JPH06308245A - Surface pollution inspection device - Google Patents

Surface pollution inspection device

Info

Publication number
JPH06308245A
JPH06308245A JP9573793A JP9573793A JPH06308245A JP H06308245 A JPH06308245 A JP H06308245A JP 9573793 A JP9573793 A JP 9573793A JP 9573793 A JP9573793 A JP 9573793A JP H06308245 A JPH06308245 A JP H06308245A
Authority
JP
Japan
Prior art keywords
smear
subject
recess
control circuit
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9573793A
Other languages
Japanese (ja)
Inventor
Junichi Tabata
淳一 田畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP9573793A priority Critical patent/JPH06308245A/en
Publication of JPH06308245A publication Critical patent/JPH06308245A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the reduction of the measurement precision and measurement efficiency and prevent the damage of a device main body by detecting the distance between the shift tip of a smear collecting member and the surface of a subject, and keeping the smear pressure of the member constant. CONSTITUTION:When a recess 4a exists on the surface of a subject 4 during smearing, the position and shape of the recess 4a are obtained by a position measurement control circuit 22 based on the position signal from a position sensor 21a and the rotation signal of an inspection bed 5, and the corresponding surface position data are stored 24 before the recess 4a is smeared with the filter paper 6. When a wiping arm head section 7 reaches the recess 4a, a position shift control circuit 23 retreats the head section 7 in the horizontal direction (right and left direction of the paper surface) by the shift quantity corresponding to the surface position data and continuously smears the subject 4 while the smear pressure by the filter paper 6 is controlled constant. The circuit 23 controls an arm drive section 10 so that the head section 7 is correctly moved based on the surface position data.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、原子力施設から搬出さ
れる放射性固体廃棄物(以下、被検体という)の表面汚
染検査装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface contamination inspection apparatus for radioactive solid waste (hereinafter referred to as "inspection object") carried out from a nuclear facility.

【0002】[0002]

【従来の技術】原子力施設では、施設内から搬出しよう
とする被検体の外観、表面汚染、放射線量が測定,検査
され、汚染等の問題のないものだけを施設外に搬出する
ようにしている。
2. Description of the Related Art In a nuclear facility, the appearance, surface contamination, and radiation dose of an object to be taken out of the facility are measured and inspected, and only those that have no problem such as contamination are taken out of the facility. .

【0003】図2はこの種の検査工程の構成を示すブロ
ック図である。この検査工程は、ITVモニタを備えた
外観検査装置1により被検体のキズの有無を目視検査す
る。次に、表面汚染検査装置2は被検体の表面をスミヤ
採取用部材としてのろ紙で擦る(スミヤする)と共に、
そのろ紙の汚染量を測定することにより、表面汚染の有
無を検査する。さらに、放射能測定装置3は放射線モニ
タを用いて放射線量を測定する。
FIG. 2 is a block diagram showing the structure of this type of inspection process. In this inspection step, the appearance inspection apparatus 1 equipped with an ITV monitor visually inspects the subject for flaws. Next, the surface contamination inspection device 2 rubs (smears) the surface of the subject with filter paper as a smear sampling member, and
By measuring the amount of contamination of the filter paper, the presence or absence of surface contamination is inspected. Further, the radioactivity measuring device 3 measures the radiation dose using a radiation monitor.

【0004】一方、このような検査工程により検査され
る被検体は、施設への受入又は貯蔵期間中に他のものと
の干渉などによって外観形状が変形するため、表面にか
なりの凹凸がある。
On the other hand, an object to be inspected by such an inspection process has a considerably uneven surface because its external shape is deformed due to interference with other objects during reception or storage in the facility.

