JPH06302634A - Resin sealing device - Google Patents

Abstract

PURPOSE:To seal electronic components with resin without damaging a work and to form a molded product, and what is more, to enhance working efficiency in a resin sealing process for degate or the like. CONSTITUTION:A cavity plate 16 capable of loading a work 10 is removably inserted between a top force 12 and a bottom tool 14 and provided with a penetration hole 18 at an area responding to an electronic component loaded on the work 10 while the work 10 is placed into contact with and clamped by the top force 12 on one side, thereby forming a cavity with the penetration hole 18, the top force 12 and the bottom tool 14. A gate 24 and a runner 20 are installed, being communicated with the cavity plate 16 along the surface of the other die 14 which comes into contact with the cavity plate 16. A frame member 30 pivots the cavity plate 167 with a horizontal shaft 32 rotatively. There are provided a removal means which removes a plate unit which comprises the cavity plate 16 and the frame member 30 between the upper and lower dies 12 and 14 and a turning means which turns the cavity pate 16, centering on the horizontal shaft 32.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing device.

[0002]

2. Description of the Related Art Conventionally, in a transfer molding apparatus for sealing electronic parts with resin, a work on which the electronic parts are mounted is inserted and pinched between upper and lower molds, and the electronic parts mounted on the work are sealed with resin. Stop. That is, a cavity and a resin flow path (runner and gate) are provided on the parting surface where the upper and lower molds are fitted together, and the work is clamped on this parting surface to seal the electronic component with the resin. As an example when the work is resin-sealed, FIG. 6 is a plan view showing a printed board 50 on which electronic components are mounted, a runner 52, and a gate 54.
FIG. 7 is a front view of FIG. 6. Like this, usually runner 5
2 and the gate 54 are set so as to pass on the surface of a work such as the printed circuit board 50. In addition to the printed circuit board 50 on which electronic components are mounted, the work may be a lead frame or the like on which a semiconductor device is mounted. After the electronic component is resin-sealed as described above, the ejector pin projects from the cavity surface to release the molded product. Further, after the molded product is released from the mold, it is transferred to another device and degateed.

[0003]

However, in the conventional resin sealing device as described above, since the runner and the gate are set on the surface of the printed circuit board 50, which is a work, the resin flow at the time of filling, Alternatively, the printed circuit pattern 56 and the substrate itself may be damaged by the action force when removing unnecessary resin (molded product runner portion, etc.) after molding. Therefore, it is necessary to set the area (runner space) occupied by the resin flow path separately from the circuit pattern. That is, the circuit pattern cannot be arranged in the runner space, and the space becomes a dead space as a semiconductor device. further,
Since the resin flow path is provided on the surface of the work that is the resin-sealed component, thin burrs are likely to occur on the surface of the work. In addition, in the above-mentioned conventional mold, since the resin component is provided so as to intersect the end surface of the work part, burrs are generated in the gap between the work and the mold. Further, in the conventional resin sealing device, it is difficult to improve the processing efficiency because the molded product is released from the mold and then transferred to another device and degate.

Therefore, an object of the present invention is to mold a molded product by resin-sealing an electronic component without damaging a work such as a circuit pattern of a printed circuit board, and processing in a resin-sealing process such as a degate. It is to provide a resin sealing device that can improve efficiency.

[0005]

In order to achieve the above object, the present invention has the following constitution. That is, the present invention is
A resin sealing device that inserts a work 10 on which an electronic component is mounted and seals the mounted electronic component with a resin has the following configuration. Upper and lower molds 12, 14
Is provided so that the mold can be opened vertically. The cavity plate 16 can mount the work 10 on which electronic components are mounted, and is inserted between the upper and lower molds 12 and 14 so as to be freely inserted and removed. The cavity plate 16 is used for the work 10.
Has a through hole 18 at a position corresponding to the electronic component mounted on the workpiece, and the workpiece 10 is held in contact with one die 12 surface to be sandwiched between the through hole 18 and the die 12, 14 surface. Form a cavity. Gate 24 and runner 20
Is the other mold 14 that abuts the cavity plate 16.
It is provided along the surface and leads to the cavity. The frame member 30 rotatably supports the cavity plate 16 on a horizontal shaft 32, and normally supports the cavity plate 16 horizontally. In addition, the cavity plate 16 and the frame member 3
The plate unit consisting of 0 and the upper and lower molds 12, 1
It is provided with an inserting / removing means for inserting / removing between the four and a rotating means for rotating the cavity plate 16 about the horizontal shaft 32 when the plate unit is taken out of the mold 12, 14.

The present invention also resides in a resin sealing device having the following structure. Upper and lower molds 12, 14 are provided so that the molds can be opened vertically. Cavity plate 46
Is formed of upper and lower plates 46a and 46b that can be divided into upper and lower parts, has a through hole 48 at a position corresponding to an electronic component mounted on the work 10, and can be inserted and removed between the upper and lower molds 12 and 14. Inserted in. This cavity plate 16
Holds the work 10 on which the electronic components are mounted between the upper and lower plates 46a and 46b, and the upper and lower molds 12 and 14 so that the through-hole 48 and the upper and lower molds 12 and 14 are clamped. A cavity is formed with the mold surface. The gate 24 and the runner 20 have a cavity plate 46.
Is provided so as to communicate with the cavity along one mold surface that abuts against the cavity. The frame member 30 rotatably supports the cavity plate 16 on a horizontal shaft 32, and normally supports the cavity plate 46 horizontally. Further, an insertion / removal means for inserting / removing the plate unit including the cavity plate 46 and the frame member 30 between the upper and lower molds 12, 14.
And a rotating means for rotating the cavity plate 46 about the horizontal shaft 32 when the plate unit is taken out of the molds 12, 14.

[0007]

According to the resin sealing device of the present invention, the cavity is formed by the die surfaces of the upper and lower dies and the through holes of the cavity plate, and the cavity is communicated with the die surface abutting the cavity plate. Gates and runners are provided. This allows the gate and runner to communicate with the cavity without passing over the surface of the work. Further, when the cavity plate is taken out of the mold, it can be rotated about the horizontal axis to move the molded product in the rotation direction. This acting force facilitates degate. Therefore, degating is performed in a series of resin sealing steps, and processing efficiency is improved.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an embodiment of a resin sealing device according to the present invention, showing a mold device part of a transfer molding device. 2 is a plan view of FIG. The work 10 on which the electronic component is mounted is inserted into the mold device portion, and the electronic component mounted on the work 10 is resin-sealed. Note that FIG. 1 shows a state where resin sealing is performed (a state in which molten resin is pressed into the cavity from the pot).

Reference numeral 12 is an upper mold, and 14 is a lower mold. The upper and lower molds 12 and 14 are provided so that the molds can be opened vertically. Reference numeral 16 denotes a cavity plate, which is insertably / removably inserted between the upper and lower molds 12 and 14, and on which the work 10 having electronic components mounted can be mounted, corresponding to the electronic components mounted on the work 10. A through hole 18 is provided at a portion to be opened. Then, in the present embodiment, the work 10 is brought into contact with the mold surface of the upper mold 12, and the cavity plate 1
The work 10 is clamped between the upper surface of 6 and the mold surface of the upper mold 12. At this time, the lower surface of the cavity plate 16 and the mold surface of the lower mold 14 are in contact with each other. Thereby, the through hole 18 of the cavity plate and the upper and lower molds 12, 14
A cavity is formed with the mold surface. The cavity plate 16 is arranged on the left and right sides of the pot 22. In addition, the through hole 18 of the cavity plate 16 has a taper angle that spreads toward the work side so that the molded product can be easily released from the mold.

Reference numeral 20 denotes a runner, which extends along the mold surface (parting surface) of the lower mold 14 abutting the lower surface of the cavity plate 16 so as to pass through the pot 22 and the cavity, and the upper and lower molds 12, 14. It is provided on the mold surface. A gate 24 is provided between the lower surface of the cavity plate 16 and the mold surface of the lower mold 14 so that the molten resin can be introduced from the lower end of the through hole 18 of the cavity plate. As a result, the gate 24 and the runner 2
It is possible for 0 to pass from the pot 22 to the cavity without passing over the surface of the work 10. Reference numeral 26 is a plunger.

Reference numeral 30 denotes a frame member, which rotatably supports the cavity plate 16 about a horizontal shaft 32 and normally abuts from below to horizontally support the cavity plate 16. The frame unit 30 and the cavity plate 16 constitute a plate unit. This plate unit is put in and taken out between the upper and lower molds 12, 14 by the inserting / removing means. As the insertion / removal means, it is needless to say that a reciprocating device by expanding and contracting an arm, a reciprocating device moving on a rail, or the like can be used.

Further, when the plate unit is taken out of the mold, the cavity plate 16 is rotated by the rotating means.
Is rotated about the horizontal shaft 32. Of course, a cylinder device, a cam mechanism, or the like can be used as the rotating means. Reference numeral 34 is a guide block, which is provided so as to project downward on each of the frame members 30 positioned in front of and behind the plate unit. This guide block 34 is a lower mold 1
The plate unit is positioned by fitting into the concave portion provided in 4. Reference numeral 36 denotes a guide pin, which is provided so as to project upward from the lower mold 14 and fits into a guide hole 37 provided by being bored in the cavity plate 16 to position the cavity plate 16. Reference numeral 38 denotes a work guide pin, which is provided so as to project upward from the cavity plate 16 and fits into a work guide hole provided in the work 10 to position the work 10. In the above embodiment, when the circuit surface of the printed circuit board, which is the work 10, is sealed with the resin facing downward, that is,
Although the example of the face-down set is shown, it can be applied to the case where the circuit surface of the printed circuit board is directed upward and is resin-sealed.

Next, FIG. 1 to FIG.
It will be described with reference to FIG. ． When the upper and lower molds 12 and 14 are opened, the plate unit on which the work 10 is set becomes
It is inserted between and set in the lower mold 14. ． The mold is clamped and the electronic component mounted on the work is resin-sealed. ． The mold is opened and the plate unit is moved out of the mold. ． By rotating the left and right cavity plates 16 together, the cull and molded product runner portions 40 are pulled between the left and right cavity plates 16 and degate. As a result, the cull and molded product runner portions 40 are dropped as shown in FIG. ． As shown in FIG. 4, the molded product 42 is pushed up by the pin 45 and released. Before the molded product 42 is released from the mold, the cavity plate 16 is rotated so that the molded product 42 is turned upside down as shown by the chain double-dashed line in FIG. 4, and the ejector pin is pushed down from above to remove the molded product 42. It may be released or pushed down. ． The cavity plate 16 is expanded 180 °, and the resin residue and the like are cleaned. ． The work 10 is set on the cavity plate 16 which has been expanded. ． The inside of the upper and lower molds 12, 14 are cleaned during the period from to. ． The plate unit is inserted between the upper and lower molds 12, 14.

By repeating the above steps, the electronic components of the work 10 can be sequentially resin-sealed and degated. According to this step, the plate unit is moved out of the mold, and the steps of releasing the molded product 42 and mounting the work 10 are performed, which is suitable for automation. Also,
By providing two plate units, the mold release of the molded product 42 and the work 10 are performed by the other plate unit when the resin sealing process is performed by one plate unit.
If the two plate units are alternately inserted and removed between the upper and lower molds 12 and 14, the efficiency of the resin sealing process can be improved.

According to this resin sealing device, resin sealing can be performed without damaging the circuit pattern or the like formed on the surface of the printed circuit board which is the work 10. This is because when the cavity is filled with the molten resin and when the gate is broken, the gate 24 is not in a position in contact with the surface of the printed board, and the peeling component force does not act between the resin sealing portion and the printed board. This is because it is possible to protect the portion where the adhesive strength is relatively weak. Further, it is not necessary to set the area (runner space) occupied by the resin flow path that affects the quality of the semiconductor device or the like on the surface of the work 10 part separately from the circuit pattern. Therefore, the surface of the work 10 can be effectively used as a circuit pattern.

In the above embodiment, the case where the cavity plate is formed by one plate has been described, but the same effect can be obtained even if the cavity plate is formed by two plates. That is, instead of the cavity plate 16 of the embodiment of FIG. 1, a cavity plate 46 as shown in FIG. 5 can be used. As shown in FIG. 5, the cavity plate 46 is formed of upper and lower plates 46a and 46b that can be divided into upper and lower parts, and has through-holes at positions corresponding to semiconductor devices (electronic parts) mounted on the lead frame which is the work 10. The upper and lower molds 12 and 14 are inserted into and removed from each other. Further, the cavity plate 16 holds the work 10 on which electronic components are mounted between the upper and lower plates 46a and 46b,
By being clamped by the upper and lower molds 12, 14,
A cavity is formed by the through hole 48 and the mold surfaces of the upper and lower molds 12, 14. The gate 24 and the runner 20 are provided so as to communicate with the cavity along one mold surface that abuts the cavity plate 46.
The frame member 30 rotatably supports the cavity plate 16 on a horizontal shaft 32, and normally supports the cavity plate 46 horizontally. In addition, the plate unit including the cavity plate 46 and the frame member 30 is attached to the upper and lower molds 12,
It has an inserting / removing means for inserting / removing between 14 and a rotating means for rotating the cavity plate 46 around the horizontal shaft 32 when the plate unit is taken out of the mold 12, 14. Therefore, the gate 24 and the runner 20 can communicate with the cavity without passing over the surface of the work 10, and the upper and lower parts of the work 10 can be resin-sealed.
Further, since the cavity plate 46 can rotate about the horizontal shaft 32, the degate can be easily performed as in the embodiment of FIG.

