JPH06349577A - Electroluminescence element - Google Patents
Electroluminescence elementInfo
- Publication number
- JPH06349577A JPH06349577A JP5134548A JP13454893A JPH06349577A JP H06349577 A JPH06349577 A JP H06349577A JP 5134548 A JP5134548 A JP 5134548A JP 13454893 A JP13454893 A JP 13454893A JP H06349577 A JPH06349577 A JP H06349577A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- light emitting
- back electrode
- moisture
- electroluminescence
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005401 electroluminescence Methods 0.000 title abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 25
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 24
- 239000011737 fluorine Substances 0.000 claims abstract description 24
- 238000010521 absorption reaction Methods 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 239000003989 dielectric material Substances 0.000 claims description 4
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 abstract description 9
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical compound FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 230000002093 peripheral effect Effects 0.000 abstract description 5
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical compound FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 abstract description 2
- 230000009545 invasion Effects 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 2
- 230000006866 deterioration Effects 0.000 abstract 1
- 230000008595 infiltration Effects 0.000 abstract 1
- 238000001764 infiltration Methods 0.000 abstract 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- 239000011230 binding agent Substances 0.000 description 12
- 229920001577 copolymer Polymers 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229920002678 cellulose Polymers 0.000 description 3
- 239000001913 cellulose Substances 0.000 description 3
- -1 cyanoethyl compound Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- NPNPZTNLOVBDOC-UHFFFAOYSA-N 1,1-difluoroethane Chemical compound CC(F)F NPNPZTNLOVBDOC-UHFFFAOYSA-N 0.000 description 1
- YMRMDGSNYHCUCL-UHFFFAOYSA-N 1,2-dichloro-1,1,2-trifluoroethane Chemical compound FC(Cl)C(F)(F)Cl YMRMDGSNYHCUCL-UHFFFAOYSA-N 0.000 description 1
- CHDVXKLFZBWKEN-UHFFFAOYSA-N C=C.F.F.F.Cl Chemical compound C=C.F.F.F.Cl CHDVXKLFZBWKEN-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＥＬ（エレクトロ ル
ミネッセンス）素子に関するものであり、特に透明電極
と背面電極との間にＥＬ発光層と絶縁層とを介在せしめ
るとともに防湿フィルムにより挟持して成るＥＬ素子に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an EL (electroluminescence) element, and in particular, an EL light emitting layer and an insulating layer are interposed between a transparent electrode and a back electrode and sandwiched by a moisture-proof film. The present invention relates to an EL element.
【０００２】[0002]
【従来の技術】現在、ＥＬ素子では、ＥＬ発光層に用い
られるＺｎＳ（Ｃｕ）等の発光体が水分により劣化する
ため、その防湿対策が重要課題である。このため、図５
ａおよび同図ａのＡＡ線断面を示した同図ｂに示すよう
に、透明電極５１と背面電極５４との間にＥＬ発光層５
２と絶縁層５３とを介在せしめるとともに防湿フィルム
５６により両面を挟持し、透明電極５１、ＥＬ発光層５
２、絶縁層５３および背面電極５４の周囲を封止して成
るＥＬ素子がある。また、図６ａおよび同図ａのＡＡ線
断面を示した同図ｂに示すように透明電極６１と背面電
極６４との間にＥＬ発光層６２と絶縁層６３とを介在せ
しめるとともに防湿フィルム６６により両面を挟持し、
透明電極６１、ＥＬ発光層６２、絶縁層６３、背面電極
６４と共に，リード引出部を除いた周縁部を切断してな
るＥＬ素子がある。2. Description of the Related Art At present, in an EL element, a light emitting body such as ZnS (Cu) used in an EL light emitting layer is deteriorated by moisture, and therefore, a moisture proof measure is an important issue. Therefore, in FIG.
a and the b in the figure, which is a sectional view taken along the line AA in FIG. a, the EL light emitting layer 5 is provided between the transparent electrode 51 and the back electrode 54.
2 and the insulating layer 53 are interposed and both surfaces are sandwiched by the moisture-proof film 56, and the transparent electrode 51 and the EL light emitting layer 5 are provided.
