JPH0635423Y2 - Contact planting structure for IC socket - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a socket of a flat type IC package,
In particular, it relates to a structure for aligning and implanting contacts in parallel slots in the IC socket.

2. Description of the Related Art The socket of the conventional flat type IC package is formed in the central portion of the socket base 1 as shown in FIGS.
A large number of slots 4 are arranged in parallel in the peripheral area of the IC accommodating portion 2 at a fine pitch with a partition wall 3 interposed therebetween. As shown in FIG. The contact 5 is planted in the stud hole 4b, the contact piece 5a of the contact 5 is extended into the slot 4, and the lead 5 of the IC package housed in the IC housing 2 at the contact portion 5a 'at the free end of the contact piece 5a. It has a structure to mount and to make contact. In FIG. 1, 6 is an IC pressing cover attached to one end of the socket base 1 so as to be openable and closable, and 7 is a lock lever for rotatably attaching to the other end of the socket base 1 for keeping the IC pressing cover closed. .

Thus, in the contact type IC socket, in the contact state, the IC lead is pressed to displace the contact piece 5a downward against its elasticity to obtain the contact pressure, and the contact 5 is elastically displaced in the vertical direction. Therefore, the slot 4 for accommodating the contact has a contact 5 as shown in FIG.
On the other hand, the groove width is formed so as to allow a slight amount of play, and the displacement movement is made smooth.

That is, the contact 5 is a support piece connected to the base of the contact piece 5a.
5b is supported on the inner bottom surface of the slot, and the male terminal 5c extending downward from the supporting piece 5b is press-fitted into the implantation hole 4b formed on the inner bottom surface of the slot to be planted. At this time, the contact piece 5a and the supporting piece 5b are attached. Is arranged in the slot 4, that is, with a gap 4a between it and the inner surface of the slot, and has a structure that allows the vertical displacement movement and the lateral displacement movement.

Problems to be Solved by the Invention As described above, the slot width of the slot 4 must be formed to be wide for the purpose of ensuring the vertical displacement movement and the lateral displacement movement of the contact piece 5a. When the groove width of is increased, a gap 4a is formed between the contact body portion including the contact piece 5a and the support piece 5b and the inner surface of the slot as described above.
Decrease the positioning function to create play. As a result, as shown in FIG. 5, the contact 5, especially the contact piece
This causes the problem that 5a is laterally offset and implanted. When the contact piece 5a comes into contact with the inner surface of the slot due to this bias, smooth vertical movement of the contact piece 5a is obstructed by friction depending on the contact state, and a normal contact pressure between the contact piece 5a and the lead of the IC package is ensured. become unable.

The socket is an IC package with leads protruding sideways or an IC package with leads bent in an L or C shape.
Alternatively, it is used for an IC package or the like in which leads are closely attached to the surface of the IC package, but the bias of the contacts in the socket is amplified by the contact portion 5a 'at the free end of the contact piece 5a, which causes a harmful pitch shift.

For example, in a general-purpose IC package socket having a lead and contact pitch of 1.27 mm and a slot width of 0.48 mm, the gap 4a between the contact piece 5a and the inner surface of the slot 4 is 0.05 mm on one side, and the contact portion 5a 'of the contact piece 5a' When a maximum deviation (a deviation of 0.05 mm) of contacting the partition wall 3 occurs, the maximum deviation amount of the adjacent contact piece is 0.1 mm. The contact 5 and the lead are extremely fine, and the contact width of the contact portion is very limited. Under such a contact condition, the deviation as described above is extremely harmful and causes a positional shift between the contact points of the lead and the contact to significantly reduce the contact area, resulting in a problem of significantly lowering reliability.

The present invention aims to solve the above problems effectively.

Further, in Japanese Utility Model Laid-Open No. 63-25475, in order to solve the above problem, a positioning groove narrower than the slot 4 is provided on the inner bottom surface of the slot 4, and the supporting piece 5b is fitted in the positioning groove. By restricting the position of the support piece, the contact piece is arranged at the center of the slot (prevents contact deviation), and a gap for smoothing the vertical displacement movement is secured on both sides of the contact piece.

However, in view of the fact that the molding of slots (molding of partition walls that define the slots) itself has reached its limit due to the recent fine pitch of contacts, the above-mentioned improvement plan is further improved in the inside of the slots rather than the slots. Since this is a proposal to form positioning grooves having a narrow interval, there is a problem that depending on the contact pitch, forming the positioning grooves (forming the walls that define the positioning grooves) becomes difficult and difficult to implement.

A particularly problematic point is that when the male terminal of the contact is to be press-fitted into the implantation hole opened in the inner bottom surface of the positioning groove,
The supporting piece of the contact rides on the upper surface (step portion between the slot and the positioning groove) of the partition wall of the positioning groove of the above-mentioned limited size, and in this state, it pushes into the above-mentioned implantation hole, causing deformation of the contact. However, there is an inherent defect that the entire socket becomes a defective product.

Means for Solving the Problems The present invention provides an IC socket in which a contact piece of a contact is arranged in a slot so as to be vertically displaceable, and a support piece supported on the bottom surface of the slot is provided at the base of the contact piece. The supporting piece is widened to be aligned with the inside of the slot, and the contact piece is narrowed to be loosely fitted into the slot.

According to the present invention, the wide support piece provided on the base of the contact piece is aligned with the slot while ensuring the vertical and lateral displacement movement of the contact piece in the slot by loosening the contact pieces. As a result, the contacts are aligned and implanted, and at the same time, the contact piece is accurately positioned at the center of the slot. The displacement movement, which is indispensable for the contact piece, is guaranteed while the positioning is achieved.

