JPH06331328A - Height measuring device and method - Google Patents
Height measuring device and methodInfo
- Publication number
- JPH06331328A JPH06331328A JP12364293A JP12364293A JPH06331328A JP H06331328 A JPH06331328 A JP H06331328A JP 12364293 A JP12364293 A JP 12364293A JP 12364293 A JP12364293 A JP 12364293A JP H06331328 A JPH06331328 A JP H06331328A
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- JP
- Japan
- Prior art keywords
- light
- height
- measured
- measuring
- intensity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Length Measuring Devices By Optical Means (AREA)
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Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はLSIの製造においてチ
ップ上に形成された電極の表面形状を光学的に検査する
装置に係り、特に計測点における反射率の差によって測
定値に誤差が介入しないよう構成された高さ測定装置に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for optically inspecting the surface shape of an electrode formed on a chip in the manufacture of an LSI, and in particular, an error does not intervene in a measured value due to a difference in reflectance at a measuring point. A height measuring device configured as described above.
【0002】近年、印刷配線基板上にLSIを高密度に
実装する方法の一つとして電極上に微細なはんだ球が付
着してなるLSIを、印刷配線基板上に形成された導体
パターンに接合するフリップチップボンディングと称す
る実装法が用いられている。In recent years, as one of the methods for mounting LSIs on a printed wiring board at a high density, an LSI in which fine solder balls are attached on electrodes is joined to a conductor pattern formed on the printed wiring board. A mounting method called flip chip bonding is used.
【0003】かかる方法でLSIを印刷配線基板に確実
に接合するには電極上のはんだ球の形状や量を厳重に管
理する必要がある。そこで、電極に付着したはんだ球の
形状や量を正確に且つ速やかに検査できる高さ測定装置
の実現が要望されている。In order to reliably bond the LSI to the printed wiring board by such a method, it is necessary to strictly control the shape and amount of the solder balls on the electrodes. Therefore, it is desired to realize a height measuring device capable of accurately and quickly inspecting the shape and amount of the solder balls attached to the electrodes.
【0004】[0004]
【従来の技術】図6はLSIの電極形成面の一部を示す
斜視図、図7は従来の高さ測定装置の構成を示す斜視
図、図8は位置検出素子の動作原理を示す斜視図であ
る。2. Description of the Related Art FIG. 6 is a perspective view showing a part of an electrode forming surface of an LSI, FIG. 7 is a perspective view showing a configuration of a conventional height measuring device, and FIG. 8 is a perspective view showing an operating principle of a position detecting element. Is.
【0005】検査の対象となるLSI(以下被測定物体
と称する)1は図6に示す如く電極形成面に複数の電極
11が形成されており、ほぼ等しい粒径を有する複数のは
んだ球12を印刷配線基板への実装に先立ってそれぞれの
電極11に付着させている。An LSI (hereinafter referred to as an object to be measured) 1 to be inspected has a plurality of electrodes on an electrode forming surface as shown in FIG.
11 are formed, and a plurality of solder balls 12 having substantially the same grain size are adhered to the respective electrodes 11 prior to mounting on the printed wiring board.
【0006】かかる被測定物体1をフリップチップボン
ディング法によって図示省略された印刷配線基板に確実
に接合させるには、同一被測定物体1に形成されたそれ
ぞれの電極11に付着させてなるはんだ球12の量と粒径を
ほぼ等しくする必要がある。In order to surely bond the measured object 1 to a printed wiring board (not shown) by the flip chip bonding method, the solder balls 12 attached to the respective electrodes 11 formed on the same measured object 1 are used. And the particle size should be approximately equal.
【0007】そこでLSIの製造工程ではチップ上の電
極11にはんだ球12を付着させた被測定物体1を図7に示
す装置に載置し、表面における凹凸の高さを光学的に測
定することによって電極11に付着させたはんだ球12の粒
径や欠落を検査している。In the LSI manufacturing process, therefore, the object to be measured 1 having the solder balls 12 attached to the electrodes 11 on the chip is placed on the apparatus shown in FIG. 7 and the height of the unevenness on the surface is optically measured. The solder spheres 12 adhered to the electrodes 11 are inspected for grain size or lack thereof.
【0008】従来の高さ測定装置は図7に示す如くレー
ザ光を出力する計測光源2と光走査機構3と高さ計測機
構4とで構成され、計測光源2はレーザ光源21とレーザ
光を尖鋭化するビームエキスパンダ22と所定の方向に曲
げるミラー23を具えている。As shown in FIG. 7, the conventional height measuring device comprises a measuring light source 2 for outputting a laser beam, an optical scanning mechanism 3 and a height measuring mechanism 4, and the measuring light source 2 emits a laser light source 21 and a laser beam. It has a sharpening beam expander 22 and a mirror 23 that bends in a predetermined direction.
