JPH0644005B2 - Flow velocity sensor - Google Patents
Flow velocity sensorInfo
- Publication number
- JPH0644005B2 JPH0644005B2 JP1186092A JP18609289A JPH0644005B2 JP H0644005 B2 JPH0644005 B2 JP H0644005B2 JP 1186092 A JP1186092 A JP 1186092A JP 18609289 A JP18609289 A JP 18609289A JP H0644005 B2 JPH0644005 B2 JP H0644005B2
- Authority
- JP
- Japan
- Prior art keywords
- flow velocity
- velocity sensor
- sensor chip
- pin
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は流速センサに関し、特に流速センサチップの保
護に関するものである。The present invention relates to a flow velocity sensor, and more particularly to protection of a flow velocity sensor chip.
従来の流速センサを第３図に示す。同図において、１は
基板、２は流速センサチップ、３はワイアボンド、４は
スルーホールパッド、５はピン、６は被測定流体の流れ
る方向を示す矢印である。第３図において、基板１に流
速センサチップ２が接着されている。基板１にはスルー
ホールパッド４がつくられており、スルーホールパッド
４の裏側の面にピン５がろう付けによって立てられてい
る。流速センサチップ２はワイアボンド３によってスル
ーホールパッド４と電気的コンタクトがされている。A conventional flow velocity sensor is shown in FIG. In the figure, 1 is a substrate, 2 is a flow velocity sensor chip, 3 is a wire bond, 4 is a through hole pad, 5 is a pin, and 6 is an arrow indicating the direction in which the fluid to be measured flows. In FIG. 3, the flow velocity sensor chip 2 is bonded to the substrate 1. Through-hole pads 4 are formed on the substrate 1, and pins 5 are erected on the back surface of the through-hole pads 4 by brazing. The flow velocity sensor chip 2 is electrically connected to the through hole pad 4 by the wire bond 3.
このように、従来の流速センサにおいては、センサを流
体にさらさなければならないため、流速センサチップ２
が露出しており、また、配線のためのワイアボンド３も
露出している。流速センサチップ２は感度を上げるため
微細加工され、非常に繊細にできており、また、ワイア
ボンド３も２０〜２５μφの細線でできている。As described above, in the conventional flow velocity sensor, since the sensor has to be exposed to the fluid, the flow velocity sensor chip 2
Is exposed, and the wire bond 3 for wiring is also exposed. The flow velocity sensor chip 2 is microfabricated in order to increase the sensitivity and is made very delicate, and the wire bond 3 is also made of a thin wire of 20 to 25 μφ.
従来の流速センサは上述したような構成であるので、流
速センサの取扱い中に誤って流速センサチップ２の表面
に触れたり、流速センサを落としたりすると、流速セン
サが動作不良になるような破損をする可能性が大きかっ
た。Since the conventional flow velocity sensor has the above-described configuration, if the flow velocity sensor is accidentally touched or the flow velocity sensor is dropped while handling the flow velocity sensor, the flow velocity sensor may be damaged and may malfunction. There was a great possibility to do it.
このような課題を解決するために本発明は、接続導体を
表面に有する基台に流速センサチップを装着し、接続導
体と流速センサチップのパッド部とを電気接続手段で接
続した流速センサにおいて、この電気接続手段の高さよ
りも基台からの高さが高くなる突起を、流速センサチッ
プ上に流線の上流側の領域以外の領域に少なくとも１個
配置するようにしたものである。In order to solve such a problem, the present invention is a flow velocity sensor in which a flow velocity sensor chip is mounted on a base having a connection conductor on its surface, and the connection conductor and the pad portion of the flow velocity sensor chip are connected by an electrical connection means At least one protrusion whose height from the base is higher than the height of the electrical connecting means is arranged on the flow velocity sensor chip in a region other than the region on the upstream side of the streamline.
本発明による流速センサは、流速センサチップや電気接
続手段に触れにくく、また落としても破損しにくい。し
かも、流速センサとしての特性は損なわれない。The flow velocity sensor according to the present invention is unlikely to come into contact with the flow velocity sensor chip or the electrical connection means, and is not easily damaged when dropped. Moreover, the characteristics of the flow velocity sensor are not impaired.
