JPH0631604A - Polishing device and polishing method - Google Patents
Polishing device and polishing methodInfo
- Publication number
- JPH0631604A JPH0631604A JP19397092A JP19397092A JPH0631604A JP H0631604 A JPH0631604 A JP H0631604A JP 19397092 A JP19397092 A JP 19397092A JP 19397092 A JP19397092 A JP 19397092A JP H0631604 A JPH0631604 A JP H0631604A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- base material
- tape
- pressing member
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、テープ状基材の表面を
研磨するための装置および方法に関し、特に、テープ状
基材の表面に結晶性の優れた薄膜を形成させるため、よ
り平滑な基材表面を鏡面研磨により調製する装置および
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for polishing the surface of a tape-shaped substrate, and more particularly, to forming a thin film having excellent crystallinity on the surface of the tape-shaped substrate so that a smoother surface is obtained. The present invention relates to an apparatus and method for preparing a substrate surface by mirror polishing.
【０００２】[0002]
【従来の技術および発明が解決しようとする課題】テー
プ状基材の表面にその長手方向にわたって結晶性の優れ
た薄膜を形成しようとする場合、より平滑でかつ清浄な
基材表面を調製する必要がある。2. Description of the Related Art When a thin film having excellent crystallinity is formed on the surface of a tape-shaped substrate along the length thereof, it is necessary to prepare a smoother and cleaner substrate surface. There is.
【０００３】たとえば、可撓性を有するテープ状金属基
材上に酸化物高温超電導体の薄膜を形成して超電導線を
作製する場合、研磨により平滑でかつ清浄な基材面を調
製し、この面に超電導膜を形成させる必要がある。For example, when a superconducting wire is produced by forming a thin film of an oxide high-temperature superconductor on a flexible tape-shaped metal base material, a smooth and clean base material surface is prepared by polishing. It is necessary to form a superconducting film on the surface.
【０００４】このようなテープ状の金属基材について平
滑な表面を得るため、通常、電解研磨が施されてきた。
しかしながら、電解研磨では、半導体ウエハのラッピン
グのような精度の高い研磨を行なうことができず、面粗
さＲmax が１００Å程度の平滑な面を調製することは困
難である。In order to obtain a smooth surface on such a tape-shaped metal base material, electrolytic polishing has usually been performed.
However, electrolytic polishing cannot perform highly accurate polishing such as lapping of a semiconductor wafer, and it is difficult to prepare a smooth surface having a surface roughness R max of about 100Å.
【０００５】特に、テープ状金属基材上に超電導膜を形
成して超電導線を得ようとする場合、膜を形成すべき基
材面の平滑性が膜の超電導特性に大きく影響するため、
精度の高い研磨を行なうことが困難である電界研磨は、
高い臨界電流密度を有する超電導膜を形成するため不十
分であった。Particularly, when a superconducting film is formed on a tape-shaped metal base material to obtain a superconducting wire, the smoothness of the surface of the base material on which the film is to be formed greatly affects the superconducting properties of the film.
Electropolishing, which is difficult to perform with high precision,
This is insufficient because it forms a superconducting film having a high critical current density.
【０００６】本発明の目的は、テープ状の金属基材、特
に酸化物高温超電導膜を形成するためのテープ状基材に
ついて、より平滑な面を調製することができる研磨装置
および研磨方法を提供することにある。An object of the present invention is to provide a polishing apparatus and a polishing method capable of preparing a smoother surface on a tape-shaped metal substrate, particularly a tape-shaped substrate for forming an oxide high temperature superconducting film. To do.