【0005】また、前述した検査工程のうち、外観検査
は被検体の局部のキズを主に確認するため、被検体表面
の凹凸を検査しきれないという性質がある。このため、
外観検査で合格とされた被検体は凹凸が大きくても表面
汚染測定装置2に送出されて検査される。
Further, of the above-mentioned inspection steps, the visual inspection mainly confirms local scratches on the subject, and therefore has the property that the unevenness on the subject surface cannot be completely inspected. For this reason,
An object that has passed the visual inspection is sent to the surface contamination measuring device 2 and inspected even if the unevenness is large.

【0006】図3はこの表面汚染検査装置の構成を示す
概略図である。この表面汚染検査装置は、所定の形状を
有する被検体4が検査台5に載置され、この検査台5が
当該被検体4を回転させる。また、この被検体4をスミ
ヤするスミヤ採取用部材としてのろ紙6が先端に装着さ
れた拭取りアームヘッド部7と、この拭取りアームヘッ
ド部7に取付けられ,例えばゴムのように弾性を有する
ヘッド位置補正機構部8と、このヘッド位置補正機構部
8に取付けられたスミヤアーム部9とを備えてなるスミ
ヤアームが上下移動可能及び進退可能にアーム駆動部1
0に設けられている。
FIG. 3 is a schematic view showing the structure of this surface contamination inspection apparatus. In this surface contamination inspection apparatus, a subject 4 having a predetermined shape is placed on an examination table 5, and the examination table 5 rotates the subject 4. Further, a wiping arm head portion 7 having a filter paper 6 as a smear collecting member for smearing the subject 4 attached to the tip, and a wiping arm head portion 7 attached to the wiping arm head portion 7 and having elasticity like rubber, for example. The arm drive unit 1 is provided with a head position correction mechanism 8 and a smear arm 9 attached to the head position correction mechanism 8 so that the smear arm can move up and down and move forward and backward.
It is set to 0.

【0007】アーム駆動部10は、スミヤアーム部9を
駆動させるモータ11を有し、駆動制御部12に制御さ
れてスミヤアームを駆動させる。駆動制御部12は、所
定の手順や位置信号に基づいてアーム駆動部10のモー
タ11を駆動してスミヤアーム部9を被検体4側に進行
させた後、アーム駆動部10を制御してスミヤアーム部
9を下降させる。これにより、スミヤアーム先端のろ紙
6は当該被検体4をスミヤする。
The arm drive unit 10 has a motor 11 for driving the smear arm unit 9, and drives the smear arm under the control of the drive control unit 12. The drive control unit 12 drives the motor 11 of the arm drive unit 10 based on a predetermined procedure or a position signal to advance the smear arm unit 9 to the subject 4 side, and then controls the arm drive unit 10 to control the smear arm unit. Lower 9 As a result, the filter paper 6 at the tip of the smear arm smears the subject 4.

【0008】なお、被検体4の凹凸は、ヘッド位置補正
機構部8の弾性によって吸収される。スミヤが終わる
と、スミヤ後のろ紙6に付着した放射能汚染量を測定
し、当該被検体4の汚染の有無を検査し、この検査結果
に応じて被検体4を検査台5から搬出する。
The unevenness of the subject 4 is absorbed by the elasticity of the head position correction mechanism section 8. When the smearing is finished, the amount of radioactive contamination adhering to the filter paper 6 after smearing is measured, the presence or absence of contamination of the subject 4 is inspected, and the subject 4 is carried out from the inspection table 5 according to the inspection result.

【0009】[0009]

【発明が解決しようとする課題】しかしながら、以上の
ような表面汚染検査装置では、外観検査で合格した被検
体4のうち、凹凸の大きい被検体4を検査するとき、ス
ミヤ圧が一定にならず、表面を均一にスミヤできない問
題がある。
However, in the surface contamination inspection apparatus as described above, when inspecting a subject 4 having large unevenness among the subjects 4 that have passed the visual inspection, the smear pressure does not become constant. There is a problem that the surface cannot be smeared uniformly.

