JPH06308519A - Flexible electrooptical hybrid wiring board - Google Patents
Flexible electrooptical hybrid wiring boardInfo
- Publication number
- JPH06308519A JPH06308519A JP9265093A JP9265093A JPH06308519A JP H06308519 A JPH06308519 A JP H06308519A JP 9265093 A JP9265093 A JP 9265093A JP 9265093 A JP9265093 A JP 9265093A JP H06308519 A JPH06308519 A JP H06308519A
- Authority
- JP
- Japan
- Prior art keywords
- optical
- optical waveguide
- flexible
- substrate
- electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Liquid Crystal (AREA)
- Optical Couplings Of Light Guides (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、光情報処理装置用モジ
ュール内の光素子や電気素子を実装するための、フレキ
シブル電気光混載配線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible electro-optical hybrid wiring board for mounting an optical element or an electric element in a module for an optical information processing device.
【０００２】[0002]
【従来の技術】高周波ベアチップ半導体素子を実装する
ためのフレシキブル電気配線板としては、従来、特願昭
６３−９９６１６号公報に記載されている、図３に示す
ようなフィルムキャリヤがある。図において、３１はフ
レキシブル絶縁基板、３２は高周波用電気配線、３３は
接地用電極、３４はバイアス供給用電極、３５は開口
部、３６は素子接続用リードをそれぞれ示す。上記開口
部３５に半導体素子を配置し、素子接続用リード３６と
熱圧着または熱超音波等を用いて接続したのち、図示し
ていないアルミナ等の電気配線板と高周波用電気配線３
２、接地用電極３３およびバイアス供給用電極３４をそ
れぞれ接続して用いる。上記フレキシブル電気配線板
は、高周波ベアチップ半導体素子の入出力インピーダン
スと整合した電気配線構造とすることにより、高周波信
号伝送を可能にするけれども、光素子を実装して上記配
線板上で光信号伝送することはできない。2. Description of the Related Art As a flexible electric wiring board for mounting a high frequency bare chip semiconductor device, there is a film carrier as shown in FIG. 3 which is described in Japanese Patent Application No. 63-99616. In the figure, 31 is a flexible insulating substrate, 32 is high-frequency electrical wiring, 33 is a ground electrode, 34 is a bias supply electrode, 35 is an opening, and 36 is an element connection lead. After a semiconductor element is placed in the opening 35 and connected to the element connecting lead 36 by thermocompression bonding or thermosonic waves, an electric wiring board (not shown) such as alumina and the high frequency electric wiring 3 are formed.
2, the grounding electrode 33 and the bias supplying electrode 34 are connected and used. The flexible electrical wiring board enables high-frequency signal transmission by having an electrical wiring structure that matches the input / output impedance of the high-frequency bare chip semiconductor element, but the optical element is mounted and the optical signal transmission is performed on the wiring board. It is not possible.
【０００３】一方、光素子を実装するための光導波路基
板としては、従来、図４に示すような光導波路基板があ
る。なお、図４（ａ）は一部切断した斜視図、（ｂ）は
上記（ａ）中のＡ−Ａ断面におけるｙ−ｚ面内の様子を
示している。図において、４１は光導波路基板、４２は
リッジ型光導波路、４３は光素子、４４は電気配線、４
５ははんだバンプ、４６は光導波路ボード、４７は上記
光導波路ボード４６に設けた深溝、４８は上記光導波路
ボード４６に設けたリッジ型光導波路をそれぞれ示す。
上記光導波路基板４１はシリコン基板上に堆積したガラ
スを反応性イオンエッチング等により加工し、リッジ型
の光導波路４２を形成している。光素子４３は上記光導
波路基板４１上の電気配線４４とはんだバンプ４５によ
り接続され、上記光導波路４２の端部に設けたミラーに
より光結合し、光信号を上記光導波路４２に伝播させる
ことができる。On the other hand, as an optical waveguide substrate for mounting an optical element, there is a conventional optical waveguide substrate as shown in FIG. Note that FIG. 4A is a partially cut perspective view, and FIG. 4B shows a state in the yz plane in the AA cross section in FIG. 4A. In the figure, 41 is an optical waveguide substrate, 42 is a ridge type optical waveguide, 43 is an optical element, 44 is electrical wiring, 4
5 is a solder bump, 46 is an optical waveguide board, 47 is a deep groove provided in the optical waveguide board 46, and 48 is a ridge type optical waveguide provided in the optical waveguide board 46.
