JPH06310387A - Solid electrolytic capacitor provided with fuse and manufacture thereof - Google Patents

Solid electrolytic capacitor provided with fuse and manufacture thereof

Info

Publication number
JPH06310387A
JPH06310387A JP5096370A JP9637093A JPH06310387A JP H06310387 A JPH06310387 A JP H06310387A JP 5096370 A JP5096370 A JP 5096370A JP 9637093 A JP9637093 A JP 9637093A JP H06310387 A JPH06310387 A JP H06310387A
Authority
JP
Japan
Prior art keywords
fuse
solid electrolytic
electrolytic capacitor
layer
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5096370A
Other languages
Japanese (ja)
Other versions
JP3033647B2 (en
Inventor
Yukio Sugizaki
幸雄 杉崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Toppan Circuit Solutions Toyama Inc
Original Assignee
NEC Toppan Circuit Solutions Toyama Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Toppan Circuit Solutions Toyama Inc filed Critical NEC Toppan Circuit Solutions Toyama Inc
Priority to JP5096370A priority Critical patent/JP3033647B2/en
Publication of JPH06310387A publication Critical patent/JPH06310387A/en
Application granted granted Critical
Publication of JP3033647B2 publication Critical patent/JP3033647B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To provide a method of manufacturing a solid electrolytic capacitor which is provided with a built-in fuse and appropriate for mass-production, enhanced in reliability of fuse connection and manufacturing yield, and set free from defects caused by a fuse wire. CONSTITUTION:An insulating resin layer 3 is formed on a cathode layer 1a of a solid electrolytic capacitor element 1, the surface of the insulating resin layer 3 is roughened by laser rays, catalyst is applied, and a metal plating 5 is provided for the formation of a fuse 5a. The fuse 5a is connected to the cathode layer 1a and the cathode terminal 7 with a carbon layer 4 and a silver paste 8 respectively. By this setup, a fuse can be formed by laser matching without using a fuse wire, so that a fuse is prevented from being disconnected due to a stress induced by vibrations or the like. As a solid electrolytic capacitor provided with a fuse of this design is formed through processes which can be carried out at the same time, it is suitable for mass production and can be assembled in the same production line with a capacitor with no built-in fuse.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ヒューズ入り固体電解
コンデンサ及びその製造方法に関し、特にヒューズ線を
使わずに構成するヒューズ入り固体電解コンデンサ及び
その製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid electrolytic capacitor with a fuse and a method for manufacturing the same, and more particularly to a solid electrolytic capacitor with a fuse which is constructed without using a fuse wire and a method for manufacturing the same.

【0002】[0002]

【従来の技術】一般に、固体電解コンデンサは、種々の
電子回路に使用されており、故障率が小さいことが利点
とされている。ところが、一旦故障が発生した場合に
は、短絡となることが多い。そして、このような場合に
大きな短絡電流が流れると、コンデンサ素子が発熱して
焼損してしまうことがある。
2. Description of the Related Art Generally, solid electrolytic capacitors are used in various electronic circuits, and it is an advantage that the failure rate is small. However, once a failure occurs, a short circuit often occurs. When a large short-circuit current flows in such a case, the capacitor element may generate heat and burn out.

【0003】この過大の短絡電流による故障の際に発生
するコンデンサ素子の焼損を防止すると共に、周辺の回
路構成素子を保護するためには、コンデンサ素子を短絡
から開放する必要がある。
In order to prevent the capacitor element from being burnt out in the event of a failure due to this excessive short-circuit current and to protect the peripheral circuit constituent elements, it is necessary to release the capacitor element from a short circuit.

【0004】従来、この目的のため、一般的にはヒュー
ズを内蔵した型の固体電解コンデンサが用いられてい
る。このような、固体電解コンデンサをヒューズ入り固
体電解コンデンサと称する。
Conventionally, a solid electrolytic capacitor having a built-in fuse is generally used for this purpose. Such a solid electrolytic capacitor is called a solid electrolytic capacitor with a fuse.

【0005】図4は、従来のヒューズ付き固体電解コン
デンサの構造を示す斜視図である。コンデンサ素子1に
は、陽極リード2と陰極層1aと陰極端子7とが絶縁性
接着剤12によって接着されている。そして、ヒューズ
線5bが、陰極層1aと陰極端子7にはんだ11で接続
され、両者を橋絡接続し、更に、全体が外装樹脂10で
外装されている。
FIG. 4 is a perspective view showing the structure of a conventional solid electrolytic capacitor with a fuse. An anode lead 2, a cathode layer 1 a, and a cathode terminal 7 are bonded to the capacitor element 1 with an insulating adhesive 12. Then, the fuse wire 5b is connected to the cathode layer 1a and the cathode terminal 7 with the solder 11, and the two are bridge-connected, and the whole is covered with the exterior resin 10.