【0010】また、最も有効に設定したスミヤ圧が変動
することにより、汚染測定精度及び汚染測定効率が低下
する問題がある。さらに、凹凸が非常に大きいとヘッド
位置補正機構部8で吸収できず、拭取りアームヘッド部
7が損傷して検査工程が中断する可能性がある。
Further, since the smear pressure set most effectively fluctuates, there is a problem that the contamination measurement accuracy and the contamination measurement efficiency decrease. Furthermore, if the unevenness is very large, the head position correction mechanism 8 cannot absorb the damage, and the wiping arm head 7 may be damaged and the inspection process may be interrupted.

【0011】本発明は上記実情を考慮してなされたもの
で、被検体の表面の凹凸を測定することにより、汚染測
定精度及び表面汚染測定効率の低下を防ぎ、装置本体の
損傷を防止し得る表面汚染検査装置を提供することを目
的とする。
The present invention has been made in consideration of the above-mentioned circumstances, and by measuring the unevenness of the surface of the subject, it is possible to prevent the deterioration of the contamination measurement accuracy and the surface contamination measurement efficiency, and to prevent the damage of the apparatus main body. An object is to provide a surface contamination inspection device.

【0012】[0012]

【課題を解決するための手段】請求項1に対応する発明
は、被検体の表面に対してスミヤ採取用部材を擦りなが
ら移動させ、このスミヤ採取用部材の放射能汚染量から
前記被検体の表面汚染を検査する表面汚染検査装置にお
いて、前記スミヤ採取用部材の移動先における前記被検
体の表面との距離を検出する位置検出手段と、この位置
検出手段による検出結果に基づいて、前記スミヤ採取用
部材のスミヤ圧を一定にするように前記スミヤ採取用部
材の位置を制御するスミヤ圧制御手段とを備えた放射能
汚染検査装置である。
According to a first aspect of the present invention, the smear collecting member is moved while rubbing against the surface of the subject, and the amount of radioactive contamination of the smear collecting member is used to detect the subject. In a surface contamination inspection device for inspecting surface contamination, position detection means for detecting a distance from the surface of the subject at the destination of movement of the smear collection member, and the smear collection based on the detection result by the position detection means. And a smear pressure control means for controlling the position of the smear collecting member so as to keep the smear pressure of the working member constant.

【0013】また、請求項2に対応する発明は、請求項
1に対応する発明の表面汚染検査装置において、前記位
置検出手段による検出結果が前記スミヤ採取用部材の所
定の限界移動量を越えたとき、前記スミヤ工程を停止さ
せて装置本体を保護するスミヤ停止手段を付加した表面
汚染検査装置である。
According to a second aspect of the present invention, in the surface contamination inspection apparatus according to the first aspect of the invention, the detection result of the position detecting means exceeds a predetermined limit movement amount of the smear collecting member. At this time, the surface contamination inspecting device is provided with a smear stopping means for stopping the smear process to protect the device body.

【0014】[0014]

【作用】従って、本発明は以上のような手段を講じたこ
とにより、表面汚染検査装置において、位置検出手段に
よりスミヤ採取用部材の移動先における被検体の表面と
の距離が検出されると、スミヤ圧制御手段により該検出
結果に基づいてスミヤ採取用部材のスミヤ圧を一定にす
るようにスミヤ採取用部材の位置が制御される。また、
表面汚染検査装置において、位置検出手段による検出結
果がスミヤ採取用部材の所定の限界移動量を越えると、
スミヤ停止手段によりスミヤ工程が停止されて装置本体
が保護される。
Therefore, according to the present invention, by taking the above-mentioned means, in the surface contamination inspecting apparatus, when the position detecting means detects the distance to the surface of the subject at the destination of the smear collecting member, The position of the smear collecting member is controlled by the smear pressure control means based on the detection result so that the smear pressure of the smear collecting member becomes constant. Also,
In the surface contamination inspection device, when the detection result by the position detecting means exceeds the predetermined limit movement amount of the smear collecting member,
The smear process is stopped by the smear stopping means, and the apparatus body is protected.

