JPH0641104B2 - Whetstone sharpening device for polishing equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grindstone sharpening device in a polishing device provided with a grindstone for polishing a work such as an aluminum substrate for a magnetic disk.

2. Description of the Related Art Conventionally, as a polishing apparatus for polishing an aluminum substrate for a magnetic disk, for example, an apparatus (5
1) is used. The polishing apparatus (51) shown in the figure has a donut disc-shaped grindstone (5
Lower surface plate (53) to which 2) is attached, and the lower surface plate (53)
Of the upper platen (55), which is arranged coaxially with the platen (53) so as to face the platen, is rotatably driven and can be moved up and down, and has a donut disk-shaped grindstone (54) attached to its lower surface. ), And the sun gear (57) arranged at the axial center position of the grindstone between the grindstones (52) (54), and the internal teeth concentrically arranged at the radially outer position of the sun gear (57). Gears (59)
And between the internal gear (59) and the sun gear (57) while being placed on the grindstone (52) of the lower turn table (53) while being meshed with both gears (57) (59). It is composed of an external gear-shaped work carrier (56) arranged. The work carrier (56) has an eccentric circular holding hole (60) along the outer peripheral shape of the magnetic disk substrate (A), and the magnetic disk substrate (A) is placed in the holding hole (60). ) Are arranged, the upper and lower surfaces of the substrate are holding holes (60) of the carrier (56).
The plate thickness is formed thinner than the substrate (A) so as to project outward from the substrate.

In this polishing apparatus (51), the magnetic disk substrate (A) is placed in the holding hole (60) of the work carrier (56) with the upper surface plate (55) being positioned at the upper standby position, and the upper portion. The surface plate (55) is lowered to sandwich both sides of the magnetic disk substrate (A) between the upper and lower grindstones (52) (54). Then, in the pressurized state, the work carrier (56) is revolved around the sun gear (57) while being rotated by the rotation of the sun gear (57), and further the upper and lower surface plates (53).
(55) is also rotated to polish both sides of the magnetic disk substrate (A).

By the way, in the polishing apparatus (51), while the work (A) is repeatedly polished, the grindstones (52) (54) are clogged or crushed. Therefore, the grindstones (52) (54) are dressed. There is a need.

Conventionally, this dressing has been performed using a dresser board (58) as shown in FIG. This dresser disk (58) is a dresser body (58a) that can be replaced with the work carrier (56) and has a large number of cylindrical pellets (58b) planted on the top and bottom surfaces of the main body (58a). is there. Grinding stone (52) with this dresser board (58)
To sharpen (54), polish the carrier (56) (51)
Then, the dresser plate (58) is placed in a meshed state between the sun gear (57) and the internal gear (59), and the grindstones (52) of the upper and lower surface plates (53) (55) are replaced. )(Five
It was carried out by rotating the sun gear (57) and the like in a state in which 4) was pressed against the dresser board (58).

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, when the whetstones (52) (54) are sharpened using the dresser board (58) as described above, the whetstone (52)
(54) has a drawback that the flatness is lowered, especially in the radial direction. This makes the distribution of the pressure received from the grindstones (52) (54) of the work to be ground after the dressing non-uniform, resulting in the non-uniform polishing amount of the work and thus the deterioration of the surface quality of the work. It was one of the major factors.

In particular, when the work requires precise polishing such as the above-mentioned aluminum substrate for magnetic disk, the sharpening of the grindstone by the dresser machine as described above has been one of the causes for lowering the manufacturing yield of the substrate. .

Also, each pellet (58b) of the conventional dresser board (58)
Since a fine-grained material for finishing shaving was used for ..., it took a lot of time to dress.

The present invention solves the conventional problems as described above, and it is possible to sharpen the polished surface of the grindstone to a surface having high flatness, thereby making the polishing amount uniform to the work, and consequently the surface texture of the work. The quality can be improved, and the time required for dressing can be significantly shortened.
An object of the present invention is to provide a whetstone sharpening device in a polishing device.

Means for Solving the Problems In the above object, the present invention is a sharpening device for a grindstone in a grinding device that is provided with a disc-shaped grindstone and grinds a work on one surface of the grindstone, wherein the grindstone is self-supporting. A dressing member that is rotatably supported around an axis and that dresses the polished surface of the grindstone is placed in a standby state at a side position of the grindstone, and at the time of dressing, the dressing member is a radial line of the grindstone. A driving means for moving back and forth in a direction, and the dressing member includes a roughing tool and a finishing tool, and a roughing tooling operation state in which the roughing tool sharpens the grinding surface of the grindstone, and a finishing tool Finishing for sharpening the surface to be ground The setting of the grindstone in the polishing device is characterized by being switched to the operating state The device is the gist.