【0009】また、入射したレーザ光を所定範囲内で走
査する光走査機構3は回転多面鏡31とスキャンレンズ32
とミラー33を有し、計測光源2から光走査機構3に入射
したレーザ光は回転多面鏡31の回転に伴って被測定物体
1の走査線13上を走査する。The optical scanning mechanism 3 for scanning the incident laser light within a predetermined range is a rotary polygon mirror 31 and a scan lens 32.
The laser light incident on the optical scanning mechanism 3 from the measurement light source 2 scans the scanning line 13 of the measured object 1 as the rotary polygon mirror 31 rotates.
【0010】一方、高さ計測機構4はPSD(position
sensitive diode)と称する位置検出素子41と結像レンズ
42とで構成されており、被測定物体1の表面において正
反射されたレーザ光は結像レンズ42を経由して位置検出
素子41の入射面に結像する。On the other hand, the height measuring mechanism 4 uses PSD (position
Position detection element 41 called "sensitive diode" and imaging lens
The laser light specularly reflected on the surface of the object to be measured 1 is imaged on the incident surface of the position detecting element 41 via the imaging lens 42.
【0011】凹凸の高さを計測する位置検出素子41は図
8に示す如くn形Si基板43の片面に4角形の浅いp形拡
散層44が形成され、4角形のp形拡散層44の上には端部
が互いに接触しないように構成された4本の電極45が各
辺に沿って形成されている。As shown in FIG. 8, a position detecting element 41 for measuring the height of unevenness has a shallow rectangular p-type diffusion layer 44 formed on one surface of an n-type Si substrate 43, and a rectangular p-type diffusion layer 44. On the upper side, four electrodes 45 are formed along each side so that their ends do not contact each other.
【0012】光量が増加してもpn接合が順方向にバイア
スされないよう底面の電極46を介してpn接合に大きい逆
バイアスを印加し、入射面の矢印で示す光点位置に細い
レーザ光を入射すると光点位置に光電流が生じ4辺の電
極45にそれぞれ分流される。A large reverse bias is applied to the pn junction through the electrode 46 on the bottom so that the pn junction is not biased in the forward direction even if the amount of light increases, and a thin laser beam is incident on the light spot position indicated by the arrow on the incident surface. Then, a photocurrent is generated at the light spot position, and the photocurrent is shunted to the electrodes 45 on the four sides.
【0013】分流された光電流Ix1、Ix2、Iy1、Iy2
の大きさは光点位置から各電極45までの拡散層のシート
抵抗に依存し、それぞれの電流の比Ix1/Ix2、Iy1/
Iy2からレーザ光が入射した光点位置の座標x、yを算
出することが可能である。Divided photocurrents I x1 , I x2 , I y1 , I y2
Is dependent on the sheet resistance of the diffusion layer from the light spot position to each electrode 45, and the ratio of the respective currents I x1 / I x2 , I y1 /
It is possible to calculate the coordinates x and y of the position of the light spot where the laser light is incident from I y2 .
【0014】被測定物体1の表面において正反射された
レーザ光の位置検出素子41への入射位置は表面の凹凸の
高さに応じて変わり、その時の光点位置の座標x、yを
算出することで被測定物体1の表面における凹凸の高さ
を測定することができる。The incident position of the laser beam specularly reflected on the surface of the object to be measured 1 on the position detecting element 41 changes depending on the height of the irregularities on the surface, and the coordinates x, y of the light point position at that time are calculated. Thus, the height of the unevenness on the surface of the measured object 1 can be measured.
【0015】[0015]
【発明が解決しようとする課題】被測定物体のレーザ光
を反射する面が同等の反射率を有する平面であれば位置
検出素子で凹凸の高さを測定できるが、はんだ球により
反射される光は同じ高さであっても反射面の傾きにより
位置検出素子に入射する光量が大きく変動する。If the surface of the object to be measured that reflects the laser light is a flat surface having the same reflectivity, the height of the unevenness can be measured by the position detecting element, but the light reflected by the solder ball can be used. Even if they have the same height, the amount of light incident on the position detection element fluctuates greatly due to the inclination of the reflecting surface.
【0016】しかるに、市販されている位置検出素子は
電流比から光点の位置を正確に検知できる光量の許容範
囲は極めて狭く、レーザ光の強度や位置検出素子の感度
を調整しても入射する光量を許容範囲に納めることがで
きないという問題があった。However, the commercially available position detecting element has an extremely narrow allowable range of the amount of light capable of accurately detecting the position of the light spot from the current ratio, and is incident even if the intensity of the laser beam or the sensitivity of the position detecting element is adjusted. There was a problem that the amount of light could not be set within the allowable range.
