JPH06335731A - Bead forming die of metallic gasket - Google Patents

Abstract

PURPOSE:To eliminate the waste in the material and simplify the processing and assembly of a die without providing a base plate holding the side surfaces of a male die base plate in a bead forming die to form the full bead on the metallic gasket. CONSTITUTION:A male base plate 3 having the width L1 and the thickness t corresponding to the width L and the height H of the full bead 2 is fixed to the lower surface of an upper die holder 5 to the full bead forming line according to the formed shape and the formed line of the full base 2 of the semi-circular section to be formed on a metallic gasket 1. The height H of the full bead 2 is pressingly formed by the die constitution where the clearance 4a having the width L2 corrsponding to the width L of the full bead 2 between female base plates 4, 4' having the thickness t2 larger than the height H of the full bead 2 is provided and the female base plates 4, 4' are fixed to the upper surface of a lower die holder 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bead molding die for a metal gasket, in which a molding die for molding a full bead having a semicircular cross section on a metal gasket is constituted by a simple die structure.

[0002]

2. Description of the Related Art FIG. 4 shows a conventional bead molding die. This molding die, as shown in the figure, is a metal gasket 1
On the other hand, the full bead 2 having a semicircular cross section is press-molded.

On the lower surface of the upper die holder 15, the upper die substrate 1
7, 17 ′ are fixed from the upper die holder 15 side by bolts 19, respectively, and between the upper die boards 17 and 17 ′, the male die board 13 is formed along the molding line of the full bead 2 to be formed on the metal gasket 1. Are clamped in a protruding state.

Further, on the upper surface of the lower die holder 16, the lower die substrates 14 and 14 'are attached from the lower die holder 16 side with bolts 19
And a gap 14a is provided between the lower mold substrates 14 and 14 'along the molding line of the full bead 2.

The positioning pin 18 is used for positioning when the metal gasket 1 is sandwiched between the upper and lower molds and press-molded. The positioning pin 18 is embedded in the pin hole 18b of the lower mold substrate 14 and protrudes upward. Front metal gasket 1
It is inserted into the pin hole 18a of the upper mold substrate 17 while being pressed while being inserted into the through hole 1a.

Further, the positioning pin 12 is embedded in the pin hole 22b of the lower die substrate 14 and protrudes upward, and this protruding portion can be inserted into the pin hole 22a of the upper die substrate 17, and the position when the upper and lower dies are closed. As a match.

[0007]

By the way, in order to manufacture the above-mentioned conventional bead molding die, the upper die substrates 17 and 1 are used.
Since the male substrate 13 is fixed to a predetermined position by sandwiching the male substrate 13 with 7'and the molding line of the full bead is set, the molding precision of the upper substrate 17 and 17 'is important. .

Further, the upper mold substrates 17 and 17 'and the lower mold substrate 1
Since 4, 14 'are fixed by bolts 19 from the upper and lower die holders 5, 6 side, in order to firmly fasten the bolts, screws 14 are attached to the substrate 14, 14', 17, 17 'side. Therefore, it is difficult to form the substrates 14, 14 ′, 17, 17 ′, and the work of fixing with the bolts 19 also requires position accuracy and is troublesome.

The present invention has been made in view of the above circumstances, and is a bead forming mold which is capable of forming a high-precision full bead by eliminating waste of material, simplifying the working and assembling of the mold. The purpose is to provide.

[0010]

In order to solve the above-mentioned problems, a bead molding die for a metal gasket according to the present invention has a shape corresponding to a molding shape and a molding line of a full bead 2 having a semicircular cross section to be molded into a metal gasket 1. Then, a male substrate 3 having a width L1 and a thickness t corresponding to the width L and the height H of the full bead 2 is fixed to the lower surface of the upper die holder 5 in line with the full bead molding line, and the height of the full bead 2 is increased. A gap 4a having a width L2 corresponding to the width L of the full bead 2 is formed between the female die substrates 4 and 4'having a thickness t2 larger than H at a position opposite to the male die substrate 3 to form the female die. It is characterized in that the height H of the full bead 2 is press-molded by a die structure in which the substrates 4 and 4'are fixed to the upper surface of the lower die holder 6.

Further, the thickness of the male substrate 3 is set to t'thicker than the thickness t corresponding to the height H of the full bead 2 and fixed to the upper die holder 5, and the male substrate 3 is fixed. Auxiliary plates 7 and 7'having a width L3 wider than the width L1 of the male substrate 3 and smaller than the width L2 of the gap 4a between the female substrates 4 and 4'on both sides of the upper die holder. The height H of the full bead 2 is press-molded by fixing the protrusion height h of the male substrate 3 by fixing the thickness to the auxiliary plate 7 and 7'and selecting the thickness t3 of the auxiliary plates 7 and 7 '. It may be configured.