2. There is an EL element formed by sealing around the insulating layer 53 and the back electrode 54. Further, as shown in FIG. 6a and FIG. 6b showing the cross section taken along the line AA of FIG. 6a, the EL light emitting layer 62 and the insulating layer 63 are interposed between the transparent electrode 61 and the back electrode 64, and the moisture-proof film 66 is used. Sandwich both sides,
There is an EL element which is formed by cutting the peripheral portion excluding the lead lead portion together with the transparent electrode 61, the EL light emitting layer 62, the insulating layer 63, and the back electrode 64.
【０００３】また、一般にＥＬ発光層は、発光体とシア
ノエチル化合物等の高誘電バインダとを混ぜ合わせて生
成された発光インクを透明電極上に印刷して形成される
が、上記高誘電バインダに代わり、防湿性の高いフッ素
系樹脂を用いるものが、特開昭５７−６３７９７号公報
に開示されている。Further, the EL light emitting layer is generally formed by printing a light emitting ink produced by mixing a light emitting body and a high dielectric binder such as a cyanoethyl compound on a transparent electrode. Instead of the high dielectric binder, Japanese Patent Application Laid-Open No. 57-63797 discloses a resin using a fluorine-based resin having high moisture resistance.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上述の
第一のものは、防湿性に優れるものではあるが、ＥＬ素
子端部に防湿フィルムによる幅１mm程度の封止部５６ａ
ができ、封止部５６ａの分、ＥＬ素子が大きくなってし
まう。このため、小型の機器（例えば、腕時計の文字板
等。）にＥＬ素子を組み込む際、文字板等の発光部に対
して枠部が大きくなり、特に問題となる。However, although the above-mentioned first one is excellent in moisture proofness, the sealing part 56a having a width of about 1 mm formed by a moisture proof film at the end of the EL element is used.
Therefore, the EL element becomes larger by the amount corresponding to the sealing portion 56a. Therefore, when the EL element is incorporated in a small device (for example, a dial of a wristwatch), the frame portion becomes large with respect to the light emitting portion of the dial, which is a particular problem.
【０００５】また、上述の第二のものでは、第一のもの
に比べて封止部５６ａを持たない分、小型機器への組み
込みには特に問題を生じない。しかし、切断面のＥＬ発
光層が露出しているため、水分が侵入し易く早期にＥＬ
発光層が劣化し、寿命の点で問題となる。Further, the above-mentioned second one does not have the sealing portion 56a as compared with the first one, so that there is no particular problem in assembling into a small equipment. However, since the EL light emitting layer on the cut surface is exposed, moisture easily enters and
The light emitting layer deteriorates, which is a problem in terms of life.
【０００６】また、上述の第三のものでは、上記第二の
ものに比べ、発光層自体に防湿性を持たせたため、露出
部よりの水分の侵入を低減し、寿命の問題を解消したも
のである。しかしながら、シアノエチル化合物からなる
高誘電バインダに代わり用いられるフッ素系樹脂の誘電
率が、前者のそれに比べ低いため、高輝度のＥＬ素子が
得られないという問題点を有する。Further, in the above-mentioned third one, since the light emitting layer itself has a moisture-proof property as compared with the above-mentioned second one, moisture invasion from the exposed portion is reduced, and the problem of life is solved. Is. However, since the fluorine-based resin used in place of the high-dielectric binder made of a cyanoethyl compound has a lower dielectric constant than that of the former, there is a problem that an EL element with high brightness cannot be obtained.
【０００７】そこで、本発明の目的は、ＥＬ発光層の面
積と素子全体の面積とがほぼ等しく小型化に適し、長寿
命かつ高輝度のＥＬ素子を提供することにある。Therefore, an object of the present invention is to provide an EL device having a long life and high brightness, which is suitable for miniaturization because the area of the EL light emitting layer and the area of the entire device are substantially equal.
【０００８】[0008]
【課題を解決するための手段】透明電極と背面電極との
間にＥＬ発光層と絶縁層とを介在せしめるとともに防湿
フィルムにより挟持して成るＥＬ素子において、上記Ｅ
Ｌ発光層の上記透明電極とは反対の面および側面を覆う
ように上記防湿フィルムより十分薄いフッ素系樹脂層を
塗布形成することにより、上記目的を達成する。An EL device having an EL light emitting layer and an insulating layer interposed between a transparent electrode and a back electrode and sandwiched by a moisture-proof film, wherein
The above object is achieved by coating and forming a fluororesin layer sufficiently thinner than the moisture-proof film so as to cover the surface and side surface of the L light emitting layer opposite to the transparent electrode.