【0017】本発明の目的は電極に付着したはんだ球の
形状や量を正確に且つ速やかに検査できる高さ測定装置
を提供することにある。An object of the present invention is to provide a height measuring device capable of accurately and quickly inspecting the shape and amount of solder balls attached to electrodes.
【0018】[0018]
【課題を解決するための手段】図1は本発明になる高さ
測定装置の原理を示す斜視図である。なお全図を通し同
じ対象物は同一記号で表している。FIG. 1 is a perspective view showing the principle of a height measuring device according to the present invention. Note that the same object is denoted by the same symbol throughout the drawings.
【0019】上記課題は凹凸を有する被計測物体の表面
をレーザ光で走査し被計測物体による正反射光を位置検
出素子に入射せしめ、正反射光の入射位置を示す位置検
出素子の出力信号によって被計測物体の凹凸の高さを計
測する測定装置において、表面の反射率を検出する反射
率検出光51および凹凸の高さを測定する高さ測定光52を
出力するレーザ光源5と、反射率検出光51と高さ測定光
52が一定の間隔で同一走査線13上を走査するよう構成さ
れた光走査機構3と、高さ測定に先立ち被測定物体1の
表面で正反射された反射率検出光51の強度を検出する光
強度検知器6と、表面で正反射された高さ測定光52の入
射位置から被測定物体1の凹凸の高さを測定する位置検
出素子41とを有し、被測定物体1の測定点における反射
率に対応した光強度検知器6の出力信号に基づいて光強
度制御部7が、一定時間後に測定点を照射する高さ測定
光52の強度を制御するよう構成された本発明の高さ測定
装置によって達成される。The above-mentioned problem is that the surface of the object to be measured having irregularities is scanned with laser light, the specularly reflected light from the object to be measured is made incident on the position detecting element, and the output signal of the position detecting element indicating the incident position of the specularly reflected light In a measuring device for measuring the height of unevenness of an object to be measured, a laser light source 5 for outputting a reflectance detection light 51 for detecting the reflectance of the surface and a height measuring light 52 for measuring the height of the unevenness, and a reflectance Detection light 51 and height measurement light
An optical scanning mechanism 3 configured to scan the same scanning line 13 at a constant interval 52, and detects the intensity of the reflectance detection light 51 specularly reflected on the surface of the measured object 1 prior to height measurement. The light intensity detector 6 and the position detecting element 41 for measuring the height of the unevenness of the object to be measured 1 from the incident position of the height measuring light 52 specularly reflected on the surface are measured points of the object to be measured 1 The intensity of the height measuring light 52 irradiating the measurement point after a certain time is controlled by the light intensity control unit 7 based on the output signal of the light intensity detector 6 corresponding to the reflectance of the height of the present invention. Is achieved by a measuring device.
【0020】[0020]
【作用】図1において本発明になる高さ測定装置は反射
率検出光および高さ測定光を出力するレーザ光源と、反
射率検出光と高さ測定光が一定の間隔で同一走査線上を
走査するよう構成された光走査機構と、高さ測定に先立
ち被測定物体の表面で正反射された反射率検出光の強度
を検出する光強度検知器と、高さ測定光の入射位置から
被測定物体の凹凸の高さを測定する位置検出素子とを具
えている。In FIG. 1, a height measuring device according to the present invention is a laser light source that outputs reflectance detection light and height measurement light, and the reflectance detection light and height measurement light scan the same scanning line at regular intervals. An optical scanning mechanism configured to operate, a light intensity detector that detects the intensity of the reflectance detection light specularly reflected on the surface of the measured object prior to height measurement, and the measured position from the incident position of the height measurement light. And a position detecting element for measuring the height of the unevenness of the object.
【0021】被測定物体の測定点における反射率に対応
した光強度検知器の出力信号に基づいて光強度制御部
が、一定時間後に測定点を照射する高さ測定光の強度を
制御するよう構成することによって、反射率に対応して
位置検出素子に入射する高さ測定光の光量を許容範囲に
納めることが可能になり、電極に付着したはんだ球の形
状や量を正確に且つ速やかに検査できる高さ測定装置を
実現することができる。The light intensity control unit controls the intensity of the height measuring light irradiating the measurement point after a predetermined time based on the output signal of the light intensity detector corresponding to the reflectance at the measurement point of the object to be measured. By doing so, it is possible to keep the amount of height measurement light incident on the position detection element within the allowable range according to the reflectance, and accurately and quickly inspect the shape and amount of solder balls attached to the electrodes. It is possible to realize a height measuring device that can be used.