【0015】このように、被検体の表面の凹凸を測定す
ることにより、スミヤ圧を一定にして汚染測定精度及び
表面汚染測定効率の低下を防ぎ、装置本体の損傷を防止
することができる。
As described above, by measuring the unevenness of the surface of the subject, the smear pressure can be made constant and the contamination measurement accuracy and the surface contamination measurement efficiency can be prevented from deteriorating, and the device body can be prevented from being damaged.

【0016】[0016]

【実施例】以下、本発明の実施例について図面を参照し
て説明する。図1は本発明の一実施例に係る表面汚染検
査装置の構成を示す概略図であり、図3と同一部分には
同一符号を付してその詳しい説明は省略し、ここでは異
なる部分についてのみ述べる。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram showing the structure of a surface contamination inspection apparatus according to an embodiment of the present invention. The same parts as those in FIG. 3 are designated by the same reference numerals and the detailed description thereof will be omitted. Here, only different parts will be described. Describe.

【0017】すなわち、本発明は、被検体の凹凸に対応
して表面汚染検査を実行可能としたものであって、具体
的には、拭取りアームヘッド部7に位置検出手段として
の位置センサ21a,21bを取付け、かつ、駆動制御
部12に代えて、スミヤ圧制御手段及びスミヤ停止手段
としての位置判定制御回路22、位置移動制御回路23
及び位置情報記憶回路24を備えた駆動判定制御部25
を設けたものである。なお、この駆動判定制御部25
は、各回路22〜24の機能以外にスミヤ工程の所定の
手順に従ってスミヤアーム部9を上昇、下降及び進退さ
せる駆動機能を有している。
That is, according to the present invention, the surface contamination inspection can be executed in correspondence with the unevenness of the subject, and specifically, the wiping arm head portion 7 has a position sensor 21a as a position detecting means. , 21b, and instead of the drive control unit 12, a position determination control circuit 22 and a position movement control circuit 23 as a smear pressure control means and a smear stop means.
And a drive determination control unit 25 including a position information storage circuit 24
Is provided. The drive determination control unit 25
In addition to the functions of the circuits 22 to 24, has a drive function of raising, lowering and advancing and retracting the smear arm portion 9 according to a predetermined procedure of the smear process.

【0018】ここで、位置センサ21a,21bは、被
検体4の表面と当該位置センサ21a,21bとの間の
距離を非接触で測定し、その測定量に対応する位置信号
を位置判定制御回路22に送出するものであって、例え
ば高周波発振形、差動コイル形、磁気形、静電容量形及
び超音波形等の各種のセンサが使用可能である。
Here, the position sensors 21a and 21b measure the distance between the surface of the subject 4 and the position sensors 21a and 21b in a non-contact manner, and the position signal corresponding to the measured amount is used as the position determination control circuit. For example, various sensors such as a high frequency oscillation type, a differential coil type, a magnetic type, a capacitance type, and an ultrasonic type can be used.

【0019】なお、この位置センサ21a,21bは拭
取りアームヘッド部7に夫々設けられている。位置セン
サ21aはスミヤ進行方向先端における被検体4との距
離を検出可能なように拭取りアームヘッド部7の下部7
aに取付けられている。また、位置センサ21bは現在
のろ紙位置の確認用に拭取りアームヘッド部7の中央部
7bに取付けられている。
The position sensors 21a and 21b are provided on the wiping arm head portion 7, respectively. The position sensor 21a is provided at the lower portion 7 of the wiping arm head portion 7 so that the position sensor 21a can detect the distance to the subject 4 at the tip of the smear moving direction.
It is attached to a. Further, the position sensor 21b is attached to the central portion 7b of the wiping arm head portion 7 for confirming the current filter paper position.