The optical waveguide substrate 41 is formed by processing glass deposited on a silicon substrate by reactive ion etching or the like to form a ridge type optical waveguide 42. The optical element 43 is connected to the electrical wiring 44 on the optical waveguide substrate 41 by a solder bump 45, and is optically coupled by a mirror provided at the end of the optical waveguide 42 so that an optical signal can be propagated to the optical waveguide 42. it can.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来技術において、複数の光導波路基板を上記光導波路ボ
ードにそれぞれ光接続し、多機能な光モジュールを実現
するためには、図４（ｂ）に示すように、上記光導波路
基板と光軸を一致させるための深溝を、上記光導波路基
板の寸法に合わせて、縦・横数ｍｍ、深さ１μｍ以下の
高精度で、数百μｍ（例えば５００μｍ）も加工を要す
るなどの難点があった。However, in the above prior art, in order to realize a multifunctional optical module by optically connecting a plurality of optical waveguide substrates to the above optical waveguide boards, FIG. As shown, a deep groove for aligning the optical axis with the optical waveguide substrate is aligned with the dimensions of the optical waveguide substrate with a high accuracy of several mm in length and width and 1 μm in depth and several hundred μm (for example, 500 μm). ) Also had the drawback that it required processing.
【０００５】本発明は、高速電気素子または高速電気素
子と光素子とを実装し、高速電気信号や光信号の伝達が
行える、柔軟性をもつフレキシブル電気光混載配線板を
得ることを目的とする。It is an object of the present invention to obtain a flexible flexible electro-optical hybrid wiring board which mounts a high-speed electric element or a high-speed electric element and an optical element and can transmit a high-speed electric signal or an optical signal. .
【０００６】[0006]
【課題を解決するための手段】上記目的は、同一基板上
に２以上の光導波路と電気素子とを備えたフレキシブル
電気光混載配線板において、フレキシブル基板上に固定
された２以上の光導波路を接続する光導波路と、上記電
気素子に電気を供給する電気配線とを備えた、電気絶縁
性を有するフレキシブル基板に、上記電気配線を介して
電気素子に接続するための端子と、上記２以上の光導波
路に接続するための結合器とを設け、上記電気素子が電
気光学素子である場合は、上記電気素子を介して接続す
る光導波路と、該光導波路を上記電気光学素子に光学的
に接続するための光学素子を備えることにより達成され
る。SUMMARY OF THE INVENTION The above-mentioned object is to provide a flexible electro-optical hybrid wiring board having two or more optical waveguides and electric elements on the same substrate, and to provide two or more optical waveguides fixed on the flexible substrate. A flexible substrate having an electrically insulating property, which comprises an optical waveguide to be connected and an electric wiring for supplying electricity to the electric element, a terminal for connecting to the electric element via the electric wiring, and two or more of the above. A coupler for connecting to the optical waveguide is provided, and when the electric element is an electro-optical element, an optical waveguide connected through the electric element and the optical waveguide is optically connected to the electro-optical element. It is achieved by providing an optical element for
【０００７】また、上記フレキシブル電気光混載配線板
における光導波路と電気素子が、該電気素子が独立して
ある場合に結合または分離することにより、光導波路が
チャネル間のスイッチ機能や増幅機能等を有する、曲
り、交差、分岐等の光回路を構成することにより達成さ
れる。Further, the optical waveguide and the electric element in the flexible electro-optical hybrid wiring board are combined or separated when the electric element is independent, so that the optical waveguide has a switching function between channels or an amplifying function. This is achieved by configuring an optical circuit having, bending, intersecting, branching, and the like.
