JPH0652149U - Vacuum tweezers - Google Patents

Abstract

(57) [Abstract] [Purpose] To improve vacuum tweezers that suck wafers so that suction can be performed accurately. [Structure] A skirt 10 made of an elastic material protruding from a suction surface 6 is provided around a wafer suction port 5 of a head 4 of vacuum tweezers. When the head 4 is brought close to the wafer 20, the skirt 10 sticks to the wafer 20 and draws the wafer 20 to the suction surface 6.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to vacuum tweezers.

[0002]

[Prior art]

 Vacuum tweezers have a head for adsorbing a wafer on the tip of a pipe. The head portion is pulled by vacuum to adsorb and fix the wafer. The pipe is made of metal pipe.

[0003]

[Problems to be solved by the device]

 Conventionally, when adsorbing a wafer to vacuum tweezers, the wafer cannot be adsorbed unless the wafer adsorbing surface of the vacuum tweezers is parallel. An object of the present invention is to improve a vacuum tweezer head and provide a vacuum tweezer in which a wafer can be easily sucked.

[0004]

[Means for Solving the Problems]

 In order to solve the above problems, the present invention is characterized in that, in vacuum tweezers for sucking a wafer, an elastic skirt surrounding the suction port and protruding from the suction surface is provided in the head. . Here, the elastic skirt refers to a skirt which is itself made of an elastic material or a scar which is biased by another elastic material such as a spring.

[0005]

[Action]

 FIG. 2 shows a vertical cross-sectional schematic perspective view of the vacuum tweezers. In the vacuum tweezers 1, the pipe 2 projects from the holding portion 3, and the head 4 is attached to the tip thereof. The suction port 5 is directed toward the wafer, and the button 9 is operated to suck the wafer on the suction surface 6 of the head 4 and suck 7 into the vacuum pump.

In the vacuum tweezers of the present invention, for example, as shown in FIG. 1, a skirt 10 made of an elastic material is provided so as to surround the suction port 5 so that the suction port is sealed. When the suction port of the head 4 is brought closer to the wafer 20 as shown in FIG. 3 (a), the skirt 10 hits the wafer surface. At this time, when suction 7 is performed, the wafer 20 moves as shown by an arrow 8 in FIG. At last, the wafer 20 is brought into close contact with the suction surface 6 as shown in FIG. 3 (c).

[0007]

【Example】

 FIG. 1 is a sectional view of a head 4 of a vacuum tweezers according to an embodiment of the present invention. In the head 4 of the vacuum tweezers, a rubber-like flexible skirt 10 is attached to the inside of the suction port 5 around the suction port 5. As shown in FIGS. 3 (a), 3 (b) and 3 (c), the rubber-like skirt 10 is not perfectly parallel to the wafer 20 and the head 4 if the wafer surface is within a certain distance range. Even then, the wafer 20 can be adsorbed. Further, after the head 4 attracts the wafer 20, the wafer 20 presses the skirt 10, contacts the hard suction surface 6 of the head 4, and is fixed.

The skirt 10 provided around the suction port 5 of the vacuum tweezers is preferably made of a material having flexibility and chemical resistance such as fluororesin rubber. Further, the skirt 10 has such a shape and strength that, when the wafer is adsorbed, the skirt 10 is pushed by the wafer and stored inside the suction port, but is not drawn deep inside the suction port due to vacuum. Any shape is acceptable as long as it has one. The skirt is a sealing member that moves up and down in the groove provided on the suction surface 6, and may be biased so as to project from the suction surface by another elastic material such as a spring. Good.

[0009]

[Effect of device]

 By using the vacuum tweezers of the present invention, the suction of the wafer is facilitated and the wafer can be firmly fixed by the head portion. Even if the wafer is lifted from the head due to some impact, the skirt maintains a vacuum so that the wafer can be sucked and held without falling, streamlining the wafer handling work and improving efficiency. Contribute to.

[Brief description of drawings]

FIG. 1 is a sectional view of a head of a vacuum tweezers of an embodiment.

FIG. 2 is a vertical cross-sectional view of a conventional vacuum tweezer head.

FIG. 3 is an operation explanatory view of the vacuum tweezers of the embodiment.

[Explanation of symbols] 1 vacuum tweezers 2 pipe 3 holding part 4 head 5 suction port 6 suction surface 7 suction 8 arrow 9 operation button 10 skirt 20 wafer

Claims (1)

[Scope of utility model registration request] 1. A vacuum tweezers for sucking a wafer, characterized in that an elastic skirt surrounding a suction port and projecting from a suction surface is provided on the head.