【０００９】ここで、上記背面電極上に吸湿性物質より
なる吸湿層を設けることが好ましい。Here, it is preferable to provide a hygroscopic layer made of a hygroscopic substance on the back electrode.
【００１０】また、上記フッ素系樹脂層は、上記ＥＬ発
光層の上面および側面を覆うように高誘電体を混入した
フッ素系樹脂を塗布して形成され、上記絶縁層を兼ねる
ことが好ましい。The fluororesin layer is preferably formed by applying a fluororesin mixed with a high dielectric material so as to cover the upper surface and the side surface of the EL light emitting layer, and also serves as the insulating layer.
【００１１】また、上記フッ素系樹脂層は背面電極の上
面に塗布形成してあるとともにＥＬ発光層、絶縁層およ
び背面電極の側面に塗布形成してあることが好ましい。
このとき、上記絶縁層は、上記ＥＬ発光層の上面および
側面を覆うように高誘電体を混入したフッ素系樹脂を塗
布して形成しても良く、さらに、上記背面電極上に吸湿
性物質よりなる吸湿層を設けることも好ましい。Further, it is preferable that the fluororesin layer is formed on the upper surface of the back electrode as well as on the side surfaces of the EL light emitting layer, the insulating layer and the back electrode.
At this time, the insulating layer may be formed by coating a fluorine-based resin mixed with a high dielectric so as to cover the upper surface and the side surface of the EL light emitting layer. It is also preferable to provide such a moisture absorption layer.
【００１２】[0012]
【実施例】次に、本発明の第一の実施例のＥＬ素子につ
いて説明する。EXAMPLES Next, the EL device of the first example of the present invention will be explained.
【００１３】図１は本例の構成を示す説明図であり、同
図ａに本例の正面を示し、同図ｂにＡＡ線断面を示す。
まず、同図を参照しながら製造工程にそって本例の構成
を示す。まず、透明電極１上にＥＬ発光層２を形成す
る。ここで、透明電極１は、ＰＥＴ（ポリエチレンテレ
フタレート）フィルム上に、ＩＴＯが蒸着されたもので
ある。また、後述するリード接点形成のための引出し部
１ａを有する。ＥＬ発光層２は、ＺｎＳ（Ｃｕ）等の発
光体と、プロピレンカーボネート溶媒により溶かされた
シアノエチル化セルロースからなる高誘電バインダとを
混ぜ合わせてなる発光インクを透明電極１上に印刷した
後、加熱乾燥処理を施して形成したものである。ここ
で、ＥＬ発光層２は、引出し部１ａを除く透明電極１の
ほぼ全面に形成される。次に、ＥＬ発光層２を覆う絶縁
層３を形成する。絶縁層３は、上記高誘電バインダと、
ＢａＴｉＯ3等の高誘電体とを混ぜ合わせてなる絶縁イ
ンクをＥＬ発光層２上に印刷した後、加熱乾燥処理を施
して形成したものである。また、絶縁層３は引出し部１
ａの一部にも設けられ、後述する背面電極のなすリード
接点と透明電極１とを絶縁する。FIG. 1 is an explanatory view showing the structure of the present example. FIG. 1A shows the front of the example, and FIG. 1B shows a cross section taken along the line AA.
First, the configuration of the present example will be shown along the manufacturing process with reference to FIG. First, the EL light emitting layer 2 is formed on the transparent electrode 1. Here, the transparent electrode 1 is formed by depositing ITO on a PET (polyethylene terephthalate) film. Further, it has a lead-out portion 1a for forming a lead contact described later. The EL light emitting layer 2 is formed by mixing a light emitting body such as ZnS (Cu) and a high dielectric binder made of cyanoethylated cellulose dissolved in a propylene carbonate solvent on the transparent electrode 1 and then heating it. It is formed by performing a drying process. Here, the EL light emitting layer 2 is formed on substantially the entire surface of the transparent electrode 1 excluding the extraction portion 1a. Next, the insulating layer 3 which covers the EL light emitting layer 2 is formed. The insulating layer 3 is composed of the high dielectric binder and
It is formed by printing an insulating ink mixed with a high dielectric material such as BaTiO 3 on the EL light emitting layer 2 and then heating and drying it. In addition, the insulating layer 3 is the lead portion 1
It is also provided in a part of a to insulate the transparent electrode 1 from the lead contact formed by the back electrode described later.