Further, the problem that the support piece rides on the step portion between the slot and the positioning groove and causes deformation when the contact is planted as in the case of the above-mentioned Japanese Utility Model Laid-Open No. 63-25475, is further solved. The difficulty of forming positioning grooves with a narrower interval than this is eliminated, and the initial purpose is effectively achieved.

Embodiment An embodiment of the present invention will be described below with reference to FIGS. 6 to 10.

As shown in FIG. 6, the IC socket has an IC retainer cover 6 attached to one end of the socket base 1 so as to be openable and closable, and a lock lever 7 for keeping the cover 6 attached rotatably at the other end. The socket base 1 has an IC accommodating portion 2 formed in the center thereof, and a plurality of slots 4 arranged side by side with a partition wall 3 around the IC accommodating portion 2 at the bottom of the slot 4. The wall has contact holes.

The other 15 indicates a contact, and the contact 15 has a contact body portion formed by a contact piece 15a on which an IC lead is mounted and a supporting piece 15b connected to the base of the contact piece 15a as shown in FIG. , A male terminal 15c vertically extending from one end or the other end of the supporting piece 15b or the central portion.

The supporting piece 15b of the contact as described above is widened and the contact piece 15a is formed narrow.

Thus, the male terminal 15c is press-fitted into the implantation hole opened in the inner bottom surface of the slot so as to be projected downward of the socket base 1 and the contact 15 is implanted and solidified. The wide support piece 15b extends in the slot 4 and is supported by the inner bottom surface of the wide support piece 15b, and both sides of the support piece are restricted by the inner side surface of the slot 4, that is, the support piece 15b.
Are aligned in the slot 4 to set the position of the contact piece 15a. The contact piece 15a extends toward the one end side of the slot 4 while rising from the implanting portion and extends into the slot, and a contact portion 15a 'formed at the free end of the contact piece 15a projects to the upper portion of the slot 4.

The contact piece 15a extends from the center of the width of the support piece 15b, and the contact piece 1a is formed by the alignment of the support piece 15b and the slot 4.
The contacts 5a and 5b are accurately arranged on the center line of the slot 4 so that the contacts are aligned and implanted. At the same time, the protruding position of the male terminal 15c is also accurate.

Due to the above, proper gaps 4a are equally formed on both sides of the contact piece 15a to ensure a smooth vertical displacement movement of the contact piece 15a, and the proper contact position to face the IC lead of the contact piece 15a by positioning as described above. Secure.

As an embodiment, as shown in FIG. 8 and FIG.
Similar to the contact piece 15a, c extends downward from the center of the width of the support piece 15b, and only the support piece 15b extending and aligned in the slot is widened.

Effect of the Invention The present invention has the contact arrangement as described above.
In the IC socket, a support piece is connected to the base of the contact piece,
A structure in which the supporting piece is widened and aligned with the slot while supporting the supporting piece on the bottom surface of the slot formed in parallel on the socket base through a partition wall, and the contact piece is loosely fitted in the slot. Therefore, the position of the contact piece can be appropriately set by the position regulation by the wide support piece, and thus the contact piece can be accurately housed and arranged in the center of the slot and aligned and implanted. At the same time, proper gaps can be formed on both sides of the contact piece to ensure smooth vertical displacement movement and lateral displacement movement of the contact piece, and also ensure a position facing the IC lead.

As a result, it is possible to effectively solve the problem that the contact piece is biased at the time of implantation and is displaced, and it is expected that a contact area can be secured and highly reliable contact can be achieved even with a fine pitch contact. Further, as in the above-mentioned Japanese Utility Model Laid-Open No. 63-25475, the problem that the support piece rides on the step portion between the slot and the positioning groove and causes deformation when the contact is planted is solved. Overcoming the molding difficulty of forming positioning grooves with a narrower spacing than this inside the
It is possible to effectively achieve the intended purpose of keeping the contact piece at the center position of the slot (forming uniform gaps at both ends of the contact piece) to make the vertical movement smooth, and to properly deal with the lead.

[Brief description of drawings]

FIGS. 1 to 5 show a conventional example, FIG. 1 is a perspective view of an IC socket, FIG. 2 is a perspective view showing a part of a contact implant portion in section, and FIG. FIG. 4 is a plan view of the same planting part, FIG. 4 is a perspective view of the contact, and FIG. 5 is a plan view of the planting part of the contact showing a planted state of the contact. 6 to 10 show an embodiment of the present invention, and FIG. 6 shows an IC.
Socket perspective view, FIG. 7 is a perspective view partially showing the contact implant portion, FIG. 8 is a contact perspective view, FIG. 9 is a contact implant sectional view, and FIG. 10 is a contact implant plan view. It is a figure. DESCRIPTION OF SYMBOLS 1 ... Socket base, 2 ... IC accommodation part, 3 ... Partition, 4 ... Slot, 4a ... Gap, 4b ... Implant hole, 6 ... IC pressing cover, 15 ...
Contact, 15a ... narrow contact piece, 15b ... wide support piece.

Claims (1)

[Scope of utility model registration request] 1. A plurality of slots are arranged in parallel on a socket base through a partition wall, contacts are embedded in the bottom wall of the slots, the contact pieces of each contact are accommodated in each slot, and the sockets are attached to each contact piece. In an IC socket in which each lead of an IC package mounted on a board is mounted and the contact piece is elastically displaced downward to obtain contact pressure, a support piece supported by the bottom surface of the slot is provided on the base of the contact piece. A contact implant structure in an IC socket, characterized in that the supporting piece is widened and aligned in the slot, and the contact piece is narrowed and loosely fitted in the slot.