【0020】位置判定制御回路22は、位置センサ21
a,21bから送出される位置信号に基づいて被検体4
の表面位置を求め、かつ、対応する表面位置データを位
置情報記憶回路(メモリ)24に記憶させる機能をもっ
ている。
The position determination control circuit 22 includes a position sensor 21.
a, 21b based on the position signals transmitted from the subject 4
Has a function of obtaining the surface position of the above and storing the corresponding surface position data in the position information storage circuit (memory) 24.

【0021】一方、位置移動制御回路23は、位置情報
記憶回路24に記憶された表面位置データに基づいて被
検体4の表面までのろ紙6の移動量を求め、かつ、この
移動量だけモータ11を駆動してスミヤアーム先端の拭
取りアームヘッド部7を被検体4に対して進退させる機
能をもっている。また、位置移動制御回路23は、表面
位置データに対応する移動量が、所定の限界移動量を越
えたとき、装置本体を停止させ、かつ、当該異常状態を
報知する機能をもっている。
On the other hand, the position movement control circuit 23 obtains the movement amount of the filter paper 6 to the surface of the subject 4 based on the surface position data stored in the position information storage circuit 24, and the motor 11 is moved by this movement amount. Is driven to move the wiping arm head portion 7 at the tip of the smear arm forward and backward with respect to the subject 4. Further, the position movement control circuit 23 has a function of stopping the apparatus main body and notifying the abnormal state when the movement amount corresponding to the surface position data exceeds a predetermined limit movement amount.

【0022】次に、以上のように構成された表面汚染検
査装置の動作を説明する。いま、凹部4aを有する被検
体4が検査台5に載置され、当該検査台5により被検体
4が回転している。
Next, the operation of the surface contamination inspecting apparatus constructed as above will be described. Now, the subject 4 having the recess 4a is placed on the examination table 5, and the subject 4 is rotated by the examination table 5.

【0023】駆動判定制御部25は前進指令をモータ1
1に与え、このモータ11を駆動してスミヤアーム部9
を被検体4に対して進行させる。拭取りアームヘッド部
7に取付けられた位置センサ21aは被検体4との距離
に対応する位置信号を位置判定制御回路22に送出す
る。位置判定制御回路22は当該位置信号に基づいて被
検体4の表面位置を求め、その表面位置データを位置情
報記憶回路24に記憶させる。
The drive determination controller 25 sends a forward command to the motor 1
1 to drive the motor 11 to drive the smear arm 9
With respect to the subject 4. The position sensor 21 a attached to the wiping arm head unit 7 sends a position signal corresponding to the distance from the subject 4 to the position determination control circuit 22. The position determination control circuit 22 obtains the surface position of the subject 4 based on the position signal, and stores the surface position data in the position information storage circuit 24.

【0024】一方、位置移動制御回路23は位置情報記
憶回路24に記憶された当該表面位置データに基づい
て、被検体4の表面までのろ紙6の移動量を求め、この
移動量だけモータ11を駆動することにより、スミヤア
ーム部9を被検体4に対して進行させて停止させる。
On the other hand, the position movement control circuit 23 obtains the movement amount of the filter paper 6 to the surface of the subject 4 based on the surface position data stored in the position information storage circuit 24, and drives the motor 11 by this movement amount. By driving, the smear arm unit 9 is advanced with respect to the subject 4 and stopped.

【0025】次に、駆動判定制御部25は下降指令をア
ーム駆動部10に送出することによりスミヤアーム部9
を下降させる。これにより、被検体4の表面のスミヤが
開始される。
Next, the drive determination control section 25 sends a descending command to the arm drive section 10 to cause the smear arm section 9 to move.
To lower. As a result, smearing of the surface of the subject 4 is started.

