JPH0632398B2 - Memory module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a memory module in which a unit memory module is composed of two gold-side mounted boards and a plurality of these memory modules are superposed and integrated.

(B) Conventional Technology FIG. 3 is a perspective view showing a conventional memory module (see Japanese Patent Laid-Open No. 59-98598).

In the conventional memory module, as shown in a perspective view of FIG. 3, the memory module (20) is supported by a mother board (21), and the memory module (20) is a first, a second, and a third memory board. (22), (23), and (24), which have a biggy-back configuration and are stacked and integrated.

The mother board (21) has leads on an insulating substrate such as a glass epoxy substrate, and the first, second, and third memory boards (22), (23), (24) are provided on the mother board (21). The respective stacking contacts (25) are aligned and stacked.

A plurality of memory chips (26) are mounted on the first memory board (22). The plate (22) is rectangular and has one edge area (28) and an opposite second edge area (27). First
The edge area (28) of the stack has one or several rows of stacking contacts (25)
Is included. Similarly, the second insulation zone (27) also contains one or several rows of stacking contacts (25).

The stacking contact (25) has a female socket end fixed in the memory plate (22) and an opposite male end. Each male end is removably secured to a suitable socket on the motherboard (21).
The memory chip (26) is provided at the socket end by the input / output conductor mechanism.
The pins are electrically connected directly or through other circuits on the board. This input / output mechanism is the same for each plate. Therefore, the contacts (25) have input / output pins and the memory board (22)
The memory chips (26) of (23) and (24) are electrically interconnected to the circuit of the motherboard (21).

The second and third memory plates (23) and (24) are also formed in the same manner as the first memory plate (22), and the second memory plate (23) is connected to the connection contact (25) of the first memory plate (22). The male end of this is the same and is integrated.

(C) Problems to be Solved by the Invention In the above-described conventional memory module technology, the gap between the memory plates is limited, and if the gap is made smaller, a signal may move to another memory plate. Further, since the substrate is an insulating substrate, noise reaches the memory plate through the substrate and affects the memory chip. Furthermore, since the entire memory module is not protected, there is a problem with a large noise from the outside. As a result, each memory has to be mounted with a certain gap provided, which requires a large space.

(D) Means for Solving the Problems The present invention has been made in view of the above-mentioned points, and is provided on the opposing main surfaces of the first metal mounting board and the second metal mounting board, respectively. On the same side where the memory element and the first and second metal mounting boards face each other, the connection electrodes formed of conductive paths extending from the inside and the first and second metal mounting boards are separated from each other. A memory module comprising: a frame body to be fixed; and a connector portion provided by enclosing the connection electrode by denting the frame body, wherein an external connection body is inserted into the connector portion. The exposed surface of the metal-mounted substrate is closely adhered to each other and integrated so that the connector portions are arranged in the same direction.

(E) The space between the working metal mounting boards is only required for mounting circuit elements. Further, since the back surface of the metal mounting board is exposed, the unit memory modules can be closely arranged. From the above, the space of the entire memory module can be reduced.

(F) Embodiment FIG. 1 is a perspective assembly view showing an embodiment of the present invention, FIG. 2 is a perspective assembly exploded view showing the structure of the unit memory module shown in FIG. 1, and (1) is a memory. Module, (2) is a unit memory module, (3) is a band, (3) 'is a screw hole, (4)
Is a connector, (4) 'is an external connector, (5) and (6) are metal mounting boards, (7) is a conductive path, (8) is a memory chip, (9) is a connecting electrode, and (10) is a frame. Body, (11) guide, (12) step, (13)
Is a spacer part, and (14) is a connector part.

In the memory module (1), unit memory module
A plurality of (2), for example, three are superposed, and a band (3) is used to fix and integrate them. In this embodiment, the band (3) is formed by bending aluminum into a U-shape, and both ends thereof are further bent outward. Each unit memory module (2) is sandwiched and fixed inside the U-shaped band (3). For the memory module (1), insert the connector part (14) of each unit memory module (2) into the external connector (4) 'of the external connector (4) and connect it by the screw hole (3)' of the band (3). It is fixed by the body (4). Unit memory module below
The structure of (2) will be described.

In the first metal mounting board (6), an insulating layer is formed on the surface of the board (6) by anodic oxidation, and a conductive path (7) is formed by etching a copper foil into a predetermined pattern. . This conductive path extends on one side of the substrate (6), and its end portion becomes the connecting electrode (9).