【０００７】[0007]
【課題を解決するための手段】第１の発明に従う研磨装
置は、テープ状基材の表面を基材の長手方向に沿って研
磨していくための装置であって、基材表面を研磨するた
め、回転可能に設けられた研磨盤と、基材を所定の力で
押さえつけて、基材表面を研磨盤に接触させる押圧部材
と、押圧部材と研磨盤との間において、基材をその長手
方向に走行させるための走行手段とを備え、上記押圧部
材で基材を押さえつける部分のエッジに面取りが施され
ていることを特徴とする。The polishing apparatus according to the first invention is an apparatus for polishing the surface of a tape-shaped substrate along the longitudinal direction of the substrate and polishing the substrate surface. Therefore, a polishing plate rotatably provided, a pressing member that presses the base material with a predetermined force to bring the surface of the base material into contact with the polishing plate, and a base member that extends between the pressing member and the polishing plate. A traveling means for traveling in a direction, and a chamfer is applied to an edge of a portion for pressing the base material with the pressing member.
【０００８】第１の発明に従う研磨装置において、走行
手段は、テープ状基材をその長手方向に送り出す手段で
あれば特に限定されるものではないが、たとえば、回転
駆動される１対のリールを走行手段として用いることが
できる。このようなリールを用いる場合、一方のリール
から巻き付けられたテープ状基材を送り出していき、他
方のリールに巻き取ることでテープ状基材を走行させる
ことができる。In the polishing apparatus according to the first aspect of the present invention, the running means is not particularly limited as long as it is means for feeding the tape-shaped base material in the longitudinal direction thereof. For example, a pair of rotationally driven reels is used. It can be used as a traveling means. When such a reel is used, the tape-shaped base material can be run by sending out the wound tape-shaped base material from one reel and winding it up on the other reel.
【０００９】第１の発明に従う押圧部材において、テー
プ状基材を研磨盤に押さえつける部分のエッジ部には、
面取りが施されている。この面取りでは、たとえば、エ
ッジに所定の曲率を有する丸みがつけられている。In the pressing member according to the first aspect of the present invention, the edge portion of the portion for pressing the tape-shaped base material against the polishing plate is
It is chamfered. In this chamfer, for example, the edge is rounded with a predetermined curvature.
【００１０】第１の発明において、押圧部材には、さら
に、テープ状の基材が嵌まり込み、テープ走行方向に垂
直な方向のテープ移動を規制するガイド溝を形成するこ
とができる。このガイド溝は、テープ状基材の厚みより
も十分浅い。In the first aspect of the present invention, the pressing member may be further provided with a tape-shaped base member, and a guide groove for restricting tape movement in a direction perpendicular to the tape running direction may be formed. This guide groove is sufficiently shallower than the thickness of the tape-shaped substrate.
【００１１】第２の発明に従う研磨方法は、テープ状基
材の表面を基材の長手方向に沿って研磨していくための
方法であって、押圧部分のエッジに面取りが施された部
材により、複数のテープ状基材を同時に、回転する研磨
盤に押しつけて複数の基材面を研磨する工程と、研磨盤
の研磨面に対して斜め方向から基材を研磨盤上に送り込
み、かつ上記研磨面に対して斜め方向に基材を送り出す
ことにより、基材の未研磨面が研磨盤上に送られる工程
とを備える。The polishing method according to the second aspect of the present invention is a method for polishing the surface of a tape-shaped substrate along the longitudinal direction of the substrate, wherein the edge of the pressing portion is chamfered. A step of simultaneously pressing a plurality of tape-shaped base materials against a rotating polishing disk to polish a plurality of base material surfaces, and feeding the base material onto the polishing disk from an oblique direction with respect to the polishing surface of the polishing disk, and The step of feeding the base material in an oblique direction with respect to the polished surface so that the unpolished surface of the base material is fed onto the polishing plate.