【０００８】[0008]
【作用】上記のように構成されたフレキシブル電気光混
載配線板は、電気的絶縁性を有するフレキシブル基板上
に、フレキシブルな光導波路層を積層して電気配線と光
配線とを混載し、上記電気配線を介して電気素子に電気
を供給する端子と、フレキシブル基板上に固定された２
以上の光導波路に接続する結合器を設け、上記電気素子
を介して接続する光導波路を電気光学素子に接続できる
光学素子を設けたことにより、電気素子、または電気素
子と光素子を実装して、電気伝送および光伝送を行うこ
とができる。さらに、本配線板は柔軟性を有しているた
めに光導波路ボード等の他の光導波路基板に対する光接
続に際し、光導波路面を一致させるための高精度な開口
を上記光導波路ボードに加工する必要がなく、かつ、フ
レキシブル電気光混載配線板の光導波路端部に光ファイ
バを接続することで、通常のパットジョイント等の光導
波路−光ファイバ間結合技術により、光導波路ボードと
容易に光接続することができる。In the flexible electric / optical hybrid wiring board having the above-mentioned structure, a flexible optical waveguide layer is laminated on a flexible substrate having electrical insulation properties so that electrical wiring and optical wiring are mixedly mounted. Terminals that supply electricity to electric elements via wiring and 2 fixed on the flexible substrate
By providing a coupler that connects to the above optical waveguide and providing an optical element that can connect the optical waveguide that connects through the electric element to the electro-optical element, the electric element or the electric element and the optical element can be mounted. , Electrical transmission and optical transmission can be performed. Further, since this wiring board has flexibility, a high-precision opening is formed in the above-mentioned optical waveguide board so as to match the optical waveguide surfaces when optically connecting to another optical waveguide substrate such as an optical waveguide board. There is no need, and by connecting the optical fiber to the end of the optical waveguide of the flexible electro-optical mixed wiring board, the optical waveguide-optical fiber coupling technology such as the ordinary pad joint makes it easy to optically connect with the optical waveguide board. can do.
【０００９】[0009]
【実施例】つぎに本発明の実施例を図面とともに説明す
る。図１は本発明によるフレキシブル電気光混載配線板
の第１実施例を示す図、図２は本発明の第２実施例を示
す図である。Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a diagram showing a first embodiment of a flexible electro-optical hybrid wiring board according to the present invention, and FIG. 2 is a diagram showing a second embodiment of the present invention.
【００１０】第１実施例 本発明の第１実施例を示す図１において、（ａ）は外観
斜視図、（ｂ）は上記斜視図のｘｙ面要部断面図、
（ｃ）は上記斜視図のＡを含むｙｚ面要部断面図であ
る。ここで、１０は電気的絶縁性フレキシブル基板、１
１は光導波路クラッド、１２は光導波路コア、１３は高
周波用電極、１４はバイアス供給用電極、１５は接地用
電極、１６は光導波路コア１２の端部に接続された光フ
ァイバ、１７は面型光素子、１８は面型光素子１７を電
気的に接続するバンプ、１９は光導波路先端に設けたミ
ラー、１１１は光導波路基板、１１２は光導波路基板１
１１上に形成した光導波路クラッド、１１３は光導波路
クラッド１１２上に形成した光導波路コアを示す。First Embodiment In FIG. 1 showing a first embodiment of the present invention, (a) is an external perspective view, (b) is a cross-sectional view of the xy plane of the above perspective view,
FIG. 6C is a cross-sectional view of a main part of a yz plane including A in the perspective view. Here, 10 is an electrically insulating flexible substrate, 1
1 is an optical waveguide clad, 12 is an optical waveguide core, 13 is a high frequency electrode, 14 is a bias supply electrode, 15 is a ground electrode, 16 is an optical fiber connected to the end of the optical waveguide core 12, and 17 is a surface. Type optical element, 18 a bump for electrically connecting the surface type optical element 17, 19 a mirror provided at the tip of the optical waveguide, 111 an optical waveguide substrate, 112 optical waveguide substrate 1
An optical waveguide clad formed on 11 and an optical waveguide core 113 formed on the optical waveguide clad 112.