【0022】[0022]
【実施例】以下添付図により本発明の実施例について説
明する。図2は本発明になる高さ測定装置の一実施例を
示す斜視図、図3は一実施例の高さ測定光の強度を示す
タイムチャート、図4は本発明になる高さ測定装置の他
の実施例を示す斜視図、図5は他の実施例の高さ測定光
の強度を示すタイムチャートである。Embodiments of the present invention will be described below with reference to the accompanying drawings. 2 is a perspective view showing an embodiment of the height measuring device according to the present invention, FIG. 3 is a time chart showing the intensity of height measuring light according to the embodiment, and FIG. 4 is a view showing the height measuring device according to the present invention. FIG. 5 is a perspective view showing another embodiment, and FIG. 5 is a time chart showing the intensity of the height measuring light of another embodiment.
【0023】本発明の一実施例は図2に示す如くビーム
エキスパンダ22を具えた2個の直線偏光光源53からなる
レーザ光源5を有し、直線偏光されたレーザ光からなる
反射率検出光51と高さ測定光52は偏光方向が互いに直交
するよう構成されている。One embodiment of the present invention has a laser light source 5 consisting of two linearly polarized light sources 53 having a beam expander 22 as shown in FIG. 2, and a reflectance detection light consisting of linearly polarized laser light. The polarization directions of 51 and the height measurement light 52 are orthogonal to each other.
【0024】同一ミラー23を経由し光走査機構3を構成
する回転多面鏡31の同一点に入射した反射率検出光51と
高さ測定光52は、回転多面鏡31の回転に伴いスキャンレ
ンズ32とミラー33を介して一定の間隔で被測定物体1の
同一走査線13上を走査する。The reflectance detecting light 51 and the height measuring light 52 which are incident on the same point of the rotary polygon mirror 31 constituting the optical scanning mechanism 3 via the same mirror 23 are scanned by the scan lens 32 as the rotary polygon mirror 31 rotates. And the same scanning line 13 of the object to be measured 1 is scanned at regular intervals via the mirror 33.
【0025】常に高さ測定光52より先行して被測定物体
1の表面において正反射された反射率検出光51は光強度
検知器6に入射し、例えば、光電子像倍管等の感度およ
び応答速度の優れた光強度検知器6で入射した反射率検
出光51の強度が測定される。The reflectance detection light 51, which is specularly reflected on the surface of the object to be measured 1 prior to the height measurement light 52, is incident on the light intensity detector 6, and the sensitivity and response of, for example, a photomultiplier tube. The intensity of the reflectance detection light 51 incident on the light intensity detector 6 having an excellent speed is measured.
【0026】また、反射率検出光51が通過した被測定物
体1の表面において正反射された高さ測定光52は位置検
出素子41に入射し、高さ測定光52のPSDからなる位置
検出素子41への入射位置によって被測定物体1の表面で
の凹凸の高さが測定される。The height measuring light 52 specularly reflected on the surface of the object to be measured 1 through which the reflectance detecting light 51 has passed is incident on the position detecting element 41, and the position detecting element composed of the PSD of the height measuring light 52. The height of the unevenness on the surface of the measured object 1 is measured by the incident position on the object 41.
【0027】被測定物体1による反射光が光強度検知器
6に入射する反射率検出光51と位置検出素子41に入射す
る高さ測定光52が、上述の如く光走査機構3を構成する
回転多面鏡31の回転に伴い一定の間隔で被測定物体1の
同一走査線13上を走査する。The reflectance detection light 51 entering the light intensity detector 6 and the height measuring light 52 entering the position detecting element 41 are reflected by the object to be measured 1 and are rotated to constitute the optical scanning mechanism 3 as described above. As the polygon mirror 31 rotates, it scans the same scan line 13 of the object 1 to be measured at regular intervals.
【0028】そこで被測定物体1の表面において正反射
された反射率検出光51と高さ測定光52を異なる経路に分
岐する手段として、偏光方向が互いに直交する直線偏光
レーザ光を分岐する偏光ビームスプリッタ61が結像レン
ズ42の後に配置されている。Therefore, as a means for branching the reflectance detection light 51 and the height measurement light 52 specularly reflected on the surface of the object to be measured 1 into different paths, a polarized beam for splitting linearly polarized laser light whose polarization directions are orthogonal to each other is used. The splitter 61 is arranged after the imaging lens 42.
【0029】前述の如く市販されている位置検出素子は
電流比から光点の位置を正確に検知できる光量の許容範
囲は極めて狭く、反射率が変動するとレーザ光の強度や
位置検出素子の感度を調整しても入射する光量を許容範
囲に納めることができない。As described above, the commercially available position detecting element has an extremely narrow allowable range of the amount of light capable of accurately detecting the position of the light spot from the current ratio, and when the reflectance fluctuates, the intensity of the laser beam and the sensitivity of the position detecting element are reduced. Even if it is adjusted, the amount of incident light cannot be kept within the allowable range.