【００１２】第２の発明に従う研磨方法では、研磨微粒
粉を懸濁させた研磨剤を用いて研磨盤により研磨仕上げ
を行なうことができる。研磨微粒粉としては、Ａｌ2 Ｏ
3 、ＳｉＣ、Ｃｒ2 Ｏ3 およびコロイダルシリカ等の少
なくともいずれかを用いることができる。また、研磨剤
中に、過酸化水素または硝酸等を加えたものを用いて、
メカノケミカルポリッシングを行なうこともできる。メ
カノケミカルポリッシングは、より平滑で欠陥の少ない
表面を調製するために好ましく用いられる。In the polishing method according to the second aspect of the invention, the polishing finish can be performed by the polishing machine using the polishing agent in which the finely divided polishing powder is suspended. Al 2 O as the fine grinding powder
At least one of 3 , SiC, Cr 2 O 3 and colloidal silica can be used. Also, using a polishing agent with hydrogen peroxide or nitric acid added,
Mechanochemical polishing can also be performed. Mechanochemical polishing is preferably used to prepare a smoother and less defective surface.
【００１３】[0013]
【作用】図を参照しながら本発明の作用について以下に
説明する。The operation of the present invention will be described below with reference to the drawings.
【００１４】図１は、本発明に従う研磨装置の一具体例
を模式的に示す斜視図である。図に示す研磨装置１０に
おいて、回転研磨盤１が２つのリール２ａおよび２ｂの
間に設けられ、リール２ａ、２ｂには２本のテープ基材
３、３′がそれぞれ巻き付けられている。FIG. 1 is a perspective view schematically showing a specific example of the polishing apparatus according to the present invention. In the polishing apparatus 10 shown in the figure, a rotary polishing disk 1 is provided between two reels 2a and 2b, and two tape base materials 3 and 3'are wound around the reels 2a and 2b, respectively.
【００１５】テープ基材３、３′は、これらリールの回
転によってリール２ａから２ｂの方向（図に矢印Ａとし
て示す）に移動させられる。また、テープ基材３、３′
は、回転研磨盤１の上方に設けられる押圧部材４により
所定の荷重で回転研磨盤１に押しつけられている。The tape substrates 3, 3'are moved in the direction of the reels 2a to 2b (shown as arrow A in the figure) by the rotation of these reels. Also, the tape substrate 3, 3 '
Is pressed against the rotary polishing platen 1 with a predetermined load by a pressing member 4 provided above the rotary polishing platen 1.
【００１６】テープ基材３，３′が回転研磨盤１に接触
する状態を図２に示す。図２に示すように、所定の張力
で２つのリール間に張られたテープ基材３、３′は、押
圧部材４により所定の荷重で回転研磨盤１の研磨面１ａ
に押しつけられている。このとき、テープ基材３、３′
は、研磨面１ａに対して斜め方向（矢印Ｂで示す）から
該研磨盤１上に供給されるとともに、研磨面１ａに対し
て斜め方向（矢印Ｃで示す）に該研磨盤１から送り出さ
れる。FIG. 2 shows a state in which the tape substrates 3 and 3'contact the rotary polishing disc 1. As shown in FIG. 2, the tape base materials 3 and 3 ′ stretched between two reels with a predetermined tension force the pressing member 4 to apply a predetermined load to the polishing surface 1 a of the rotary polishing machine 1.
Is pressed against. At this time, the tape substrate 3, 3 '
Is supplied onto the polishing platen 1 in an oblique direction with respect to the polishing surface 1a (shown by an arrow B), and is sent out from the polishing platen 1 in an oblique direction with respect to the polishing surface 1a (shown by an arrow C). .
【００１７】また、押圧部材４のエッジ４ａおよび４ｂ
には、面取りが施されており、所定の曲率を有する丸み
がつけられている。Further, the edges 4a and 4b of the pressing member 4 are
Is chamfered and is rounded with a predetermined curvature.