Further, the male substrate 3 may be fixed in advance to the thin intermediate plate 10 by spot welding or solder welding, and then the intermediate plate 10 may be fixed to the upper die holder 5. .

[0013]

The above-mentioned structure is such that the male die substrate 3 on which the full bead 2 is to be pressed and formed on the metal gasket 1 is fixed to the upper die holder 5. That is, when the male substrate 3 is fixed, the substrate (the upper substrates 17 and 17 'in FIG. 4) for sandwiching the side surface of the male substrate 3 is not provided unlike the conventional case, and the male substrate 3 is fixed to the upper die holder 5. Fixed directly to.

The male substrate 3 itself has a height H of the full bead 2.
Since it is for molding, the female substrates 4, 4 ′ facing it may also be thin, and the upper and lower die holders are each made by a simple fixing means such as an adhesive or a double-sided tape. It becomes possible to fix directly to 5 and 6.

In addition to the above, the fixing means may be spot welding, hot pressure bonding, or bolt fastening.

However, when the male substrate 3 is fixed by spot welding, solder welding, or the like, an intermediate plate having a thickness substantially the same as the thickness of the male substrate 3 is provided in order to ensure a good joining condition between them. 10 is prepared, and the male substrate 3 is fixed in advance to the intermediate plate 10 by spot welding or solder welding, and then the intermediate plate 10 is fixed to the upper mold holder 5.

At this time, the male substrate 3 is not directly fixed to the upper mold holder 5, but in this case, the intermediate plate 10 fixed to the upper mold holder 5 should be substantially adhered to the male substrate 3. It will be regarded as the mold holder 5. This is because, in this case as well, the male substrate 3 is not sandwiched between the substrates as in the conventional case, but the bottom surface of the male substrate 3 is directly fixed to the intermediate plate 10 corresponding to the upper die holder 5. Is.

Further, the thickness of the male substrate 3 is fixed to the upper die holder 5 as t'thicker than the thickness t corresponding to the height H of the full bead 2 and is fixed to the periphery of the male substrate 3. By selecting the thickness t3 of the plates 7, 7 ', the male substrate 3
The protrusion height h of the bead is the thickness t corresponding to the height H of the full bead 2.
Can be

This is because when there is no thickness t corresponding to the height H of the full bead 2 when the original plate of the male substrate 3 is prepared, the male substrate 3 having a thicker plate thickness t'is prepared. Further, the auxiliary plates 7 and 7 ′ are used auxiliary to provide the thickness t corresponding to the height H of the full bead 2.

[0020]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an exploded perspective view of a bead molding die according to the present invention.

2 (a) to 2 (c) are partial longitudinal sectional views taken along the line AA of FIG. 1, and FIG. 2 (a) shows the male substrate directly fixed to the upper die holder. FIG. 2B is a partial cross-sectional view showing the periphery of the male substrate in FIG. 2B, in which an interposing plate is inserted between the male substrate and the upper holder. The situation where the board is joined to the upper die holder by spot welding or solder welding is shown.

FIGS. 3 (a) and 3 (b) show another embodiment of the present invention, which corresponds to a longitudinal section taken along the line AA of FIG. 1 and in which an auxiliary plate is provided around the male type substrate. Is a partial cross-sectional view showing
Figure 3 (a) shows that the male substrate is directly fixed to the upper die holder.
In (b), an interposing plate is inserted between the male die substrate and the upper die holder.

In FIG. 1, on the lower surface of the upper die holder 5, a male die substrate 3 formed so as to press-mold a full bead 2 having a semicircular cross section on a metal gasket 1 is fixed. Further, on the upper surface of the lower die holder 6, female substrates 4, 4 ′ are fixed in a state where a gap 4 a is formed along the molding line of the male substrate 3.

That is, in FIG. 2A, the upper die holder 5
A male substrate 3 having a thickness t is formed on the lower surface of the metal gasket 1 in accordance with the width L of the full bead 2 to be formed on the metal gasket 1, the width L1 corresponding to the height H, and the thickness t in accordance with the forming line of the full bead 2. Stick to it.

At this time, the thickness t of the male substrate 3 is set to the height H of the full bead 2 to be molded on the metal gasket 1 plus the amount of bounce back during pressure molding.

The molding line of the full bead 2 refers to a line formed by the largest projecting portion at the center when the cross section of the full bead 2 to be molded is symmetrical, and the cross section of the full bead 2 to be molded is asymmetrical. , The line formed by the largest protrusion.

As the material of the male type substrate 3, female type substrates 4 and
Similarly to 4 ', a hard thin plate such as SUS301 is used.

To fix the male die substrate 3 to the upper die holder 5, an adhesive, a double-sided tape, or the like may be used, or spot welding, solder welding, hot pressure bonding, or bolt fastening may be used. .