【００１４】次に、絶縁層３上に背面電極を形成する。
背面電極４は、絶縁層３上にカーボンインクを印刷した
後、加熱乾燥処理を施して形成したものである。同時
に、透明電極１の引出し部１ａの一部に一方のリード接
点４ａを設け、上述の引出し部１ａ上に設けられた背面
電極４の一部がもう一方のリード接点４ｂとなる。Next, a back electrode is formed on the insulating layer 3.
The back electrode 4 is formed by printing carbon ink on the insulating layer 3 and then performing heat drying treatment. At the same time, one lead contact 4a is provided on a part of the lead-out portion 1a of the transparent electrode 1, and a part of the back electrode 4 provided on the above-mentioned lead-out portion 1a becomes the other lead contact 4b.
【００１５】次に、フッ素系樹脂層５を形成する。フッ
素系樹脂層５は、背面電極４の上面と、ＥＬ発光層２、
絶縁層３および背面電極の側面とを覆う厚さ３０μm 程
度の層である。このフッ素系樹脂層５は、例えば、フッ
化ビニリデンと六フッ化プロピレンの共重合体をメチル
エチルケトンに溶かしてなるフッ素系樹脂インクを印刷
した後、加熱乾燥処理を施して形成したものである。な
お、フッ素系樹脂層５は上述のリード接点４ａ、４ｂ上
には形成されていない。Next, the fluororesin layer 5 is formed. The fluororesin layer 5 includes the upper surface of the back electrode 4, the EL light emitting layer 2,
It is a layer having a thickness of about 30 μm, which covers the insulating layer 3 and the side surface of the back electrode. The fluororesin layer 5 is formed, for example, by printing a fluororesin ink obtained by dissolving a copolymer of vinylidene fluoride and propylene hexafluoride in methyl ethyl ketone and then subjecting it to heat drying treatment. The fluororesin layer 5 is not formed on the lead contacts 4a and 4b described above.
【００１６】次に、各リード接点にリード電極４ｃ、４
ｄを装着した後、両面を三フッ化塩化エチレン等よりな
る防湿フィルム６にてラミネートする。続いて、図１ａ
に示すように、ＥＬ発光層２の外周より幅０．１mm程度
余裕を持たせて、防湿フィルム６を透明電極１、フッ素
系樹脂層５とともに切断して（図１ｂの破線にそって切
断する。）、本例のＥＬ素子が完成する。Next, the lead electrodes 4c and 4 are attached to the respective lead contacts.
After attaching d, both surfaces are laminated with a moisture-proof film 6 made of trifluoroethylene chloride or the like. Then, FIG. 1a
As shown in FIG. 1, the moisture-proof film 6 is cut together with the transparent electrode 1 and the fluorine-based resin layer 5 with a margin of about 0.1 mm from the outer circumference of the EL light emitting layer 2 (cut along the broken line in FIG. 1b). ), The EL device of this example is completed.
【００１７】以上のように構成される本例ＥＬ素子は、
図１ｂに示すように、ＥＬ素子周縁部はフッ素系樹脂層
５にて覆われている。このフッ素系樹脂層５に用いられ
るフッ素系樹脂の吸水率は、０．０４% 以下であり、高
誘電バインダとして用いられるシアノエチル化セルロー
スの吸水率２% に比べ極めて小さいため、厚さ３０μm
程度と薄い層にかかわらず、素子周縁部からの水分の侵
入を防ぐことが可能である。これにより、ＥＬ素子の外
寸を、ＥＬ発光層の外周より幅０．１mmだけ上回る程度
に収めることが可能となるとともに、水分侵入による寿
命の低下を抑えることが可能となる。The EL element of the present example configured as described above is
As shown in FIG. 1b, the periphery of the EL element is covered with the fluororesin layer 5. The water absorption of the fluororesin used in this fluororesin layer 5 is 0.04% or less, which is much smaller than the water absorption of 2% of cyanoethylated cellulose used as a high dielectric binder.
It is possible to prevent moisture from entering from the peripheral portion of the element regardless of the degree and the thin layer. As a result, the outer size of the EL element can be set to be about 0.1 mm wider than the outer circumference of the EL light emitting layer, and at the same time, the life of the EL element can be prevented from being shortened due to moisture intrusion.
