus having the above-described configuration, first, the molten tin 21 is melted into the molten tin storage portion 1 before starting the plating operation.
The piston 16a of the tilting device 16 is moved in the direction of arrow A so as to move to the 1 side to expose the copper wire passage hole 12a. Next, the copper wire 22 delivered from the wire drawing softener 17 is guided through the inlet side guide roll 23 from the upper portion of the molten tin dipping portion 12 to the copper wire insertion hole 12a at the bottom thereof, and the die 24
The copper wire 22 that has passed through the molten tin dipping portion 12 and is guided to the water cooling tank 18 via the guide roller 25 on the outlet side, and is wire-wound to the winding machine 19 via the sheave 26, the water cooling tank 18 ', and the guide roll 27. To do. The guide roll 25 is movable back and forth toward the copper wire passage by the air cylinder 25a. The guide roll 25 advances toward the copper wire passage when the piston 16a moves in the direction of arrow A, and moves backward when the piston 16a moves in the opposite direction. Then, the copper wire 22 is always guided to substantially the center of the copper wire insertion hole 12a. After completion of the wire drawing, the piston 16a of the tilting device 16 is raised to melt the molten tin 21 from the molten tin storage portion 11 side so that the immersion length L necessary for plating the copper wire 22 in the molten tin immersion portion 12 can be obtained. It is moved to the tin immersion part 12 side. The immersion length L can be changed by adjusting the amount of molten tin put into the molten tin reservoir 11.

After that, when the winding machine 19 is driven to continuously pass the copper wire 22 through the molten tin dipping portion 12, the copper wire 22 is tin-plated.

By the way, in this tin plating apparatus, there is a risk that the air cylinder 25a may not operate smoothly due to air shortage, heat from the molten tin immersion portion, or failure of the electrical system.

When such a defect occurs, there is a possibility that a disconnection occurs, it takes a lot of trouble to restore it, and productivity is greatly impaired.

[Object of the Invention] The present invention has been made in response to such conventional circumstances.
It is an object of the present invention to provide a vertical plating apparatus which includes a plated wire holding device with few failures and which solves the above problems.

[Summary of the Invention] That is, in the plating apparatus of the present invention, in the above-described vertical plating apparatus, the plated wire holding device is held so as to be retractable by positioning the plated wire holding portion at the tip in the plated wire passage. Operating arm, a spring device for urging the operating arm toward the plated wire passage, a two-tank type plating tank and a base, and the two-tank type plating tank is returned from a tilted position to a normal position. When the two-tank type plating tanks are brought into contact with each other when the two-tank type plating tanks are tilted, the operating arms are retracted against the springs of the spring devices, so that the number of failures is reduced, thereby improving the productivity in the plating operation. Is improved.

Embodiments of the Invention Next, embodiments of the present invention will be described.

In the following examples, parts other than the device for holding a wire to be plated have the same configuration as the vertical plating device invented by the present inventor, and therefore, the same parts are designated by the same reference numerals to omit redundant description. To do.

FIG. 1 is a front view showing the main part of the device of the present invention.

The plated wire holding device 50 of this embodiment has a main body fixed to the two-tank tin plating tank 14 and is configured to be tiltable together with the two-tank tin plating tank 14 by a hinge 15a.

This main body portion has a tubular portion 5 having a flange 51 at the rear end.
2 and the operating arm 5 slidably inserted in the tubular portion 52
3 and 3. A guide roll 54 is attached to the tip of the operating arm 53, and the rear end has a small diameter.
A stop plate 55 is fixed to the end surface. Working arm 53
A coil spring 56 is inserted between the small-diameter portion and the tubular portion 52, and is fixed by a holding plate 57. Furthermore, the tubular portion 5
A wedge-shaped striker 58a is fixed to the outer lower portion of 2, and the striker 58a on the upper surface of the support device 15 is fixed.
A wedge-shaped striker 58b is fixed at a position where it engages with a.

