JPH064326B2 - Liquid jet recording head - Google Patents

Description

The present invention relates to a liquid jet recording head that ejects liquid to perform recording.

[Prior Art] The inkjet recording method (liquid jet recording method) enables high-speed recording in that noise generation during recording is extremely small to a negligible level, and a special process of fixing on so-called plain paper is required. Recently, he has been interested in the fact that he can record without needing it.

Among them, the liquid jet recording method described in, for example, Japanese Patent Laid-Open No. 54-51837 and German Patent (DOLS) 2843064, applies thermal energy to a liquid to provide a driving force for discharging liquid droplets. In that respect, it has different characteristics from other liquid jet recording methods.

In particular, the liquid jet recording method disclosed in DOLS 2843064 is a so-called drop-on deman.
Not only is it very effectively applied to the d-recording method, but it is also possible to easily embody a recording head with a full line type high-density multi-orifice, so that high-resolution, high-quality images can be produced at high speed. It has the feature of being obtained.

The recording head portion of the apparatus applied to the above-described recording method is an orifice provided for ejecting a liquid, and a portion which is in communication with the orifice and in which energy for ejecting a droplet acts on the liquid. It is provided with a liquid discharge part having a liquid flow path provided with an action part, and an electrothermal converter as means for generating thermal energy.

The electrothermal converter includes a pair of electrodes, and a heating resistance layer that is connected to these electrodes and has a region (heat generating portion) that generates heat between these electrodes.

Typical examples showing the structure of such a liquid jet recording head are shown in FIGS. 1 (a) and 1 (b).

FIG. 1 (a) is a front partial view of the liquid jet recording head according to the present invention as seen from the orifice side, and FIG. 1 (b) is a sectional view taken along the one-dot chain line XY in FIG. 1 (a). It is a cut surface partial view in the case.

The recording head 101 shown in the figure is provided with a groove having a predetermined number of grooves with a predetermined cotton density and a predetermined width and depth provided on the surface of a substrate 103 on which the electrothermal converter 102 is provided. It has a structure in which the orifice 105 and the liquid discharge portion 106 are formed by joining so as to cover with the plate 104. In the case of the recording head shown in the drawing, it is shown as having a plurality of orifices 105, but of course, the present invention is not limited to this, and a recording head with a single orifice also falls within the scope of the present invention. It is a thing.

The liquid ejecting portion 106 has an orifice 105 for ejecting the liquid at the end thereof, and thermal energy generated by the electrothermal converter 102 acts on the liquid to generate bubbles, which rapidly expands and contracts due to expansion and contraction of the volume. And a heat acting portion 107 that is a portion that causes various state changes.

The heat acting portion 107 is the heat generating portion 10 of the electrothermal converter 102.
The heat acting surface 109, which is located on the upper part of 8 and is in contact with the liquid of the heat generating portion 108, is the bottom surface thereof.

The heat generating portion 108 is the lower layer 1 provided on the substrate 103.
10, heating resistance layer 11 provided on the lower layer 110
1 and an upper layer 112 provided on the heating resistance layer 111. The heating resistance layer 111 is provided with electrodes 113 and 114 on its surface for supplying electricity to the layer 111 in order to generate heat. The electrode 113 is an electrode common to the heat generating portions of the liquid ejecting portions, and the electrode 114 is a selection electrode for selecting the heat generating portion of each liquid ejecting portion to generate heat. It is provided along the flow path.

The upper layer 112 fills the heat generation resistance layer 111 and the liquid flow paths of the liquid ejection unit 106 in order to chemically and physically protect the heat generation resistance layer 111 in the heat generation unit 108 from the liquid used. The electrode 1 that separates from the liquid and passes through the liquid
Heating resistance layer 1 for preventing short circuit between 13 and 114
It has 11 protective functions.

Further, the upper layer 112 also serves to prevent electrical leakage between the adjacent electrodes. In particular, prevention of electrical leakage between the selected electrodes, or the electrode under each liquid flow channel is contacted with the liquid for some reason, and the electrical corrosion caused by energizing this Prevention is important,
For this reason, the upper layer 112 having such a protective layer function is provided at least on the electrode under the liquid flow path.

Further, the liquid flow paths provided in the respective liquid discharge parts are communicated with each other through a common liquid chamber which constitutes a part of the liquid flow paths upstream of the respective liquid discharge parts. The electrode connected to the electrothermal converter provided in the section is provided so as to pass under the common liquid chamber on the upstream side of the heat acting section due to its design convenience.

