JPH0646177U - heat pipe - Google Patents

Abstract

(57) [Abstract] [Purpose] In a heat pipe used for heat dissipation from a heating element, the heating element and the heat pipe are extremely easily adhered to each other without brazing, and an excellent heat dissipation effect is maintained. [Structure] In a cylindrical heat pipe 20, a heat receiving portion 23 is provided near the center of the heat pipe 20, and heat radiating portions 21 are provided at both ends of the heat pipe 20, and a contact portion between the heat receiving portion 23 and the heating element 12 is processed into a flat shape. The heat dissipating fins 25 are provided on at least one of the heat dissipating portions 21 of the heat pipe.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a heat sink having a heat pipe structure, and more particularly to the structure of a heat sink and a heat sink.

[0002]

[Prior art]

 In recent years, electronic circuits have always been required to have higher speed and higher density (high integration), and accordingly, in large-scale integrated circuits and semiconductor devices, especially in arithmetic processing devices, higher speed operation and higher density are required. Electronic equipment products that have been realized and incorporate these arithmetic processing units are rapidly becoming smaller.

Along with this, it is an important issue to suppress or effectively dissipate heat generated in the semiconductor device. In this heat radiating means (device), a heat sink formed of a material having a high thermal conductivity is provided in the heat generating portion of the semiconductor device, or a small fan for forcedly cooling the semiconductor device is most often used.

However, the semiconductor device described above is further increasing in speed and density, and the heat dissipation device is no longer able to obtain a sufficient heat dissipation effect. In addition, with the recent demand for miniaturization of electronic devices, it is extremely difficult to secure an extra space in a specific place only to improve the heat dissipation effect.

Therefore, a heat sink having a later-described heat pipe structure (hereinafter simply referred to as “heat pipe”), which can perform positive heat discharge in place of the above-mentioned heat dissipation device in order to perform more effective heat dissipation, is becoming popular. .

As is well known, the heat pipe means the inside of the cylindrical or planar container 22 having a good thermal conductivity such as copper, aluminum, etc., which is sealed as shown in FIG. However, a wick 24 having a large capillary force is provided to the inside of the container 22, and a fluid called a working fluid that easily changes alternately into a gas layer and a liquid layer (for example, water, alcohol, etc.) is introduced into the working fluid inlet port 26. After injecting an appropriate amount through the above, the injection port 26 is sealed.

The operating principle is that when heat is generated in the evaporation part (heat receiving part) 23 at one end of the container 22, the working fluid enclosed inside is evaporated, and the generated steam has a temperature lower than that of the evaporation part 22. The liquid moves to the condensation part (heat dissipation part) 21 at the other end and is changed into a liquid, and this liquid is returned to the heat receiving part by the capillary force of the wick 24. Due to this latent heat of vaporization, a large amount of heat is transferred from one end to the other end where there is no slight temperature difference.

In the heat pipe shown in FIG. 3, the heat receiving portion and the heat radiating portion may be arranged in opposite positions, and the heat conduction efficiency is higher as the heat radiating portion is placed higher in the installed state.

[0009]

[Problems to be solved by the device]

 In the heat pipe shown in FIG. 3 described above, as shown in FIG. 4, if the heat receiving portion of the heat pipe can be brazed to the semiconductor device (heating element) 12 with the brazing material 4 having extremely excellent thermal conductivity, this cross section will keep a circular shape. However, the cross-section that becomes the passage of steam can be maximized, and the best heat dissipation effect can be obtained due to the characteristics of the heat pipe, but with the above means, the brazing material 4 with excellent heat conductivity in practice is very expensive, Even in the brazing work, if this work is not performed reliably, the heat radiation effect cannot be fully exerted and the manufacturing process will be extremely troublesome.

It is also possible to make the entire heat pipe 20 into a flat plate shape. However, as described above, the larger the cross section of the heat pipe 20 that is a passage for steam, that is, the circular shape, the better the heat radiation effect. can get. Therefore, the heat dissipation effect of the flat heat pipe 20 is lower than that of the flat heat pipe 20. Further, processing both ends of the heat pipe into a flat plate is very expensive because it requires a large number of processing steps.