【００１８】次に第二の実施例について説明する。本例
は、上記第一の実施例の構成において、絶縁層として高
誘電体を混入したフッ素系樹脂層を用いたものである。
図２ａは本例の構成を示す断面図であり、同図ａにおい
て、７は、フッ素系樹脂層としてのフッ素系樹脂絶縁層
であり、これ以外、フッ素系樹脂層５を除く、他の構成
は上記第一の実施例と同一であり、同様の工程にて形成
される。Next, a second embodiment will be described. In this example, a fluorine resin layer mixed with a high dielectric material is used as the insulating layer in the structure of the first example.
FIG. 2A is a cross-sectional view showing the structure of this example, and in FIG. 2A, reference numeral 7 denotes a fluorine-based resin insulating layer as a fluorine-based resin layer, and other configurations except for the fluorine-based resin layer 5. Is the same as that of the first embodiment and is formed in the same process.
【００１９】フッ素系樹脂絶縁層７は、例えば、高誘電
体ＢａＴｉＯ3（６０g ）を、予め、フッ化ビニリデン
と六フッ化プロピレンの共重合体（１０ｇ）をメチルエ
チルケトン（２５g ）に溶かしてなるバインダに混ぜ撹
拌して得られたインクを、ＥＬ発光層２の上面及び側面
を覆うように印刷した後、加熱乾燥処理を施す。この
後、第一の実施例と同様に背面電極４の形成工程、防湿
フィルム６によるラミネート工程、ＥＬ発光層２の外周
より幅０．１mm程度の周縁部を残して防湿フィルム６を
切断する工程を順次行ない形成されたものである。The fluorine-based resin insulating layer 7 is, for example, a binder obtained by previously dissolving a high dielectric constant BaTiO 3 (60 g) in a copolymer of vinylidene fluoride and propylene hexafluoride (10 g) in methyl ethyl ketone (25 g). The ink obtained by mixing and stirring is printed so as to cover the upper surface and the side surface of the EL light emitting layer 2, and then heat drying treatment is performed. After this, as in the first embodiment, the step of forming the back electrode 4, the step of laminating with the moisture-proof film 6, and the step of cutting the moisture-proof film 6 leaving a peripheral portion of a width of about 0.1 mm from the outer periphery of the EL light emitting layer 2. Are sequentially formed.
【００２０】ここで、フッ化ビニリデンと六フッ化プロ
ピレンの共重合体をメチルエチルケトンに溶かしてなる
バインダの非誘電率は、１２０Hzの交流電圧印加の下に
て、１３．０であり、同条件下でのシアノエチル化セル
ロースをプロピレンカーボネートに溶かしてなるバイン
ダのそれが１７．０であるのに比べ、若干低い値となっ
ている。しかし、これに混入される誘電体ＢａＴｉＯ3
の誘電率は１８００とこれらに比べ極めて高いため、フ
ッ化ビニリデンと六フッ化プロピレンの共重合体をメチ
ルエチルケトンに溶かしてなるバインダを用いて絶縁層
を形成することでＥＬ素子の輝度低下の問題は起こらな
い。Here, the non-dielectric constant of the binder prepared by dissolving the copolymer of vinylidene fluoride and propylene hexafluoride in methyl ethyl ketone is 13.0 under the application of an AC voltage of 120 Hz, and under the same conditions. The value is slightly lower than that of the binder prepared by dissolving cyanoethylated cellulose in propylene carbonate in 17.0, which is 17.0. However, the dielectric BaTiO 3 mixed in this
Has a dielectric constant of 1800, which is extremely high compared to these, and therefore, the problem of reduction in brightness of the EL element is caused by forming an insulating layer using a binder prepared by dissolving a copolymer of vinylidene fluoride and propylene hexafluoride in methyl ethyl ketone. It won't happen.