【0026】スミヤ中に被検体4の表面に凹部4aがあ
るとき、この凹部4aをろ紙6によってスミヤする前
に、位置判定制御回路22が位置センサ21aから受け
る位置信号と検査台5の所定の回転速度とに基づいて該
凹部4aの位置及び形状を求め、対応する表面位置デー
タを位置情報記憶回路24に記憶させる。
When there is a concave portion 4a on the surface of the subject 4 in the smear, before the concave portion 4a is smeared by the filter paper 6, the position determination control circuit 22 receives a position signal from the position sensor 21a and a predetermined signal of the inspection table 5. The position and shape of the recess 4a are obtained based on the rotation speed, and the corresponding surface position data is stored in the position information storage circuit 24.

【0027】これにより、拭取りアームヘッド部7が凹
部4aにきたとき、位置移動制御回路23は、表面位置
データに対応する移動量だけ拭取りアームヘッド部7を
水平方向に進退させてろ紙6によるスミヤ圧を一定に制
御しながら被検体4のスミヤを続ける。
As a result, when the wiping arm head portion 7 reaches the concave portion 4a, the position movement control circuit 23 advances and retracts the wiping arm head portion 7 in the horizontal direction by the moving amount corresponding to the surface position data, and the filter paper 6 is moved. The smearing of the subject 4 is continued while controlling the smearing pressure by the constant.

【0028】また、位置移動制御回路23は、位置セン
サ21bによる位置信号から同様にして得られる現在の
表面位置データに基づいて、拭取りアームヘッド部7を
正しく移動したか否かを確認し、この結果に従って拭取
りアームヘッド部7を正しく移動するようにアーム駆動
部10を制御する。
Further, the position movement control circuit 23 confirms whether or not the wiping arm head portion 7 is correctly moved based on the current surface position data obtained in the same manner from the position signal from the position sensor 21b. According to this result, the arm drive unit 10 is controlled so that the wiping arm head unit 7 is moved correctly.

【0029】なお、位置移動制御回路23は、表面位置
データに対応する移動量が限界移動量を越えたとき、表
面汚染検査装置を停止させることにより、スミヤ工程を
中止させる。
The position movement control circuit 23 stops the smear process by stopping the surface contamination inspection device when the movement amount corresponding to the surface position data exceeds the limit movement amount.

【0030】さらに、位置移動制御回路23は当該異常
状態を示す異常報知信号を外部に出力する。上述したよ
うに、本実施例によれば、拭取りスミヤヘッド部7に取
付けられた位置センサ21aにより被検体4の表面との
距離が検出されると、駆動判定制御部25により該検出
結果に基づいてろ紙6によるスミヤ圧を一定にするよう
に拭取りスミヤヘッド部7の位置が制御される。また、
表面汚染検査装置において、位置センサ21aによる検
出結果が所定の限界移動量を越えると、位置判定制御回
路22によりスミヤ工程が停止されて装置本体が保護さ
れる。
Further, the position movement control circuit 23 outputs an abnormality notification signal indicating the abnormal state to the outside. As described above, according to the present embodiment, when the position sensor 21a attached to the wiping smear head unit 7 detects the distance from the surface of the subject 4, the drive determination control unit 25 determines the distance based on the detection result. The position of the wiping smear head portion 7 is controlled so that the smear pressure by the filter paper 6 is kept constant. Also,
In the surface contamination inspection device, when the detection result of the position sensor 21a exceeds a predetermined limit movement amount, the position determination control circuit 22 stops the smear process to protect the device body.

【0031】このように、被検体4の表面との距離から
被検体4の凹凸を測定することにより、スミヤ圧を一定
にして汚染測定精度及び表面汚染測定効率の低下を防
ぎ、装置本体の損傷を防止することができる。
By measuring the unevenness of the subject 4 from the distance from the surface of the subject 4 in this manner, the smear pressure is kept constant and the contamination measurement accuracy and the surface contamination measurement efficiency are prevented from deteriorating, and the device body is damaged. Can be prevented.