【００１８】以上のように構成される装置において、２
本のテープ基材３、３′は、回転研磨盤１の回転によっ
て、研磨面１ａに押しつけられた表面がそれぞれ研磨さ
れる。また、基材３、３′において研磨の完了した部分
は、リール２ｂに巻き取られていき、研磨されていない
部分は、リール２ａから回転研磨盤１に供給される。こ
のように基材３、３′をリール２ａから２ｂに走行させ
ることによって、長尺の表面が順次研磨されていく。In the device constructed as described above, 2
The surfaces of the tape base materials 3 and 3'pressed against the polishing surface 1a are polished by the rotation of the rotary polishing disk 1. Further, the parts of the base materials 3 and 3'which have been polished are wound up on the reel 2b, and the unpolished parts are supplied from the reel 2a to the rotary polishing plate 1. By running the base materials 3 and 3'from the reels 2a to 2b in this manner, the long surface is sequentially polished.
【００１９】また、このような研磨に際し、押圧部材の
エッジに面取りが施されているため、このエッジで局所
的な荷重がテープ基材にかかることもなく、基材に傷を
つけることもない。Further, during such polishing, since the edge of the pressing member is chamfered, a local load is not applied to the tape base material at this edge and the base material is not damaged. .
【００２０】さらに、テープ基材を研磨面に対して斜め
方向から供給し、斜め方向に送り出すことで、図に示す
ように、基材において研磨を行なう部分以外は、研磨盤
から離れるようにしている。このため、基材が研磨盤の
エッジ等で傷つけられることもない。Further, by feeding the tape base material in an oblique direction to the polishing surface and sending it out in an oblique direction, as shown in the figure, the parts other than the part of the base material to be polished are separated from the polishing plate. There is. Therefore, the base material is not damaged by the edge of the polishing plate.
【００２１】また、押圧部材により複数のテープ基材を
同時に研磨盤に押しつけることで、バランスよく基材に
荷重することができる。一方、テープ基材１本のみを研
磨しようとすると、押しつけのバランスが悪くなり、平
滑な表面を調製することが難しくなる。なお、図では２
本のテープ基材を同時に研磨しているが、本発明に従っ
て、同時に研磨する本数をさらに増やすことができる。Further, by pressing a plurality of tape base materials against the polishing plate simultaneously by the pressing member, it is possible to load the base materials in a well-balanced manner. On the other hand, if only one tape base material is to be polished, the pressing balance becomes unbalanced and it becomes difficult to prepare a smooth surface. In the figure, 2
Although the tape base material of the book is polished at the same time, the number of simultaneous polishing can be further increased according to the present invention.
【００２２】また、上記装置において、図３に示すよう
な押圧部材を用いることもできる。図３に示す押圧部材
１４には、所定の間隔を隔てて平行にガイド溝１５ａお
よび１５ｂが形成されている。これらガイド溝は、テー
プ基材の厚みよりも浅い。Further, in the above apparatus, a pressing member as shown in FIG. 3 can be used. In the pressing member 14 shown in FIG. 3, guide grooves 15a and 15b are formed in parallel at a predetermined interval. These guide grooves are shallower than the thickness of the tape base material.
【００２３】この押圧部材１４を用いて基材を研磨盤に
押しつける場合、図に示すように、テープ基材１３、１
３′をそれぞれガイド溝１５ａ、１５ｂ内に入れ、溝を
形成する面でテープ基材１３、１３′を研磨盤１１に押
しつけるようにする。このようなガイド溝は、テープの
移動方向を制御し、円滑なテープ走行に寄与する。When the base material is pressed against the polishing board using the pressing member 14, as shown in the drawing, the tape base materials 13, 1 are used.
3'is inserted into the guide grooves 15a and 15b, respectively, and the tape base materials 13 and 13 'are pressed against the polishing plate 11 at the surfaces forming the grooves. Such guide grooves control the moving direction of the tape and contribute to smooth tape running.
【００２４】[0024]
【実施例】図１に示す装置において、図３に示すような
ガイド溝が２本形成された押圧部材を用い、他は図１に
示すと同様にしてテープ基材の研磨を行なった。EXAMPLES In the apparatus shown in FIG. 1, a tape base material was polished in the same manner as shown in FIG. 1 except that a pressing member having two guide grooves as shown in FIG. 3 was used.
