JPH0631729Y2 - String structure of semiconductor element - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a string structure of a semiconductor element, and more particularly to a string structure of a semiconductor device such as a light emitting diode suitable for a printed circuit board of a display device.

(Prior Art) When a large display device is formed by using a plurality of semiconductor elements such as light emitting diodes which are usually manufactured as independent elements, a plurality of light emitting diodes (hereinafter referred to as LEDs) are used. It is necessary to position and position each of the elements on the printed circuit board and electrically connect them.

(Problems to be solved by the invention) Therefore, (1) it takes time to assemble each LED into a large display device, and the display device cannot be efficiently produced.

(2) When a large number of LEDs, for example 400, are to be arranged on a printed circuit board, it is necessary to connect 800 lead pins so as to form a predetermined pattern, and these LEDs are aligned in accurate parts. Because there is also a need
The work is extremely difficult and the manufacturing cost is extremely high.

(3) It is difficult to check because it is difficult to approach the LED leads.

The present invention has been made in view of the above circumstances, and when assembling a plurality of LEDs into a large display device,
The number of pins that must be connected to the printed circuit board can be greatly reduced, all the LED elements can be easily held in a predetermined position, and the inspection is easy, and the printed circuit board is simplified. It is an object of the present invention to provide a string structure of a semiconductor element capable of being manufactured.

(Means for Solving the Problems) In order to solve the problems, according to the present invention, a lateral connecting piece and a plurality of pieces integrally formed with the connecting piece by the ends of the first lead and the second lead respectively owned. The semiconductor element and a lateral connecting portion that is formed between the leads and integrally connects the leads to each other. When the semiconductor element is attachable to a printed circuit board, the end of the first lead is cut off from the connecting piece. The connecting portion is cut off from each lead, and each second lead is bent into a substantially S-shape so that the connecting piece is substantially close to the first lead, and each bent second lead is connected to each first lead. It is characterized in that it is displaced in the same direction with respect to one lead, and both ends of the connecting piece are vertically bent downward so as to be parallel to the first lead to form an insertion portion.

(Operation) With the above configuration, a plurality of semiconductor elements can be attached to the printed circuit board at one time.
The mounting work can be simplified and the fixed state of each semiconductor element is extremely good. Further, since the second lead is bent, it is easy to bring the inspection tool close to it when inspecting it. Further, since the respective second leads are displaced in the same direction, even if they are bent, they do not increase the occupied space.

(Embodiment) Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings.

In FIG. 1, reference numeral 1 in the drawing denotes a case in which a chip constituting a semiconductor device is housed, and the chip is provided at the tips of the first and second conductive leads 14 and 15 provided so as to penetrate the chip. The leads that are fixed and connected to the same electrode of the semiconductor device are arranged on the same side, that is, the lead 14 connected to the cathode is arranged on the left side and the lead 15 connected to the anode is arranged on the right side. There is.

At the ends of all the conductive leads 14 and 15, a lateral connecting piece 2 integrally formed with the leads 14 and 15 is provided so as to be perpendicular to the leads 14 and 15, and each of the first leads 14 is provided. A lateral connecting portion 13 is integrally formed with the middle portion and the middle portion of each second lead 15.

Further, the lengths of both ends of the lateral connecting piece 2 are selected so as to project outward from the outermost LED.

When using the present invention, as shown in FIG.
4 and 15 are disconnected from each other, and at the same time, the connecting portion 1 is formed so that the lead 14 separated from the connecting piece 2 has a small remaining cutout piece.
Cut 3 appropriately to form each LED. By appropriately cutting, the contact protrusions 141 located at the same height are formed in the middle part of each first lead 14. As will be described later, when the present invention is mounted on a printed circuit board, the abutment protrusion 141 can abut the mounting hole of the printed circuit board to hold a plurality of LEDs at the same height with respect to the circuit board 3.

After cutting off the connecting portion 13, as shown in FIG.
The lead 15 is bent so as to be perpendicular to each first lead 14, and then each second lead 15 is bent so that the angle becomes θ with respect to the original position, that is, the bent portion 151 is X-.
Twist and shift in the Y plane. After that, the connecting piece 2 is bent into a substantially S-shape so that the connecting piece 2 is close to each first lead 14, and both ends of the connecting piece 2 are connected to each first lead 1.
4 are bent vertically downward so as to be parallel to each other to form the insertion portion 21. The unit is brought into the state shown in FIG. 4 by such processing steps. Of course, the leads 14 and 15 are on the plane X.
Since it is twisted within -Y, the S-shaped portion of the second lead 15 does not come into contact with the first lead 14.