【0006】[0006]

【発明が解決しようとする課題】上述した従来のヒュー
ズ入りチップ型固体電解コンデンサは、陰極層と陰極端
子とがヒューズ線によって電気的に接続される構造とな
っている。このことから、以下のような欠点を持ってい
る。(1)ヒューズ線とコンデンサ素子とが直接接続さ
れている。従って、過電流が流れてヒューズ線が発熱し
た時に、この熱によって、間接的には、陰極層のはんだ
が溶け、熱膨張して外装樹脂を破壊する欠点があった。
(2)コンデンサ素子の陰極層と陰極端子とを接着する
ために絶縁性接着剤が用いられている。ところが、コン
デンサ素子の陰極層と陰極端子とが固定されてしまうた
め、外装樹脂の成形時及び外装後のはんだ浸漬時に、機
械的及び熱的ストレスがコンデンサ素子にかかり電気的
特性を劣化させる恐れがあった。(3)陽極リードと陽
極端子との接続状態及びヒューズ線の接続状態によっ
て、コンデンサ素子や陰極端子が外装樹脂の外部に露出
しやすい上、コンデンサ素子自体は、容量や対電圧によ
って、大きさ、形状が必ずしも一定でないことから、ヒ
ューズ線と陰極層とをはんだ付けで接続する位置も一定
せず、ヒューズ線のはんだ付けを自動的に行うことも困
難である。
The conventional chip-type solid electrolytic capacitor with a fuse described above has a structure in which the cathode layer and the cathode terminal are electrically connected by a fuse wire. Therefore, it has the following drawbacks. (1) The fuse wire and the capacitor element are directly connected. Therefore, when an overcurrent flows and the fuse wire heats up, this heat indirectly melts the solder in the cathode layer and causes thermal expansion to destroy the exterior resin.
(2) An insulating adhesive is used to bond the cathode layer and the cathode terminal of the capacitor element. However, since the cathode layer and the cathode terminal of the capacitor element are fixed to each other, mechanical and thermal stress may be applied to the capacitor element during the molding of the exterior resin and the immersion of the solder after the exterior package, which may deteriorate the electrical characteristics. there were. (3) Depending on the connection state of the anode lead and the anode terminal and the connection state of the fuse wire, the capacitor element and the cathode terminal are likely to be exposed to the outside of the exterior resin, and the capacitor element itself has a large size depending on the capacity and the counter voltage. Since the shape is not always constant, the position where the fuse wire and the cathode layer are connected by soldering is not constant, and it is difficult to automatically solder the fuse wire.

【0007】本発明の目的は、ヒューズ線使用による欠
点を除去し、ヒューズ接続の信頼性及び歩留が向上し、
量産化に適したヒューズ付き固体電解コンデンサを提供
することにある。
The object of the present invention is to eliminate the drawbacks due to the use of fuse wires, improve the reliability and yield of fuse connection,
It is to provide a solid electrolytic capacitor with a fuse suitable for mass production.

【0008】[0008]

【課題を解決するための手段】本発明の第1の発明のヒ
ューズ付き固体電解コンデンサは、固体電解コンデンサ
素子と前記固体電解コンデンサ素子から導出された陽極
リードに接続された陽極端子と、前記固体電解コンデン
サ素子の陰極層と陰極端子をヒューズで接続したヒュー
ズ入り固体電解コンデンサにおいて、前記コンデンサ素
子の陰極層の一側面に絶縁樹脂を塗布し、前記陽極リー
ドの対向面の前記陰極層にカーボン層を形成し、さらに
順次金属メッキ層、シリコン層を被着させ、前記金属メ
ッキ層の一部と前記陰極端子とを導電性接着剤で接続し
た構造で、前記絶縁樹脂面上に金属メッキでヒューズを
形成させたことを特徴とする。
A solid electrolytic capacitor with a fuse according to a first aspect of the present invention is a solid electrolytic capacitor element, an anode terminal connected to an anode lead derived from the solid electrolytic capacitor element, and the solid electrolytic capacitor. In a fused solid electrolytic capacitor in which a cathode layer and a cathode terminal of an electrolytic capacitor element are connected by a fuse, an insulating resin is applied to one side surface of the cathode layer of the capacitor element, and a carbon layer is formed on the cathode layer on the opposite surface of the anode lead. A metal plating layer and a silicon layer are sequentially deposited, and a part of the metal plating layer and the cathode terminal are connected by a conductive adhesive, and a fuse is formed by metal plating on the insulating resin surface. Is formed.