【００１１】例えばポリイミドからなる電気的絶縁性フ
レキシブル基板１０に、ホトリソグラフィ技術によりパ
ターニングを行い、高周波用電極１３、バイアス供給用
電極１４および接地電極１５を形成する。さらに、面型
光素子１７搭載用の開口部を化学エッチングまたは反応
性イオンエッチングにより形成し、例えば上記高周波用
電極１３上に面型光素子１７と電気的に接続するための
バンプ１８として、例えば金バンプをホトリソグラフィ
技術とめっき処理により形成する。フレキシブル光導波
路基板１１１は、例えばふっ素化ポリイミド材料をシリ
コン基板上でスピンコート・キュアして、光導波路クラ
ッド１１層および光導波路コア１２層を形成し、例えば
反応性イオンエッチングによりリッジ型光導波路を形成
したのち、収束イオンビーム等を用いてビーム焦点深度
を徐々に変化させながら、図１（ｂ）に示すように光導
波路中にミラー１９を形成する。さらに、面型光素子１
７を搭載するための開口部を、化学エッチングまたは反
応性イオンエッチング等により形成したのち、上記シリ
コン基板から剥離することにより得られる。この後、上
記電気的絶縁性フレキシブル基板１０と上記フレキシブ
ル光導波路基板１１１を、例えば紫外線接着剤で接着す
ることにより本発明のフレキシブル電気光混載配線板が
得られる。The electrically insulating flexible substrate 10 made of, for example, polyimide is patterned by a photolithography technique to form a high frequency electrode 13, a bias supply electrode 14 and a ground electrode 15. Further, an opening for mounting the surface-type optical element 17 is formed by chemical etching or reactive ion etching, and as a bump 18 for electrically connecting with the surface-type optical element 17 on the high frequency electrode 13, for example, Gold bumps are formed by photolithography and plating. For the flexible optical waveguide substrate 111, for example, a fluorinated polyimide material is spin-coated and cured on a silicon substrate to form an optical waveguide clad 11 layer and an optical waveguide core 12 layer, and a ridge type optical waveguide is formed by, for example, reactive ion etching. After the formation, the mirror 19 is formed in the optical waveguide as shown in FIG. 1B while gradually changing the beam focal depth using a focused ion beam or the like. Furthermore, the surface-type optical element 1
It is obtained by forming an opening for mounting 7 by chemical etching or reactive ion etching and then peeling the opening from the silicon substrate. Then, the electrically insulating flexible substrate 10 and the flexible optical waveguide substrate 111 are bonded to each other with, for example, an ultraviolet adhesive to obtain the flexible electro-optical hybrid wiring board of the present invention.
【００１２】上記フレキシブル電気光混載配線板を上記
フレキシブル光導波路基板１１１上のリッジ型光導波路
と光接続させる方法の一例を図１（ｃ）に示す。光導波
路基板１１１上のリッジ型光導波路は、光導波路クラッ
ド１１２層および光導波路コア１１３層を例えば反応性
イオンエッチングすることによって得られる。上記リッ
ジ型光導波路とフレキシブル電気光混載配線板に接続・
固定された光ファイバ１６との光接続は、例えば上記リ
ッジ型光導波路端部に光ファイバ挿入用のガイド溝（図
示せず）を上記リッジ型光導波路と同時に形成し、上記
ガイド溝に光ファイバ１６を挿入して光導波路基板１１
１上のリッジ型光導波路端面につきあて、例えば紫外線
硬化型接着剤等で接着し固定すればよい。上記方法によ
れば、図４に示した従来技術のように、上記光導波路基
板１１１にフレキシブル電気光混載配線板を配置するた
めの開口を形成する必要がなくなる。An example of a method for optically connecting the flexible electro-optical hybrid wiring board to the ridge type optical waveguide on the flexible optical waveguide substrate 111 is shown in FIG. 1 (c). The ridge type optical waveguide on the optical waveguide substrate 111 is obtained by, for example, reactive ion etching the optical waveguide clad 112 layer and the optical waveguide core 113 layer. Connect to the ridge type optical waveguide and flexible electro-optical mixed wiring board
For optical connection with the fixed optical fiber 16, for example, a guide groove (not shown) for inserting an optical fiber is formed at the end of the ridge type optical waveguide simultaneously with the ridge type optical waveguide, and the optical fiber is inserted into the guide groove. 16 is inserted and the optical waveguide substrate 11 is inserted.
The end face of the ridge-type optical waveguide on 1 may be affixed and fixed by, for example, an ultraviolet-curing adhesive. According to the above method, it is not necessary to form an opening for arranging the flexible electro-optical hybrid wiring board in the optical waveguide substrate 111 as in the prior art shown in FIG.