The length of the operating arm 53 and the strikers 58a, 5
As shown in FIG. 2, the fixed positions of the 8b are the strikers 58a, 5a when the two-tank tin plating tank 14 is tilted.
8b is separated from each other and the elastic force of the coil spring 56 causes the operating arm 5 to move.
3 moves forward and the guide roll 54 positions its guide surface in the passage of the wire to be plated, and the striker 58a, in the process of the dual tank tin plating tank 14 returning from this position to the normal state.
58b engages and moves along the wedge surface to retreat the actuating arm 53 against the elastic force of the coil spring 56, whereby the distance between the guide roll 54 and the plated wire passage is almost equal to the striker thickness. The distance d corresponding to the height is set.

When the two-tank tin plating tank 14 tilts from the normal position, the striker 58 is moved in the reverse order to the above.
The a and 58b are separated from each other, and the operating arm 53 is moved forward by the elastic force of the coil spring 56 so that the guide roll 54 is positioned in the plated wire passage.

[Advantages of the Invention] As described above, the vertical plating apparatus of the present invention has the following advantages.

Since the copper wire passes vertically through the molten tin immersion part,
A plating layer having a uniform thickness can be obtained without flattening the plating thickness due to its own weight.

Since the copper wire passes through the center of the molten tin soaked portion, tin oxide is not entrained and a good plating layer can be obtained.

Since the immersion length of the molten tin immersion part is variable, the linear velocity can be increased even in the case of a copper wire having a small diameter.

Since the die to be used need only be one copper wire passage hole in the molten tin dipping portion, it is easy to wire.

Since the convection area in the molten tin immersion part through which the copper wire passes is small, the generation of tin oxide is small.

Since the cooling device can be arranged directly below the molten tin immersion portion, the installation area can be reduced.

 Since it is a two-tank type, the heating efficiency of the heater is good.

The device for holding a wire to be plated operates by mechanical means in response to the tilting operation of the two-tank type plating tank k, so that there are few failures and the productivity can be improved.

[Brief description of drawings]

FIG. 1 is a front view showing a main part of a vertical tin plating apparatus according to an embodiment of the present invention, FIG. 2 is a front view showing its operation, FIG. 3 is a schematic view of a conventional horizontal tin plating apparatus, and FIG. Is a sectional view taken along the line III-III of FIG. 3, and FIG. 5 is a sectional view of another conventional horizontal tin plating apparatus. 11 ... Molten tin storage part 12 ... Molten tin immersion part 13 ... Molten tin communication part 14 ... Two-tank type tin plating tank 15 ... Supporting device 16 ... Tilt device 17 ... Wire drawing softening machine 18, 18 ' …… Water cooling tank 19 …… Winder 20 …… Heater 21 …… Molten tin 22 …… Copper wire 50 …… Plated wire material holding device 51 …… Flange 52 …… Cylindrical part 53 …… Operating arm 54 …… Guide roll 55 …… Stop plate 56 …… Coil spring 57 …… Pressing plate 58a, 58b …… Striker

Claims (1)

[Claims] 1. A hot-dip plated material dipping portion for allowing a wire to be plated to pass through the through hole in the vertical direction, a hot-dip plated material reservoir for storing hot-dip plated material, and A two-tank type plating tank having a hot-dip plating material communicating portion that connects the hot-dip plating material immersion portion and the hot-dip plating material storage portion, and a supporting means for tiltably supporting the two-tank plating tank on a base, Means for tilting the two-tank type plating tank so that the hot-dip plated material immersion part moves up and down relative to the hot-dip plated material reservoir, and the hot-dip plated material when the two-tank type plating tank is tilted A plated wire holding device for projecting into the plated wire passage below the immersion part to hold the plated wire and maintain the relative position between the plated wire and the plated wire insertion hole of the hot dip immersion part Vertical plating equipment In the device for holding a plated wire rod, the device for holding a plated wire rod at a tip end is positioned in the plated wire passage, and the operating arm is held so as to be retractable, and the operating arm is attached to the plated wire passage. A biasing spring device, and the two-tank plating tank and the base, which are provided in the two-tank plating tank and the base, contact each other when the two-tank plating tank is returned from the tilted position to the normal position, and the operating arm moves as the two-tank plating tank tilts. An engaging device for retracting the spring against the spring of the spring device.