JPH0645178A - Electronic part - Google Patents

Abstract

PURPOSE:To realize a four-terminal electronic part which can be lessened in size and where a lead wire is high fixing strength by a method wherein a lead wire is bent into a U shape, and the U-shaped lead wire is fixed to each side face of an electronic part main body so as to make the top of its bent part located above the center of the side face of the part. CONSTITUTION:Metallikon electrodes 7 and 8 are provided to both the side faces of an element main body 6 respectively, and lead wires 9 and 10 are fixed to the electrodes 7 and 8 respectively. CP wires are bent into the U-shaped lead wires 9 and 10, and the wires 9 and 10 are fixed to the electrodes 7 and 8 respectively, where each of the wires 9 and 10 is so fixed to the corresponding electrode along its U-shaped outline as to make the top 11 of its bent part located above the center of the electrode surface concerned. By this setup, when an element main body is sheathed into a finished product, the product can dispense with a conventional pad and be lessened in size, and moreover a lead wire can be enhanced in fixing strength independent of the number of welding spots of the lead wire.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a four-terminal type capacitor in which two lead wires are drawn from one electrode.

[0002]

2. Description of the Related Art As is well known, many types of capacitors generally have a structure in which one lead wire is drawn from each internal electrode to form a two-terminal type. is there.

By the way, in the case of such a two-terminal type, there is a problem that the impedance becomes high when used in a high frequency region due to the influence of the inductance of the lead wire,
Various improvements have been made.

As one of the measures for improvement, a capacitor having a so-called four-terminal structure in which two lead wires are drawn out from one electrode has been conventionally considered. FIG. 7 shows the conventional four-terminal type capacitor, for example, for a film capacitor or an electrolytic capacitor. In this case, a pair of electrodes a and a dielectric b between them are wound to form an element body c, and two lead wires d are attached to each electrode a of the element body c by welding or soldering. Has been. Then, a pedestal e is provided in order to further increase the attachment strength of the lead wire d, and the pedestal e is further covered with an outer case f to form a four-terminal capacitor A. In the case of welding or soldering without using the pedestal e, at least about two places are required for each lead wire d in order to obtain sufficient attachment strength, so that a total of eight places must be welded. I won't.

Thus, in the case of the four-terminal capacitor A,
In order to obtain sufficient mounting strength, the number of welding points is increased as compared with the two-terminal type, or the pedestal e is inevitably used. Therefore, if a space to be welded and a place for mounting the pedestal e are secured, there is a problem that it is difficult to downsize.

As a solution to such a problem, recently, in order to minimize the welded portion of the metallikon electrode surface g and the lead wire d, the lead wire d is bent into an inverted U shape as shown in FIG. It is also conceivable to form a four-terminal capacitor by welding this to the metallikon electrode surface g, further inserting it into the pedestal e, and applying the mold exterior h to the element body c as shown in FIG. ing.

[0007]

However, as described above, the inverted U-shaped lead wire d is simply welded to the metallikon electrode surface g, that is, the lead wire d is attached only at the lower part of the end face of the metallikon electrode. Therefore, it is not possible to expect a predetermined lead wire mounting strength, and, in the end, a pedestal e is required, so that a conventional one that satisfies both the mounting strength of the lead wire d and the miniaturization at the same time has been obtained. Didn't.

[0008]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a four-terminal type electronic component which has a high lead wire mounting strength and is effective for downsizing.

[0009]

In order to achieve the above object, the present invention is an electronic component in which lead wires are respectively drawn from both side surfaces of an electronic component element to serve as external electrodes, and each lead wire has one lead. The wire is bent so that the top of the bent portion is located above the center of both side surfaces.

[0010]

With the above-mentioned structure, the lead wire is provided over the entire element side surface electrode, and the welded portion can be joined to a part of the element side surface electrode without being biased. , Less stress concentration on external force,
The lead wire mounting strength is improved, thus eliminating the need for a pedestal.

[0011]

Embodiments of the present invention will be described below with reference to the drawings by applying the embodiments to a film capacitor.

Example 1 This film capacitor is
As shown in FIG. 1, it has a four-terminal structure including a capacitor element 2 and a resin outer package 3.

As shown in FIG. 2, the capacitor element 2 is formed by winding a pair of single-sided metallized films 4, 5 or double-sided metallized film and green film to form an element body 6.
After pressing this, both sides of the element body 6 are shown in FIG.
The metallikon electrodes 7 and 8 shown in FIG. The lead wires 9, 1 are respectively connected to the metallikon electrodes 7, 8.
0 is attached.