第１図は本発明による流速センサの第１の実施例を示す
構成図である。第１図の実施例は、第３図において裏面
にろう付けされていたピン５をスルーホールを貫通して
表面に突出させてピン５′としたものである。ピン５′
の高さはワイアボンド３の高さよりも適宜高くなるよう
にする。こうすることで、このピン５′がバリアになっ
て、流速センサチップ２やワイアボンド３に触れにくく
なる。また、ピン５′があるため、流速センサを落とし
ても、ピン５′で保護され破損しにくい。ピン５′は流
れ方向６に平行に並ぶようにし、流速センサチップ２の
前面にはピン５′がないように配置すれば、流速の検出
には影響しない。FIG. 1 is a block diagram showing a first embodiment of a flow velocity sensor according to the present invention. In the embodiment shown in FIG. 1, the pin 5 which is brazed to the back surface in FIG. 3 penetrates through the through hole and is projected to the front surface to form the pin 5 '. Pin 5 '
Is appropriately higher than the height of the wire bond 3. By doing so, this pin 5'becomes a barrier, and it becomes difficult to touch the flow velocity sensor chip 2 and the wire bond 3. Further, since the pin 5'is provided, even if the flow velocity sensor is dropped, it is protected by the pin 5'and is not easily damaged. If the pins 5'are arranged parallel to the flow direction 6 and the pins 5'are not arranged on the front surface of the flow velocity sensor chip 2, the flow velocity detection is not affected.
第２図はスルーホールを持たない通常の基板１′を用い
た第２の実施例である。FIG. 2 shows a second embodiment using a normal substrate 1'without through holes.
第２図の実施例は流速センサチップ２の両側についたて
７を設置し、流速センサチップ２に触れにくくなるよう
にしている。また、落としても破損しくにいことは第１
図の実施例と同様である。なお、５″はリードピンであ
る。In the embodiment shown in FIG. 2, the flow velocity sensor chip 2 is provided with the hanging pieces 7 on both sides so that the flow velocity sensor chip 2 is hard to touch. Also, it is the first thing that it will be damaged even if dropped.
This is similar to the illustrated embodiment. In addition, 5 ″ is a lead pin.
以上説明したように本発明は、電気接続手段の高さより
も基台からの高さが高くなる突起を、流速センサチップ
上に流線の上流側の領域以外の領域に少なくとも１個配
置したことにより、流速センサチップや電気接続手段に
触れ難くなり、また落としても、突起が保護機能を有す
るので、上記流速センサチップや電気接続手段の破損を
防止できる効果がある。また、突起は被測定流体の流れ
を乱さないように取り付けたことにより、流速センサの
特性を損なわない効果がある。As described above, in the present invention, at least one protrusion whose height from the base is higher than the height of the electrical connecting means is arranged on the flow velocity sensor chip in a region other than the region on the upstream side of the streamline. As a result, it becomes difficult to touch the flow velocity sensor chip and the electrical connection means, and the protrusion has a protective function even when dropped, so that the flow velocity sensor chip and the electrical connection means can be prevented from being damaged. Further, since the protrusion is attached so as not to disturb the flow of the fluid to be measured, it has an effect of not impairing the characteristics of the flow velocity sensor.
