JPH0645913Y2 - Thermal shock test equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Industrial Field of the Invention The present invention relates to a thermal shock test apparatus that repeatedly cools and heats electronic components such as semiconductors, and does not provide a high temperature chamber as heating means.

2. Description of the Related Art As a conventional thermal shock test device, as shown in FIG. 7, the inside of the device 1 is independently arranged in a test chamber 2, a low temperature chamber 3 and a high temperature chamber 4, and a partition plate 5a is provided in the low temperature chamber 3. The bypass flow path 6a is formed, and the bypass flow path is formed in the high temperature chamber 4 by the partition plate 5b.
6b is formed, the evaporator 7, heater 8 and blower 9 of the refrigeration cycle are installed in the low temperature chamber 3, and the heater 11 is installed in the high temperature chamber 4, so that the damper 10 is switched to lower the temperature. It is known that cold air in the chamber 3 or hot air in the high temperature chamber 4 is circulated in the test chamber (JP-A-61-89429).

The damper 10 provided in each of the low temperature chamber 3 and the high temperature chamber 4 is
By simply opening and closing the low greenhouse 3 and the high temperature chamber 4 and the test chamber 2, the bypass flow paths 6a and 6b are always opened.

With the above-mentioned configuration, in the conventional apparatus, the damper 10 on the high temperature chamber 4 side is opened to blow hot air into the test chamber 2 to raise the temperature inside the test chamber and heat the test article in the test chamber 2.
After the test product is heated to a predetermined temperature or higher, the damper 10 on the high temperature chamber 4 side is closed, the damper 10 on the low temperature chamber 3 side is opened, and cool air is blown into the test chamber 2. Then, the inside of the test chamber 2 is gradually cooled, and the test product is cooled to a predetermined temperature or lower.

In this way, the cooling and heating in the test chamber 2 is alternately performed, and the thermal shock test of the test product is performed.

Problems to be Solved by the Invention However, in the case of such a conventional thermal shock test apparatus, the following inconveniences occur due to the reason of its configuration.

By providing the bypass passage, the volume of the low temperature chamber is increased, and the air is circulated to store the cold. Then, when the damper is opened, the temperature in the test chamber can be rapidly lowered, but when the temperature is lower than the temperature at which the air in the low temperature chamber and the air in the test chamber are completely mixed, the cooled air is bypassed. It took time to cool the test chamber because it was circulated through the chamber.

Since it is configured to have a high greenhouse and a low temperature room, the entire device has become large.

Since air is used as the heating and cooling means for the test product, it takes a considerable amount of time to lower the temperature from the high temperature state to the low temperature state and to raise the temperature from the low temperature state to the high temperature state. I was not good at doing it.

Therefore, the present invention has an object to provide a device capable of performing a continuous test in view of the above-mentioned drawbacks of the prior art, requiring a smaller device than before, and requiring no time for cooling.

Means for Solving the Problems That is, the present invention is to provide a low temperature chamber and a test chamber in which a casing covered with a heat insulating material is partitioned by partition walls, and a low temperature air supply partitioned by a partition plate in the low temperature chamber. It consists of a chamber and a bypass channel, and an evaporator of the refrigeration cycle, a heater, and a blower for blowing, which are arranged in the low temperature air supply chamber. A damper mechanism is provided, and an air flow path is formed in the test chamber in the vicinity of the mounting part of the test product, the upstream and downstream of which are opened via a plate material, and the heating of the test product is performed in the open part in the air flow path. This object is achieved by a thermal shock test device equipped with means.

Action In the device of the present invention, first, a test article such as a semiconductor is mounted in close contact with the heating means in the air flow path. Then, by heating the heating means, the test article is heated to a predetermined temperature.
At this time, since only the air flow path in which the test article is mounted need be heated by the heating means, the test chamber is not heated so much.

Next, the damper, which has blocked the communication port between the test chamber and the low temperature chamber, is operated to close the bypass passage and open the communication port.

Then, the cooling air, which has been circulating in the bypass passage, flows into the test chamber and cools the test chamber. At this time, the test chamber functions as a bypass flow path.

Then, the damper mechanism is activated again to close the communication port,
Heat the heating means. Then, while the test chamber is in a low temperature state, heat rays are radiated from the heating means to the test article, so that only the test article is heated to a predetermined temperature.

As described above, the apparatus according to the present invention conducts a thermal shock test by partially heating in a cold state without heating the entire test chamber.

Embodiment Hereinafter, the present invention will be described in detail according to an embodiment shown in the drawings.