Therefore, even in this portion, the above-mentioned upper layer is generally provided in order to prevent the electrode from coming into contact with the liquid.

By the way, the characteristics required for the lower layer 110 are: a. Good heat resistance to withstand the heat generated in the heat generating portion of the heat generating resistance layer, b. Good thermal shock resistance capable of withstanding repeated heat generation in the heat generating portion of the heat generating resistance layer, c. Having a coefficient of thermal expansion that is substantially the same as that of the heating resistance layer and the electrode layer laminated on the lower layer, d. It is mainly important that the adhesiveness with each layer laminated on the lower layer is good. When these characteristics are sufficiently satisfied, the liquid jet recording head has a long life and high reliability. In addition, from the viewpoint of manufacturing a liquid jet recording head, generally, the heating resistance layer is formed into a desired shape by a photolithography process.
If the etching rate ratio between the lower layer and the heating resistance layer is not sufficiently large, unnecessary parts of the lower layer may be etched or side etching may occur, which may shorten the life of the completed head. The fact that the layer has high etching resistance is also mentioned as one of the important characteristics.

Further, one of the important roles of the lower layer is to control the heat generated by the heating resistance layer. At the time of recording, necessary and sufficient heat must be transferred to the liquid side, and unnecessary heat must be quickly released to the substrate side. If this heat cannot be controlled well, the electricity to the electrothermal converter can be removed. There are adverse effects such that the responsiveness to the input of a signal is deteriorated and that heat is accumulated to destroy a component that constitutes the liquid jet recording head such as an electrothermal converter. In particular, recently, since a gradation recording property and a high speed recording property are required, there is a great demand for a liquid jet recording head having high responsiveness. In order to satisfy such requirements, it is desired that the substrate constituting the recording head be made of a material having excellent heat dissipation. Further, in order for the substrate having such characteristics to function sufficiently effectively, it is necessary that the lower layer is formed of a material having high thermal conductivity.

However, a material satisfying all of the above characteristics has not been proposed yet, and thermal oxidation of Si is known to be suitably used for a lower layer of a liquid jet recording head.
Etching resistance even in O _2, there may not be said to be particularly as the lower layer of a suitable liquid jet recording head in high-speed recording as it is capable of fully satisfactory thermal expansion coefficient, in terms of thermal conductivity and the like It was Therefore, under the present circumstances, a liquid jet recording head which is excellent in overall use durability is not yet provided when high-speed recording is continuously performed for a long time.

[Object of the Invention]

The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide a liquid jet recording head having a long life, extremely high reliability, and good high-speed response.

Another object of the present invention is to provide a liquid jet recording head which has high reliability in the manufacturing process, high yield in the manufacturing process, and has no variation in the liquid jetting characteristics.

A further object of the present invention is to provide a liquid jet recording head in which a lower layer satisfying the above-mentioned required characteristics is formed on a substrate.

Another object of the present invention is to provide a highly reliable liquid jet recording head which has a high manufacturing yield even when a multi-orifice is used.

[Outline of Invention]

The object is to provide a support, carbon or a lower layer containing carbon as a main component formed on the support, a heating resistance layer formed in a desired pattern on the lower layer by etching, and the heating resistance layer. An electrothermal converter having a pair of electrodes that are electrically connected to each other, and a grooved plate that forms a liquid flow path corresponding to the electrothermal converter, and Is achieved by a liquid jet recording head.

FIG. 2 (a) is a front view partial view seen from the orifice side for explaining the main part of the structure of the preferred embodiment of the liquid jet recording head of the present invention, and FIG. Shows a partial sectional view of a section taken along the chain line AA 'in FIG. 2 (a), and FIG. 2 (a) corresponds to FIG. 1 (a). FIG. 2 (b) corresponds to FIG. 1 (b).

A liquid jet recording head 200 shown in the figure has a substrate for liquid jet recording (hereinafter, simply referred to as a substrate) 20 provided with a desired number of electrothermal converters 201 and utilizing heat for liquid ejection.
2 and a grooved plate 203 having a desired number of grooves provided corresponding to the electrothermal converter 201, the main portion thereof is configured.