【００２５】押圧部材のエッジに設けられた丸みの曲率
（Ｒ）は２０ｍｍであり、押圧部材による荷重は２ｋｇ
／ｃｍ2 とした。また、押圧部材に形成されるガイド溝
の深さは、約４０μｍであった。The curvature (R) of the roundness provided on the edge of the pressing member is 20 mm, and the load by the pressing member is 2 kg.
/ Cm 2 . The depth of the guide groove formed in the pressing member was about 40 μm.
【００２６】このような装置において、ハステロイＣ
（１６．５％Ｃｒ、〜２．５％Ｃｏ、１７％Ｍｏ、５％
Ｆｅ、残部Ｎｉ）で形成される厚さ約５０μｍのテープ
基材を２本、同時に研磨盤により研磨した。研磨におい
て、テープ基材は研磨面に対して５°の角度で研磨盤上
に供給され、５°の角度で研磨盤から送り出された。In such an apparatus, Hastelloy C
(16.5% Cr, ~ 2.5% Co, 17% Mo, 5%
Two tape base materials having a thickness of about 50 μm formed of Fe and the balance Ni) were simultaneously polished by a polishing plate. In the polishing, the tape base material was supplied onto the polishing plate at an angle of 5 ° with respect to the polishing surface and sent out from the polishing plate at an angle of 5 °.
【００２７】テープ基材の送り速度を１０ｍｍ／分と
し、テープを送りながら連続的に基材表面を研磨した結
果、基材全長にわたり傷のない平滑な表面を調製するこ
とができた。The tape substrate was fed at a feed rate of 10 mm / min, and the surface of the substrate was continuously polished while feeding the tape. As a result, a smooth surface without scratches could be prepared over the entire length of the substrate.
【００２８】一方、押圧部材のエッジについて、図に示
すような丸みをつけず、尖った状態とし、テープ基材の
供給および送り出しの角度を０°として研磨を行なっ
た。この場合、１μｍ〜３μｍ程度の深さの傷がテープ
基材の全長にわたって観察された。On the other hand, the edges of the pressing member were sharpened without being rounded as shown in the figure, and polishing was carried out with the tape base material supply and delivery angles set to 0 °. In this case, scratches having a depth of about 1 μm to 3 μm were observed over the entire length of the tape substrate.
【００２９】[0029]
【発明の効果】以上説明したように、本発明の研磨装置
および研磨方法によれば、長尺のテープ基材について、
その長手方向に効率よく表面を研磨していくことができ
る。このため、本発明は、たとえば、テープ基材に酸化
物高温超電導膜を形成して超電導線を製造する技術にお
いて、超電導膜を形成すべき平滑な基材表面を調製する
ため、効果的に利用される。As described above, according to the polishing apparatus and the polishing method of the present invention, the long tape base material is
The surface can be efficiently polished in the longitudinal direction. Therefore, the present invention is effectively utilized, for example, in the technique of forming a high-temperature oxide superconducting film on a tape base material to produce a superconducting wire, in order to prepare a smooth base material surface on which the superconducting film is to be formed. To be done.
【図１】本発明に従う研磨装置の一具体例を模式的に示
す斜視図である。FIG. 1 is a perspective view schematically showing a specific example of a polishing apparatus according to the present invention.
【図２】図１に示す装置において、テープ基材が研磨盤
上に押しつけられる状態を示す断面図である。FIG. 2 is a cross-sectional view showing a state in which the tape base material is pressed onto a polishing platen in the apparatus shown in FIG.
【図３】本発明に従う装置において、押圧部材の他の例
を示す断面図である。FIG. 3 is a cross-sectional view showing another example of the pressing member in the device according to the present invention.
