JPH0649546Y2 - IC individualization mechanism of IC handler - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention separates the IC from the loader and supplies it to the measurement unit.
It relates to the IC handler that checks the electrical characteristics of the IC, classifies them according to their characteristics, and stores them in the unloader, especially because the ICs are individually (one by one) slipped from the upstream supply chute to the downstream supply chute. Of IC individualization mechanism.

[Conventional technology]

Generally, burrs 13 (see Figs. 4 and 5) generated in the manufacturing process are projected on the front, side and rear of IC1.
When C1 is individualized and sent to the measuring unit 14 (see Fig. 3), the IC
Burrs 13 of the same group interfere with each other, resulting in individualization mistakes.

Therefore, in the conventional IC individualizing mechanism, a step 17 is provided on the rail surface 16 of the supply chute 15 as shown in FIGS. 4 and 5, and a kicker 19 projecting from the step 17 by a rotating operation is provided below the rail surface 16. The kicker 19 is pivoted on the rotary shaft 18, and the kicker 19 is rotated to make a step.
I was hitting the rear end of IC1 that was fitted in 17, and forced out IC1.

[Problems to be solved by the invention]

However, in the above-mentioned conventional mechanism, the burr 13 on the rear surface of the leading IC1 is the burr 13 on the front surface of the next IC1 as shown in FIG.
In some cases, a phenomenon may occur in which the user rides on the floor and floats in the air, and does not fit into the step 17. In such a case, even if the kicker 19 is rotated, the kicker 19 will be missed and the supply chute 15
There was a problem that the IC1 was clogged inside and the IC1 could not be individualized.

The present invention has been made in view of the drawbacks of the conventional example,
The target place is surely not affected by Bali
It is to provide an IC individualizing mechanism of an IC handler that can individualize the IC.

[Means for solving problems]

In order to solve the above problems and achieve the above object, the mechanism of the present invention is provided with an upstream supply chute 2 in which a large number of ICs 1 slide down in a row as shown in the first and second illustrations, and are individualized. The downstream supply chute 3 in which the IC1 slides down one by one is arranged at the required angle, and the engagement of the leading IC and the next IC by the burr is rotated between the upstream and downstream supply chutes 2 and 3. A rotary chute 4 that is released by operation is provided, and an inlet 6 and an outlet 8 of the rotary chute 4 are provided in the rotary chute 4, and an outlet 5 and a downstream supply chute 3 of the upstream supply chute 2 are provided, respectively.
When the rotary chute 4 is connected to the downstream supply chute 3, it is disconnected from the IC passage 10 of the rotary chute 4 when the rotary chute 4 is connected to the inlet 7 of the When separated from the downstream supply chute 3, the rotation chute 4 is provided with a stopper 11 which projects into the IC passage 10 to prevent the IC 1 from slipping off, and after the rotation chute 4 is connected to the upstream supply chute 2. From the point of time until it is separated from the upstream supply chute 2, the IC passage of the upstream supply chute 2
From the time when the rotary chute 4 is separated from the upstream chute 4 until it is connected to the upstream chute 2 next time, it projects into the IC passage 10 of the upstream chute 2 and the next The IC pressing pin 12 for pressing the back surface of the IC 1 is provided near the outlet of the upstream supply chute 2.

[Action]

When the IC 1 is supplied to the upstream supply chute 2 of the IC individualizing mechanism A of the present invention, the inlet 6 of the rotating chute 4 is connected to the outlet 5 of the upstream supply chute 2, and the IC pressing pin 12 is the upstream side. The stopper 11 is in a state of being disengaged from the IC passage 10 of the supply chute 2 while being in a state of protruding into the IC passage 10 of the rotating chute 4 (see FIG. 2).

In this state, when the IC1 is supplied to the upstream supply chute 2, the IC1 slides down in the chute 2 in a line and collides with the stopper 11 to stop (see FIG. 2). IC at the beginning
When 1 collides with stopper 11 and stops, IC holding pin 12
Moves down and presses the back surface of the next IC19.

In this state, as shown in the first illustration, the drive unit 9 operates to rotate the rotating chute 4, and the outlet 8 of the rotating chute 4 is connected to the inlet 7 of the downstream supply chute 3. In accordance with this movement, the stopper 11 is removed from the IC passage 10 to free the leading IC 1.

Further, at this time, even if the leading IC 1 and the next IC 1 are engaged with each other by the burr 13, the leading IC 1 is forcibly moved by the turning motion of the turning chute 4, and the burr 13 is engaged. As a result, the IC1 at the beginning will be completely free.

The thus freed IC1 slides into the downstream supply chute 3. When the leading IC1 slides down and the IC1 disappears from the turning chute 4, the driving unit 9 operates in the opposite direction to rotate the turning chute 4 in the opposite direction, and the inlet 6 of the turning chute 4 is again moved. It is connected to the outlet 5 of the upstream supply chute 2. At this time, the stopper 11 is again brought into a state of being projected into the IC passage 10.