As the polishing device, between the upper and lower grindstones, an external gear-shaped work carrier is revolved by the action of the sun gear and the internal gear, and a polishing device of a type that polishes the work is suitable. Adopted.

Further, in order to bring the grindstone and the dressing member into contact with each other, it is preferable that the grindstone is supported so as to be displaceable in the rotation axis direction.

In the grindstone dressing device in the above-mentioned polishing apparatus, the grindstone is dressed by rotating the grindstone and moving the dressing member forward and backward in the radial direction while the dressing member is in contact with the polishing surface of the grindstone. Therefore, the polishing surface of the grindstone that has passed through the dressing member is dressed to have a high flatness in both the radial direction and the circumferential direction.

Further, the dressing member includes a rough cutting tool and a finish cutting tool, and a rough cutting and dressing operating state in which the rough cutting tool sets the grinding surface of the grindstone and a finishing cutting setting in which the grinding tool surface is set by the finishing cutting tool. Since the setting can be switched to and, the setting time can be significantly shortened by performing the setting by the finish cutting tool after the setting by the rough cutting tool. Moreover, since it is only necessary to switch, the transition time from the rough cutting process to the finish cutting process is shortened.

EXAMPLE An example in which the present invention is applied to an apparatus for polishing a disk-shaped aluminum substrate for a magnetic disk will be described below with reference to the drawings.

1 and 2, (2) is a lower surface plate, and (3)
Is the upper platen, (4) is the sun gear, (5) is the internal gear,
(6) is a work carrier, and (7) is a dressing member.

The lower surface plate (2) has a donut disk-shaped grindstone (8) of a predetermined thickness attached to its upper part, and is rotated about its own axis and moved in the vertical direction by a drive device (not shown). It is supposed to be profitable.

The upper surface plate (3) is coaxially disposed above the lower surface plate (2), and a doughnut-shaped grindstone (9) is attached to the lower part of the upper surface plate (3) so as to face the grindstone (8). It was done. The upper surface plate (3) can also rotate about its own axis and move in the vertical direction by a driving device (not shown).

The sun gear (4) is arranged in the axial center position of the grindstones (8) and (9) between the upper and lower surface plates (2) and (3), and is rotated around its own axis by a drive device (not shown). Has been done.

The internal gear (5) is concentrically arranged at a radially outer position of the sun gear (4) with a donut-shaped space between the sun gear (4) and the sun gear (4).

The work carrier (6) is formed by a thin plate external gear, and one or more work carriers (6) are arranged in a donut-shaped space between the sun gear (4) and the internal gear (5). It is meshed with both toothed gears (4) and (5). The work carrier (6) is provided with one or a plurality of circular holding holes (10) along the outer peripheral shape of the magnetic disk substrate (A) at a position eccentric from the center position. The thickness of the work carrier (6) is smaller than that of the magnetic disk substrate (A), and the upper and lower sides of the work carrier (6) are arranged with the magnetic disk substrate (A) in the holding hole (10). The surface of is capable of protruding to the outside of the holding hole (10).

The dressing member (7) is composed of the upper and lower surface plates (2) (3).
Of the upper and lower surface plates (2) and (3) and then the upper and lower grindstones (8) and (9) in the radial direction by a driving device (not shown). It is supposed to be.

As shown in FIG. 3, this dressing member (7) is for holding a cutting tool, which is attached to the tip of a cylinder rod (12) of an air cylinder as a driving means so as to be rotatable around the axis of the rod. A block (13), and rough cutting tools (14) (14) for finishing and finishing, which are attached to the block (13) in a cross-shaped protruding state alternately arranged in a plane orthogonal to the axis of the rod (12). Byte (15)
(15) due to. Both the rough cutting tool and the finish cutting tool (14) (15) are formed such that the former is rougher than the latter in the grain size of the diamond pellets provided at the tip thereof.

Next, the operation of the above-mentioned polishing apparatus and the grinding stone dressing apparatus in the apparatus will be described together with the method of controlling the apparatus.

As shown in FIG. 1, the lower surface plate (2) is provided with the lower surface of the work carrier (6) in a state where the sun gear (4) and the internal gear (5) are engaged with the work carrier (6). The height is set so that it can be supported on the upper surface of the lower grindstone (8),
It is held at the height position during the polishing process. And
The magnetic disk substrate (A) is arranged in the holding hole (10) of the work carrier (6) in a state where the upper surface plate (3) is held at the upper standby position.

After the arrangement of the substrate (A) is completed, the upper surface plate (3) is lowered and, as shown in FIG. 5, the upper and lower grindstones (8) and (9).
Is brought into contact with both surfaces of the substrate (A), and is brought into a pressure state by a pressure device (not shown). In that state,
The sun gear (4) and the upper and lower surface plates (2) and (3) are rotated,
Thereby, the work carrier (6) revolves around the sun gear (4) while rotating, and the magnetic disk substrate (A).
Slides on the surfaces of the grindstones (8) and (9) to polish the substrate (A).

Then, when the substrate (A) has been polished by a predetermined amount, the rotation of the sun gear (4) and the like is stopped and the upper platen (3) is lifted to move the substrate from the work carrier (6). (A) is taken out.

Then, a new substrate (A) is placed in the holding hole (10) of the work carrier (6) again, and the same operation as above is repeated to polish the substrate (A) one after another.

Then, while repeatedly performing the polishing process, the upper and lower grindstones (8) and (9) are clogged, and the grindstone (8) is clogged.
When it becomes necessary to perform sharpening processing on the substrate, the board (A) is taken out and the cutting tool (14) for rough cutting of the sharpening member (7).
In the state where (14) is oriented in the vertical direction, as shown in FIG. 6, the upper and lower surface plates (2) and (3) move the polishing surfaces of those grindstones above and below the dressing member (7). It is vertically displaced so as to be positioned inward by the rough cutting thickness with respect to the positions of the tips of the cutting tools (14, 14).

In this state, the sun gear (4) is previously stopped in such a state that the work carrier (6) is not positioned on the advancing / retreating movement path of the dressing member (7).

Then, the upper and lower surface plates (2) (3) and then the whetstone (8)
(9) is rotated and the dressing member (7) is moved to the surface plate (2).
Horizontal advance operation is performed from the side position (3) inward in the radial direction of the surface plate. As a result, the upper and lower grindstones (8) and (9) are sharpened by rough cutting from their outer peripheral ends toward the center of rotation.

Then, when the cutting tools (14) (14) reach the inner peripheral edge of the grindstones (8) (9), the dressing member (7) retreats toward the outer peripheral edge side of the grindstones (8) (9). It is operated and rough-cuts the parts left uncut during the advance operation. And
After completing this withdrawal operation, the cutting tool holding block (13) is rotated 90 °, and the finishing tool (15) (15)
Is oriented vertically. And the upper and lower surface plates (2)
(3) is vertically displaced by the thickness of the finished shaving, and the setting member (7) is moved back and forth in the same manner as described above to finish the whetstones (8) and (9) in the set state.

Then, again as described above, the magnetic disk substrate (A)
The polishing process is restarted.

The sharpening by rough cutting is thicker than the sharpening by finish cutting (for example, 30 μm in rough cutting and 10 μm in finish cutting), faster in advancing and retreating speed of the operating body (7), and 2)
The number of rotations of (3) is reduced.

In the device of the above embodiment, the bite (14) of the dressing member (7)
The (15) is brought into contact with the grindstones (8) and (9) and the surface plate (2)
Since the setting member (7) is moved forward and backward between the two whetstones in the radial direction while the (3) is rotationally operated, the whetstones (8) and (9) are dressed.
In addition to being able to set the polished surface to a surface having high flatness in both the radial direction and the circumferential direction, the following effects are further exerted.

That is, in the apparatus of the above embodiment, it is possible to sharpen the grindstones (8) and (9) while the work carrier (6) is meshed with the sun and internal gears (4) and (5), As in the past (see Fig. 8), the work carrier (56) is removed, the dresser board (58) is attached, and the dresser board (5) is installed.
It is not necessary to perform a series of troublesome operations such as the removal of 8) and the attachment of the work carrier (56), and it is possible to improve the work efficiency of the dressing work and eventually reduce the idle time of the polishing device.

In addition, in the above embodiment, the bite (1
4) Since the upper and lower surface plates (2) and (3) can be moved up and down together in order to bring the whetstones (8) and (9) into contact with each other, the whetstone ( 8) (9) and the bite (14) (15) can be brought into contact with each other.

Furthermore, since the dressing is performed in two steps, the rough cutting step and the finishing step, it is possible to significantly reduce the time required for the dressing. Moreover, these two steps
Retaining block (13) rotatable on the tip of the rod (12)
Since the roughing tool (14) and the finishing tool (15) are cross-arranged in the form of a sharpening member (7), the roughing sharpening process immediately shifts to the finishing sharpening process. Therefore, the dressing time can be further shortened.

In the above embodiment, as the sharpening member (7), a pivotally operable holding block (13) is attached to the tip of the rod (12), and the rough cutting tool (14) is attached to the block (13). The finishing tool (15) and the finishing bit (15) are arranged in a cross shape. However, as shown in Fig. 4, the holding block (13) is fixedly attached to the tip of the rod (12). The block (13) is equipped with a bite (14) for both rough cutting and finish cutting, which is held in the vertical direction, and the cutting thickness, the moving speed of the operating body (7), and the surface plate (2) are adopted.
Rough cutting and finish cutting may be performed by providing a difference in the number of revolutions in (3).

Further, in the device of the present invention, as in the above-mentioned embodiment, the work (6) is rotated and revolved to grind the work (8).
In addition to the polishing device of the type that performs polishing in (9), for example, to a polishing device that polishes a work by holding the work in a protruding and fixed state, applying a grindstone from above, and rotating the grindstone Can also be applied.

EFFECTS OF THE INVENTION Depending on the above, the whetstone sharpening device in the polishing device of the present invention is a whetstone sharpening device in a polishing device that is provided with a disk-shaped whetstone and polishes a workpiece on one surface of the whetstone. The grindstone is rotatably supported around its own axis, and a dressing member for dressing the polished surface of the grindstone is arranged in a standby state at a side position of the grindstone, and the dressing member is provided at the time of dressing. Is provided with a driving means for moving the whetstone in the radial direction of the whetstone, so that the whetstone is sharpened by rotating the whetstone while the whetstone is in contact with the grinding surface of the whetstone. It is performed by moving the member forward and backward in the radial direction, so that the grindstone can be dressed on the surface with high flatness in both the radial direction and the circumferential direction, and the work polishing amount can be made uniform. As a result, it is possible to improve the surface quality of the work.

In particular, in the case where the work is one that requires highly accurate surface properties such as an aluminum substrate for a magnetic disk, the production yield can be greatly improved by using this dressing device.

In addition, the dressing member is equipped with a rough cutting tool and a finishing tool, and the rough cutting tool sets the grinding surface of the grindstone with the rough cutting tool, and the finish cutting tool sets the grinding surface of the grindstone with the finishing tool. Since it is supposed to be switched to and
After dressing with the rough cutting tool, dressing with the finishing tool can be performed, and the dressing time can be greatly reduced. Moreover, since it suffices to switch, the transition time from the rough cutting process to the finish cutting process can be shortened, and more efficient dressing work can be realized.

[Brief description of drawings]

1 to 6 show an apparatus according to an embodiment of the present invention. FIG. 1 is a sectional view of the apparatus, FIG. 2 is a view taken along the line II-II of FIG. 1, and FIG. 3 is a dressing member. FIG. 4, FIG. 4 is a perspective view showing another example of the dressing member, FIG. 5 is a sectional view showing an operating state of the polishing apparatus during polishing, and FIG. 6 is a state in which the grindstone is being dressed. It is sectional drawing shown. FIGS. 7 and 8 show a conventional polishing apparatus.
FIG. 8 is a perspective view showing a state when performing polishing, and FIG. 8 is a perspective view showing a state when performing dressing. (7) ... Sharpening member, (8) (9) ... Grinding stone.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Isao Tezuka 224, Kaiyamacho, Sakai City, Osaka Prefecture, Showa Aluminum Co., Ltd. (72) Yoshinobu Kimura, 6224, kaiyamacho, Sakai City, Osaka Prefecture, Showa Aluminum Within the corporation

Claims (1)

[Claims] 1. A sharpening device for a grindstone in a grinding device, which comprises a disk-shaped grindstone and grinds a work on one surface of the grindstone, wherein the grindstone is rotatably supported about its own axis, A dressing member for dressing the polished surface of the grindstone is arranged in a standby state at a lateral position of the grindstone, and a driving means for moving the dressing member forward and backward in the radial direction of the grindstone at the time of dressing is provided. In addition, the dressing member includes a roughing tool and a finishing tool, and the roughing tool is used to roughen the grinding surface of the grindstone, and the finishing tool is used to dress the grinding surface of the grinding stone. A grinding stone sharpening device in a polishing device, which is characterized in that it can be switched to a state.