１、１１ 回転研磨盤 ２ａ、２ｂ リール ３、３′、１３、１３′ テープ基材 ４、１４ 押圧部材 １０ 研磨装置 １５ａ、１５ｂ ガイド溝 1, 11 Rotating polishing machine 2a, 2b Reel 3, 3 ', 13, 13' Tape base material 4, 14 Pressing member 10 Polishing device 15a, 15b Guide groove
Claims (2)
向に沿って研磨していくための研磨装置であって、 前記基材の表面を研磨するため、回転可能に設けられた
研磨盤と、 前記基材を所定の力で押さえつけて、前記基材の表面を
前記研磨盤に接触させるための押圧部材と、 前記押圧部材と前記研磨盤との間において、前記基材を
その長手方向に走行させるための走行手段とを備え、 前記押圧部材で前記基材を押さえつける部分のエッジに
面取りが施されている、研磨装置。1. A polishing apparatus for polishing the surface of a tape-shaped substrate along the longitudinal direction of the substrate, which is rotatably provided for polishing the surface of the substrate. A board, a pressing member for pressing the base material with a predetermined force to bring the surface of the base material into contact with the polishing board, and between the pressing member and the grinding board, the base material And a traveling means for traveling in a direction, and a chamfer is applied to an edge of a portion where the pressing member presses the base material.
向に沿って研磨していくための研磨方法であって、 押圧部分のエッジに面取りが施された部材により、複数
のテープ状基材を同時に、回転する研磨盤に押しつけて
複数の基材表面を研磨する工程と、 前記研磨盤の研磨面に対して斜めの方向から、基材を前
記研磨盤上に送り込み、かつ前記研磨面に対して斜めの
方向に前記基材を送り出すことにより、前記基材の未研
磨面が前記研磨盤上に送られる工程とを備える、研磨方
法。2. A polishing method for polishing the surface of a tape-shaped base material in the longitudinal direction of the base material, wherein a plurality of tape-shaped base materials are formed by a member having a chamfered edge of a pressing portion. A step of simultaneously pressing the base material against a rotating polishing disk to polish a plurality of substrate surfaces; and feeding the base material onto the polishing disk from a direction oblique to the polishing surface of the polishing disk, and performing the polishing. And a step of feeding the base material in a direction oblique to the surface to feed the unpolished surface of the base material onto the polishing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19397092A JPH0631604A (en) | 1992-07-21 | 1992-07-21 | Polishing device and polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19397092A JPH0631604A (en) | 1992-07-21 | 1992-07-21 | Polishing device and polishing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0631604A true JPH0631604A (en) | 1994-02-08 |
Family
ID=16316805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19397092A Pending JPH0631604A (en) | 1992-07-21 | 1992-07-21 | Polishing device and polishing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0631604A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002004170A1 (en) * | 2000-07-11 | 2002-01-17 | Sintokogio, Ltd. | Method and device for finishing surface of long material |
| JP2016055413A (en) * | 2014-09-12 | 2016-04-21 | 株式会社東芝 | Surface treatment apparatus and surface treatment method |
| JP2020171987A (en) * | 2019-04-10 | 2020-10-22 | パナソニックＩｐマネジメント株式会社 | Polishing device and polishing method |
-
1992
- 1992-07-21 JP JP19397092A patent/JPH0631604A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002004170A1 (en) * | 2000-07-11 | 2002-01-17 | Sintokogio, Ltd. | Method and device for finishing surface of long material |
| JP2016055413A (en) * | 2014-09-12 | 2016-04-21 | 株式会社東芝 | Surface treatment apparatus and surface treatment method |
| US9937600B2 (en) | 2014-09-12 | 2018-04-10 | Kabushiki Kaisha Toshiba | Surface treatment apparatus, and surface treatment method |
| JP2020171987A (en) * | 2019-04-10 | 2020-10-22 | パナソニックＩｐマネジメント株式会社 | Polishing device and polishing method |
| CN111805433A (en) * | 2019-04-10 | 2020-10-23 | 松下知识产权经营株式会社 | Polishing apparatus and polishing method |
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