In the lower mold, the female mold substrates 4 and 4'having a plate thickness t2 which is larger than the height H of the full bead 2 are provided in the gap 4a.
And the gap 4a is set to a width L2 corresponding to the width L of the full bead 2 and the female substrates 4 and 4'are attached to the upper surface of the lower die holder 6 using the same fixing method as that of the male substrate 3. It's stuck.

Further, the positioning pins 8, 8 ', 12 are embedded in the pin holes 8b, 8'b, 12b formed in the lower holder 6 and project upward, so that the positioning pins 8, 8', 12 are located at the opposite positions of the upper die holder 5, respectively. Have mating holes 8a, 8'a, 12a.

When the female substrate 4 is fixed to the lower holder 6, the through holes 8c, 8'c, formed in the female substrates 4, 4'corresponding to the positioning pins 8, 8 ', 12 are formed. The positioning pins 8, 8 ', 12 are inserted into 12c and fixed.

These positioning pins 8, 8 ', 12 are
When closing the mold, the matching holes 8a of the upper mold holder 5 facing each other,
8'a and 12a are inserted to perform positioning during molding.

The positioning pin 8 penetrates the bolt hole 1a formed in the metal gasket 1 to position the metal gasket 1 during molding.

FIG. 2B shows a case where the male substrate 3 is fixed to the upper die holder 5 by spot welding or solder welding.

An interposing plate 10 having a thickness substantially the same as the thickness of the male substrate 3 is prepared, and as shown in FIG. 2 (c), the male substrate 3 is spot-welded 11 or soldered to the interposing plate 10. The intermediate plate 10 is fixed to the upper die holder 5 after being fixed by welding.

In FIG. 2 (b), in order to insert the positioning pins 8, 8'and 12, through holes are formed in the interposition plate 10 at positions corresponding to the alignment holes 8a, 8'a and 12a. 8d, 8'd and 12d are provided.

The interposing plate 10 with respect to the upper die holder 5 is also provided.
The positioning pin 9 is used as a positioning for fixing the pin, the pin hole 9a is bored in the upper die holder 5 to embed the positioning pin 9, and the interposition plate at a position corresponding to the position of the pin hole 9a is bored. 10 is provided with a through hole 9d, and the female substrate 4 facing this is provided with a through hole 9c.
A matching hole 9b is formed at the same position.

Further, in FIG. 3 (a), the thickness of the male substrate 3 is fixed to the upper die holder 5 as t'which is thicker than the thickness t corresponding to the height H of the full bead 2, and the male substrate 3 is fixed. By selecting the thickness t3 of the auxiliary plates 7 and 7 ′ that are fixed to the periphery of 3, the protrusion height h of the male substrate 3 can be set to the thickness t corresponding to the height H of the full bead 2.

As a result, by applying the auxiliary plates 7, 7'to the male substrate 3 having an arbitrary plate thickness t'which is thicker than the thickness t, the male plates protruding from the lower surface of the auxiliary plates 7, 7 '. The protruding height h of the substrate 3 is adjusted to the thickness t according to the height H of the full bead 2. At this time, the lower surfaces of the auxiliary plates 7 and 7 ′ act as molding surfaces for the flat plate portion of the metal gasket 1.

Further, as shown in FIG. 3 (b), a mold in which an interposing plate 10 for spot welding or solder welding and auxiliary plates 7 and 7'for adjusting the plate thickness of the male type substrate 3 are used together. It can also be configured.

That is, the male substrate 3 having a thickness t'thicker than the thickness t corresponding to the height H of the full bead 2 is spot-welded or solder-welded to the interposing plate 10, and the interposing plate 10 is used. After being fixed to the upper mold holder 5, as shown in FIG. 3 (a), the auxiliary plates 7 and 7'are fixed to the intermediate plate 10 to adjust the protruding height h of the male substrate 3.

When the hot pressure-bonding agent is used to fix the male substrate 3, the female substrates 4, 4 ', the auxiliary plates 7, 7'and the interposing plate 10 as described above, the re-hot conditions are used. Therefore, it is possible to perform maintenance such as removing the once fixed and replacing it.

Further, it is possible to fix these members by bolt fastening. In this case, in order to secure the screw fastening force, the male type substrate 3, female type substrates 4, 4 ', auxiliary plate 7,
Bolts are erected from the side of 7'or the interposing plate 10 toward the upper and lower die holders 5 and 6, and the bolt heads are embedded in the plate material to ensure the smoothness of the molding surface.

[0045]

As described above, according to the bead molding die of the present invention, when the male substrate 3 is fixed, the male substrate 3 is laterally pinched and held as in the prior art. There is no need to provide an upper mold substrate, and a male mold substrate 3 is provided for the upper mold holder
Can be fixed directly.