【００１３】なお、上記フレキシブル電気光混載配線板
の形成としては、上記の接着剤による電気的絶縁性フレ
キシブル基板１０とフレキシブル光導波路基板１１との
一体化のほかに、上記電気的絶縁性フレキシブル基板１
０上で光導波路材料をスピンコート・キュアおよびエッ
チング処理して一体化させてもよい。また、上記光導波
路は直線形状のみでなく、曲り、交差、分岐などの光回
路であってもよい。上記電気的絶縁性フレキシブル基板
材料はポリイミドの他にエポキシ系樹脂等を用いてもよ
く、さらに上記光導波路材料としてポリメチルメタクリ
レート等を用いてもよい。また、光導波路構造として
は、リッジ型の他に埋め込み型でもよい。さらに、上記
ミラー１９の形成方法として、反応性イオンビームやレ
ーザ等を用いてもよいことはいうまでもない。The flexible electric / optical hybrid wiring board is formed by integrating the electrically insulating flexible substrate 10 and the flexible optical waveguide substrate 11 with the adhesive as described above, as well as the electrically insulating flexible substrate. 1
The optical waveguide material may be integrated by spin coating, curing and etching on the surface. Further, the above-mentioned optical waveguide is not limited to a linear shape, and may be an optical circuit having a bend, an intersection, a branch, or the like. As the electrically insulating flexible substrate material, epoxy resin or the like may be used in addition to polyimide, and polymethyl methacrylate or the like may be used as the optical waveguide material. The optical waveguide structure may be a buried type instead of the ridge type. Further, it goes without saying that a reactive ion beam, a laser, or the like may be used as a method of forming the mirror 19.
【００１４】第２実施例 上記第１実施例ではフレキシブル電気光混載配線板の光
導波路内にミラーを設けた例を示したが、光導波路のみ
が形成されている場合の実施例を、第２実施例として図
２により説明する。図２において、（ａ）は外観斜視
図、（ｂ）は上記斜視図のｘｙ面要部断面図、（ｃ）は
上記斜視図のＡを含むｙｚ面要部断面図である。図中、
２１は電気的絶縁性フレキシブル基板、２２は光導波路
クラッド、２３は光導波路コア、２４は高周波用電極、
２５はバイアス供給用電極、２６は接地用電極、２７は
光導波路コア２３の端部に接続された光ファイバ、２８
は電気素子、２９は電気素子２８の接続用バンプ、２１
１は光導波路基板、２１２は光導波路基板２１１上に形
成された光導波路クラッド、２１３は光導波路クラッド
２１２上に形成された光導波路コアを示す。Second Embodiment In the first embodiment described above, the example in which the mirror is provided in the optical waveguide of the flexible electro-optical mixed wiring board is shown. However, the embodiment in which only the optical waveguide is formed is described in the second embodiment. An example will be described with reference to FIG. 2, (a) is an external perspective view, (b) is a cross-sectional view of a main part of the xy plane of the above-mentioned perspective view, and (c) is a cross-sectional view of a main part of the yz plane including A of the above-mentioned perspective view. In the figure,
21 is an electrically insulating flexible substrate, 22 is an optical waveguide clad, 23 is an optical waveguide core, 24 is a high frequency electrode,
Reference numeral 25 is a bias supply electrode, 26 is a ground electrode, 27 is an optical fiber connected to the end of the optical waveguide core 23, 28
Is an electric element, 29 is a bump for connecting the electric element 28, 21
Reference numeral 1 is an optical waveguide substrate, 212 is an optical waveguide clad formed on the optical waveguide substrate 211, and 213 is an optical waveguide core formed on the optical waveguide clad 212.
【００１５】例えばポリイミドからなる電気的絶縁性フ
レキシブル基板２１にホトリソグラフィ技術によりパタ
ーニングを行い、高周波用電極２４、バイアス供給用電
極２５および接地電極２６を形成する。さらに、電気素
子２８搭載用の開口部を化学エッチングまたは反応性イ
オンエッチング等により形成し、上記高周波用電極２
４、バイアス供給用電極２５、接地用電極２６上に、上
記電気素子２８との接続用バンプ２９として、例えば金
バンプをホトリソグラフィ技術とめっき処理により形成
する。上記フレキシブル光導波路基板２１１は、例えば
ふっ素化ボリイミド材料をシリコン基板上でスピンコー
ト・キュアし、光導波路クラッド２２層および光導波路
コア２３層を形成したのち、例えば反応性イオンエッチ
ングを用いてリッジ型光導波路を形成し、電気素子２８
を搭載するための開口部を反応性イオンエッチング等に
より形成して、上記シリコン基板から剥離することによ
り図２（ｂ）のように得られる。その後、電気的絶縁性
フレキシブル基板２１と上記フレキシブル光導波路基板
２１１とを、図示していない位置合わせ装置により位置
合わせしたのち、例えば紫外線硬化型接着剤で接着し、
リッジ型光導波路端部に光ファイバを紫外線接着剤など
で接着して、本発明のフレキシブル電気光混載配線板が
得られる。The electrically insulating flexible substrate 21 made of, for example, polyimide is patterned by a photolithography technique to form a high frequency electrode 24, a bias supply electrode 25 and a ground electrode 26. Further, an opening for mounting the electric element 28 is formed by chemical etching or reactive ion etching, and the high frequency electrode 2 is formed.
