JPH0652188U - High frequency device package - Google Patents

Abstract

(57) [Summary] [Object] To provide a package for a high-frequency element that prevents deterioration of a high-frequency signal transmitted through a circuit board 6 due to disturbance such as electromagnetic waves. [Structure] The circuit board 6 is provided with a pattern 6A and a ground conductor 6B, the coaxial connectors 4 and 5 are provided with outer conductors 4A and 5A, and the ends of the pattern 6A are fixed with solder 9 by core wires 4B and 5B. 6B is fixed to the conductor base 3 with the solder 9, the package 1 is fixed with the coaxial connector 5 via the insulator 8, the conductor base 3 is fixed with the insulator base 7, and the coaxial connector 4 is fixed via the solder 9. And fix it to package 1.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 This invention relates to a high-frequency device package that houses a high-frequency device.

[0002]

[Prior art]

 The conventional technique will be described with reference to FIG. FIG. 2 is a cross-sectional view of a high frequency device package, where 4 and 5 are coaxial connectors, 4A and 5A are outer conductors, 4B and 5B are core wires, 6 is a circuit board, 6A is a circuit pattern, and 6B is a ground conductor. Is solder, 10 is a package, 11 is a ground, and 12 is a lid.

In FIG. 2, the package 10 and the lid 12 are made of a conductor. Both sides of the circuit board 6 are metallized, one side is a circuit pattern 6A on which a circuit is formed, and the other side is a ground conductor 6B. The ground conductor 6B of the circuit board 6 is fixed to the package 10 with solder 9. The coaxial connectors 4 and 5 are composed of outer conductors 4A and 5A and core wires 4B and 5B. The outer conductors 4A and 5A are fixed to the package 10 by the solder 9, and the core wires 4B and 5B are fixed to the circuit pattern 6A of the circuit board 6 by the solder 9.

The lid 12 is fixed to the package 10 with solder 9. In FIG. 2, the solder 9 is used to fix the package 10 and the coaxial connectors 4 and 5, or the package 10 and the lid 12, but any other conductor may be used.

In FIG. 2, the ground path of the coaxial connector 5 passes from the outer conductor 5 A of the connector 5 through the package 10 and reaches the ground 11 via the outer conductor 4 A of the connector 4.

[0005]

[Problems to be solved by the device]

 In the configuration of FIG. 2, when the potential of the package 10 changes, the potential of the outer conductor 5A of the coaxial connector 5 also changes. For example, when an electromagnetic wave is incident on the package 10 or the lid 12, the electric potential of the package 10 changes due to the electromagnetic wave, and the electric potential of the outer conductor 5A of the coaxial connector 5 easily changes. As a result, there is a problem that noise due to disturbance such as electromagnetic waves is superimposed on the high frequency signal transmitted through the circuit board 6 and the high frequency signal deteriorates. An object of the present invention is to provide a high-frequency device package that prevents deterioration of a high-frequency signal transmitted through the circuit board 6 due to disturbance such as electromagnetic waves.

[0006]

[Means for Solving the Problems]

 To achieve this object, in the present invention, a circuit board 6 having a pattern 6A and a ground conductor 6B, a core wire 4B for fixing one end of the pattern 6A of the circuit board 6 with solder 9, and an outer conductor 4A. , A core 5B for fixing the other end of the pattern 6A of the circuit board 6 with solder 9, a coaxial connector 5 composed of the outer conductor 5A, and a ground conductor of the circuit board 6. 6B includes a conductor base 3 for fixing 6B with solder 9, and a package 1 for fixing the coaxial connector 4, the coaxial connector 5, and the conductor base 3. The package 1 fixes the coaxial connector 5 via an insulator 8. The conductor base 3 is fixed via the insulator base 7, and the coaxial connector 4 is fixed to the package 1 via the solder 9.

[0007]

[Action]

 Next, the structure of the high frequency package according to the present invention is shown in FIG. 1 is a package, 3 is a conductor base, 7 is an insulator base, 8 is an insulator, and others are the same as those in FIG. In FIG. 1, the conductor base 3 is fixed to the insulator base 7, and the insulator base 7 is fixed to the package 1. The outer conductor 4A of the coaxial connector 4 is fixed to the package 1 and the conductor base 3 with solder 9. The outer conductor 5A of the coaxial connector 5 is fixed to the conductor base 3 with solder 9 and to the package 1 with an insulator 8.

Next, the operation will be described with reference to FIG. The ground path of the coaxial connector 5 passes from the outer conductor 5A to the ground 11 through the conductor base 3 and the outer conductor 4A of the coaxial connector 4. The outer conductor 5A of the coaxial connector 5 is insulated from the package 1 by the insulator 8, and the conductor base 3 is insulated from the package 1 by the insulator base 7.

The outer conductor 4 A of the coaxial connector 4 is electrically connected to the package 1, but is directly connected to the ground 10 and therefore has a low ground impedance and is not affected by the potential change of the package 1. Therefore, the potential of the outer conductor 5A of the coaxial connector 5 is independent of the potential of the package 1 and is only affected by the potential of the outer conductor 4A of the coaxial connector 4.

[0010]

[Effect of device]

 According to this invention, even when electromagnetic waves or the like enter the package or lid of the high-frequency device package, the outer conductor of the coaxial connector on the side not grounded is insulated from the package by the insulator, so The high-frequency signal transmitted through the circuit board can be prevented from being deteriorated due to the influence of disturbance such as electromagnetic waves, because it is not affected by the potential fluctuation due to. Although FIG. 1 illustrates the case where there are two coaxial connectors, even in the case of a package having a plurality of coaxial connectors, only one coaxial connector is electrically connected to the package 1 and is connected to the ground 11, and the other coaxial connectors are used. By insulating and holding the same with the package 1, the influence of the potential fluctuation of the package is eliminated as in the case of FIG.

[Brief description of drawings]

FIG. 1 is a package for a high frequency device according to the present invention.

FIG. 2 is a package for a high frequency device according to the related art.

[Explanation of symbols]

 1 Package 3 Conductor Base 4.5 Coaxial Connector 4A / 5A Outer Conductor 4B / 5B Core 6 Circuit Board 6A Circuit Pattern 6B Grounding Conductor 7 Insulator Base 8 Insulator 9 Solder 10 Package 11 Grounding 12 Lid

Claims (1)

[Scope of utility model registration request] 1. A circuit board (6) comprising a pattern (6A) and a ground conductor (6B), and one end of the pattern (6A) of the circuit board (6) is soldered (9).
The core wire (4B) to be fixed with, the coaxial connector (4) composed of the outer conductor (4A), and the other end of the pattern (6A) on the circuit board (6).
The core wire (5B) fixed with (9), the coaxial connector (5) composed of the outer conductor (5A), and the conductor base (5) that fixes the ground conductor (6B) of the circuit board (6) with solder (9). 3), coaxial connector (4), coaxial connector (5), and conductor base (3)
And the package (1) for fixing the coaxial connector (5) via the insulator (8) and the conductor base (3) via the insulator base (7). A high-frequency device package characterized in that the coaxial connector (4) is fixed and the coaxial connector (4) is fixed to the package (1) via solder (9).