第１図〜第２図は本発明による流速センサの第１の実施
例〜第２の実施例を示す構成図、第３図は従来の流速セ
ンサを示す構成図である。 １，１′……基板、２……流速センサチップ、３……ワ
イアボンド、４……スルーホールパッド、５，５′，
５″……ピン。1 and 2 are configuration diagrams showing first to second embodiments of the flow velocity sensor according to the present invention, and FIG. 3 is a configuration diagram showing a conventional flow velocity sensor. 1, 1 '... Substrate, 2 ... Flow velocity sensor chip, 3 ... Wire bond, 4 ... Through hole pad, 5, 5',
5 ″ ... pin.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 安部 健 神奈川県川崎市高津区梶ケ谷２―11―２ (72)発明者 岡林 誠 大阪府大阪市中央区平野町４―１―２ 大 阪瓦斯株式会社内 (72)発明者 早川 秀樹 大阪府大阪市中央区平野町４―１―２ 大 阪瓦斯株式会社内 (72)発明者 安田 弘一 愛知県豊田市若林西町北間57 (72)発明者 青島 滋 神奈川県藤沢市川名１丁目12番２号 山武 ハネウエル株式会社藤沢工場内 (72)発明者 上運天 昭司 神奈川県藤沢市川名１丁目12番２号 山武 ハネウエル株式会社藤沢工場内 (72)発明者 落合 耕一 神奈川県藤沢市川名１丁目12番２号 山武 ハネウエル株式会社藤沢工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ken Abe 2-11-2 Kajigaya, Takatsu-ku, Kawasaki-shi, Kanagawa Prefecture (72) Makoto Okabayashi 4-1-2 Hirano-cho, Chuo-ku, Osaka-shi, Osaka Osaka Stock Exchange In-house (72) Inventor Hideki Hayakawa 4-1-2 Hirano-cho, Chuo-ku, Osaka City, Osaka Prefecture Osaka Osaka Gas Co., Ltd. (72) Inventor Koichi Yasuda 57 Wakabayashi Nishimachi Kita, Toyota City, Aichi Prefecture (72) Inventor Aoshima Shigeru, 1-12-2, Kawana, Fujisawa, Kanagawa Yamatake Honeywell Co., Ltd., Fujisawa Plant (72) Inventor Shoji Kaminenten, 1-2-12, Kawana, Fujisawa, Kanagawa Yamatake Honeywell, Co., Ltd. (72) Inventor Koichi Ochiai 1-12-2 Kawana, Fujisawa-shi, Kanagawa Yamatake Honeywell Co., Ltd. Fujisawa factory
Claims (2)
チップを装着し、前記接続導体と前記流速センサチップ
のパッド部とを電気接続手段で接続した流速センサにお
いて、 前記電気接続手段の高さよりも基台からの高さが高くな
る突起を、前記流速センサチップ上に流線の上流側の領
域以外の領域に少なくとも１個配置したことを特徴とす
る流速センサ。1. A flow velocity sensor in which a flow velocity sensor chip is mounted on a base having a connection conductor on the surface thereof, and the connection conductor and a pad portion of the flow velocity sensor chip are connected by an electrical connection device. A flow velocity sensor, characterized in that at least one protrusion having a height higher than that of the base is arranged on the flow velocity sensor chip in a region other than a region on the upstream side of the streamline.
前記板の長手方向が前記流速センサチップ上の流線に平
行になるように前記板を前記流速センサチップの両側に
配置したことを特徴とする流速センサ。2. The method according to claim 1, wherein the protrusion is a plate,
A flow velocity sensor, wherein the plates are arranged on both sides of the flow velocity sensor chip such that the longitudinal direction of the plate is parallel to the streamline on the flow velocity sensor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1186092A JPH0644005B2 (en) | 1989-07-20 | 1989-07-20 | Flow velocity sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1186092A JPH0644005B2 (en) | 1989-07-20 | 1989-07-20 | Flow velocity sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0353170A JPH0353170A (en) | 1991-03-07 |
| JPH0644005B2 true JPH0644005B2 (en) | 1994-06-08 |
Family
ID=16182229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1186092A Expired - Lifetime JPH0644005B2 (en) | 1989-07-20 | 1989-07-20 | Flow velocity sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644005B2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5434873A (en) * | 1977-08-24 | 1979-03-14 | Toyoda Chuo Kenkyusho Kk | Sensor for thermoelectric anemometer |
| JPS5679258A (en) * | 1979-11-30 | 1981-06-29 | Toyota Central Res & Dev Lab Inc | Detecting body for thermoelectric and air-temperature anemometer |
| JPS60220864A (en) * | 1983-12-27 | 1985-11-05 | 株式会社山武 | Housing for flow velocity sensor |
| JPS6396563A (en) * | 1986-10-14 | 1988-04-27 | Shizuoka Seiki Co Ltd | Wind speed sensor |
-
1989
- 1989-07-20 JP JP1186092A patent/JPH0644005B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5434873A (en) * | 1977-08-24 | 1979-03-14 | Toyoda Chuo Kenkyusho Kk | Sensor for thermoelectric anemometer |
| JPS5679258A (en) * | 1979-11-30 | 1981-06-29 | Toyota Central Res & Dev Lab Inc | Detecting body for thermoelectric and air-temperature anemometer |
| JPS60220864A (en) * | 1983-12-27 | 1985-11-05 | 株式会社山武 | Housing for flow velocity sensor |
| JPS6396563A (en) * | 1986-10-14 | 1988-04-27 | Shizuoka Seiki Co Ltd | Wind speed sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0353170A (en) | 1991-03-07 |
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