【0009】また、本発明の第2の発明のヒューズ入り
固体電解コンデンサの製造方法は、固体電解コンデンサ
素子の一側面に絶縁樹脂を塗布する工程と、前記絶縁樹
脂面上をヒューズを形成する形状にレーザで粗面加工
し、金属粉末を含む4触媒液を浸漬・塗布する工程と、
前記固体電解コンデンサ素子の陰極層の一面にカーボン
を浸漬・塗布する工程と、前記粗面加工したヒューズ形
成部と前記カーボン層に無電解メッキし、メッキ層を形
成する工程と、シリコン樹脂を塗布する工程と、前記陽
極リードと前記陽極端子を接続する工程と、前記メッキ
層の一部と陰極端子とを導電性接着剤で接続する工程と
を含むことを特徴として構成される。
The method for manufacturing a solid electrolytic capacitor with a fuse according to a second aspect of the present invention includes a step of applying an insulating resin to one side surface of the solid electrolytic capacitor element, and a shape for forming a fuse on the insulating resin surface. Laser roughening the surface, dipping and applying 4 catalyst solutions containing metal powder,
A step of dipping and applying carbon on one surface of the cathode layer of the solid electrolytic capacitor element; a step of electrolessly plating the roughened fuse forming portion and the carbon layer to form a plating layer; and applying a silicon resin And a step of connecting the anode lead and the anode terminal, and a step of connecting a part of the plating layer and the cathode terminal with a conductive adhesive.

【0010】[0010]

【実施例】次に、本発明について図面を参照して説明す
る。図1は、本発明の一実施例であるヒューズ入りチッ
プ型固体電解コンデンサの外装樹脂上部をはがした状態
での平面図及び側断面図、図2は本発明の一実施例であ
るヒューズ形成する形状に加工後の平面図、図3は本発
明の一実施例であるヒューズを形成する工程を説明する
平面図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a plan view and a side cross-sectional view of a chip type solid electrolytic capacitor with a fuse according to an embodiment of the present invention, in which an upper portion of an exterior resin is peeled off, and FIG. 2 is a fuse formation according to an embodiment of the present invention. FIG. 3 is a plan view after processing into a shape to be formed, and FIG. 3 is a plan view illustrating a step of forming a fuse which is an embodiment of the present invention.

【0011】図1で、タンタル、アルミニウム等の弁作
用を有する金属粉末に陽極リード2の一部を埋設した状
態で、プレス成形して陽極体を形成し、この陽極体を真
空焼結した後、陽極酸化し、その陽極酸化膜上に二酸化
マンガン層、カーボン層、銀ペースト層を順次被着させ
て陰極層1aを形成したものが、コンデンサ素子1(以
下素子1と略す)となる。
In FIG. 1, in a state where a part of the anode lead 2 is embedded in a metal powder having a valve action such as tantalum or aluminum, press molding is performed to form an anode body, and the anode body is vacuum-sintered. The capacitor element 1 (hereinafter abbreviated as element 1) is obtained by anodizing and then forming a cathode layer 1a by sequentially depositing a manganese dioxide layer, a carbon layer, and a silver paste layer on the anodized film.

【0012】図1で、素子1の一面に塗着されたはっ水
性の絶縁樹脂3上に形成した5μm厚の金属メッキ層5
の一部を含み、陽極リード2を埋設した対向面側にカー
ボン層4を形成させ、素子1の陽極層1aと金属メッキ
層5を電気的に導通させる。更にカーボン層4にはシリ
コン樹脂6を塗着し陰極端子7と絶縁している。
In FIG. 1, a 5 μm thick metal plating layer 5 formed on a water-repellent insulating resin 3 applied on one surface of the element 1.
A carbon layer 4 is formed on the side of the opposite surface in which the anode lead 2 is embedded, including a part of the above, and the anode layer 1a of the element 1 and the metal plating layer 5 are electrically connected. Further, a silicon resin 6 is applied to the carbon layer 4 to insulate it from the cathode terminal 7.