【００２１】本例においても、ＥＬ発光層２の上面及び
側面を覆うようにフッ素系樹脂絶縁層７が設けられてい
るため、ＥＬ素子周縁部にＥＬ発光層２が露出せず、フ
ッ素系樹脂絶縁層７にて被覆されることとなる。このた
め、第一の実施例と同様に、ＥＬ素子端部からの水分の
侵入を防ぎ、寿命の低下を抑えることが可能となる。こ
れとともに、絶縁層を兼ねるフッ素樹脂絶縁層７を設け
たため、フッ素系樹脂層５を省いても上記第１の実施例
と同様の効果を得られるため、工程を減らすことがで
き、コストの削減も可能となる。Also in this example, since the fluorine-based resin insulating layer 7 is provided so as to cover the upper surface and the side surface of the EL light-emitting layer 2, the EL light-emitting layer 2 is not exposed at the peripheral portion of the EL element, and the fluorine-based resin is not exposed. It will be covered with the insulating layer 7. For this reason, as in the first embodiment, it is possible to prevent moisture from entering from the end portion of the EL element and prevent the life from being shortened. At the same time, since the fluororesin insulating layer 7 also serving as an insulating layer is provided, the same effect as that of the first embodiment can be obtained even if the fluororesin layer 5 is omitted, so that the number of steps can be reduced and the cost can be reduced. Will also be possible.
【００２２】なお、本例において、図３に示すように、
上記第一の実施例と同様に、背面電極４の上面と、背面
電極４、フッ素系樹脂絶縁層７およびＥＬ発光層２の側
面を覆うようにフッ素系樹脂層５を設けても良い。この
場合、フッ素系樹脂絶縁層７、フッ素系樹脂層５の２層
により、ＥＬ発光層２が保護されるため、寿命の低下抑
制にさらに効果を奏するものである。In this example, as shown in FIG.
Similar to the first embodiment, the fluororesin layer 5 may be provided so as to cover the upper surface of the back electrode 4 and the side surfaces of the back electrode 4, the fluororesin insulating layer 7 and the EL light emitting layer 2. In this case, since the EL light emitting layer 2 is protected by the two layers of the fluorine-based resin insulating layer 7 and the fluorine-based resin layer 5, the life reduction is further suppressed.
【００２３】次に、さらに他の実施例について説明す
る。これは、上記第一の実施例及び第二の実施例におい
て、背面電極４上に吸湿層８を設けたものであり、それ
ぞれを図４ａ、ｂに示す。吸湿層８は、デンプン系の吸
湿物質をアクリルまたはポリエステルのバインダ中に撹
拌してなる吸湿インクを背面電極４上に印刷した後、加
熱乾燥処理を施して形成したものである。このように吸
湿層８を設けることで、万一、ＥＬ素子内部に水分が侵
入したとしても、吸湿層８により水分を捕らえ、ＥＬ発
光層を侵す水分量を抑えることができる。よって、寿命
の低下抑制にさらに効果を奏するものである。Next, still another embodiment will be described. This is one in which the moisture absorption layer 8 is provided on the back electrode 4 in the first and second embodiments, and they are shown in FIGS. 4a and 4b, respectively. The hygroscopic layer 8 is formed by printing a hygroscopic ink formed by stirring a starch-based hygroscopic substance in an acrylic or polyester binder on the back electrode 4 and then performing a heat drying process. By providing the moisture absorption layer 8 in this way, even if moisture invades into the EL element, it is possible to capture the moisture by the moisture absorption layer 8 and suppress the amount of moisture that invades the EL light emitting layer. Therefore, it is more effective in suppressing the decrease in life.
【００２４】また、上述の各実施例では、フッ化ビニリ
デンと六フッ化プロピレンの共重合体をメチルエチルケ
トンに溶かしてなるフッ素系樹脂を用いて、フッ素系樹
脂層５を形成したが、これに限るものではない。例え
ば、フッ化エチレン、フッ化ビニル、フッ化ビニリデ
ン、三フッ化エチレン、三フッ化塩化エチレン、四フッ
化エチレン、六フッ化プロピレンの内、いずれか２種以
上の共重合可能な共重合体およびそれらの単量体との重
合体を用いても良い。Further, in each of the above-mentioned embodiments, the fluorine resin layer 5 is formed by using the fluorine resin obtained by dissolving the copolymer of vinylidene fluoride and propylene hexafluoride in methyl ethyl ketone, but the invention is not limited to this. Not a thing. For example, a copolymerizable copolymer of two or more of ethylene fluoride, vinyl fluoride, vinylidene fluoride, ethylene trifluoride, ethylene trifluoride chloride, tetrafluoroethylene, and propylene hexafluoride. Also, a polymer with those monomers may be used.