In FIG. 1, reference numeral 20 denotes a casing covered with a heat insulating material, and the inside of the casing 20 is divided into a test chamber 22 and a low temperature chamber 23 via a partition wall 21. The partition wall 21 has at least two communication ports 24 so that the air in the test chamber 22 and the low temperature chamber 23 circulates.
It has a and 24b.

The low greenhouse 23 is partitioned into a low temperature air supply chamber 26 and a bypass flow passage 27 via a partition plate 25, and the bypass flow passage 27 allows the air in the low temperature air supply chamber 26 to circulate.

Inside the low temperature air supply chamber 26, an evaporator 28 (not shown) of a refrigeration cycle, a heater 29 as a heating means, and a blower 30 for air circulation are mounted.

In the test chamber 22, an air flow path 36 in which the upstream and downstream of air are opened by passing the plate materials 35a and 35b made of a heat insulating material between the casings 20 near the mounting of the test article 32 is formed,
An electrothermal heater 31 is installed at the upstream opening of the air flow path 36.

The heater portion of the electric heater 31 that radiates heat is directed toward the test product.

The communication ports 24a, 24b provided on the partition wall 21 are rotated by a driving device and are connected to the communication ports 24a, 24b or the inlet portion of the bypass passage 27,
Damper mechanisms 33a and 33b for opening and closing the outlet are installed.

This damper mechanism is configured such that when heating the test article mounted in the test chamber 22, the communication ports 24a and 24b are closed so that cooling air does not flow into the test chamber, and when cooling the test article, The communication ports 24a, 24b are opened and the bypass flow path 27 is closed.

In the device according to the present invention having the above configuration,
A shock test is performed by operating each part as shown in the timing chart of the figure.

The relationship between the temperature in the test chamber and the temperature of the test product during the impact test is shown in FIG.

That is, when heating the inside of the test chamber 22, the damper mechanism 33a,
33b is operated to close the communication ports 24a and 24b, thereby isolating the low temperature chamber 23 and the test chamber 22 from each other.

At this time, the air cooled by the evaporator 28 passes through the bypass passage 27
The cold is stored while circulating in the low temperature chamber 23 through.

Further, since the electric current flows through the electric heater installed above the test product, the radiant heat heats the test product and the inside of the air flow path 36 in which the test product is mounted to, for example, 150 ° C.

However, the temperature of the air in the test chamber 22 does not rise so much because the heating is performed only in the air flow path 36. Next, when heating is completed and cooling is performed, the damper mechanisms 33a, 33b are operated to open the communication ports 24a, 24b and close the bypass flow path 27.

Therefore, the air stored in the low temperature chamber 23 and the air being cooled flow into the test chamber 22 to cool the test chamber 22 at once.

Then, the air passes through the test chamber 22 and returns to the low temperature chamber 23 again. During this time, the temperature inside the test chamber 22 and the test product is kept at a predetermined temperature (for example, −
Cooled to 20 ℃). When the test product is cooled to the specified temperature, the cooling is terminated and the damper mechanisms 33a, 33b are restarted.
Is activated to close the communication port, and then heating is performed.

As described above, heating and cooling are repeated many times to perform a thermal shock test on electronic components and the like, but the temperature in the test chamber 22 does not change remarkably as in the conventional device.

In the electrothermal heater 31 used in this embodiment, a temperature measuring element is attached to the surface of the test product, and temperature control is performed so as to adjust the current value flowing through the electrothermal heater 31 based on the detection result.

FIG. 2 shows a second embodiment of the present invention, in which two auxiliary fans 34 for air circulation are installed above the air flow path 36 in the test chamber 22. Further, the inside of the air flow path 36 is divided into two by the plate material 35c, and the electric heaters 31a and 31b are installed at the upstream open portions of the air flow paths 36a and 36b.

In this embodiment, the auxiliary fan 34 is operated only when the inside of the test chamber 22 is cooled.

Such a configuration is because when the damper mechanisms 33a and 33b are operated to circulate the cooling air in the test chamber 22, the test chamber 22 in which the test article is installed has a large volume, so that the low temperature chamber is provided.
This is because the blower 30 of 23 alone slows down the flow velocity of air and cannot uniformly blow air to the test product, so that the cooling speed of the test product is slow and prevents uneven cooling. As a result, the air flowing through the evaporator circulates uniformly and has, for example, an optimum 2-3 m / sec.

If the motor of the auxiliary fan 34 is provided with a speed controller, the amount of air blown becomes variable, and the cooling speed of the DUT can be adjusted.