【0013】陰極端子7と銀ペースト8で導通接続した
金属メッキ5部分と前述のカーボン層4との接続部分は
0.2mm程度幅の金属メッキ5で橋絡接続し、ヒュー
ズ5aを形成する。次に、陽極リート2と陽極端子9を
溶接等で接続し、モールド樹脂10で外装すると、図1
に示す本発明の第1の実施例であるヒューズ入り固体電
解コンデンサが形成できる。
A portion of the metal plating 5 which is conductively connected to the cathode terminal 7 and the silver paste 8 and the connecting portion of the carbon layer 4 are bridge-connected by the metal plating 5 having a width of about 0.2 mm to form the fuse 5a. Next, the anode reed 2 and the anode terminal 9 are connected to each other by welding or the like, and are covered with the mold resin 10.
It is possible to form a solid electrolytic capacitor with a fuse, which is the first embodiment of the present invention shown in FIG.

【0014】以下に第1の実施例の製造方法について述
べる。図1で素子1の一側面にはっ水性の絶縁樹脂3を
塗布、乾燥する。その絶縁樹脂3表面に図示省略したレ
ーザでヒューズ5aがI字状となる様に粗面3aを削成
し、その粗面3aに微少な金属粉末を含む触媒液を塗布
したものが図2(a)となる。図2(b),(c)は図
2(a)の変形である。
The manufacturing method of the first embodiment will be described below. In FIG. 1, a water-repellent insulating resin 3 is applied to one side surface of the element 1 and dried. The surface of the insulating resin 3 is ground by a laser (not shown) so that the fuse 5a becomes I-shaped, and the rough surface 3a is coated with a catalyst solution containing a minute amount of metal powder as shown in FIG. a). 2B and 2C are modifications of FIG. 2A.

【0015】図3(a)で、陽極リード2と対向面に前
述の粗面3aの一部を含めてカーボン層4を浸漬塗布形
成し、素子1全体を金属メッキ5させると、図3(b)
に示すヒューズ回路が形成される。
In FIG. 3A, the carbon layer 4 is formed by dip coating on the surface facing the anode lead 2 including a part of the rough surface 3a described above, and the entire element 1 is metal-plated 5. b)
The fuse circuit shown in is formed.

【0016】図3(c)で、ヒューズ回路の一部とカー
ボン層4とをシリコン樹脂6で浸漬塗布後、金属メッキ
層5陰極端子7とを銀ペースト8で接続し、陽極リード
2と陽極端子9とを溶接等で接続し、トランスファモー
ルド工法で樹脂外装し、陽陰極端子を成形すれば、第1
の実施例であるヒューズ入りチップ型固体電解コンデン
サが完成する。
In FIG. 3 (c), a part of the fuse circuit and the carbon layer 4 are dip-coated with a silicon resin 6, and then the metal plating layer 5 and the cathode terminal 7 are connected with a silver paste 8 to make the anode lead 2 and the anode. If the terminal 9 is connected by welding, etc., and the anode / cathode terminal is molded by resin transfer coating, the first
The chip-type solid electrolytic capacitor with a fuse, which is the embodiment of FIG.

【0017】次に、第2の実施例について述べる。第1
の実施例では、ヒューズ回路の形成に金属メッキ層5を
陰極端子7との接続を銀ペースト8で実施したが本実施
例では、金属メッキ層5上に同一形状のはんだ層(図示
省略)を形成し、陰極端子7との接続をはんだ付けで実
施しても同じ様な効果が得られる。本実施例では、陰極
端子との接続強度が得られ、はんだを使用することによ
りヒューズ部5aにも0.1mm程度のはんだが形成さ
れ温度ヒューズとして機能するという特徴を有する。
Next, a second embodiment will be described. First
In the embodiment described above, the metal plating layer 5 was connected to the cathode terminal 7 with the silver paste 8 to form the fuse circuit. However, in this embodiment, a solder layer (not shown) having the same shape is formed on the metal plating layer 5. The same effect can be obtained by forming and connecting to the cathode terminal 7 by soldering. The present embodiment is characterized in that the connection strength with the cathode terminal is obtained, and that solder is used to form solder of about 0.1 mm in the fuse portion 5a and functions as a thermal fuse.