The substrate 202 and the grooved plate 203 are joined together at a predetermined position with an adhesive or the like, so that the portion of the substrate 202 where the electrothermal converter 201 is provided and the groove portion of the grooved plate 203 cause liquid flow. A channel 204 is formed, and the liquid eye 204 has a heat acting portion 205 as a part of its configuration. Board 202
Is a support 206 made of silicon, glass, ceramics or the like, carbon or a lower layer 207 containing carbon as a main component on the support 206, a heating resistance layer 208, and both sides of the surface of the heating resistance layer 208. The electrodes 209 and 210 and the portion of the heating resistance layer 208 not covered by the electrodes along the liquid flow path 204, and the protective layer 211 made of an inorganic material so as to cover the portions of the electrodes 209 and 210 are provided. It has. The electrothermal converter 201 has a heat generating part 212 as a main part thereof, and the heat generating part 212 is arranged on the support 206 in order from the support 206 side to the heat generating resistance layer 208 and the upper layer 211.
Are laminated, and the surface (heat-acting surface) 213 of the upper layer 211 is in direct contact with the liquid filling the liquid flow path 204.

In the case of the liquid jet recording head 200 shown in FIG. 2, the upper layer 211 has a double-layer structure in which layers 216 and 217 are provided in order to further increase the mechanical strength of the layer 211. The layer 216 is made of, for example, an inorganic oxide such as SiO ₂ or S.
The layer 217 is composed of an inorganic material such as i ₃ N ₄ or the like having relatively high electric insulation and heat resistance, and the layer 217 is tenacious and has relatively high mechanical strength. Adhesiveness and adhesiveness, for example, when the layer 216 is made of SiO ₂ , it is made of a metal material such as Ta.

As described above, the surface layer of the first upper layer 211 is made of an inorganic material such as a metal having a comparatively tenacity and a mechanical strength, so that the cavitation generated at the time of liquid ejection on the heat acting surface 213. The shock from the action can be sufficiently absorbed, and the life of the electrothermal converter 201 can be significantly extended.

In addition, the layer 21 provided as the surface layer of the upper layer 211.
No. 7 is not always required in the present invention.

As the material forming the first upper layer 211, in addition to the above-mentioned inorganic materials, titanium oxide, vanadium oxide, niobium oxide, molybdenum oxide, tantalum oxide, tungsten oxide, chromium oxide, zirconium oxide, hafnium oxide,
Transition metal oxides such as lanthanum oxide, yttrium oxide, and manganese oxide, as well as metal oxides such as aluminum oxide, calcium oxide, strontium oxide, barium oxide, and silicon oxide, and their composites, silicon nitride, aluminum nitride, boron nitride. , High-resistance nitrides such as tantalum nitride and composites of these oxides and nitrides, as well as semiconductors such as amorphous silicon and amorphous selenium, even if they have low resistance in bulk, sputtering method, CV
There can be mentioned thin film materials capable of achieving high resistance in the manufacturing process such as D method, vapor deposition method, gas phase reaction method, liquid coating method,
The layer thickness is generally 0.1 μm to 5 μm, preferably 0.2 μm to 3 μm.

As the material forming the heating resistance layer 208, almost any material can be adopted as long as it can generate desired heat when energized.

As such a material, specifically, for example, tantalum nitride,
Nichrome, silver-palladium alloy, silicon semiconductor, or hafnium, lanthanum, zirconium, titanium, tantalum, tungsten, molybdenum, niobium, chromium,
Preferred examples include borides of metals such as vanadium.

Among these materials forming the heating resistance layer 208, metal borides can be mentioned as particularly excellent ones, of which hafnium boride has the most excellent characteristics, and zirconium boride is next. The order is lanthanum boride, tantalum boride, vanadium boride, and niopide boride.

The heat generating resistance layer 208 can be formed by using the above-mentioned materials by a method such as electron beam evaporation or sputtering.

As the material for forming the electrodes 209 and 210, many of the commonly used electrode materials are effectively used, and specifically, metals such as Al, Au, Ag, Pt, and Cu are mentioned. These are used to provide a desired size, shape, and thickness at a desired position by a technique such as vapor deposition. Lower layer 2
Reference numeral 07 denotes a support body 2 for heat generated mainly by the heat generating section 212.
It is provided as a layer that controls the flow to the 06 side,
When heat energy is applied to the liquid in the heat acting portion 205, a large amount of heat generated by the heat generating portion 212 is made to flow toward the heat acting portion 205 side, so that the electrothermal converter 20.
The layer thickness is designed so that the heat remaining in the heat generating portion 212 flows quickly to the support body 206 side when the energization to 1 is turned off.