Since the second leads 15 of all the LED elements are connected by the connecting piece 2, the number of contacts can be reduced to about half when forming a large LED display device. And a pair of insertion parts 2 of the unit
1 and each of the first leads 14 when mounted in the mounting hole of the printed circuit board 3 (see FIG. 5), the contact protrusion 1
Since 41 is brought into contact with the upper surface of the printed circuit board 3 and locked, all the LED elements are held at the same height. In addition, since a plurality of units can be easily arranged on the printed circuit board, not only a dense effect can be obtained, but also a gap is generated because the first lead 14 and the second lead 15 are displaced from each other, and the inspection tool Can be easily inserted. Further, since the connecting piece 2 is provided, each LED element of the present invention can be connected to the printed circuit board 3.
Since a better fixing property can be obtained when the display device is fixed to the display device, it is possible to efficiently manufacture a large display device.

As shown in FIGS. 4 and 5, the above-mentioned second leads 15 are provided.
Are shifted in the same direction, the volume of the present invention can be effectively reduced. Therefore, no unnecessary space is generated when the present invention is mounted on the printed circuit board.

Although the LED has been described as an example in this embodiment, it is apparent that the same effect can be obtained even when applied to other semiconductor devices such as a photodiode and a transistor.

(Effects of the Invention) As described above, according to the present invention, a lateral connecting piece, and a plurality of semiconductor elements integrally formed with the connecting piece by the ends of the first lead and the second lead which are respectively owned by the lateral connecting piece, And a lateral connecting portion formed between the leads for connecting the leads together, and in a state in which the first lead can be attached to the printed circuit board, an end of the first lead is cut off from the connecting piece. Is cut from each lead, and each second lead is bent into a substantially S-shape so that the connecting piece is substantially adjacent to the first lead, and each bent second lead is attached to each first lead. Structure of a printed circuit board relating to a large-sized display device, in which LED elements that are displaced in the same direction and are vertically bent downward so that both ends of the connecting piece are parallel to the first lead are used as insertion parts To Not only can it be simplified, but (1) since the LED elements are mounted in a gathered state, the number of steps for mounting can be simplified.

(2) The number of soldering points and contact points can be significantly reduced.

(3) When a part of the LEDs fails, the cutting machine can be used to take out the unfailed LEDs for reuse, which is economical.

(4) Good fixability.

(5) Since the second lead is bent, it is easy to inspect.

And so on.

[Brief description of drawings]

FIG. 1 is a front view of an apparatus showing an embodiment of the present invention, FIG. 2 is a front view showing a state in which the connecting portion of the apparatus is cut off, and FIG.
FIG. 4 is a perspective view showing a pretreatment process of the same device, FIG. 4 is a perspective view showing a state in which the same device is processed to be attachable, and FIG. 5 is a perspective view showing a panel type display device using the present invention. . 1 ... Case, 13 ... Connection part 14 ... First lead, 15 ... Second lead 141 ... Abutment protrusion, 2 ... Connection piece 21 ... Insertion part 3 ... Printed circuit board

Claims (2)

[Scope of utility model registration request] 1. A lateral connecting piece, a plurality of semiconductor elements integrally molded with the connecting piece by the ends of a first lead and a second lead, respectively, and each lead formed between the leads. And a lateral connecting portion for connecting together, and in a state in which the first lead can be attached to the printed circuit board, an end of the first lead is cut from the connecting piece, and the connecting portion is cut off from each lead, In addition, each second lead is bent in an S-shape so that the connecting piece is substantially in the vicinity of the first lead, and each bent second lead is in the same direction with respect to each first lead. A string structure of a semiconductor element, which is offset and has both ends of the connecting piece bent vertically downward so as to be parallel to the first lead to form an insertion portion. 2. The string structure of a semiconductor element according to claim 1, wherein a contact protrusion is formed near the middle stage of each first lead by cutting off the lateral connecting portion.