【0018】次に、本発明の効果を確かめるために、本
発明のヒューズ入り固体電解コンデンサのヒューズ溶断
特性の結果について述べる。用いた試料は、本発明の第
1の実施例によるもの及び比較のため従来例各々100
0個である。これらの試料に過電流を流し、ヒューズ溶
断の状態を観察した。その結果は表1に示す通りで、本
実施例のものでは、ヒューズ5aが発熱してから溶断す
る迄の間にモールド樹脂10が破壊したものは1個もな
かった。また表には表示してないがコンデンサ素子1が
焼損したものも1個も発生せず、全数が安全装置として
確実に機能した。
Next, in order to confirm the effect of the present invention, the result of the fuse blowing characteristic of the solid electrolytic capacitor with a fuse of the present invention will be described. The samples used were 100 according to the first embodiment of the present invention and 100 for the conventional example for comparison.
It is 0. An overcurrent was applied to these samples to observe the blown state of the fuse. The results are shown in Table 1. In the present example, none of the mold resins 10 was broken between the time the fuse 5a generated heat and the time it was blown. Although not shown in the table, none of the capacitor elements 1 burned out, and all of them functioned reliably as safety devices.

【0019】[0019]

【表1】 [Table 1]

【0020】これは、従来のはんだによるヒューズ線に
比べ、数μm厚の金属メッキでヒューズを形成すること
で、従来に比べ60%以下の電流値でヒューズが溶断す
るためであると考えられる。尚、本実施例ではヒューズ
回路の形状をI字状としたが図2(b),(c)に示す
クランク状やジグザグ状としても同等の効果が得られる
ことは言うまでもない。又、ディップ型についても、ヒ
ューズ形状を変えれば容易に同等の効果が得られ、ディ
ップ型固体電解コンデンサが得られる。
It is considered that this is because the fuse is blown at a current value of 60% or less as compared with the conventional case by forming the fuse by metal plating having a thickness of several μm as compared with the conventional fuse wire made of solder. In this embodiment, the fuse circuit has an I shape, but it is needless to say that the same effect can be obtained by using the crank shape or the zigzag shape shown in FIGS. 2B and 2C. Also for the dip type, the same effect can be easily obtained by changing the fuse shape, and the dip type solid electrolytic capacitor can be obtained.

【0021】[0021]

【発明の効果】以上説明したように本発明は、素子の陰
極層上に金属メッキによるヒューズ回路を形成すること
により、(1)ヒューズ線の取扱いが無いため、自動化
が行いやすく、(2)レーザによりヒューズ形状が自在
に加工できるため、ヒューズ特性を製品の品種別に組合
せることが可能となり、(3)ヒューズ回路の形成後
は、製品の組立工程がヒューズを内蔵しない量産ライン
と共有できる等の効果がある。
As described above, according to the present invention, since the fuse circuit is formed by metal plating on the cathode layer of the element, (1) there is no handling of the fuse wire, so that automation is easy, and (2) Since the shape of the fuse can be freely processed by the laser, it is possible to combine the fuse characteristics for each product type. (3) After the fuse circuit is formed, the product assembly process can be shared with mass production lines that do not have a built-in fuse. Has the effect of.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例であるヒューズ入りチップ型
固体電解コンデンサの外層樹脂上部をはがした状態での
平面図及び側断面図である。
FIG. 1 is a plan view and a side sectional view of a chip type solid electrolytic capacitor with a fuse, which is an embodiment of the present invention, in a state where an outer layer resin upper portion is peeled off.

【図2】本発明の一実施例で、ヒューズ形状の形成を説
明するために工程順に示した素子の平面図である。
FIG. 2 is a plan view of an element showing the order of steps for explaining the formation of a fuse shape according to an embodiment of the present invention.

【図3】本発明の一実施例で、ヒューズ形成を説明する
ために工程順に示した素子の平面図である。
FIG. 3 is a plan view of an element, which is shown in order of steps for explaining fuse formation in an example of the present invention.

【図4】従来のヒューズ入りチップ型固体電解コンデン
サの斜視図及びその断面図である。
FIG. 4 is a perspective view and a sectional view of a conventional chip solid electrolytic capacitor with a fuse.