In the present invention, the lower layer portion 207 is composed of a layer made of carbon or a material containing carbon as a main component. More preferably, it is a layer containing 90 atomic% or more of carbon atoms.
The lower layer 207 is more preferably a layer having properties similar to diamond, and most preferably a thin film having a diamond structure or a layer containing microcrystals having a diamond structure. Such layers are formed by CVD method, plasma CV
It can be formed by a D method, an ionization vapor deposition method, an ion beam method, or a sputtering method, and a gas containing a carbon atom, more preferably a hydrocarbon gas is used as a reaction gas. Specifically, CH ₄ gas or C is used. ₂ H ₆ gas is preferably used. Further, a gas obtained by mixing hydrogen gas other than the above gases may be used. The pressure in the chamber during layer formation varies depending on the layer formation method, but is generally preferably 10 ^−2.
The temperature of the support is preferably in the range of room temperature to 1000 ° C., and is preferably 10 ⁻³ Pa, more preferably 10 ⁻² to 10 ² Pa.

Although the layer thickness of the lower layer 207 depends on the thermal design conditions, it is usually
Preferably 1 μm to 20 μm, more preferably 1 μm to 1
It is desirable that the thickness is 0 μm, optimally 1 μm to 5 μm.

As a material forming the common liquid chamber constituent member provided on the upstream side of the grooved plate 203 and the heat acting portion 205, the shape is thermally influenced in the environment at the time of working the recording head or at the time of use. Since it does not or hardly receives it, fine precision processing can be easily applied, surface accuracy can be easily obtained as desired, and liquid flows smoothly in the flow path formed by such Most of them are effective as long as they can be processed to obtain them.

Next, referring to FIG. 3, carbon or a lower layer containing carbon as a main component, more specifically, a layer containing 90 atomic% or more of carbon atoms, which has characteristics similar to diamond and has a CVD method. It will be described that the etching resistance is required for the film formed on the support by the plasma CVD method, the ionization deposition method, or the like. FIG. 3 (a) is a schematic sectional view of an electrode portion of an electrothermal converter of a recording head when a conventional lower layer (eg, SiO ₂ ) is used, and FIG. 3 (b) shows a recording head according to the present invention. It is a typical sectional view of the electrode part of the electrothermal converter.

When the recording head is manufactured, the heating resistance layer 208 provided on the lower layer 207 is generally made of the above-mentioned materials, and these materials have excellent etching resistance. For this reason, an etching solution having a high solubility such as a mixed solution of hydrofluoric acid and nitric acid is usually used for forming a pattern for forming the heating resistance layer 208 into a desired shape. Therefore, the lower layer 207 is also touched when forming the pattern of the heating resistance layer 208, and the step 2 is formed as shown in FIG.
18 is formed. This step 218 is defined by the electrode 20.
9 and the upper layer 211 provided to protect the heating resistance layer 208 are formed, they become a cause of generation of a defective portion 219 having a poor step coverage as shown in FIG. The liquid that fills the upper layer 211 permeates through the defective portion 219, and the electrode 209 and the heating resistance layer 20 are penetrated.
8 causes a chemical reaction with the electrode 8 and invades the electrode 209 and the heating resistance layer 208. As a result, in the conventional recording head, the conductive layer serving as an electrode or the heat generating resistance layer is broken, or due to repeated thermal shock due to the heat generation of the heat generating resistance layer 208, the defective portion 219 is struck and a crack is generated, and the upper layer 211. Was peeled off, which significantly reduced the life and reliability.

However, when the lower layer is made of carbon or a material containing carbon as a main component according to the present invention, the lower layer is not soaked in the etching solution even when the heating resistor layer 208 is etched, so that steps or upper portions are not formed. The defect portion 219 generated during the formation of the layer 211 does not occur, and ideal pattern formation can be performed as shown in FIG. 3 (b). This directly leads to high reliability and long life of the recording head.

In another conventional example in which SiO ₂ is used for the lower layer, in order to suppress the step 218 due to etching as much as possible, when the heating resistor layer 208 on the substrate is etched into a desired shape, it is almost simultaneously removed from the etching solution into the etching stopper. The substrate was immersed. However, in the case of performing such a treatment, the pattern is not formed in a desired manner due to the contamination on the substrate, the gas generated during etching, the resist residue, the variation in the film thickness and the film quality of the heating resistance layer, and the unnecessary pattern is not needed. There is a problem that a part remains or a short circuit part is generated as a result, and the yield is reduced. By using the lower layer of the present invention, since the substrate can be redundantly dipped in the etching solution even after the heating resistance layer is almost etched, the decrease in yield due to the above problems can be dramatically eliminated. .