When the connection between the inlet 6 of the rotary chute 4 and the outlet 5 of the upstream supply chute 2 is completed, the IC pressing pin 12 is raised to raise the IC.
Free one One free row of IC1 slides down and collides with stopper 11 to stop.

After that, the above-mentioned operation is repeated, and the rows of IC1 that have slid onto the upstream supply chute 2 are individualized and the downstream supply chute 3 is separated.
It will slide down to.

〔Example〕

First, an IC handler to which the mechanism of the present invention is applied will be described with reference to FIG.

In FIG. 3, 20 is a loader loaded with a large number of IC filling magazines 25, 26 is an IC supply device, 27 is a tilting arm, 2 is an upstream supply chute, A is an IC individualizing mechanism according to the present invention, and 3 is a downstream side. Supply chute, 14 measuring unit, 21 unloader, 22
Is a test station, 23 is a control unit, and 24 is a mount on which each block is placed.

The IC filling magazines 25 loaded on the loader 20 are supplied one by one to the IC supply device 26, held by the tilting arm 27 and tilted, and connected to the upstream supply chute 2. When the IC filling magazine 25 is connected to the upstream supply chute 2,
The ICs 1 slide into the upstream supply chute 2 and are individually singulated by the singulation mechanism A of the present invention, and then supplied to the measuring unit 14.

The IC 1 supplied to the measuring unit 14 is checked for its electrical characteristics here, and then classified according to characteristics and stored in the empty magazine 36 of the unloader 21.

The configuration of the mechanism A of the present invention applied to such an IC handler will be described in detail.

FIG. 1 is an enlarged cross-sectional view showing a state where a rotary chute is connected to a downstream side supply chute which constitutes an embodiment of the mechanism of the present invention, and FIG. 2 is a state where the rotary chute is similarly connected to an upstream side chute. It is an expanded sectional view shown.

In FIGS. 1 and 2, an upstream supply chute 2 in which a large number of ICs 1 slide down in a row and a downstream supply chute 3 in which individual ICs 1 slide down are arranged at required angles. The outlet portion 30 of the upstream supply chute 2 is divided, but it may not be divided.

A rotating chute 4 is arranged between the outlet portion 30 of the upstream supply chute 3 and the downstream supply chute 3 and is pivotally supported by a rotating shaft 28. Reference numeral 9 is a drive unit, such as a drive cylinder, connected to the lever unit 35 of the rotating chute 4.

Roof part 30 that constitutes the outlet part 30 of the upstream supply chute 2
The upper part of the rear end of a projects from the rear end face of the rail part 30b to the upper surface side of the roof part 2a of the upstream supply chute 2, and the front end of the supply chute 2 and the rear end side of its outlet part 30 are
The IC passages 10 are fitted so that they match each other.

Also, the lower front end of the roof portion 30a constituting the outlet portion 30,
The upper part of the front end projects in two steps from the front end face of the rail part 30b, and the rear end face of the roof part 4a constituting the turning chute 4 connected thereto is retracted from the rear end face of the rail part 4b, and the outlet of the outlet part 30 When the inlet 6 of the rotary chute 4 is fitted and connected to the turn chute 5, the IC passages 10 of them are matched.

Reference numeral 11 denotes a positioning stopper inserted into a through hole 29 formed in the roof portion 4a of the rotating chute 4, and when the rotating chute 4 is connected to the downstream supply chute 3,
When the turning chute 4 separates from the downstream supply chute 3 when it comes off from the IC passage 10, it projects into the IC passage 10 to prevent the IC 1 from slipping off. The drive portion of the stopper 11 is not shown.

Reference numeral 12 is an IC pressing pin inserted into a through hole 31 formed in the roof portion 30a of the outlet portion 30, and from the time point after the turning chute 4 is connected to the outlet portion 30 of the upstream supply chute 2, the outlet portion concerned. The IC passage 10 is detached from the IC passage 10 of the exit portion 30 until it is separated from 30, and the rotation chute 4 is also separated from the IC passage 10 until it is connected to the next outlet portion 30.
It projects inward and presses the back surface of the next IC1.

Reference numeral 32 is a drive portion of the IC pressing pin 12, and the IC pressing pin 12 is screwed to the screw portion 33 thereof. Reference numeral 34 is an adjustment nut for adjusting the height of the IC pressing pin 12.

The operation of this embodiment will be described below.

When IC1 is supplied from the tilting arm 27 to the upstream supply chute 2 of the IC individualizing mechanism A of the present invention, the inlet 6 of the rotating chute 4 is connected to the outlet 5 of the outlet portion 30 of the upstream supply chute 2. , IC holding pin 12 is located on the upstream side chute 2
The stopper 11 is in a state of being disengaged from the IC passage 10 while the stopper 11 is in a state of protruding into the IC passage 10 of the turning chute 4 (see FIG. 2).