【００２５】また、フッ素系樹脂絶縁層７に用いられる
バインダは、フッ化ビニリデンと六フッ化プロピレンの
共重合体をメチルエチルケトンに溶かしてなるものに限
るものではない。例えば、フッ化ビニリデンまたはポリ
フッ化ビニリンデンと、上記フッ素系樹脂の内、いずれ
か１種以上の共重合可能なものとの共重合体を用いても
良い。The binder used for the fluororesin insulating layer 7 is not limited to the one obtained by dissolving a copolymer of vinylidene fluoride and propylene hexafluoride in methyl ethyl ketone. For example, a copolymer of vinylidene fluoride or polyvinylidene fluoride and a copolymerizable one or more of the above fluororesins may be used.
【００２６】また、上記各実施例では、発光体として、
ＺｎＳに蛍光体としてのＣｕをドープしたものを用いた
が、これに限るものではない。例えば、蛍光体として使
用可能なＣｕ等の物質に、予め、ＳｉＯ2、ＴｉＯ2、Ａ
ｌ2Ｏ3等の無機の透明な誘電体をコーティングしたもの
を蛍光体として用いても良い。この場合、ＥＬ発光層自
体の誘電率が増加し、ＥＬ素子の輝度を向上させること
が可能となる。Further, in each of the above embodiments,
Although ZnS doped with Cu as a phosphor was used, the present invention is not limited to this. For example, if a substance such as Cu that can be used as a phosphor is added in advance to SiO 2 , TiO 2 , A
A phosphor coated with an inorganic transparent dielectric such as l 2 O 3 may be used as the phosphor. In this case, the dielectric constant of the EL light emitting layer itself increases, and the brightness of the EL element can be improved.
【００２７】また、発光体としてのＺｎＳにフッ素系樹
脂をコーティングしたものを用いても良い。これにより
発光体自体の耐水性を向上させることが可能となる。Alternatively, ZnS as a light-emitting body coated with a fluorine-based resin may be used. This makes it possible to improve the water resistance of the light emitting body itself.
【００２８】[0028]
【発明の効果】本発明によれば、ＥＬ発光層の面積と素
子の面積とがほぼ等しく小型化に適し、長寿命かつ高輝
度のＥＬ素子を提供することが可能となる。According to the present invention, it is possible to provide an EL device having a long life and high brightness, which is suitable for miniaturization because the area of the EL light emitting layer is substantially equal to the area of the device.
【図１】本発明の第１の実施例のＥＬ素子の構成を示す
説明図。FIG. 1 is an explanatory diagram showing a configuration of an EL element according to a first embodiment of the present invention.
【図２】本発明の第２の実施例のＥＬ素子の構成を示す
説明図。FIG. 2 is an explanatory diagram showing a configuration of an EL element according to a second embodiment of the present invention.
【図３】本発明の第２の実施例のＥＬ素子の他の構成を
示す説明図。FIG. 3 is an explanatory diagram showing another configuration of the EL element according to the second embodiment of the present invention.
【図４】本発明のさらに他の実施例のＥＬ素子の構成を
示す説明図。FIG. 4 is an explanatory diagram showing a configuration of an EL device of still another embodiment of the present invention.
【図５】従来のＥＬ素子のＥＬ素子の構成を示す説明
図。FIG. 5 is an explanatory diagram showing a configuration of an EL element of a conventional EL element.
【図６】従来の他のＥＬ素子のＥＬ素子の構成を示す説
明図。FIG. 6 is an explanatory diagram showing a configuration of an EL element of another conventional EL element.
１ 透明電極 ２ ＥＬ発光層 ３ 絶縁層 ４ 背面電極 ５ フッ素系樹脂層 ６ 防湿フィルム ７ フッ素系樹脂絶縁層（フッ素系樹脂層） ８ 吸湿層 1 Transparent Electrode 2 EL Light Emitting Layer 3 Insulating Layer 4 Back Electrode 5 Fluorine Resin Layer 6 Moisture-Proof Film 7 Fluorine Resin Insulating Layer (Fluorine Resin Layer) 8 Moisture Absorbing Layer
Claims (6)
と絶縁層とを介在せしめるとともに防湿フィルムにより
挟持してなるＥＬ素子において、上記ＥＬ発光層の上記
透明電極とは反対の面および側面を覆うように上記防湿
フィルムより十分薄いフッ素系樹脂層を塗布形成してあ
ることを特徴とするＥＬ素子。1. An EL device having an EL light emitting layer and an insulating layer interposed between a transparent electrode and a back electrode and sandwiched by a moisture-proof film, wherein the surface of the EL light emitting layer opposite to the transparent electrode and An EL device, characterized in that a fluorine resin layer, which is sufficiently thinner than the moisture-proof film, is formed by coating so as to cover the side surface.