FIG. 4 is a diagram for explaining the thermal responsiveness of the substrate 202 and is a diagram showing a temporal change of the temperature of the heat acting surface for applying heat energy to the liquid. In FIG. 4, the vertical axis shows a value obtained by dividing the temperature at the time t on the heat acting surface by the temperature Tth at which the liquid starts to foam on the heat acting surface. Usually, Tth is in the range of 150 to 250 ° C. The horizontal axis is the time when the time when the pulse signal is applied to the heat acting surface is O. A curve A is a thermal waveform when an alumina substrate is used as the support, the lower layer 207 is a glaze layer (40 μm), and a pulse signal of 6 μs is applied, and B is the support made of Si.
And the thermal waveform when the lower layer is thermally oxidized SiO ₂ (5 μm) and a pulse signal similar to the above is given. further,
C shows a thermal waveform when Si is used as the support and the lower layer (5 μm) of the present invention is used. From the results shown, SiO ₂
From about 0.002 cal / sec · cm · ° C, etc.,
By changing the lower layer of the present invention to about 1.0 cal / sec.cm.degree. C., it becomes possible to provide a recording head having a significantly improved heat dissipation property and a superior thermal response as compared with the conventional case. For this reason, even if high-speed driving is performed, heat can be stored in the substrate and recording can be performed with a constant applied voltage.

For example, in the case of the A recording head, there is a problem that the dot size is changed and the printing quality is deteriorated at a driving frequency of about 1.5 KHz or higher. Also, in the case of the recording head of B, the same problem occurs at 10 KHz or higher, but the recording head of the present invention can sufficiently record at 20 KHz or higher. FIG. 5 is a diagram for explaining the above effect and is a diagram showing the relationship between the drive frequency and the ejection start voltage.
The vertical axis is the ejection start voltage Vth on the low frequency side (the voltage measured in the region where the ejection start voltage does not change even if the frequency is changed), and the ejection start voltage V · f on the high frequency side (the frequency is changed). At this time, it is a value obtained by dividing the voltage measured in the frequency region in which the foaming start voltage of the liquid changes due to the heat storage effect of the substrate.

From this, it is shown that the recording head of the present invention having high heat dissipation does not generate heat up to a high frequency, the discharge start voltage is constant, and stable recording can be performed.

This indicates that a liquid jet recording head capable of high-speed recording and multi-gradation recording can be provided.

Further, the other physical properties of the lower layer used in the present invention are far more desirable than those of conventional SiO ₂ .

The thermal expansion coefficient of the lower layer used in the present invention is 1 × 10 ^−6.
Since it is about 5 × 10 ⁻⁶ / ° C., Si (coefficient of thermal expansion 2.5 × 10 ⁻⁶ −3 ×), which is preferably used as a support, is used.
(About 10 ⁻⁶ / ° C.) or HfB ₂ (coefficient of thermal expansion of about 7.6 × 10 ⁻⁶ / ° C.) which is preferably used as a heating resistance layer (due to a very small difference in thermal expansion coefficient (thermal expansion of SiO ₂ The coefficient is about 3.5 × 10 ^{−7 to} 5.5 × 10 ⁻⁷ / ° C.)
A recording head having high reliability without peeling of each layer or generation of blisters is provided.

The lower layer may be provided on the entire upper surface of the support, but in order to improve the high-speed response of the recording head, the lower layer should be provided at least under the heat generating portion of the electrothermal converter. Good.

Although the upper layer has a two-layer structure in FIG. 2, there is no problem even if it has a single-layer structure as long as the purpose of the upper layer is achieved. Alternatively, in the case of the present invention, the upper layer is not always necessary unless the support, the conductive layer and the heat generating resistance layer cause a chemical reaction with the liquid (ink). Further, even if the upper layer is composed of three or more layers, it does not matter if the heat energy is effectively transferred to the liquid. As an example of the case where the upper layer has a three-layer structure,
In some cases, a SiO ₂ layer, a Ta layer, and an organic resin layer are laminated in this order from the support side. In this case, the organic resin layer is provided to improve ink resistance.

Hereinafter, the present invention will be described with reference to examples.

<Example> First, a 4-inch wafer Si support was cleaned and then housed in a chamber capable of reducing the pressure. Then, the inside of the chamber is evacuated, CH ₄ gas is introduced as a source gas together with hydrogen gas, and the inside of the chamber is 10 ⁻² to 10 ³ P.
High frequency voltage (RF power 3kw) between electrodes while keeping at a
Was applied to generate a discharge to form a plasma atmosphere, thereby forming a carbon thin film of 5 μm as a lower layer on the support.

