JPH0647295B2 - Method of manufacturing thermal head - Google Patents

Method of manufacturing thermal head

Info

Publication number
JPH0647295B2
JPH0647295B2 JP8858786A JP8858786A JPH0647295B2 JP H0647295 B2 JPH0647295 B2 JP H0647295B2 JP 8858786 A JP8858786 A JP 8858786A JP 8858786 A JP8858786 A JP 8858786A JP H0647295 B2 JPH0647295 B2 JP H0647295B2
Authority
JP
Japan
Prior art keywords
layer
heating resistor
thermal head
power feeding
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP8858786A
Other languages
Japanese (ja)
Other versions
JPS62244663A (en
Inventor
享志 白川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP8858786A priority Critical patent/JPH0647295B2/en
Publication of JPS62244663A publication Critical patent/JPS62244663A/en
Publication of JPH0647295B2 publication Critical patent/JPH0647295B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はサーマルプリンタに用いられるサーマルヘッ
ド、特に薄膜型のサーマルヘッドに感する。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a thermal head used in a thermal printer, particularly a thin film type thermal head.

〔従来技術および問題点〕 サーマルプリンタに搭載するサーマルヘッドは、例えば
複数個の発熱抵抗体素子を同一基板上に直線的に配列
し、情報に従ってこの発熱抵抗体素子を通電加熱させ
て、感熱記録紙に発色記録させ、あるいはインクリボン
を介して、普通紙に転写記録するために用いられる。[Prior Art and Problems] In a thermal head mounted on a thermal printer, for example, a plurality of heat generating resistor elements are linearly arranged on the same substrate, and the heat generating resistor elements are energized and heated according to information to perform thermal recording. It is used for color recording on paper or transfer recording on plain paper via an ink ribbon.

第３図は、従来のこの種サーマルヘッドの一般構造例を
示すものである。図において、セラミック基板等の絶縁
性基板１上には、蓄熱層として機能するガラスからなる
グレーズ層２が形成されており、このグレーズ層２の上
にTa2N等からなる発熱抵抗体層３が蒸着、スパッタ等で
被着された後、エッチングされて、複数個直線状に配置
・形成されている。この発熱抵抗体層３の上には、さら
にこの発熱抵抗体層３に対して給電するための給電体層
４が形成されている。この給電体層４は、例えばアルミ
ニウムや銅や金等からなるもので、蒸着、スパッタリン
グ等で被着さんた後、エッチングによって所望形状のパ
ターンに形成され、各発熱抵抗体層３の両側に各々一方
が共通電極として、他方が個別リード電極としてそれぞ
れ引出されている。そして、この共通電極および個別リ
ード電極として対をなす給電体層４、４間において、１
ドット相当分の発熱領域を形づくられた各個独立した発
熱抵抗体３は、対をなす給電体層４、４間に電圧を印加
することによって発熱されるようになっている。なお、
4aは、エッチングによって形成された、給電体層４の分
断部である。FIG. 3 shows an example of a general structure of a conventional thermal head of this type. In the figure, a glaze layer 2 made of glass that functions as a heat storage layer is formed on an insulating substrate 1 such as a ceramic substrate, and a heating resistor layer 3 made of Ta 2 N or the like is formed on the glaze layer 2. Is deposited by vapor deposition, sputtering, etc., and then etched to form a plurality of linearly arranged and formed. A power supply layer 4 for supplying power to the heating resistor layer 3 is further formed on the heating resistor layer 3. The power supply layer 4 is made of, for example, aluminum, copper, gold or the like, and is formed into a pattern of a desired shape by etching after being deposited by vapor deposition, sputtering, etc., and is formed on each side of each heating resistor layer 3. One is led out as a common electrode and the other is led out as an individual lead electrode. Then, between the power supply layers 4 and 4 forming a pair as the common electrode and the individual lead electrode, 1
The individual heat generating resistors 3 each having a heat generating area corresponding to dots are heated by applying a voltage between the pair of power feeding layers 4 and 4. In addition,
Reference numeral 4a denotes a dividing portion of the power feeding layer 4 formed by etching.

上記発熱抵抗体層３および給電体層４の上には、これら
の保護層７が形成されている。この保護層７は発熱抵抗
体層３を酸化による劣化から保護するSiO2などからなる
耐酸化層５と感熱記録紙（図示せず）等との接触による
摩耗から発熱抵抗体層３および給電体層４を保護するTa
2O5等からなる耐摩耗層６とからなっており、該保護層
７は端子部以外のヘッド面のすべてを覆うようになって
いる。この保護層７は、スパッタリング等の手段によっ
て耐酸化層５および耐摩耗層６が順次形成され、然る
後、最終工程で、絶縁性基板１を分割して所望のサーマ
ルヘッドチップを得るようになっている。These protective layers 7 are formed on the heating resistor layer 3 and the power feeding layer 4. The protective layer 7 is formed by contact between the oxidation resistant layer 5 made of SiO 2 or the like, which protects the heating resistor layer 3 from deterioration due to oxidation, and the thermal recording paper (not shown), so that the heating resistor layer 3 and the power feeding member are protected from abrasion. Ta protecting layer 4
A wear resistant layer 6 made of 2 O 5 or the like is provided, and the protective layer 7 covers all of the head surface other than the terminal portion. The protective layer 7 has an oxidation resistant layer 5 and a wear resistant layer 6 sequentially formed by means such as sputtering. After that, in the final step, the insulating substrate 1 is divided to obtain a desired thermal head chip. Has become.

しかしながら、第３図の構成においては発熱抵抗体層３
をはさんで給電体層４が分断しているため、分断部4aは
保護層７に凹部7aを生じさせることになり、印字に際し
て感熱記録媒体に対して空隙を生じるから、効率よく熱
の伝導が行えず印字濃度がうすいものとなり易い。この
点を解消するために印加エネルギーを増大させて印字濃
度を高めようとすると、熱歪の増大によってサーマルヘ
ッドの寿命が劣化するという問題を生じた。However, in the configuration of FIG. 3, the heating resistor layer 3
Since the power feeding layer 4 is divided by sandwiching the gap, the dividing portion 4a causes a concave portion 7a in the protective layer 7, and a void is generated in the heat-sensitive recording medium during printing, so that heat can be efficiently transmitted. Is not possible and the print density tends to be light. If the applied energy is increased to increase the print density in order to solve this problem, there is a problem that the life of the thermal head is deteriorated due to the increase of thermal strain.

その問題を解決するため、第４図に示すように発熱抵抗
体層３をミアンダ状に形成して発熱抵抗体層３の中央部
3aと端部3bの抵抗値に差をもうけて、給電体層４の分断
部4aの幅を広げたものが実用化されているが、ミアンダ
発熱抵抗体層はパターン幅が大変狭くなるため、方形の
発熱抵抗体層に比べてはるかに製造歩留りが低下すると
いう問題点を有していた。In order to solve the problem, the heating resistor layer 3 is formed in a meandering shape as shown in FIG.
Although the width of the dividing portion 4a of the power feeding layer 4 is widened by making a difference in the resistance value between 3a and the end portion 3b, the meander heating resistor layer has a very narrow pattern width. There is a problem that the manufacturing yield is much lower than that of the rectangular heating resistor layer.

従って本発明の目的とするところは、上述の従来問題点
を解消し、感熱記録媒体との接触性が良好で、効率の良
い熱伝導が行なえて、且つ長寿命で高印刷性を有するサ
ーマルヘッドを比較的製造を容易な手法で抵抗すること
にある。Therefore, an object of the present invention is to solve the above-mentioned conventional problems, to provide a thermal head having good contact with a thermal recording medium, efficient heat conduction, and long life and high printability. To resist in a way that is relatively easy to manufacture.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、フォトリソ技術で形成した給電体層の分断部
を形成し酸化処理により発熱抵抗体層を高抵抗化した後
に、さらにフォトリソ技術により前記分断部を幅広にエ
ッチングすることによって、発熱抵抗体層の中央部を高
抵抗領域とし、給電体層に近接する部分を低抵抗領域と
したものであり前記酸化処理におけるマスクは給電体層
であることを特徴とする。The present invention provides a heating resistor by forming a divided portion of a power supply layer formed by a photolithography technique, increasing the resistance of the heating resistor layer by an oxidation process, and then etching the divided portion wide by a photolithography technique. The central portion of the layer is a high resistance region and the portion close to the power feeding layer is a low resistance region, and the mask in the oxidation treatment is a power feeding layer.

