JPH06343199A - Piezoelectric speaker and manufacture therefor - Google Patents

Abstract

PURPOSE:To connect piezoelectric elements on both surfaces by a lead wire while a piezoelectric sounding body is attached to a frame, to use the conductive wire of an optical thickness as the lead wire and to surely hold the lead wire. CONSTITUTION:The peripheral part of the diaphragm 12 of the piezoelectric sounding body 11 for which the piezoelectric elements 13 are provided on both main surfaces is supported by a ring-like frame 16 and the lead wire 18 is connected to the piezoelectric elements 13 on the both main surface sides of the diaphragm 12 around the outer peripheral side of the frame 16. The lead wire 18 is held between the frame 16 and a ring-like pressure sensitive adhesive double coated tape 17 and also is stuck to the adhesive surface of the tape 17.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric speaker using a so-called bimorph type piezoelectric sounding body in which piezoelectric elements are provided on both sides of a diaphragm, and a method of manufacturing the same.

[0002]

2. Description of the Related Art As a piezoelectric speaker using this type of bimorph piezoelectric sounding body, for example, Japanese Utility Model Publication No. 4-13915.
The one shown in Japanese Patent Publication is known. The outline of this piezoelectric speaker will be described with reference to FIGS. 4 and 5. In this piezoelectric speaker, the piezoelectric speaker 1 in which the piezoelectric elements 3 and 3 are provided on both surfaces of the diaphragm 2 and the adhesives 5 and 6 on both surfaces are provided. And a ring-shaped frame 7 formed of a resin or the like.

In the piezoelectric speaker 1, both ends of the lead wire 8 are soldered to the piezoelectric elements 3 and 3 on both sides of the vibration plate 2. The lead wire 8 is attached by rotating the outer circumference of the vibration plate 2. Has been. The foam 4 is attached to the outer peripheral surface of the diaphragm 2, and the adhesive surface 5 on one side thereof is adhered to the outer peripheral surface of the diaphragm 2. In this state, the lead wire 8 is sandwiched between the foam 4 and the diaphragm 2, and the adhesive surface 5
Is glued to. Further, the other adhesive surface 6 of the foam body 4
Are adhered to the frame 7, whereby the outer peripheral portion of the diaphragm 2 is held by the frame 7 via the foam 4. Further, on the upper surface side of the vibration plate 1, lead wires 9 for applying a drive voltage to the piezoelectric sounding body 1 are connected to the vibration plate 1 and the piezoelectric element 3, respectively.

In this piezoelectric speaker, lead wires 8 of which both ends are soldered are attached to the piezoelectric elements 3 and 3 on both sides of the diaphragm 2 by rotating around the outer periphery of the diaphragm 2, which is the foam 4 and the diaphragm 2. Since the lead wire 8 is sandwiched between and is adhered to the adhesive surface 5, the lead wire 8 does not move and the lead wire is stably held.

[0009]

In the conventional piezoelectric speaker described above, before attaching the piezoelectric sounding body 7 to the frame 7, lead wires 8 are provided on the piezoelectric elements 3 and 3 on both sides of the diaphragm 2.
Must be soldered. However, the vibration plate 2 is extremely thin, and the piezoelectric elements 3 on both sides of the vibration plate 2,
When soldering the lead wire 8 to 3, it is necessary to invert the thin diaphragm 2. For this reason, the workability of soldering the lead wire 8 is poor, and a large external force is sometimes applied to the diaphragm 8, which may damage the diaphragm 8.

Further, since the lead wire 8 is passed between the diaphragm 2 that emits sound by vibration and the foam 4 that elastically supports it, when the thick lead wire 8 is used, the foam 4 And a diaphragm 2, a gap is generated, and the acoustic characteristics deteriorate. Therefore, it is necessary to use, as the lead wire 8, a thin lead wire 8 to the extent that no gap is created between the diaphragm 2 and the foam body 4. However, when such a thin lead wire 8 is used, troubles such as disconnection during soldering are likely to occur. In addition to the fact that the lead wire 8 must be soldered in a single state before the piezoelectric speaker 1 is attached to the frame 7 as described above, the workability of the connection work of the lead wire 8 is extremely deteriorated. ing.

Therefore, in the present invention, in order to solve the above-mentioned problems, it is possible to connect the piezoelectric elements on both sides of the piezoelectric sounding body with lead wires in a state where the piezoelectric sounding body is attached to the frame. An object of the present invention is to provide a piezoelectric speaker which can use a conductive material having a thickness and can surely hold a lead wire, and a manufacturing method thereof.

[0012]

That is, in order to achieve the above-mentioned object, the gist of the first means adopted in the present invention is as follows.
First, the piezoelectric sounding body 11 having the piezoelectric elements 13, 13 provided on both principal surfaces of the diaphragm 12, a ring-shaped frame 16 for supporting the peripheral portion of the diaphragm 12, and both main members of the diaphragm 12. Lead wire 1 for connecting the piezoelectric elements 13 on the surface side to each other
In a piezoelectric speaker having
A ring-shaped frame 1 that supports the periphery of the diaphragm 12.
The outer peripheral side of 6 is rotated and the piezoelectric elements 1 on both main surface sides of the diaphragm 12 are rotated.
3, 13 and the lead wire 18 is connected to the frame 1
6 and the ring-shaped double-sided adhesive tape 17 adhered thereto, and is attached to the adhesive surface of the double-sided adhesive tape 17.

Further, the gist of the second means adopted in the present invention is to prepare a piezoelectric sounding body 11 in which piezoelectric elements 13, 13 are provided on both main surfaces of a vibration plate 12, and the vibration plate 1 of the piezoelectric sounding body 11 is prepared.
2. A method for manufacturing a piezoelectric speaker, comprising the steps of attaching the peripheral portion of 2 to a ring-shaped frame 16 and connecting the piezoelectric elements 13 on both main surface sides of the diaphragm 12 to each other with lead wires 18. After attaching the peripheral portion of the vibrating plate 12 of the piezoelectric sounding body 11 to the frame 16, the lead wire 18 is turned around the outer peripheral side of the frame 16 and connected to the piezoelectric elements 13 on both main surface sides of the vibrating plate 12. Then, one side adhesive surface of the ring-shaped double-sided adhesive tape 17 is attached to the frame 16, the lead wire 18 is sandwiched between the frame 16 and the double-sided adhesive tape 17, and the lead wire 18 is attached to the double-sided adhesive tape. It is characterized in that it is attached to the adhesive surface of 17.

[0014]

In the piezoelectric speaker according to the present invention, the diaphragm 1
According to the present invention, the lead wires 18 connecting the piezoelectric elements 13 on both main surface sides of No. 2 are attached around the outer circumference of the ring-shaped frame 16 supporting the peripheral portion of the diaphragm 12. As in the method of manufacturing a piezoelectric speaker, the piezoelectric elements 13, 13 on both sides of the diaphragm 12 can be connected to each other with the peripheral portion of the diaphragm 12 of the piezoelectric speaker 11 attached to the ring-shaped frame 16. . That is, after attaching the peripheral portion of the diaphragm 12 of the piezoelectric speaker 11 to the ring-shaped frame 16, the lead wire 18 is turned to the outer peripheral side of the ring-shaped frame 16 that supports the outer periphery of the diaphragm 12, and both ends thereof are attached. The piezoelectric elements 1 on both main surface sides of the diaphragm 12.
3, 13 can be connected.

Further, the lead wire 18 is connected to the frame 16
Since it is sandwiched between the ring-shaped double-sided adhesive tape 17 and the adhesive surface of the double-sided adhesive tape 17, the lead wire 18 is securely held so as not to move. Moreover, even if a conductive wire having a certain thickness is used as the lead wire 18, the frame 16 and the diaphragm 12
Since there is no gap between the lead wire 18 and the lead wire 18, the lead wire 18 having an arbitrary thickness can be used without considering deterioration of acoustic characteristics.

[0016]

EXAMPLES Examples of the present invention will now be described in detail with reference to FIGS. As shown in these figures, the piezoelectric sounding body 11 is one in which piezoelectric elements 13 are provided on both surfaces of a diaphragm 12. As shown in FIGS. 1 and 2, a ring-shaped double-sided adhesive sheet 14 made of urethane foam or the like and having both surfaces coated with an adhesive is prepared.
A ring-shaped protective sheet 15 made of a polyethylene terephthalate sheet or the like is attached to one main surface of the double-sided adhesive sheet 14, that is, the entire upper surface in FIG. In addition, the other main surface of the double-sided adhesive sheet 14, that is, FIG.
In, the outer peripheral side of the lower surface is attached to the upper surface of the ring-shaped frame 16 formed of resin or the like. In the illustrated frame 16, the inner peripheral portion is one step lower than the outer peripheral portion, and the outer peripheral portion of the double-sided adhesive tape 14 is one step lower than the outer peripheral portion of the frame 16 in the double-sided adhesive tape 1.
It is fixed and supported via 6.

On the inner peripheral side of the lower surface of the double-sided pressure-sensitive adhesive sheet 14, the outer peripheral portion of the piezoelectric sounding body 13 on one main surface of the vibration plate 12 is attached. Thereby, the diaphragm 1
The outer peripheral portion of 2 is fixed to and supported by the frame 16 via the double-sided adhesive sheet 14.

As shown in FIGS. 1 to 3, the piezoelectric elements 13, 13 on both sides of the vibration plate 12 of the piezoelectric sounding body 11 are connected to each other via a lead wire 18. That is, the lead wire 18 is attached by rotating around the outer periphery of the frame 16 holding the outer peripheral portion of the vibration plate 2, and both ends of the lead wire 18 are soldered to the piezoelectric elements 13 on both surfaces of the vibration plate 12 by solders 21 and 2.
It is electrically conductively fixed at 1.

On the lower surface side of the vibrating plate 12 of the piezoelectric sounding body 11, one end of each lead wire 19, 19 is soldered to the piezoelectric element 13 and the outer portion of the piezoelectric element 13 of the vibrating plate 12, respectively.
It is electrically conductively fixed at 20. This lead wire 19, 19
Is for applying a drive voltage to the piezoelectric sounding body 12, and is passed through the lower surface side of the frame 16 in FIG.
Is pulled out of.

Further, one side of a slightly thick ring-shaped double-sided adhesive tape 17 made of urethane foam or the like is adhered to the lower surface side of the frame 16 in FIG. The double-sided adhesive tape 17 is for attaching the frame 16 to a housing or an earphone portion of an audio device, and a release sheet 22 is attached to the other adhesive surface. That is, the release sheet 22 is peeled off from the adhesive surface, and the adhesive surface is attached to the inner surface of the housing of the acoustic device or the earphone section, whereby the piezoelectric speaker is attached.

Piezoelectric elements 1 on both sides of the piezoelectric speaker 11.
The lead wire 18 for connecting 3 and 13 and the drive lead wires 19 and 19 for applying a drive voltage are sandwiched between the double-sided adhesive tape 17 and the frame 16, and the double-sided adhesive tape 17 has It is adhered and held on one adhesive surface.

Next, a method of manufacturing this piezoelectric speaker, that is, an assembling method will be described. First, a ring-shaped double-sided adhesive sheet 14 made of urethane foam or the like and coated on both sides with an adhesive is prepared.
A ring-shaped protective sheet 15 made of a polyethylene terephthalate sheet or the like is previously attached to the entire main surface on one side of the above. Then, the outer peripheral side portion of the other main surface of the double-sided adhesive sheet 14 can be attached to the upper surface of the ring-shaped frame 16. In the illustrated embodiment, the outer peripheral portion of the double-sided adhesive sheet 14 is attached to the inner peripheral portion of the frame 16 which is one step lower than the outer peripheral portion.

Next, the vibrating plate 1 is provided on the inner peripheral side of the portion of the double-sided adhesive sheet 14 to which the frame 16 is attached.
The portion on the outer peripheral side of the piezoelectric sounding body 13 on one main surface of 2 is attached. As a result, the vibrating plate 12 has its peripheral portion fixed to the frame 16 via the double-sided adhesive sheet 14 and supported. Next, as shown in FIGS.
The lead wire 18 is rotated around the outer circumference of the frame 16, and both ends of the lead wire 18 are soldered to the piezoelectric elements 13 and 13 on both sides of the vibration plate 12, 21 and 2.
Conductive fixation at 1. Also, the diaphragm 12 of the piezoelectric speaker 11
On the lower surface side of the piezoelectric element 13 and the vibrating plate 1 on the outer side thereof.
One ends of lead wires 19 and 19 are electrically conductively fixed to the outer portion of 2 with solders 20 and 20, respectively, and the lead wires 19 and 19 are pulled out through the lower surface side of the frame 16 in FIG.

Further, one side of the double-sided adhesive tape 17 is bonded to the lower surface side of the frame 16 in FIG. At this time, the lead wire 18 and the lead wire 1
9 and 19 are sandwiched between the double-sided adhesive tape 17 and the frame 16, and are bonded and held on one surface of the double-sided adhesive tape 17. This completes the piezoelectric speaker described above.

[0025]

As described above, in the piezoelectric speaker of the present invention, as in the method of manufacturing the piezoelectric speaker of the present invention, the piezoelectric sounding body 11 is attached to the frame 16, and the piezoelectric elements 13 and 13 on both surfaces thereof are provided. It is possible to connect the lead wire 18 to. Moreover, it is not necessary to use a particularly thin conductive wire as the lead wire 18, and the lead wire 18 having an arbitrary thickness can be used.
Therefore, it is possible to easily and reliably assemble the piezoelectric speaker, particularly to connect the piezoelectric elements 13 on both sides of the piezoelectric sounding body 11, and to obtain high productivity. After the assembly, the lead wire can be securely held, so that a highly reliable piezoelectric speaker can be obtained.

[Brief description of drawings]

FIG. 1 is a vertical sectional side view of a piezoelectric speaker according to an embodiment of the present invention.

FIG. 2 is a plan view of the piezoelectric speaker according to the embodiment.

FIG. 3 is a bottom view of the piezoelectric speaker according to the embodiment.

FIG. 4 is a vertical sectional side view of a piezoelectric speaker according to a conventional example.

FIG. 5 is a plan view of a piezoelectric speaker according to the conventional example.

[Explanation of symbols]

 12 Vibration plate 13 Piezoelectric element 11 Piezoelectric sounding body 16 Frame 18 Lead wire 17 Double-sided adhesive tape

Claims (2)

[Reference number] 0050245-01 [Claims] 1. A piezoelectric element (1) is provided on both main surfaces of a diaphragm (12).
3) and (13) are provided on the piezoelectric sounding body (11), a ring-shaped frame (16) that supports the peripheral portion of the diaphragm (12), and both main surface sides of the diaphragm (12). Lead wire (18) for connecting the piezoelectric elements (13), (13) to each other
A piezoelectric speaker having:
8) is connected to the piezoelectric elements (13), (13) on both main surface sides of the vibrating plate (12) by rotating the outer peripheral side of the ring-shaped frame (16) supporting the peripheral part of the vibrating plate (12). The lead wire (18) was sandwiched between the frame (16) and the ring-shaped double-sided adhesive tape (17) adhered to the frame (16), and was attached to the adhesive surface of the double-sided adhesive tape (17). A piezoelectric speaker characterized in that 2. A piezoelectric element (1) is provided on both main surfaces of a diaphragm (12).
3), prepare a piezoelectric sounding body (11) provided with (13),
The step of attaching the peripheral portion of the vibration plate (12) of the piezoelectric sounding body (11) to the ring-shaped frame (16), and the piezoelectric elements (13), (13) on both main surface sides of the vibration plate (12). And a lead wire (18) for connecting the piezoelectric speaker to each other.
After attaching the peripheral part of the diaphragm (12) of the piezoelectric sounding body (11) to (6), the lead wire (18) is attached to the frame (1).
The outer peripheral side of 6) is rotated and connected to the piezoelectric elements (13) and (13) on both main surface sides of the diaphragm (12), and the frame (1
One side of the ring-shaped double-sided adhesive tape (17) is attached to 6), the lead wire (18) is sandwiched between the frame (16) and the double-sided adhesive tape (17), and the lead wire is the same. A method for manufacturing a piezoelectric speaker, characterized in that (18) is attached to an adhesive surface of a double-sided adhesive tape (17).