Next, HfB ₂ was deposited as R on the carbon thin film as a heating resistance layer.
2000 Å was formed by F sputtering, and subsequently, 1 μm of Al was formed by an EB vapor deposition method as a conductive layer to be an electrode.

After that, a conductive layer and (Al) are etched to form a desired shape by a photolithography process to form an electrode, and subsequently, a heating resistance layer (HfB ₂ ) of an unnecessary portion is HF by a photolithography process. An electrothermal converter was formed by removing it with a system etching solution.

In the present embodiment, the electrothermal converter has a heat generating portion,
That is, the size of the heating resistance layer portion sandwiched between a pair of opposed electrodes was 100 μm × 100 μm, and the pitch was 8 pieces / mm. The resistance value at that time was 80Ω.

S is formed on the substrate having the electrothermal converter manufactured as described above.
The io ₂ layer was sputtered to a thickness of 1.9 μm, and the Ta layer was sputtered to a thickness of 0.5 μm to form a protective layer (upper layer).

After laminating a photosensitive resin on this substrate, the photosensitive resin was exposed and developed according to a desired pattern to form the wall surface of the liquid flow path and the liquid chamber. Further, a glass plate having two 1-m holes as ink supply ports was bonded on the above-described photosensitive resin cured film formed in a desired pattern so that the ink supply ports became the liquid chamber portion. Subsequently, the distance between the tip of the heating resistor and the orifice is 300μ.
A recording head was manufactured by polishing the end face of the orifice so that the recording head had a thickness of m.

While supplying the ink containing black dye and ethanol as the main components to the heat-acting part with a thickness of 0.01 atm to this recording head, a rectangular voltage pulse print signal was applied to the electrothermal converter to record and evaluate the image. did.

As a result, the liquid droplets will not be ejected even during the recording operation for a long time, and even if a high-frequency electric pulse signal is input, there is almost no difference in the recorded dot diameters, and it is possible to continue the operation. Stable recording can be performed.

In addition, stable recording could be performed from beginning to end even when a high frequency electric pulse signal was input and recording was performed for a long time.

Further, a test in which the recording head was left in an atmosphere of temperatures of −30 ° C. and 60 ° C. with the ink filled in the recording head and a thermal shock was repeated was repeated, but conventional SiO ₂ was used as a lower layer for recording. Even in the condition that some defects occur in the head, no defects due to the substrate were found in the examples of the present invention.

〔The invention's effect〕

As described above in detail, according to the present invention, the heat storage in the lower layer does not occur even after repeated continuous use, and the heat dissipation becomes high, so that the liquid jet recording head suitable for high-speed recording and multi-gradation recording is provided. Will be submitted.

Further, since the lower layer of the present invention has high etching resistance, a liquid jet recording head having a high yield in the manufacturing process and high reliability is provided.

In addition, according to the present invention, the coefficient of thermal expansion of the lower layer is close to the coefficient of thermal expansion of the other material in contact with the lower layer, which is sufficient for the thermal stress due to the repeated thermal action accompanying the recording operation. Provided is a liquid jet recording head which has high durability and long life.

[Brief description of drawings]

FIG. 1 (a) is a schematic front partial view for explaining a liquid jet recording head according to the present invention, and FIG. 1 (b) is a sectional view taken along a dashed line XY in FIG. 1 (a). It is a typical cut surface partial view of. 2 (a) is a schematic front partial view for explaining the present invention, and FIG. 2 (b) is FIG. 2 (a).
FIG. 7 is a schematic sectional view partial view in the case of cutting at a portion indicated by a chain line X′Y ′ in FIG. FIG. 3A is a schematic sectional view of an electrode portion of a conventional recording head, and FIG. 3B is a schematic sectional view of an electrode portion of the present invention. FIG. 4 is a diagram showing a temporal change of the temperature of the heat acting surface, and FIG. 5 is a diagram showing a relationship between the driving frequency and the ejection start voltage. 103, 206 ... Supports 110, 207 ... Lower layers 111, 208 ... Heating resistance layers 113, 114, 209, 210 ... Electrodes 112, 211 ... Upper layers 101, 200 ... Recording heads 104, 203 ... Grooved plates

Claims (1)

[Claims] 1. A support, a carbon or a lower layer containing carbon as a main component formed on the support, a heating resistance layer formed in a desired pattern on the lower layer by etching, and the heat generation. And an electrothermal converter having a pair of opposed electrodes electrically connected to the resistance layer, and a grooved plate forming a liquid flow path corresponding to the electrothermal converter. A liquid jet recording head characterized by: