JPH0636570Y2 - Resin molded circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a resin-molded circuit in which the entire circuit portion is covered with a resin mold in order to efficiently dissipate heat from the mounted circuit portion. It is a thing.

[Conventional technology]

Conventionally, such a resin mold type circuit is constructed as shown in FIG. 2, for example.

The resin mold type circuit 1 has various components 3 (electrolytic capacitors in the case shown) mounted at predetermined positions on the printed circuit board 2, and then a resin mold 4 is formed so as to cover the entire circuit portion constituted by the various components 3. It is formed by applying.

According to the resin mold type circuit 1 configured in this way,
During operation of the circuit formed on the printed circuit board 2, heat generated from various components 3 mounted on the printed circuit board 2 is radiated to the outside through the resin mold 4 that is in close contact with the various components 3. As a result, the heat dissipation effect of the various components 3 is improved.

[Problems to be solved by the device]

However, in the resin-molded circuit configured as described above, the electrolytic capacitor 3 is usually vaporized by gradually decomposing the electrolytic solution when a voltage is applied. However, when the electrolytic capacitor 3 is covered with the resin mold 4, the halogen component contained in the resin forming the resin mold 4 is generated by the gas generated by the decomposition of the electrolytic solution. Are extracted and enter the inside of the electrolytic capacitor 3 based on the electrophoretic effect. As a result, the halogen component corrodes the internal elements of the electrolytic capacitor 3, so that there is a problem that the electrolytic capacitor 3 is corroded before the life of the electrolytic capacitor 3.

The present invention has been made in view of the above points, and an object thereof is to provide a resin-molded circuit in which an electrolytic capacitor in a resin mold is prevented from being corroded by a halogen component in the resin.

[Means for Solving the Problems]

According to the present invention, the above object is to provide a resin-molded circuit in which various components including at least an electrolytic capacitor are mounted, and the entire circuit portion constituted by the various components is covered with a resin mold. A cap that completely and airtightly surrounds the rubber packing is attached to the electrolytic capacitor mounted on the circuit board at the end where the rubber packing is fitted. Is achieved by penetrating through the resin mold and opening to the outside.

[Action]

According to this invention, one end of the electrolytic capacitor, which is covered with the rubber packing, is hermetically enclosed by the cap. Therefore, when a voltage is applied during operation of the electrolytic capacitor, the internal electrolytic solution Is decomposed and vaporized, and even if the gas thus generated permeates the rubber packing and leaks to the outside of the electrolytic capacitor, this gas is trapped in the cap, and the resin is discharged from the cap. It is discharged to the outside of the resin-molded circuit through the air passage extending to the outside of the mold.

Therefore, the halogen component contained in the resin forming the resin mold does not enter the inside of the electrolytic capacitor based on the electrophoretic effect to corrode internal elements at all, and the electrolytic solution contained in the electrolytic capacitor does not exist at all. It becomes possible to effectively operate this electrolytic capacitor until it is dried up, and thus it is possible to prevent the corrosion damage accident of various devices using the resin mold.

〔Example〕

Hereinafter, the present invention will be described in more detail with reference to the embodiments shown in the drawings.

FIG. 1 shows a resin-molded circuit according to the present invention. In this resin-molded circuit 10, after various components (only the electrolytic capacitor 12 is shown) are mounted at predetermined positions on the printed board 11, a resin mold 13 is applied so as to cover the entire circuit portion constituted by the various components. It is formed by

The above configuration is similar to that of the conventional resin-molded circuit 1, but in the resin-molded circuit 10 according to the present invention, further, one end of the electrolytic capacitor 12 where the rubber packing 12a is fitted, A cap 14 is attached so as to completely and airtightly surround the rubber packing 12a.

In the illustrated case, the cap 14 is provided with an air passage 14a extending upward and penetrating the resin mold 13 and opening to the outside.

The resin-molded circuit 10 according to the present invention is configured as described above, and one end of the electrolytic capacitor 12 to which the rubber packing 12a is fitted is hermetically enclosed by the cap 14, so that the resin-molded circuit 10 is formed. When a voltage is applied to the electrolytic capacitor 12 during the operation of the circuit 10, the electrolytic solution inside the electrolytic capacitor 12 is decomposed and vaporized, but the gas thus generated is generated by the rubber packing 12.
Even if the gas passes through a and leaks to the outside of the electrolytic capacitor 12, this gas will be trapped in the cap 14.

The gas trapped inside the cap 14 is further ventilated from the cap 14 to the outside of the resin mold 13.
It is released to the outside of the resin mold type circuit 10 via a. Therefore, the halogen component contained in the resin forming the resin mold 13 does not enter the inside of the electrolytic capacitor based on the electrophoretic effect and corrode internal elements.

[Effect of device]

As described above, according to the present invention, since one end of the electrolytic capacitor in which the rubber packing is fitted is hermetically enclosed by the cap, a voltage is applied during the operation of the electrolytic capacitor. The internal electrolytic solution is decomposed and vaporized by the above, and even if the gas thus generated permeates the rubber packing and leaks to the outside of the electrolytic capacitor, this gas is trapped in the cap. Become.

Therefore, since it is released to the outside of the resin mold type circuit through the air passage extending from the cap to the outside of the resin mold, the halogen component contained in the resin forming the resin mold is extracted. , The electrolytic capacitor does not enter the inside of the electrolytic capacitor based on the electrophoretic effect to corrode internal elements at all, and the electrolytic capacitor is effectively operated until the electrolytic solution contained in the electrolytic capacitor is dried up. Thus, it is possible to prevent corrosion damage accidents of various devices using the resin mold.

Thus, according to the present invention, the electrolytic capacitor in the resin mold is not corroded by the halogen component in the resin, and the electrolytic capacitor can operate effectively until the electrolyte is dried up. A circuit could be provided.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing an embodiment of a resin-molded circuit according to the present invention. FIG. 2 is a schematic perspective view showing an example of a conventional resin-molded circuit. 10 …… Resin-molded circuit; 11 …… Printed circuit board; 12 ……
Electrolytic capacitor; 12a …… Rubber packing; 13 …… Resin mold; 14 …… Cap; 14a …… Ventilation path.

Claims (1)

[Scope of utility model registration request] 1. A resin-molded circuit in which various components including at least an electrolytic capacitor are mounted, and the entire circuit portion constituted by the various components is covered with a resin mold, wherein the circuit portion is provided on a substrate. A cap that completely and airtightly surrounds the rubber packing is attached to the mounted electrolytic capacitor at one end where the rubber packing is fitted, and a ventilation path extending from the cap is formed in the resin mold. It is characterized by penetrating through and opening to the outside,
Resin molded circuit.