〔実施例〕 本発明の一実施例を第１図及び第２図に基づいて説明す
る。第１図は本発明のサーマルヘッドの断面図であり、
第２図は同主要部平面図である。[Embodiment] An embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a sectional view of a thermal head of the present invention,
FIG. 2 is a plan view of the same main part.

絶縁性基板11上に部分グレーズ層12を設け、その上にTa
2Nからなる発熱抵抗体層13およびアルミニウムからなる
給電体層14を順に積層し、フォトリソ技術によって、発
熱抵抗体層13の初期露出部13ａが部分グレーズ層12の略
頂面部上に位置するように給電体層14を分断する。そし
て、空気焼成炉を用いて発熱抵抗体層の露出部13ａの抵
抗値が高い値になるよう焼成酸化を行なった後、フォト
リソ技術によって給電体層14の分断部14ａの幅を広くす
ることによって、発熱抵抗体層13に中央部に高抵抗層13
ａと、給電体層14の間には低抵抗層13ｂが形成されるこ
とになる。この上にSiO2からなる耐酸化層15およびTa2O
5からなる耐摩耗層16をスパッタして保護層17としてサ
ーマルヘッドが形成される。このように本発明のサーマ
ルヘッドの発熱抵抗体層13はその抵抗値の高い領域13ａ
と、低い領域13ｂを精度よく形成されており、主たる発
熱は酸化処理を行った高抵抗領域13ａに発生し、低抵抗
領域13ｂは給電体層14によってマスキングされているた
め未酸化であり発熱は少ないものとなる。このため給電
体層14の分断部14ａの幅を広げても実行発熱ドットサイ
ズは同じで電力ロスも比較的少ないものとなる。そして
給電体層の分断部14ａが広くなったため、保護層17の凹
部17ａの幅も広がり発熱部は感熱記録媒体に従来よりも
圧接でき熱伝導が良好なものとなるので印刷性が著しく
改善される。また本発明の発熱抵抗体層13は従来と同様
の方形であり、製造上の困難性はなく、工程歩留りの高
いものとできる。A partial glaze layer 12 is provided on the insulating substrate 11, and Ta is formed on it.
A heating resistor layer 13 made of 2 N and a power feeding layer 14 made of aluminum are laminated in this order, and the initial exposed portion 13a of the heating resistor layer 13 is located on the substantially top surface portion of the partial glaze layer 12 by photolithography. The power feeding layer 14 is divided. Then, after performing firing and oxidation using an air firing furnace so that the resistance value of the exposed portion 13a of the heating resistor layer becomes a high value, the width of the divided portion 14a of the power feeding layer 14 is widened by the photolithography technique. , The heating resistor layer 13 and the high resistance layer 13 in the central portion.
A low resistance layer 13b is formed between a and the power feeding layer 14. On top of this, an oxidation resistant layer 15 made of SiO 2 and Ta 2 O
A wear resistant layer 16 made of 5 is sputtered to form a thermal head as a protective layer 17. As described above, the heating resistor layer 13 of the thermal head of the present invention has the high resistance region 13a.
Since the low region 13b is accurately formed, the main heat generation occurs in the oxidized high resistance region 13a, and the low resistance region 13b is masked by the power supply layer 14 and thus is not oxidized and does not generate heat. It will be few. Therefore, even if the width of the dividing portion 14a of the power feeding layer 14 is widened, the execution heating dot size is the same and the power loss is relatively small. Since the dividing portion 14a of the power feeding layer is widened, the width of the concave portion 17a of the protective layer 17 is also widened, and the heat generating portion can be pressed against the heat-sensitive recording medium as compared with the conventional case, resulting in better heat conduction, so that the printability is remarkably improved. It Further, the heating resistor layer 13 of the present invention has the same rectangular shape as that of the conventional one, so that there is no difficulty in manufacturing and the process yield can be made high.