【0032】また、異常状態を示す異常報知信号を出力
することにより、操作者が異常状態を速やかに知ること
ができるので、スムーズに検査を再開することができ
る。さらに、測定した被検体形状によりスミヤを行うこ
とから拭取りアームヘッド部7の位置設定が不要になる
ため、操作性を向上させることができる。
Further, by outputting the abnormality notification signal indicating the abnormal state, the operator can quickly know the abnormal state, so that the inspection can be restarted smoothly. Further, since smearing is performed according to the measured object shape, it is not necessary to set the position of the wiping arm head portion 7, so that operability can be improved.

【0033】また、表面汚染検査実施前に被検体4の凹
凸の有無及びその度合を確認する必要がなく、外観検査
と表面汚染検査を同時に処理できるため、検査工程全体
の稼働率を向上させることができる。
Further, it is not necessary to confirm the presence or absence and the degree of unevenness of the subject 4 before the surface contamination inspection is carried out, and the appearance inspection and the surface contamination inspection can be processed at the same time, so that the operation rate of the whole inspection process is improved. You can

【0034】なお、上記実施例では、位置センサ21a
から受ける位置信号に基づいて、拭取りスミヤヘッド部
7の移動量を求める場合について説明したが、これに限
らず、位置信号に基づいて被検体4の外形寸法を求め、
この外形寸法を他の検査におけるパラメータとして測定
検査精度を向上させるようにしても、本発明を同様に実
施して同様の効果を得ることができる。
In the above embodiment, the position sensor 21a
Although the case where the movement amount of the wiping smear head portion 7 is obtained based on the position signal received from is described, the present invention is not limited to this, and the outer dimension of the subject 4 is obtained based on the position signal,
Even when the measurement and inspection accuracy is improved by using the external dimensions as a parameter in another inspection, the present invention can be similarly implemented and the same effect can be obtained.

【0035】また、上記実施例では、位置センサ21a
を拭取りアームヘッド部7の下部7a及び中央部7bに
取付けた場合について説明したが、これに限らず、スミ
ヤ進行方向先端に位置センサを設けた構成であれば、本
発明を同様に実施して同様の効果を得ることができる。
その他、本発明はその要旨を逸脱しない範囲で種々変形
して実施できる。
Further, in the above embodiment, the position sensor 21a
The above description is for the case where the above is attached to the lower portion 7a and the central portion 7b of the wiping arm head portion 7. However, the present invention is not limited to this and the present invention can be similarly implemented if the position sensor is provided at the tip of the smear advancing direction. The same effect can be obtained.
In addition, the present invention can be modified in various ways without departing from the scope of the invention.

【0036】[0036]

【発明の効果】以上説明したように本発明によれば、被
検体の表面の凹凸を測定することにより、汚染測定精度
及び表面汚染測定効率の低下を防ぎ、装置本体の損傷を
防止できる表面汚染検査装置を提供できる。
As described above, according to the present invention, by measuring the unevenness of the surface of the subject, it is possible to prevent the contamination measurement accuracy and the surface contamination measurement efficiency from deteriorating, and prevent the apparatus body from being damaged. An inspection device can be provided.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例に係る表面汚染検査装置の構
成を示す概略図。
FIG. 1 is a schematic diagram showing a configuration of a surface contamination inspection device according to an embodiment of the present invention.

【図2】従来の検査工程の構成を示すブロック図。FIG. 2 is a block diagram showing a configuration of a conventional inspection process.

【図3】従来の表面汚染検査装置の構成を示す概略図。FIG. 3 is a schematic diagram showing a configuration of a conventional surface contamination inspection device.