【符号の説明】[Explanation of symbols]

1 コンデンサ素子 1a 陰極層 2 陽極リード 3 絶縁樹脂 3a 粗面 4 カーボン層 5 金属メッキ層 5a ヒューズ部 5b ヒューズ線 6 シリコン樹脂層 7 陰極端子 8 銀ペースト 9 陽極端子 10 モールド樹脂 11 はんだ層 12 絶縁性接着剤 1 Capacitor Element 1a Cathode Layer 2 Anode Lead 3 Insulating Resin 3a Rough Surface 4 Carbon Layer 5 Metal Plating Layer 5a Fuse Part 5b Fuse Wire 6 Silicon Resin Layer 7 Cathode Terminal 8 Silver Paste 9 Anode Terminal 10 Mold Resin 11 Solder Layer 12 Insulation adhesive

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 固体電解コンデンサ素子と、前記固体電
解コンデンサ素子から導出された陽極リードと、前記陽
極リードに接続された陽極端子と、前記固体電解コンデ
ンサ素子の陰極層と陰極端子をヒューズで接続したヒュ
ーズ入り固体電解コンデンサにおいて、前記コンデンサ
素子の陰極層の一側面に塗布された絶縁樹脂層と、前記
コンデンサ素子の陽極リード導出面の対向面の陰極層上
に形成されたカーボン層と、前記絶縁樹脂層及び前記カ
ーボン層の上に順次被着された金属メッキ層,シリコン
樹脂層と、前記金属メッキ層の一部と導電性接着剤で接
続された陰極端子とを有し、前記絶縁樹脂面上に形成さ
れた金属メッキ層でヒューズを構成したことを特徴とす
るヒューズ入り固体電解コンデンサ。
1. A solid electrolytic capacitor element, an anode lead derived from the solid electrolytic capacitor element, an anode terminal connected to the anode lead, a cathode layer and a cathode terminal of the solid electrolytic capacitor element are connected by a fuse. In the solid electrolytic capacitor with a fuse, an insulating resin layer applied to one side surface of the cathode layer of the capacitor element, a carbon layer formed on the cathode layer opposite to the anode lead lead-out surface of the capacitor element, An insulating resin layer and a metal plating layer sequentially deposited on the carbon layer, a silicon resin layer, and a cathode terminal connected to a part of the metal plating layer with a conductive adhesive, A solid electrolytic capacitor with a fuse, characterized in that the fuse is composed of a metal plating layer formed on the surface.
【請求項2】 固体電解コンデンサ素子の一側面に絶縁
樹脂を塗布する工程と、前記絶縁樹脂面上をヒューズを
形成する形状にレーザで粗面加工し、金属粉末を含む触
媒液に浸漬・塗布する工程と、前記固体電解コンデンサ
素子の陰極層の一面にカーボンを浸漬・塗布する工程
と、前記粗面加工したヒューズ形成部と前記カーボン層
に無電解メッキし、メッキ層を形成する工程と、シリコ
ン樹脂を塗布する工程と、前記陽極リードと前記陽極端
子を接続する工程と、前記メッキ層の一部と陰極端子と
を導電性接着剤で接続する工程とを含むことを特徴とす
るヒューズ入り固体電解コンデンサの製造方法。
2. A step of applying an insulating resin to one side surface of the solid electrolytic capacitor element, and a surface roughening by laser of the insulating resin surface into a shape for forming a fuse, and dipping / application in a catalyst solution containing metal powder. A step of dipping and applying carbon to one surface of the cathode layer of the solid electrolytic capacitor element, a step of electrolessly plating the roughened fuse forming portion and the carbon layer, and forming a plating layer, A fuse including a step of applying a silicone resin, a step of connecting the anode lead and the anode terminal, and a step of connecting a part of the plating layer and a cathode terminal with a conductive adhesive. Manufacturing method of solid electrolytic capacitor.
JP5096370A 1993-04-23 1993-04-23 Fused solid electrolytic capacitor and method of manufacturing the same Expired - Fee Related JP3033647B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5096370A JP3033647B2 (en) 1993-04-23 1993-04-23 Fused solid electrolytic capacitor and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5096370A JP3033647B2 (en) 1993-04-23 1993-04-23 Fused solid electrolytic capacitor and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPH06310387A true JPH06310387A (en) 1994-11-04
JP3033647B2 JP3033647B2 (en) 2000-04-17

Family

ID=14163089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5096370A Expired - Fee Related JP3033647B2 (en) 1993-04-23 1993-04-23 Fused solid electrolytic capacitor and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JP3033647B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017204525A (en) * 2016-05-10 2017-11-16 住友電工プリントサーキット株式会社 Flexible printed wiring board and electronic parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017204525A (en) * 2016-05-10 2017-11-16 住友電工プリントサーキット株式会社 Flexible printed wiring board and electronic parts

Also Published As

Publication number Publication date
JP3033647B2 (en) 2000-04-17

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