〔発明の効果〕〔The invention's effect〕

以上説明してきたように、本発明においては、フォトリ
ソ技術により給電体層の分断部を形成して発熱抵抗体層
を露出し、酸化処理により該発熱抵抗体層の露出部を高
抵抗化した後、再度フォトリソ技術により前記給電体層
の分断部の幅を広げることによりサーマルヘッドを製造
したので、給電体層の分断部の幅が広く、かつ、発熱抵
抗体層の中央部が高抵抗領域、その両側が低抵抗領域と
なるため、感熱記録媒体との圧接がよく電力ロスが少な
いという長所をもったサーマルヘッドが容易に製造でき
る。As described above, in the present invention, after the divided portion of the power supply layer is formed by the photolithography technique to expose the heating resistor layer, the exposed portion of the heating resistor layer is increased in resistance by the oxidation treatment. Since the thermal head is manufactured by expanding the width of the divided portion of the power feeding layer again by the photolithography technique, the width of the divided portion of the power feeding layer is wide, and the central portion of the heating resistor layer has a high resistance region, Since both sides thereof have a low resistance region, a thermal head having an advantage that it is well pressed against the thermosensitive recording medium and the power loss is small can be easily manufactured.

【図面の簡単な説明】[Brief description of drawings]

第１図は本発明の一実施例の断面図、第２図は同主要部
平面図、第３図は従来例の断面図、第４図は同主要部平
面図である。 11……絶縁性基板 12……グレーズ層 13……発熱抵抗体層 13ａ……高抵抗領域 13ｂ……低抵抗領域 14……給電体層 14ａ……分断部 17……保護層FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a plan view of the same main part, FIG. 3 is a sectional view of a conventional example, and FIG. 4 is a plan view of the same main part. 11 ... Insulating substrate 12 ... Glaze layer 13 ... Heating resistor layer 13a ... High resistance region 13b ... Low resistance region 14 ... Feeder layer 14a ... Dividing part 17 ... Protective layer

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】絶縁性基板上に断面が円弧状のグレーズ層
を形成し、次に該グレーズ層上に発熱抵抗体層、給電体
層の順に積層し、その次のフォトリソ技術により前記グ
レーズ層の頂面部上に前記給電体層の分断部を形成して
前記発熱抵抗体層を露出し、さらに酸化処理により該発
熱抵抗体層の露出部を高抵抗化した後再度フォトリソ技
術により前記給電体層の分断部の幅を広げ、最後に前記
発熱抵抗体層および給電体層上に保護層を形成したこと
を特徴とするサーマルヘッドの製造方法。1. A glaze layer having an arcuate cross section is formed on an insulating substrate, and then a heating resistor layer and a power feeding layer are laminated in this order on the glaze layer, and then the glaze layer is formed by a photolithography technique. Of the power-supplying body layer is formed on the top surface of the power-supplying body layer to expose the heat-generating resistor layer, and the exposed part of the heat-generating resistor layer is further increased in resistance by oxidation treatment, and then the power-supplying body is again formed by photolithography. A method for manufacturing a thermal head, characterized in that a width of a divided portion of the layer is widened, and finally a protective layer is formed on the heating resistor layer and the power feeding layer.
JP8858786A 1986-04-17 1986-04-17 Method of manufacturing thermal head Expired - Lifetime JPH0647295B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8858786A JPH0647295B2 (en) 1986-04-17 1986-04-17 Method of manufacturing thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8858786A JPH0647295B2 (en) 1986-04-17 1986-04-17 Method of manufacturing thermal head

Publications (2)

Publication Number Publication Date
JPS62244663A JPS62244663A (en) 1987-10-26
JPH0647295B2 true JPH0647295B2 (en) 1994-06-22

Family

ID=13946966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8858786A Expired - Lifetime JPH0647295B2 (en) 1986-04-17 1986-04-17 Method of manufacturing thermal head

Country Status (1)

Country Link
JP (1) JPH0647295B2 (en)

Also Published As

Publication number Publication date
JPS62244663A (en) 1987-10-26

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