【0030】しかし、高さ測定光52の走査に先立ち被測
定物体1の同一走査線13上を反射率検出光51により走査
することによって、計測点を照射する高さ測定光52の強
度に対する計測点において正反射された高さ測定光52の
強度の比率を検出できる。However, by scanning the same scanning line 13 of the object to be measured 1 with the reflectance detecting light 51 prior to the scanning of the height measuring light 52, the measurement of the intensity of the height measuring light 52 irradiating the measuring point is performed. The ratio of the intensities of the height measuring light 52 specularly reflected at the points can be detected.
【0031】例えば、反射率検出光51が任意の計測点を
照射したときに光強度検知器6によって検出される強度
が低下した場合は、一定時間後に同じ計測点において正
反射され位置検出素子41に入射する高さ測定光52の光量
もほぼ同じ比率で低下する。For example, when the intensity detected by the light intensity detector 6 is lowered when the reflectance detection light 51 irradiates an arbitrary measuring point, the position detecting element 41 is specularly reflected at the same measuring point after a certain period of time. The light amount of the height measuring light 52 incident on is also reduced at substantially the same rate.
【0032】そこで本発明の一実施例は直線偏光光源53
から出力される反射率検出光51の強度を一定にすると共
に図3に示す如く、光強度検知器により検出した反射率
検出光の強度に基づいて一定時間後に出力される高さ測
定光の強度を制御している。Therefore, one embodiment of the present invention is a linearly polarized light source 53.
While the intensity of the reflectance detection light 51 output from the device is kept constant, the intensity of the height measurement light output after a fixed time based on the intensity of the reflectance detection light detected by the light intensity detector as shown in FIG. Are in control.
【0033】即ち、光強度検知器が検出した反射率検出
光51の強度と一定時間後に同計測点を照射する高さ測定
光52の強度の積が、常に一定になるよう高さ測定光52を
出力する直線偏光光源53を制御し位置検出素子41に入射
する光量を安定化している。That is, the product of the intensity of the reflectance detection light 51 detected by the light intensity detector and the intensity of the height measurement light 52 irradiating the same measurement point after a fixed time is always constant. The linearly polarized light source 53 that outputs the light is controlled to stabilize the amount of light incident on the position detection element 41.
【0034】また、本発明の他の実施例は図4に示す如
くレーザ光源5がビームエキスパンダ22を具えた1個の
円偏光光源54を有し、円偏光光源54から出力された円偏
光レーザ光はハーフミラー57とミラー58からなる分光手
段55によって2分割される。Further, in another embodiment of the present invention, as shown in FIG. 4, the laser light source 5 has one circularly polarized light source 54 having the beam expander 22, and the circularly polarized light source 54 outputs the circularly polarized light. The laser light is split into two by a spectroscopic means 55 including a half mirror 57 and a mirror 58.
【0035】分光手段55により分割された円偏光レーザ
光はそれぞれ 1/4波長板56を通すことで直線偏光された
レーザ光からなり、偏光方向が互いに直交する反射率検
出光51と高さ測定光52に変換され光走査機構3を構成す
る回転多面鏡31に入射する。The circularly polarized laser light split by the spectroscopic means 55 consists of laser light linearly polarized by passing through the quarter-wave plate 56, and the reflectance detection light 51 and the height measurement are orthogonal to each other in the polarization direction. The light 52 is converted into light 52 and is incident on the rotary polygon mirror 31 which constitutes the light scanning mechanism 3.
【0036】光走査機構3を構成する回転多面鏡31の同
一点に入射した反射率検出光51と高さ測定光52は前記実
施例と同様に、回転多面鏡31の回転に伴いスキャンレン
ズ32とミラー33を介して一定の間隔で被測定物体1の同
一走査線13上を走査する。The reflectance detecting light 51 and the height measuring light 52 incident on the same point of the rotary polygon mirror 31 constituting the optical scanning mechanism 3 are scanned by the scan lens 32 with the rotation of the rotary polygon mirror 31, as in the above embodiment. And the same scanning line 13 of the object to be measured 1 is scanned at regular intervals via the mirror 33.
【0037】本実施例においても前記実施例と同様に図
5に示す如く光強度検知器により検出した反射率検出光
の強度に基づいて、反射率検出光の強度を検出してから
一定時間経過後に円偏光光源54から出力される高さ測定
光52の強度を制御している。Also in this embodiment, as in the case of the above-described embodiment, a certain time has elapsed since the intensity of the reflectance detection light was detected based on the intensity of the reflectance detection light detected by the light intensity detector as shown in FIG. The intensity of the height measuring light 52 output from the circularly polarized light source 54 later is controlled.
【0038】即ち、光強度検知器が検出した反射率検出
光51の強度と一定時間後に同計測点を照射する高さ測定
光52の強度の積が、常に一定になるよう円偏光レーザ光
を出力する円偏光光源54を制御し位置検出素子41に入射
する光量を安定化している。That is, a circularly polarized laser light is used so that the product of the intensity of the reflectance detection light 51 detected by the light intensity detector and the intensity of the height measurement light 52 irradiating the same measurement point after a predetermined time is always constant. The output circularly polarized light source 54 is controlled to stabilize the amount of light incident on the position detection element 41.
【0039】このように本発明になる高さ測定装置は反
射率検出光および高さ測定光を出力するレーザ光源と、
反射率検出光と高さ測定光が一定の間隔で同一走査線上
を走査するよう構成された光走査機構と、高さ測定に先
立ち被測定物体の表面で正反射された反射率検出光の強
度を検出する光強度検知器と、高さ測定光の入射位置か
ら被測定物体の凹凸の高さを測定する位置検出素子とを
具えている。As described above, the height measuring device according to the present invention includes a laser light source for outputting reflectance detection light and height measurement light,
An optical scanning mechanism configured so that the reflectance detection light and the height measurement light scan the same scanning line at regular intervals, and the intensity of the reflectance detection light specularly reflected on the surface of the object to be measured prior to height measurement. And a position detecting element for measuring the height of the unevenness of the object to be measured from the incident position of the height measuring light.
【0040】被測定物体の測定点における反射率に対応
した光強度検知器の出力信号に基づいて光強度制御部
が、一定時間後に測定点を照射する高さ測定光の強度を
制御するよう構成することによって、反射率に対応して
位置検出素子に入射する高さ測定光の光量を許容範囲に
納めることが可能になり、電極に付着したはんだ球の形
状や量を正確に且つ速やかに検査できる高さ測定装置を
実現することができる。The light intensity control unit controls the intensity of the height measuring light irradiating the measurement point after a certain time based on the output signal of the light intensity detector corresponding to the reflectance at the measurement point of the object to be measured. By doing so, it is possible to keep the amount of height measurement light incident on the position detection element within the allowable range according to the reflectance, and accurately and quickly inspect the shape and amount of solder balls attached to the electrodes. It is possible to realize a height measuring device that can be used.
【0041】[0041]
【発明の効果】上述の如く本発明によれば電極に付着し
たはんだ球の形状や量を正確に且つ速やかに検査できる
高さ測定装置を提供することができる。As described above, according to the present invention, it is possible to provide a height measuring device capable of accurately and quickly inspecting the shape and amount of solder balls attached to electrodes.
【図1】 本発明になる高さ測定装置の原理を示す斜視
図である。FIG. 1 is a perspective view showing the principle of a height measuring device according to the present invention.
【図2】 本発明になる高さ測定装置の一実施例を示す
斜視図である。FIG. 2 is a perspective view showing an embodiment of a height measuring device according to the present invention.
【図3】 一実施例の高さ測定光の強度を示すタイムチ
ャートである。FIG. 3 is a time chart showing the intensity of height measurement light according to an example.
【図4】 本発明になる高さ測定装置の他の実施例を示
す斜視図である。FIG. 4 is a perspective view showing another embodiment of the height measuring device according to the present invention.
【図5】 他の実施例の高さ測定光の強度を示すタイム
チャートである。FIG. 5 is a time chart showing the intensity of height measurement light according to another embodiment.
【図6】 LSIの電極形成面の一部を示す斜視図であ
る。FIG. 6 is a perspective view showing a part of an electrode formation surface of an LSI.
【図7】 従来の高さ測定装置の構成を示す斜視図であ
る。FIG. 7 is a perspective view showing a configuration of a conventional height measuring device.
【図8】 位置検出素子の動作原理を示す斜視図であ
る。FIG. 8 is a perspective view showing the operating principle of the position detection element.