In the above embodiments, the case where the present invention is applied to the transfer molding apparatus has been described. However, the present invention is not limited to this, and the same can be applied to an injection molding machine. Further, the resin sealing device according to the present invention is not limited to one in which electronic components are mounted on the printed circuit board, and one in which electronic components are mounted, such as one in which a semiconductor device is mounted on a lead frame, Can be targeted. Although various preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and many modifications can be made without departing from the spirit of the invention. That is.

[0018]

According to the resin sealing device of the present invention, the cavity is formed by the die surfaces of the upper and lower dies and the through holes of the cavity plate, and the gate and runner do not pass over the surface of the work. Can lead to the cavity. Therefore, the electronic component can be resin-sealed to form a molded product without damaging the work during resin sealing or degate. Further, when the cavity plate is taken out of the mold, it can be rotated about the horizontal axis to move the molded product in the rotation direction. With this acting force, it is possible to easily degate the runner portion of the molded product.
Therefore, the degate can be easily performed in a series of resin sealing steps, and the processing efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a resin sealing device according to the present invention.

FIG. 2 is a plan view of the embodiment shown in FIG.

FIG. 3 is an explanatory view showing a working state of the embodiment of FIG.

FIG. 4 is an explanatory view showing a working state of the embodiment of FIG.

FIG. 5 is a sectional view showing another embodiment of the resin sealing device according to the present invention.

FIG. 6 is a plan view showing a conventional technique.

FIG. 7 is a sectional view showing a conventional technique.

[Explanation of symbols]

 10 Work 12 Upper Mold 14 Lower Mold 16 Cavity Plate 18 Through Hole 20 Runner 22 Pot 24 Gate 30 Frame Member 32 Horizontal Axis 46 Cavity Plate 46a Upper Plate 46b Lower Plate 48 Through Hole

Claims (2)

[Claims] 1. A resin sealing device for inserting a work on which electronic components are mounted and sealing the mounted electronic components with a resin, wherein upper and lower molds are provided so that the molds can be opened vertically, and the upper and lower molds. It is insertable and removable between the molds, and it is possible to mount a work on which the electronic parts are mounted.There is a through hole at a location corresponding to the electronic parts mounted on the work, and one mold surface A workpiece is abutted and clamped to form a cavity with the through hole and the die surface, and along the other die surface abutting the cavity plate,
A gate and a runner provided through the cavity, and the cavity plate is rotatably supported on a horizontal axis,
A frame member that normally horizontally supports the cavity plate, an insertion / removal unit that inserts and removes a plate unit including the cavity plate and the frame member between upper and lower molds, and the plate unit is outside the mold. A resin sealing device, comprising: a rotating means for rotating the cavity plate about the horizontal axis when the resin is taken out. 2. A resin sealing device in which a work on which electronic components are mounted is inserted and which seals the mounted electronic components with a resin, wherein upper and lower molds are provided so that the molds can be opened vertically and vertically. A work piece that is formed of upper and lower plates that can be divided, has through holes at locations corresponding to the electronic components mounted on the work, and is removably inserted between the upper and lower molds, and has the electronic component mounted thereon. Is sandwiched between the upper and lower plates, and is sandwiched by the upper and lower molds to form a cavity between the through hole and the mold surfaces of the upper and lower molds, and one of the cavity plates abutting the cavity plate. Along the mold surface,
A gate and a runner provided through the cavity, and the cavity plate is rotatably supported on a horizontal axis,
A frame member that normally horizontally supports the cavity plate, an insertion / removal unit that inserts and removes a plate unit including the cavity plate and the frame member between upper and lower molds, and the plate unit is outside the mold. A resin sealing device, comprising: a rotating means for rotating the cavity plate about the horizontal axis when the resin is taken out.