4. On the bias supply electrode 25 and the ground electrode 26, for example, gold bumps are formed as the connection bumps 29 with the electric elements 28 by the photolithography technique and the plating process. The flexible optical waveguide substrate 211 is formed into a ridge type by, for example, reactive ion etching after spin coating and curing a fluorinated polyimide material on a silicon substrate to form an optical waveguide clad 22 layer and an optical waveguide core 23 layer. An optical element is formed by forming an optical waveguide.
2B is obtained by forming an opening for mounting the substrate by reactive ion etching or the like and peeling the opening from the silicon substrate. After that, the electrically insulative flexible substrate 21 and the flexible optical waveguide substrate 211 are aligned with each other by an alignment device (not shown), and then bonded with, for example, an ultraviolet curable adhesive,
An optical fiber is bonded to the end portion of the ridge type optical waveguide with an ultraviolet adhesive or the like to obtain the flexible electro-optical hybrid wiring board of the present invention.
【００１６】上記フレキシブル電気光混載配線板を光導
波路基板２１１上のリッジ型光導波路と光接続させる方
法の一例を図２（ｃ）に示す。上記光導波路基板２１１
上のリッジ型光導波路は、光導波路クラッド２１２層お
よび光導波路コア２１３層を、例えば反応性イオンエッ
チングすることにより得られる。上記リッジ型光導波路
と上記フレキシブル電気光混載配線板に接続・固定され
た光ファイバ２７との光接続は、例えば光導波路基板２
１１上のリッジ型光導波路端部に光ファイバ挿入用のガ
イド溝（図示せず）を上記リッジ型光導波路と同時に形
成し、上記ガイド溝に光ファイバ２７を挿入して光導波
路基板２１１上のリッジ光導波路端面につきあて、例え
ば紫外線硬化型接着剤で接着・固定すればよい。上記方
法によれば図４（ｂ）に示す従来技術のように、光導波
路基板２１１にフレキシブル電気光混載配線板を配置す
るための深溝を形成する必要がなくなる。FIG. 2C shows an example of a method for optically connecting the flexible electro-optical hybrid wiring board to the ridge type optical waveguide on the optical waveguide substrate 211. The optical waveguide substrate 211
The upper ridge type optical waveguide is obtained by, for example, reactive ion etching the optical waveguide clad 212 layer and the optical waveguide core 213 layer. The optical connection between the ridge type optical waveguide and the optical fiber 27 connected / fixed to the flexible electro-optical hybrid wiring board is performed by, for example, the optical waveguide substrate 2
A guide groove (not shown) for inserting an optical fiber is formed at the end portion of the ridge type optical waveguide on the optical waveguide substrate 11 at the same time as the ridge type optical waveguide, and the optical fiber 27 is inserted into the guide groove to place on the optical waveguide substrate 211. The end surface of the ridge optical waveguide may be affixed and fixed with, for example, an ultraviolet curable adhesive. According to the above method, it is not necessary to form a deep groove for arranging the flexible electro-optical hybrid wiring board on the optical waveguide substrate 211 as in the conventional technique shown in FIG.
【００１７】なお、上記フレキシブル電気光混載配線板
の形成として、上記接着剤による電気的絶縁性フレキシ
ブル基板２１とフレキシブル光導波路基板２２との一体
化の他に、上記電気的絶縁性フレキシブル基板２１上
で、光導波路材料をスピンコート・キュアおよびエッチ
ング処理して一体化してもよい。また、光導波路は直線
形状のみでなく、曲り、交差、分岐等の光回路であって
もよい。また、電気的絶縁性フレキシブル基板材料はポ
リイミドの他にエポキシ系樹脂等を用いてもよく、さら
に光導波路材料としてポリメチルメタクリレートを用い
てもよい。また、光導波路構造としては、埋め込み型な
どでもよいことはいうまでもない。In addition to the integration of the electrically insulating flexible substrate 21 and the flexible optical waveguide substrate 22 by the adhesive, the flexible electrically-optical mixed wiring board is formed on the electrically insulating flexible substrate 21 in order to form the flexible electrically-optical mixed wiring board. Then, the optical waveguide material may be integrated by spin coating, curing and etching. Further, the optical waveguide is not limited to a linear shape, and may be an optical circuit having a bend, an intersection, a branch, or the like. Further, as the electrically insulating flexible substrate material, epoxy resin or the like may be used in addition to polyimide, and polymethyl methacrylate may be used as the optical waveguide material. Further, it goes without saying that the optical waveguide structure may be a buried type or the like.