In this embodiment, the auxiliary fan 34 is provided above the air flow path 36, but the present invention is not limited to this, and it may be provided below.

Further, as the auxiliary fan 34, it is desirable to adopt a cross flow fan having a length as close as possible to the inner size of the test chamber 22 in order to uniformly blow air to the test product.

In the device of this embodiment, the auxiliary fan is operated only during cooling, but in order to average the temperature distribution during heating, the auxiliary fan may be operated during heating. At this time, the temperature rising speed becomes slow.

3 shows a third embodiment of the present invention, in which a damper mechanism 38 for opening and closing the air passage 36 is provided at the inlet and outlet of the air passage 36 in the test chamber 22. 33a,
The air flow path 36 is opened when the test chamber 22 and the low temperature chamber 23 are made to communicate with each other by interlocking with 33b.

The configuration is such that the air flow path 36 is formed by the electric heater 31.
Although it is configured to heat only the inside, it is to prevent the heat of the electric heater 31 from leaking into the test chamber 22 and heating the inside of the test chamber 22 and to increase the efficiency of heating in the air flow path 36. .

In this embodiment, the damper mechanism 38 is installed in the air passage.
36 are upstream and downstream, but the present invention is not limited to this, and heat may easily escape upward, so it may be installed only upstream.

Although the electric heater 31 is used as the heating means in the apparatus of this embodiment, the heating means is not limited to this, and any means that can heat the inside of the air flow path 36 such as an infrared lamp may be used.

Further, in the above-mentioned devices of the first to third embodiments, the air flow path is composed of two plate members which are passed between the casings, but the invention is not limited to these and is constructed so as to surround the periphery of the test product. Any structure is acceptable.

Effect As described above, the device according to the present invention has two chambers such as a low temperature chamber and a test chamber, which is different from the conventional device having a high temperature chamber, a low temperature chamber and a test chamber. It is possible to reduce the size.

Since the heating method of the test article in the test chamber is configured to heat only the inside of the air flow path by the heating means and the entire test room is not heated, the cooling time of the test room and the test article should be shortened compared with the conventional method. You can

[Brief description of drawings]

1 to 6 show an embodiment of the device according to the present invention. FIG. 1 is a vertical sectional view showing the outline of the device, and FIG. 2 is a vertical sectional view showing the outline of the device of the second embodiment. Fig. 3 is a schematic vertical sectional view of the apparatus showing the third embodiment during cooling, Fig. 4 is a schematic vertical sectional view of the apparatus showing the third embodiment during heating, and Fig. 5 is an operation of each part. 6 is a graph showing a temperature relationship between a test chamber and a test product, and FIG. 7 is a schematic vertical sectional view of a device showing a conventional technique. 1 ... Device, 2 ... Testing room 3 ... Low temperature room, 4 ... High temperature room 5a, 5b ... Partition plate, 6a, 6b ... Bypass flow path 7 ... Evaporator, 8 ... Heater 9 ... … Blower, 10 …… Damper 11 …… Heater, 20 …… Casing 21 …… Compartment wall, 22 …… Test room 23 …… Low temperature room, 24a, 24b …… Communication port 25 …… Partition plate, 26 …… Low temperature air supply chamber 27 …… Bypass passage, 28 …… Evaporator 29 …… Heater, 30 …… Blower 31 …… Electric heater, 32 …… Test product 33a, 33b …… Damper, 34 …… Auxiliary fan 35a, 35b, 35c …… plate material, 36 …… air flow path 38 …… damper mechanism

Claims (4)

[Scope of utility model registration request] 1. A low temperature chamber and a test chamber which are partitioned by a partition wall in a casing covered with a heat insulating material, a low temperature air supply chamber and a bypass flow path which are partitioned by a partition plate in the low temperature chamber, and a low temperature. A refrigeration cycle evaporator arranged in the air supply chamber, a heater and a blower for blowing air, and a damper mechanism for opening and closing the bypass passage and the communication port are provided near the communication port between the test chamber and the low temperature chamber. In the test chamber, near the mounting part of the test product, an air flow path is formed which is open upstream and downstream through the plate material, and the heating means for the test product is installed in the open part in the air flow path. A characteristic thermal shock tester. 2. The thermal shock test apparatus according to claim 1, wherein an auxiliary fan for air circulation is provided above or below the heating means. 3. The thermal shock test device according to claim 1 or 2, wherein the heating means comprises an infrared heater and an electric heater. 4. A utility model registration claim according to any one of claims 1 to 3, characterized in that a damper mechanism for opening and closing the flow path is installed above or below the air flow path. The thermal shock test apparatus according to item 1.