The second metal mounting board (5) is formed in the same manner as the first metal mounting board (6), and the conductive path extends on the same side as the connection electrode (9) of the first metal mounting board (6). Located on the first metal mounting board (6)
Similarly to the above, a connection electrode (not shown) is formed.

By disposing the memory chips (8) on the first and second metal mounting boards (6) and (5), the heat dissipation is excellent and 8 to 10 per board.
Individual memory chips (8) can be mounted in high density.

The frame body (10) is made of an insulating material such as synthetic resin and has a guide portion (1
1), a step part (12) and a spacer part (13), the cross section of which is T-shaped.

On the back surface and the top surface where the first and second metal mounting boards (6) and (5) are fitted, respectively, a step part (12) and a spacer part (1
The surface of 3) is the same surface, and the spacer portion (13) keeps a distance from the first and second metal mounting boards (6) and (5).

The guide portion (11) regulates the position when the first and second metal mounting boards (6) and (5) are fitted.

An adhesive sheet is attached to the surfaces of the stepped portion (12) and the spacer portion (13) of the frame body (10), and the connection electrode (9) of the first metal mounting board (6)
One side provided with is aligned with the spacer portion (13) of the frame body (10) so that the connecting electrode (9) is outside the frame and is inserted into the frame body (10). Furthermore, one side of the second metal mounting board (5) provided with the connecting electrode and the connector portion (14) of the frame body (10) are aligned so that the connecting electrode is outside the frame, and the inner main surfaces face each other. It is inserted like this and is bonded through the frame body (10).

The connector part (14) is formed by utilizing a space formed by denting a part of the frame body (10) inward, and the first part of the space part,
Conductive paths (7) are provided on the inner surfaces of the second metal mounting substrate (6) (5) facing each other.
Is a unit memory module (2) which is extended and arranged in a predetermined arrangement without using any external lead.

Each of the above-mentioned unit memory modules (2) is closely adhered to the exposed surface of the metal mounting board and overlapped, and a connecting electrode
Arrange so that (9) faces the external connector (4) 'of the connection body (4). In order to further stabilize the adhesion, as shown in FIG. 1, the inner side surface of the rectangular band (3) and the exposed metal mounting board surface of the memory module (1) are brought into close contact with each other to achieve integration. When connecting to an external circuit, as shown in FIG. 1, it is inserted into the space of the connector portion (14) of the unit memory module (2) corresponding to the external connector (4) 'of the connection body (4). .

As another embodiment, there is also a method in which aluminum larger than the unit memory module (2) is sandwiched between the unit memory modules (2) to be closely fixed and arranged.

(G) Effects of the Invention As described in detail above, according to the present invention, since each unit memory module can prevent generation of high voltage due to charge accumulation and noise from the outside, a plurality of integrated memory modules can be integrated. Even if they are converted, they do not affect each other's unit memory modules at all. Therefore, a large number of memory modules can be stacked, and a large capacity memory module can be obtained.

[Brief description of drawings]

1 is a perspective assembly view showing an embodiment of the present invention, FIG. 2 is a perspective assembly exploded view showing the structure of the unit memory module shown in FIG. 1, and FIG. 3 is a perspective view showing a conventional example. . (1) …… Memory module, (2) …… Unit memory module, (3) …… Band, (3 ′) …… Screw hole, (4) …… Connecting body,
(4 ′) …… External connector, (6) (5) …… Metal mounting board,
(7) ...... Conductive path, (8) ...... Memory chip, (9) ...... Connection electrode, (10) ...... Frame, (11) ...... Guide section, (12) ...... Step section, ( 13) …… Spacer part, (14) …… Connector part.

Claims (1)

[Claims] 1. A first and second metal mounting board, a memory element provided on each of the opposing main surfaces of the first and second metal mounting boards, and the first and second metal mounting boards. And a frame body for fixing the connecting electrodes formed of conductive paths extending from the inside on the same opposite sides of the first and second metal mounting boards so as to be spaced apart from each other; In a memory module having a connector part surrounding the connection electrode, and an external connector is inserted into the connector part, the exposed metal mounting board surfaces of a plurality of the memory modules are closely adhered to each other. A memory module characterized by being integrated together and arranged so that the connector portions are in the same direction.