【００１８】[0018]
【発明の効果】上記のように本発明によるフレキシブル
電気光混載配線板は、同一基板上に２以上の光導波路と
電気素子とを備えたフレキシブル電気光混載配線板にお
いて、フレキシブル基板上に固定された２以上の光導波
路を接続する光導波路と、上記電気素子に電気を供給す
る電気配線とを備えた、電気絶縁性を有するフレキシブ
ル基板に、上記電気配線を介して電気素子に接続するた
めの端子と、上記２以上の光導波路に接続するための結
合器とを設け、上記電気素子が電気光学素子である場合
は、上記電気素子を介して接続する光導波路と、該光導
波路を上記電気光学素子に光学的に接続するための光学
素子を備えることにより、電気的絶縁性を有するフレキ
シブル基板上にフレキシブル光導波路層を積層し、電気
配線と光配線とを混載することにより、電気素子または
電気素子と光素子とを実装して、電気伝送および光伝送
を行うことができる。さらに、本フレキシブル電気光混
載配線板は柔軟性を有しているため、光導波路ボード等
の他の光導波路基板との光接続に際し、光導波路面を一
致させるための高精度な開口を光導波路ボードに加工す
る必要はなく、かつ、フレキシブル電気光混載配線板の
光導波路端部に光ファイバを接続することによって、通
常のバットジョイント等の光導波路−光ファイバ間結合
技術により、上記光導波路ボードと容易に光接続するこ
とが可能である。As described above, the flexible electro-optical hybrid wiring board according to the present invention is a flexible electro-optical hybrid wiring board provided with two or more optical waveguides and electric elements on the same substrate, and is fixed on the flexible substrate. For connecting to an electric element via the electric wiring, to a flexible substrate having an electric insulation property, which includes an optical waveguide connecting two or more optical waveguides and electric wiring for supplying electricity to the electric element. When a terminal and a coupler for connecting to the two or more optical waveguides are provided, and the electric element is an electro-optical element, an optical waveguide connected through the electric element and the optical waveguide By providing an optical element for optically connecting to the optical element, a flexible optical waveguide layer is laminated on a flexible substrate having electrical insulation, and electric wiring and optical wiring are provided. By placing, by implementing an electrical device or an electrical element and the optical element, it is possible to perform electrical transmission and optical transmission. Furthermore, since this flexible electro-optical hybrid wiring board has flexibility, it is possible to provide a highly accurate opening for matching the optical waveguide surfaces when making an optical connection with another optical waveguide substrate such as an optical waveguide board. The optical waveguide board is not required to be processed into a board, and by connecting an optical fiber to the end of the optical waveguide of the flexible electric / optical mixed wiring board, the optical waveguide-optical fiber coupling technique such as a normal butt joint is used. It is possible to easily make an optical connection with.
【図１】本発明によるフレキシブル電気光混載配線板の
第１実施例を示す図で、（ａ）は外観斜視図、（ｂ）は
上記斜視図のｘｙ面要部断面図、（ｃ）は上記斜視図の
Ａを含むｙｚ面要部断面図である。1A and 1B are views showing a first embodiment of a flexible electro-optical hybrid wiring board according to the present invention, in which FIG. 1A is an external perspective view, FIG. 1B is a cross-sectional view of the xy plane of the perspective view, and FIG. FIG. 6 is a cross-sectional view of a main part of a yz plane including A in the perspective view.
【図２】本発明の第２実施例を示す図で、（ａ）は外観
斜視図、（ｂ）は上記斜視図のｘｙ面要部断面図、
（ｃ）は上記斜視図のＡを含むｙｚ面要部断面図であ
る。2A and 2B are views showing a second embodiment of the present invention, in which FIG. 2A is an external perspective view, FIG.
FIG. 6C is a cross-sectional view of a main part of a yz plane including A in the perspective view.
【図３】従来のフレキシブル電気配線板のフィルムキャ
リヤを示す図である。FIG. 3 is a view showing a film carrier of a conventional flexible electric wiring board.