The lead wires 9 and 10 are formed by bending one CP wire into a U-shape as shown in FIG. 4, and as shown in FIG. 1, its top portion 11 is located above the center of the metallikon electrode surface. It is located on the side and is attached so as to form an inverted U shape along the outer peripheral edges of the metallikon electrodes 7, 8. The lead wires 9 and 10 are provided with a top portion 11 and a lead-out portion 1
It is welded at three points 2 and 13, and two pieces are drawn out from each metallikon electrode 7 and 8.

The capacitor element 2 thus constructed
Is resin-coated by being immersed in a thermosetting powder resin tank, for example.

<Embodiment 2> The capacitor element 2 of this embodiment uses the same element body 6 as in Embodiment 1 described above, and the lead wires 14 and 1 are connected to the metallikon electrodes 7 and 8, respectively.
5 is attached.

As shown in FIG. 5, the lead wires 14 and 15 are bent and deformed into a Q shape and attached along the outer peripheral edge of the metallikon electrode surface. Then, the lead wires 14 and 15 are welded at two points of the top portion 16 and the cut portion 17, and two lead wires are drawn from each of the metallikon electrodes 7 and 8. Further, as for the exterior, the above-mentioned Example
Like the above, it is made of a thermosetting resin.

The bent shape of the lead wire may be an inverted Y-shape in addition to the inverted U-shape and Ω-shape described above,
Even in this case, there are two welding points.

<Embodiment 3> A capacitor element 2 of this embodiment has a pair of single-sided metallized film or double-sided metallized film and green film laminated, as shown in FIG. Similarly, metallikon electrodes 18, 19 are provided on both sides.
Are formed. Then, the metallikon electrode 18,
Lead wires 20 and 21 bent in an M shape are attached to 19. Further, in the case of the lead wires 20 and 21, there are three welding points, that is, the central portion 22 of the bent portion and the lead-out portion 23. Further, the exterior is made of a thermosetting resin as in the above-mentioned embodiments.

In the above embodiment, the case where the electronic component is applied to the film capacitor has been described. However, the present invention is not limited to this, and may be applied to the electrolytic capacitor or the entire electronic component other than the capacitor. Although the dip type has been described as the exterior body in the above embodiments, the present invention is not limited to this and may be of a case type or the like, and various design changes can be made within the scope of the technical idea described in the claims. Is.

[0021]

As described above, according to the present invention, the lead wire is not simply welded to the electrode surface, but one lead wire is bent and attached so as to be positioned above the center of the electrode surface. Therefore, no matter how many points the lead wire is welded to, when it is packaged into a finished product, the mounting strength of the lead wire is increased without the need for a pedestal like the conventional one. Therefore, it is very effective for miniaturization.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view showing a lead wire mounting portion in an embodiment in which an electronic component of the present invention is applied to a four-terminal type metallized film capacitor.

FIG. 2 is a perspective view showing the internal structure of the element body of the embodiment.

FIG. 3 is a perspective view showing an appearance of a capacitor element of the same example.

FIG. 4 is a partially cutaway front view showing a method for forming a lead wire in the example.

FIG. 5 is a front view showing a lead wire attaching portion of another embodiment.

FIG. 6 is a front view showing a lead wire mounting portion of another embodiment.

FIG. 7 is a perspective view showing a state in which the internal structure of a conventional four-terminal capacitor is disassembled for easy understanding.

FIG. 8 is a perspective view showing a state in which the internal structure of another four-terminal type capacitor is disassembled for easy understanding.

9 is a sectional view of the state shown in FIG. 8 assembled.

[Explanation of symbols]

 1 ……………… Film capacitor 2 ……………… Capacitor element 3 ……………… Resin exterior body 4,5 ………… Single-sided metallized film 6 ……………… Element body 7,8 ………… Metallicon Electrode 9,10 Lead wire 11 Top part 12, 13 Lead-out part 14, 15 Lead wire 16 Top part 17 Scratch part 18, 19 Metallicon electrode 20, 21 Lead Line 22 ………… Center part 23 ………… Drawer part

Claims (3)

[Claims] 1. In an electronic component in which lead wires are respectively drawn from both side surfaces of an electronic component element to serve as external electrodes, each lead wire is formed by bending one lead wire, and the top of the bent portion is An electronic component that is mounted so as to be located above the center of both side surfaces. 2. The electronic component according to claim 1, wherein the electronic component is a wound or laminated four-terminal capacitor. 3. The bent portion of the lead wire has an inverted U shape or an M shape, and is welded to the top of the bent portion at a predetermined position extending therefrom. Electronic components.