【符号の説明】[Explanation of symbols]

4…被検体、4a…凹部、5…検査台、6…ろ紙、7…
拭取りアームヘッド部、8…ヘッド位置補正機構部、9
…スミヤアーム部、10…アーム駆動部、11…モー
タ、21a,21b…位置センサ、22…位置判定制御
回路、23…位置移動制御回路、24…位置情報記憶回
路、25…駆動判定制御部。
4 ... Subject, 4a ... Recess, 5 ... Inspection table, 6 ... Filter paper, 7 ...
Wiping arm head part, 8 ... Head position correction mechanism part, 9
... smear arm part, 10 ... arm drive part, 11 ... motor, 21a, 21b ... position sensor, 22 ... position determination control circuit, 23 ... position movement control circuit, 24 ... position information storage circuit, 25 ... drive determination control part.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 被検体の表面に対してスミヤ採取用部材
を擦りながら移動させ、このスミヤ採取用部材の放射能
汚染量から前記被検体の表面汚染を検査する表面汚染検
査装置において、 前記スミヤ採取用部材の移動先における前記被検体の表
面との距離を検出する位置検出手段と、 この位置検出手段による検出結果に基づいて、前記スミ
ヤ採取用部材のスミヤ圧を一定にするように前記スミヤ
採取用部材の位置を制御するスミヤ圧制御手段とを備え
たことを特徴とする放射能汚染検査装置。
1. A surface contamination inspection apparatus for inspecting the surface contamination of the subject based on the amount of radioactive contamination of the smear collecting member while rubbing the smear collecting member against the surface of the subject. Position detecting means for detecting the distance to the surface of the subject at the moving destination of the sampling member, and the smear so as to make the smear pressure of the smear collecting member constant based on the detection result by the position detecting means. And a smear pressure control means for controlling the position of the sampling member.
【請求項2】 請求項1記載の表面汚染検査装置におい
て、 前記位置検出手段による検出結果が前記スミヤ採取用部
材の所定の限界移動量を越えたとき、前記スミヤ工程を
停止させて装置本体を保護するスミヤ停止手段を付加し
たことを特徴とする表面汚染検査装置。
2. The surface contamination inspection apparatus according to claim 1, wherein when the detection result by the position detection means exceeds a predetermined limit movement amount of the smear collecting member, the smear process is stopped and the apparatus main body is moved. A surface contamination inspecting device, characterized in that a smear stopping means for protection is added.
JP9573793A 1993-04-22 1993-04-22 Surface pollution inspection device Pending JPH06308245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9573793A JPH06308245A (en) 1993-04-22 1993-04-22 Surface pollution inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9573793A JPH06308245A (en) 1993-04-22 1993-04-22 Surface pollution inspection device

Publications (1)

Publication Number Publication Date
JPH06308245A true JPH06308245A (en) 1994-11-04

Family

ID=14145803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9573793A Pending JPH06308245A (en) 1993-04-22 1993-04-22 Surface pollution inspection device

Country Status (1)

Country Link
JP (1) JPH06308245A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09281242A (en) * 1996-04-15 1997-10-31 Aloka Co Ltd Whole body counter
JP2008051649A (en) * 2006-08-24 2008-03-06 Toshiba Corp Surface contamination inspection apparatus and its inspection method
EP2818894A1 (en) * 2013-06-24 2014-12-31 Kabushiki Kaisha Toshiba Inspection device of radioactive waste body and inspection method of radioactive waste body

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09281242A (en) * 1996-04-15 1997-10-31 Aloka Co Ltd Whole body counter
JP2008051649A (en) * 2006-08-24 2008-03-06 Toshiba Corp Surface contamination inspection apparatus and its inspection method
JP4672619B2 (en) * 2006-08-24 2011-04-20 株式会社東芝 Surface contamination inspection system and inspection method thereof
EP2818894A1 (en) * 2013-06-24 2014-12-31 Kabushiki Kaisha Toshiba Inspection device of radioactive waste body and inspection method of radioactive waste body
JP2015007538A (en) * 2013-06-24 2015-01-15 株式会社東芝 Inspection device of radioactive waste body and inspection method of radioactive waste body
US9182499B2 (en) 2013-06-24 2015-11-10 Kabushiki Kaisha Toshiba Inspection device of radioactive waste body and inspection method of radioactive waste body

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