【図４】従来の光導波路基板の例を示す図で、（ａ）は
一部切断した斜視図、（ｂ）は上記（ａ）におけるＡ−
Ａ断面の要部を示す図である。FIG. 4 is a view showing an example of a conventional optical waveguide substrate, (a) is a partially cut perspective view, and (b) is A- in (a).
It is a figure which shows the principal part of A cross section.
１１、２１…電気的絶縁性フレキシブル基板 １３…高周波用電極 １４、２５…バイア
ス供給用電極 １５、２６…接地用電極 １７…面型光素子 １９…光学素子（ミラー） ２２…フレキシブル
光導波路基板 ２８…電気素子 １１１、２１１…光
導波路基板11, 21 ... Electrically insulating flexible substrate 13 ... High frequency electrode 14, 25 ... Bias supply electrode 15, 26 ... Grounding electrode 17 ... Planar optical element 19 ... Optical element (mirror) 22 ... Flexible optical waveguide substrate 28 ... Electric elements 111, 211 ... Optical waveguide substrate
Claims (2)
とを備えたフレキシブル電気光混載配線板において、フ
レキシブル基板上に固定された２以上の光導波路を接続
する光導波路と、上記電気素子に電気を供給する電気配
線とを備えた、電気絶縁性を有するフレキシブル基板
に、上記電気配線を介して電気素子に接続するための端
子と、上記２以上の光導波路に接続するための結合器と
を設け、上記電気素子が電気光学素子である場合は、上
記電気素子を介して接続する光導波路と、該光導波路を
上記電気光学素子に光学的に接続するための光学素子を
備えることを特徴とするフレキシブル電気光混載配線
板。1. A flexible electric-optical hybrid wiring board comprising two or more optical waveguides and electric elements on the same substrate, and an optical waveguide for connecting two or more optical waveguides fixed on the flexible substrate, A flexible substrate having electrical insulation, which comprises an electric wiring for supplying electricity to the element, a terminal for connecting to the electric element via the electric wiring, and a coupling for connecting to the two or more optical waveguides. And an optical element for optically connecting the optical waveguide to the electro-optical element when the electric element is an electro-optical element. Flexible electro-optical mixed wiring board characterized by.
素子が独立してある場合に、結合または分離することに
より、光導波路がチャネル間のスイッチ機能や増幅機能
等を有する曲り、交差、分岐等の光回路を構成すること
を特徴とする請求項１記載のフレキシブル電気光混載配
線板。2. The optical waveguide and the electric element are bent or intersecting so that the optical waveguide has a switching function between channels or an amplifying function by coupling or separating when the electric element is independent. 2. The flexible electro-optical hybrid wiring board according to claim 1, which constitutes an optical circuit such as a branch or a branch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9265093A JPH06308519A (en) | 1993-04-20 | 1993-04-20 | Flexible electrooptical hybrid wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9265093A JPH06308519A (en) | 1993-04-20 | 1993-04-20 | Flexible electrooptical hybrid wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06308519A true JPH06308519A (en) | 1994-11-04 |
Family
ID=14060341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9265093A Pending JPH06308519A (en) | 1993-04-20 | 1993-04-20 | Flexible electrooptical hybrid wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06308519A (en) |
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| US6936854B2 (en) | 2001-05-10 | 2005-08-30 | Canon Kabushiki Kaisha | Optoelectronic substrate |
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| US6936854B2 (en) | 2001-05-10 | 2005-08-30 | Canon Kabushiki Kaisha | Optoelectronic substrate |
| US6970610B2 (en) | 2002-03-25 | 2005-11-29 | Canon Kabushiki Kaisha | Optical transmission sheet, optoelectric apparatus, and optical transmission method |
| JP2003302543A (en) * | 2002-04-10 | 2003-10-24 | Matsushita Electric Ind Co Ltd | Opto-electric circuit and opto-electric wiring board |
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| JP2008310066A (en) * | 2007-06-15 | 2008-12-25 | Hitachi Cable Ltd | Optoelectric composite transmission assembly and module |
| JP4613964B2 (en) * | 2008-01-21 | 2011-01-19 | 富士ゼロックス株式会社 | Photoelectric composite wiring module and information processing apparatus |
| JP2008158539A (en) * | 2008-01-21 | 2008-07-10 | Fuji Xerox Co Ltd | Photoelectric composite wiring module and information processor |
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| JP2011018076A (en) * | 2008-06-10 | 2011-01-27 | Sumitomo Bakelite Co Ltd | Electronic device and cellular phone |
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