In this state, when the IC1 is supplied to the upstream supply chute 2, the IC1 slides down in the chute 2 in a line and collides with the stopper 11 to stop (see FIG. 2). IC at the beginning
When 1 collides with stopper 11 and stops, IC holding pin 12
Goes down and presses the back of the next IC1.

In this state, the drive cylinder 9 operates to the right as shown in FIG. 1 to rotate the rotary chute 4 clockwise about the rotary shaft 28, and the outlet 8 of the rotary chute 4 is supplied to the downstream side. Connect to the entrance 7 of the chute 3. In accordance with this movement, the stopper 11 is removed from the IC passage 10 to free the leading IC 1.

Further, at this time, even if the leading IC 1 and the next IC 1 are engaged with each other by the burr 13, the leading IC 1 is forcibly moved by the turning motion of the turning chute 4, and the burr 13 is engaged. As a result, the IC1 at the beginning will be completely free.

The thus freed IC1 slides into the downstream supply chute 3 and is sent to the measuring unit 14. Top
When IC1 slides down and IC1 disappears from the rotation chute 4, the drive cylinder 9 operates to the left to rotate the rotation chute 4 counterclockwise, and the inlet 6 of the rotation chute 4 is again upstream. It is connected to the outlet 5 of the outlet part 30 of the side feed chute 2.
At this time, the stopper 11 is again brought into a state of being projected into the IC passage 10.

When the connection between the inlet 6 of the rotating chute 4 and the outlet 5 of the outlet portion 30 of the upstream supply chute 2 is completed, the IC pressing pin 12 is raised to free the IC 1. 1 row of free IC1
It slides down and collides with the stopper 11 to stop.

After that, the above-mentioned operation is repeated, and the rows of IC1 that have slid onto the upstream supply chute 2 are individualized and the downstream supply chute 3 is separated.
It will slide down to.

[Effect of device]

As described above, according to the present invention, the rotary chute 4 is provided between the upstream supply chute 2 and the downstream supply chute 3 which are arranged at different angles, and the rotary chute 4 is provided with the stopper 11.
Since the IC pressing pin 12 is provided in the vicinity of the outlet of the upstream side supply chute 2, the rotating chute 4 is rotated to individualize the IC and the outlet 5 of the upstream side supply chute 2 and the downstream side supply chute 3 are rotated. Even if the leading IC1 and the next IC1 are engaged by the burr 13, the leading chute 4 is switched by the turning chute 4 even if the leading IC1 and the next IC1 are engaged with each other.
Since the IC1 is forcibly rotated together with the rotation chute 4 and is disengaged from the next IC1, there is an advantage that individualization can be surely performed without a bridge state as in the conventional case.

[Brief description of drawings]

FIG. 1 is an enlarged cross-sectional view showing a state where a rotary chute is connected to a downstream side supply chute which constitutes an embodiment of the mechanism of the present invention, and FIG. 2 is a state where the rotary chute is similarly connected to an upstream side chute. FIG. 3 is an enlarged cross-sectional view, FIG. 3 is a front view of an IC handler to which the mechanism of the present invention is applied, FIG. 4 is a cross-sectional view showing an example of a conventional mechanism, and FIG. It is sectional drawing which shows the case where it becomes a bridge state. A ... IC individualization mechanism of the present invention, 1 ... IC, 2 ... Upstream supply chute, 5 ... Outlet, 3 ... Downstream supply chute, 7 ... Inlet, 4 ... Rotating chute, 6 ... the inlet, 8 ... the outlet, 9 ... driving part (driving cylinder), 10 ... IC passage, 11 ... stopper, 12 ... IC holding pin.

Claims (1)

[Scope of utility model registration request] 1. An upstream supply chute 2 in which a large number of ICs 1 slide down in a row, and a downstream supply chute 3 in which individual ICs 1 slide down one by one are arranged at a required angle. Between the side and downstream supply chutes 2 and 3, a turning chute 4 that disengages the leading IC and the next IC due to the burr by a turning operation is provided. The drive chute 4 is connected so that the inlet 6 and the outlet 8 of the moving chute 4 are connected to the outlet 5 of the upstream supply chute 2 and the inlet 7 of the downstream supply chute 3, respectively, and the rotating chute 4 supplies the downstream chute. Rotating chute 4 when connected to chute 3
When the turning chute 4 separates from the downstream side supply chute 3 when the turning chute 4 is separated from the IC passing path 10, the stopper 11 that prevents the IC 1 from sliding down is provided on the turning chute 4 and the turning chute 4 From the time point after 4 is connected to the upstream supply chute 2 until it is separated from the upstream supply chute 2, it is disconnected from the IC passage 10 of the upstream supply chute 2.
From the time when the rotary chute 4 is separated from the upstream supply chute 2 until the time when it is connected to the next upstream supply chute 2, it projects into the IC passage 10 of the upstream supply chute 2 and the next
An IC individualizing mechanism for an IC handler in which an IC pressing pin 12 for pressing the back surface of the IC 1 is provided near the outlet of the upstream supply chute 2.