湿層を設けたことを特徴とする請求項１記載のＥＬ素
子。2. The EL element according to claim 1, further comprising a hygroscopic layer made of a hygroscopic substance provided on the back electrode.
の上面および側面を覆うように高誘電体を混入したフッ
素系樹脂を塗布して形成され、上記絶縁層を兼ねること
を特徴とする請求項１記載のＥＬ素子。3. The fluororesin layer is formed by applying a fluororesin mixed with a high dielectric material so as to cover the upper surface and the side surface of the EL light emitting layer, and also serves as the insulating layer. The EL device according to claim 1.
塗布形成してあるとともにＥＬ発光層、絶縁層および背
面電極の側面に塗布形成してあることを特徴とする上記
請求項１記載のＥＬ素子。4. The fluororesin layer is formed by coating on the upper surface of the back electrode and is also formed by coating on the side surfaces of the EL light emitting layer, the insulating layer and the back electrode. EL element.
よび側面を覆うように高誘電体を混入したフッ素系樹脂
を塗布して形成してあることを特徴とする請求項４記載
のＥＬ素子。5. The EL according to claim 4, wherein the insulating layer is formed by coating a fluorine-based resin mixed with a high dielectric so as to cover the upper surface and the side surface of the EL light emitting layer. element.
湿層を設けたことを特徴とする請求項５記載のＥＬ素
子。6. The EL device according to claim 5, wherein a moisture absorption layer made of a hygroscopic substance is provided on the back electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5134548A JPH06349577A (en) | 1993-06-04 | 1993-06-04 | Electroluminescence element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5134548A JPH06349577A (en) | 1993-06-04 | 1993-06-04 | Electroluminescence element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06349577A true JPH06349577A (en) | 1994-12-22 |
Family
ID=15130896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5134548A Pending JPH06349577A (en) | 1993-06-04 | 1993-06-04 | Electroluminescence element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06349577A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000079840A1 (en) * | 1999-05-19 | 2000-12-28 | Fal Corporation | A thin luminescent plate and a method for preparing the same |
| KR20020067278A (en) * | 2001-02-16 | 2002-08-22 | 주식회사 밝은세상 | Electroluminescent device comprising a fluorinated polymer as a binder resin |
| JP2013197099A (en) * | 2012-03-16 | 2013-09-30 | Universal Display Corp | Electronic device with reduced non-device edge region |
| JP2019528201A (en) * | 2016-08-29 | 2019-10-10 | アルケマ フランス | Protecting electronic devices |
-
1993
- 1993-06-04 JP JP5134548A patent/JPH06349577A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000079840A1 (en) * | 1999-05-19 | 2000-12-28 | Fal Corporation | A thin luminescent plate and a method for preparing the same |
| KR20020067278A (en) * | 2001-02-16 | 2002-08-22 | 주식회사 밝은세상 | Electroluminescent device comprising a fluorinated polymer as a binder resin |
| JP2013197099A (en) * | 2012-03-16 | 2013-09-30 | Universal Display Corp | Electronic device with reduced non-device edge region |
| US10483487B2 (en) | 2012-03-16 | 2019-11-19 | The Trustees Of Princeton University | Electronic device with reduced non-device edge area |
| US10505137B2 (en) | 2012-03-16 | 2019-12-10 | Universal Display Corporation | Electronic device with reduced non-device edge area |
| US11018319B2 (en) | 2012-03-16 | 2021-05-25 | Universal Display Corporation | Electronic device with reduced non-device edge area |
| US11309522B2 (en) | 2012-03-16 | 2022-04-19 | Universal Display Corporation | Electronic device with reduced non-device edge area |
| US11871607B2 (en) | 2012-03-16 | 2024-01-09 | Universal Display Corporation | Electronic device with reduced non-device edge area |
| JP2019528201A (en) * | 2016-08-29 | 2019-10-10 | アルケマ フランス | Protecting electronic devices |
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