1 被測定物体 3 光走査機構 5 レーザ光源 6 光強度検知器 7 光強度制御部 13 走査線 22 ビームエキスパンダ 23 ミラー 31 回転多面鏡 32 スキャンレンズ 33 ミラー 41 位置検出素子 42 結像レンズ 51 反射率検出光 52 高さ測定光 53 直線偏光光源 54 円偏光光源 55 分光手段 56 1/4波長板 57 ハーフミラー 58 ミラー 61 偏光ビームスプリッ
タ1 Object to be Measured 3 Optical Scanning Mechanism 5 Laser Light Source 6 Optical Intensity Detector 7 Optical Intensity Control Section 13 Scanning Line 22 Beam Expander 23 Mirror 31 Rotating Polyhedral Mirror 32 Scan Lens 33 Mirror 41 Position Detector 42 Imaging Lens 51 Reflectance Detection light 52 Height measurement light 53 Linearly polarized light source 54 Circularly polarized light source 55 Spectroscopic means 56 1/4 wavelength plate 57 Half mirror 58 Mirror 61 Polarization beam splitter
Claims (5)
光で走査し該被計測物体による正反射光を位置検出素子
に入射せしめ、該正反射光の入射位置を示す該位置検出
素子の出力信号によって該凹凸の高さを計測する測定装
置において、 表面の反射率を検出する反射率検出光(51)および凹凸の
高さを測定する高さ測定光(52)を出力するレーザ光源
(5) と、該反射率検出光(51)と該高さ測定光(52)が一定
の間隔で同一走査線(13)上を走査するよう構成された光
走査機構(3) と、 高さ測定に先立ち被測定物体(1) の表面で正反射された
該反射率検出光(51)の強度を検出する光強度検知器(6)
と、表面で正反射された該高さ測定光(52)の入射位置か
ら被測定物体(1) の凹凸の高さを測定する位置検出素子
(41)とを有し、 被測定物体(1) の測定点における反射率に対応した該光
強度検知器(6) の出力信号に基づいて光強度制御部(7)
が、一定時間後に該測定点を照射する高さ測定光(52)の
強度を制御するよう構成されてなることを特徴とする高
さ測定装置。1. An output of the position detecting element indicating the incident position of the specularly reflected light by scanning the surface of the object to be measured having irregularities with a laser beam to cause the specularly reflected light from the object to be measured to enter the position detecting element. A laser light source that outputs a reflectance detection light (51) for detecting the reflectance of the surface and a height measurement light (52) for measuring the height of the unevenness in a measuring device for measuring the height of the unevenness by a signal
(5), an optical scanning mechanism (3) configured to scan the reflectance detection light (51) and the height measurement light (52) on the same scanning line (13) at regular intervals, Light intensity detector (6) for detecting the intensity of the reflectance detection light (51) specularly reflected on the surface of the object to be measured (1) prior to measurement
And a position detecting element for measuring the height of the unevenness of the object to be measured (1) from the incident position of the height measuring light (52) specularly reflected on the surface.
(41) and a light intensity control unit (7) based on the output signal of the light intensity detector (6) corresponding to the reflectance at the measurement point of the object to be measured (1)
The height measuring device is configured so as to control the intensity of the height measuring light (52) for irradiating the measuring point after a predetermined time.
光で走査し該被計測物体による正反射光を位置検出素子
に入射せしめ、該正反射光の入射位置を示す該位置検出
素子の出力信号によって該凹凸の高さを計測する測定装
置において、 表面の反射率を検出する反射率検出光(51)および凹凸の
高さを測定する高さ測定光(52)を出力するレーザ光源
(5) と、該反射率検出光(51)と該高さ測定光(52)が一定
の間隔で同一走査線(13)上を走査するよう構成された光
走査機構(3) と、 高さ測定に先立ち被測定物体(1) の表面で正反射された
該反射率検出光(51)の強度を検出する光強度検知器(6)
と、表面で正反射された該高さ測定光(52)の入射位置か
ら被測定物体(1) の凹凸の高さを測定する位置検出素子
(41)とを有し、 被測定物体(1) の測定点における反射率に対応した該光
強度検知器(6) の出力信号に基づいて光強度制御部(7)
が、該測定点で反射され該位置検出素子(41)に入力され
る高さ測定光(52)の強度を制御することを特徴とした高
さ測定方法。2. The output of the position detecting element, which indicates the incident position of the specular reflected light, by scanning the surface of the object to be measured having irregularities with a laser beam to cause the specularly reflected light from the object to be measured to enter the position detecting element. A laser light source that outputs a reflectance detection light (51) for detecting the reflectance of the surface and a height measurement light (52) for measuring the height of the unevenness in a measuring device for measuring the height of the unevenness by a signal
(5), an optical scanning mechanism (3) configured to scan the reflectance detection light (51) and the height measurement light (52) on the same scanning line (13) at regular intervals, Light intensity detector (6) for detecting the intensity of the reflectance detection light (51) specularly reflected on the surface of the object to be measured (1) prior to measurement
And a position detecting element for measuring the height of the unevenness of the object to be measured (1) from the incident position of the height measuring light (52) specularly reflected on the surface.
(41) and a light intensity control unit (7) based on the output signal of the light intensity detector (6) corresponding to the reflectance at the measurement point of the object to be measured (1)
However, the height measuring method is characterized in that the intensity of the height measuring light (52) reflected at the measuring point and input to the position detecting element (41) is controlled.