[0011]

[Means for Solving the Problems] In order to solve the above problems, in the present invention, a semiconductor device (heating element) is provided with a heat receiving portion of a cylindrical heat pipe formed of a material having good thermal conductivity such as copper or aluminum. Make them adhere closely. Here, this heat receiving part is arranged near the center in the longitudinal direction of the heat pipe or near the center in the lateral direction, and the heat radiating parts of the heat pipe are arranged at both ends thereof, and the heat receiving part is flat and closely adheres to the heating element. is doing.

Further, fins for heat dissipation are provided on at least one of the heat dissipation parts arranged at both ends of the heat pipe, either integrally with the heat pipe or as separate parts.

[0013]

[Action]

 As described above, if the heat-receiving part, which is arranged near the center of the cylindrical heat pipe and is in close contact with the semiconductor device (heating element), is formed into a flat plate shape, the semiconductor device can be connected to the semiconductor device without using an expensive brazing material. Adhesion of the heat receiving part is improved, and efficient heat transfer between them is possible.

Since the steam passage of the heat pipe and the heat radiating portions provided at both ends are cylindrical, the maximum cross-sectional area is obtained, so that the steam is quickly condensed, and the characteristics of the heat pipe are lost. The best heat dissipation effect can be obtained without.

Further, since at least one of the heat radiating portions arranged at both ends of the heat pipe is provided with a heat radiating fin integrally with the heat pipe or as a separate component, the heat radiating area is increased, which is equivalent to the case of using a larger heat pipe. The heat radiation effect of is obtained.

[0016]

【Example】

 FIG. 1 is a side view of a heat pipe showing an embodiment of the present invention, and FIG. 2 is a top view of the heat pipe. In FIGS. 1 and 2, a heat radiating portion 21 -21 is provided at both ends of the tubular heat pipe 20, and a hydraulic fluid inlet 26 is provided at either one of the both ends, through which the hydraulic fluid is introduced into the heat pipe 20. After the injection, the injection port 26 is sealed. Further, a heat receiving portion 23 to which a heating element is closely attached such as the semiconductor device 12 is arranged near the center of the heat pipe 20, and the heat receiving portion 23 is a flat plate formed by crushing the cylindrical heat pipe 20 The contact portion with the device 12 is adhered with silicone grease or the like.

As shown in FIGS. 1 and 2, the heat radiating portion 21-21 is provided with a heat radiating fin 25-25. In this case, the fin 25-25 is provided only on at least one of the heat radiating portions 21-21. However, the fins 25-25 may be attached to the heat pipe 20 either integrally or as a separate component.

[0018]

[Effect of device]

 If the heat receiving portion 23, which is arranged near the center of the cylindrical heat pipe 20 and is in close contact with the semiconductor device 12, is formed into a flat plate shape as in the above-described configuration, an expensive brazing material 4 as shown in FIG. Even without using, the degree of adhesion between the semiconductor device 12 and the heat receiving portion 23 is improved, and efficient heat transfer between them is possible.

Further, since the heat receiving portion 23 of the heat pipe 20 is formed into a flat plate shape and the contact portion with the semiconductor device 12 is closely adhered with a silicone grease or the like, the brazing work is not required and the semiconductor device 12 can be mounted. It will be extremely easy.

Further, generally, in the processing of the heat radiation fins 25, the means for attaching to the tubular pipe is simpler and cheaper than the flat plate shape. In the present invention, the heat radiation portion 21 provided with the fins 25 is provided as described above. Since it is tubular, this processing can be performed easily and inexpensively.

[Brief description of drawings]

FIG. 1 is a heat pipe showing an embodiment of the present invention in close contact with a semiconductor device.

FIG. 2 is a cross-sectional view of the heat pipe of FIG. 1 taken along the line AA in the arrow direction.

FIG. 3 is a cross-sectional view of a heat pipe.

FIG. 4 is a cylindrical heat pipe brazed to a semiconductor device.

[Explanation of symbols]

 In the drawings, the same reference numerals indicate the same or corresponding parts. 12 semiconductor device 20 heat pipe 21 heat dissipation part 23 heat receiving part 25 fins

Claims (1)

[Scope of utility model registration request] 1. In a heat sink having a cylindrical heat pipe structure, a heat receiving portion is provided near the center of the heat pipe, and heat radiating portions are provided at both ends of the heat pipe, and a contact portion between the heat receiving portion and the heating element is processed into a flat shape. A heat pipe that is closely attached and has a fin for heat radiation on at least one of the heat radiation portions of the heat pipe.