Therefore, the upper mold substrate conventionally used as the receiving surface for full bead molding is unnecessary in the present invention,
The lower surface of the upper die holder 5 acts as a molding surface of the flat portion of the metal gasket 1.

The height of the full bead 2 is H
Since the thickness t is equivalent to, the thickness is very thin, and the female substrates 4 and 4 ′ are also thin because the gap 4 a has a depth enough to accommodate the height H of the full bead 2. For both the male type substrate 3 and the female type substrates 4 and 4 ′, the fixing to the upper and lower die holders 5 and 6 may be performed with an adhesive or a double-sided tape,
It can be performed by other simple means such as spot welding, solder welding, hot pressure bonding, and bolt joining.

The metal plates used for the male substrate 3, the female substrates 4 and 4 ', the auxiliary plates 7 and 7', and the interposing plate 10 may be thin and can be easily cut by laser cutting or wire cutting. It can be performed and a predetermined shape can be easily obtained.

Further, when a metal gasket is manufactured as a trial in order to select a metal gasket suitable for the engine, the thickness of the female substrates 4, 4 '(the gap 4a is large enough to accommodate the deformed height of the full bead). Depth), the height H of the full bead can be variously and easily changed only by changing the height of the male substrate 3.

Further, when mass-producing the metal gasket, since the corners of the substrate are sagged due to the proof stress of the mold, conventionally it was necessary to grind the substrate for molding at regular intervals, but according to the present invention. By exchanging only the thin male substrate 3 and the female substrates 4 and 4 ', the mold can be easily maintained.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a bead molding die according to the present invention.

2 (a) to 2 (c) are partial vertical cross-sectional views taken along the line AA of FIG. 1, and FIG. 2 (a) shows a male substrate directly fixed to an upper die holder. (b) is an interposing plate interposed between the male substrate and the upper holder, and FIG. 2 (c) is a partial sectional view showing the periphery of the male substrate in FIG. 2 (b). The situation in which the mold substrate is joined to the upper mold holder by spot welding, solder welding, or the like is shown.

3 (a) and 3 (b) show another embodiment of the present invention, which corresponds to a vertical section taken along the line AA of FIG. 1, and an auxiliary plate is provided around the male substrate. FIG. 3 is a partial cross-sectional view showing the situation.
In (a), the male substrate is directly fixed to the upper die holder, and
Is an interposing plate between the male die substrate and the upper die holder.

FIG. 4 is a partial cross-sectional view of a conventional bead molding die.

[Explanation of sign]

1 ... Metal gasket, 2 ... Full bead, 3 ... Male substrate,
4, 4 '... Female substrate, 4a ... Gap between female substrates, 5 ... Upper die holder, 6 ... Lower die holder, 7, 7' ... Auxiliary plate, 1
0 ... Interposing plate, 8, 8 ', 9, 12 ... Positioning pin, h ...
Projection height of male substrate, t, t '... Male substrate thickness, t2
... thickness of female substrate, t3 ... thickness of auxiliary plate, H ... height of full bead, L ... width of full bead, L1 ... width of male substrate,
L2 ... gap width between female substrates, L3 ... gap width between auxiliary plates.

Claims (3)

[Claims] 1. A male having a width L1 and a thickness t corresponding to a width L and a height H of the full bead 2 according to a molding shape and a molding line of a full bead 2 having a semicircular cross section to be molded into a metal gasket 1. The mold substrate 3 is fixed to the lower surface of the upper mold holder 5 in line with the full bead molding line, and the female mold substrate 4 having a thickness t2 larger than the height H of the full bead 2.
A gap 4a having a width L2 corresponding to the width L of the full bead 2 is formed between 4'at a position facing the male substrate 3, and the female substrates 4 and 4'are fixed to the upper surface of the lower die holder 6. The metal mold bead molding die is characterized in that the height H of the full bead 2 is press-molded by the above-described mold configuration. 2. The thickness of the male substrate 3 is set to the full bead 2
Is set to be thicker than the thickness t corresponding to the height H of the male substrate 3 and fixed to the upper die holder 5 on both sides of the male substrate 3 and wider than the width L1 of the male substrate 3. Auxiliary plates 7, 7'having a width L3 smaller than the width L2 of the gap 4a between the female mold substrates 4, 4'are fixed to the upper mold holder 5, and the thickness t3 of the auxiliary plates 7, 7'is fixed. By selecting the protrusion height h of the male substrate 3, the full bead 2 can be changed.
A bead forming die for a metal gasket, characterized in that the height H of the metal gasket is pressed. 3. The male plate 3 is pre-fixed to a thin intermediate plate 10 by spot welding or solder welding, and then the intermediate plate 10 is fixed to the upper die holder 5. Mold for bead molding of metal gasket.