検出光(51)と高さ測定光(52)を出力する2個の直線偏光
光源(53)が、該反射率検出光(51)と該高さ測定光(52)の
偏光方向が互いに直交するよう配設されたレーザ光源
(5) を有し、 該反射率検出光(51)が任意の計測点を照射したとき光強
度検知器(6) によって検出される強度と、一定時間後に
該計測点を照射する該高さ測定光(52)の強度の積が一定
になるよう光強度制御部(7) が、該高さ測定光(52)を出
力する該直線偏光光源(53)を制御するよう構成された請
求項1記載の高さ測定装置。3. The reflectance detection light (51) comprising two linearly polarized light sources (53) for outputting a reflectance detection light (51) made of linearly polarized laser light and a height measurement light (52). And a laser light source arranged such that the polarization directions of the height measuring light (52) are orthogonal to each other.
(5), the intensity detected by the light intensity detector (6) when the reflectance detection light (51) irradiates an arbitrary measurement point, and the height at which the measurement point is irradiated after a certain time. The light intensity control unit (7) is configured to control the linearly polarized light source (53) that outputs the height measurement light (52) so that the product of the intensities of the measurement light (52) becomes constant. 1. The height measuring device according to 1.
定の間隔で走査する反射率検出光(51)と高さ測定光(52)
の正反射光を、異なる経路に分岐する手段として偏光ビ
ームスプリッタ(61)を具えてなる請求項1記載の高さ測
定装置。4. A reflectance detection light (51) and a height measurement light (52) for scanning the same scanning line (13) of the object to be measured (1) at regular intervals.
The height measuring device according to claim 1, further comprising a polarization beam splitter (61) as a means for splitting the specularly reflected light of (1) into different paths.
光源(54)と分光手段(55)および 1/4波長板(56)を具え、
該分光手段(55)により該円偏光レーザ光を分割し形成さ
れた反射率検出光(51)と高さ測定光(52)を、該 1/4波長
板(56)により偏光方向が互いに直交する直線偏光レーザ
光に変換するレーザ光源(5) を有し、 該反射率検出光(51)が任意の計測点を照射したとき光強
度検知器(6) によって検出される強度と、一定時間後に
該計測点を照射する該高さ測定光(52)の強度の積が一定
になるよう光強度制御部(7) が、該円偏光レーザ光を出
力する該円偏光光源(54)を制御するよう構成された請求
項1記載の高さ測定装置。5. A circularly polarized light source (54) for outputting circularly polarized laser light, a spectroscopic means (55) and a quarter wavelength plate (56) are provided,
The reflectance detection light (51) and the height measurement light (52) formed by dividing the circularly polarized laser light by the spectroscopic means (55) are orthogonal to each other in polarization direction by the quarter wavelength plate (56). Which has a laser light source (5) for converting it into a linearly polarized laser light, which is detected by the light intensity detector (6) when the reflectance detection light (51) irradiates an arbitrary measuring point, and The light intensity control unit (7) controls the circularly polarized light source (54) that outputs the circularly polarized laser light so that the product of the intensities of the height measuring light (52) that illuminates the measurement point later becomes constant. The height measuring device according to claim 1, which is configured to:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12364293A JPH06331328A (en) | 1993-05-26 | 1993-05-26 | Height measuring device and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12364293A JPH06331328A (en) | 1993-05-26 | 1993-05-26 | Height measuring device and method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06331328A true JPH06331328A (en) | 1994-12-02 |
Family
ID=14865652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12364293A Withdrawn JPH06331328A (en) | 1993-05-26 | 1993-05-26 | Height measuring device and method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06331328A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998034273A1 (en) * | 1997-01-30 | 1998-08-06 | Nippon Steel Corporation | Ball arranging substrate for forming bump, ball arranging head, ball arranging device, and ball arranging method |
CN104390605A (en) * | 2014-12-01 | 2015-03-04 | 中国科学院微电子研究所 | Vertical adjusting device |
-
1993
- 1993-05-26 JP JP12364293A patent/JPH06331328A/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998034273A1 (en) * | 1997-01-30 | 1998-08-06 | Nippon Steel Corporation | Ball arranging substrate for forming bump, ball arranging head, ball arranging device, and ball arranging method |
US6571007B1 (en) | 1997-01-30 | 2003-05-27 | Nippon Steel Corporation | Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging method |
EP2256793A1 (en) * | 1997-01-30 | 2010-12-01 | Nippon Steel Corporation | Ball-arranging substrate for forming bumps, ball-arranging head, ball-arranging apparatus and method for arranging balls |
CN104390605A (en) * | 2014-12-01 | 2015-03-04 | 中国科学院微电子研究所 | Vertical adjusting device |
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