JPH06296089A - Electric equipment - Google Patents

Electric equipment

Info

Publication number
JPH06296089A
JPH06296089A JP8083693A JP8083693A JPH06296089A JP H06296089 A JPH06296089 A JP H06296089A JP 8083693 A JP8083693 A JP 8083693A JP 8083693 A JP8083693 A JP 8083693A JP H06296089 A JPH06296089 A JP H06296089A
Authority
JP
Japan
Prior art keywords
case
filler
thermal expansion
coefficient
electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8083693A
Other languages
Japanese (ja)
Inventor
Toshiki Imai
敏樹 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Healthcare Manufacturing Ltd
Original Assignee
Hitachi Medical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Medical Corp filed Critical Hitachi Medical Corp
Priority to JP8083693A priority Critical patent/JPH06296089A/en
Publication of JPH06296089A publication Critical patent/JPH06296089A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To enable an electric device, which is composed of an electric component and a case wherein the component is housed and held by filler and forcibly cooled down or heated up, to be protected against such troubles that the case is cracked at heating or cooling (thermal expansion, thermal shrinkage), or a signal wire connected between electric components in the case is disconnected. CONSTITUTION:Components 2 and 3 are housed in a case 1 and held by a mixture 8 of fragment 5 of the same material as that of the case 1 and filler 4.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ケース内に電気部品を
保持部材を介して収納してなる電気装置に係り、特に、
滅菌などのためにケースが加熱されたり、あるいは冷却
される電気装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric device in which electric parts are housed in a case via a holding member, and more particularly,
The present invention relates to an electric device in which a case is heated or cooled for sterilization or the like.

【0002】[0002]

【従来の技術】図3は従来のこの種の電気装置を示す。
この図3において、1は例えばプラスチックからなるケ
ースである。このケース1内には、電気装置の電気部
品、例えば超音波診断用探触子の電気部品、ここではフ
レキシブルサーキット2とフレキシブルサーキット3が
収納されている。フレキシブルサーキット2とフレキシ
ブルサーキット3とは必要部(信号線部分)が例えば半
田付けなどで接続されている。
2. Description of the Related Art FIG. 3 shows a conventional electric device of this type.
In FIG. 3, 1 is a case made of plastic, for example. In this case 1, electric parts of an electric device, for example, electric parts of an ultrasonic diagnostic probe, here, a flexible circuit 2 and a flexible circuit 3 are housed. The required portions (signal line portions) of the flexible circuit 2 and the flexible circuit 3 are connected by, for example, soldering.

【0003】また、これらフレキシブルサーキット2,
3は、ケース1との隙間がシリコン樹脂、エポキシ樹脂
又はポリウレタンなどの充填材4により埋められること
によって相互間の絶縁とケース1内における位置決めと
がなされている。
In addition, these flexible circuits 2,
The gap between the case 3 and the case 1 is filled with a filling material 4 such as a silicone resin, an epoxy resin, or a polyurethane, so that they are insulated from each other and positioned within the case 1.

【0004】[0004]

【発明が解決しようとする課題】上記のように、ケース
1内に電気部品(フレキシブルサーキット2,3など)
を充填材4を介して殆ど密封状態又は充填材4がケース
1外に排出されないように収納されている電気装置にお
いて、その使用目的からそれが加熱されたり、冷却され
たりする場合がある。
As described above, electric parts (flexible circuits 2, 3 etc.) are housed in the case 1.
There is a case where the electric device is heated or cooled depending on the purpose of use in an electric device that is almost sealed via the filler 4 or is housed so that the filler 4 is not discharged to the outside of the case 1.

【0005】ところが上記従来装置では、外側のケース
1の熱膨張係数の値と大きく異なる熱膨張係数の値をも
つ充填材4が使用されている場合、高温や低温時に無理
な力が加わり、その程度が大きい場合、ケース1との境
に隙間ができたり、ケース1が割れてしまうことがあっ
た。また、ケース1内に配置されている信号線が断線し
てしまうことがあった。
However, in the above-mentioned conventional apparatus, when the filler 4 having a coefficient of thermal expansion greatly different from the coefficient of thermal expansion of the outer case 1 is used, an unreasonable force is applied at a high temperature or a low temperature. When the degree is large, a gap may be formed at the boundary with the case 1 or the case 1 may be broken. In addition, the signal line arranged in the case 1 may be broken.

【0006】以下、これを詳述する。すなわち、殆どの
物質は加熱時には大きくなる性質をもち、その程度は物
質毎に特有の値(熱膨張係数)をもつ。前記充填材4の
熱膨張係数の値がケース1の熱膨張係数の値よりずっと
大きいと、加熱時には熱膨張係数の値に相当する力が矢
印6a,6bに示すように生じる。この場合、矢印6a
は充填材4の熱膨張の大きさを示し、矢印6bはケース
1の熱膨張の大きさを示すとすると、矢印6a,6bの
差に相当する力がケース1に加わり、この力のためにケ
ース1が割れてしまうことがあった。
This will be described in detail below. That is, most substances have the property of becoming large when heated, and the degree thereof has a unique value (coefficient of thermal expansion) for each substance. When the value of the coefficient of thermal expansion of the filling material 4 is much larger than the value of the coefficient of thermal expansion of Case 1, a force corresponding to the value of the coefficient of thermal expansion is generated during heating as shown by arrows 6a and 6b. In this case, the arrow 6a
Represents the amount of thermal expansion of the filler 4 and the arrow 6b represents the amount of thermal expansion of the case 1, and a force corresponding to the difference between the arrows 6a and 6b is applied to the case 1, and due to this force. Case 1 was sometimes broken.

【0007】また、加熱時にはフレキシブルサーキット
2とフレキシブルサーキット3との信号線半田付け部分
にも矢印7a,7bに示すような大きさの力が生じる。
すなわち加熱時、フレキシブルサーキット2が充填材4
から受ける力(矢印7a)が、フレキシブルサーキット
3が充填材4から受ける力(矢印7b)よりずっと大き
ければ、それらの差分の力が2つのフレキシブルサーキ
ット2,3を引き離す力(図中左右方向のせん断力)と
なり、フレキシブルサーキット2,3間の信号線の断線
を起こすこともある。
Further, at the time of heating, a force having a magnitude as shown by arrows 7a and 7b is also generated in the signal line soldering portion between the flexible circuit 2 and the flexible circuit 3.
That is, when heated, the flexible circuit 2 is filled with the filling material 4.
If the force (arrow 7a) received from the flexible circuit 3 is much larger than the force (arrow 7b) that the flexible circuit 3 receives from the filling material 4, the difference between these forces separates the two flexible circuits 2 and 3 (in the horizontal direction in the figure). Shearing force), which may cause disconnection of the signal line between the flexible circuits 2 and 3.

【0008】以上は加熱の場合についてであるが、冷却
時の場合にも、力の向き(矢印6a,6b;7a,7b
の方向)が逆になるだけで上記と同様なことがいえる。
The above is the case of heating, but also in the case of cooling, the direction of force (arrows 6a, 6b; 7a, 7b).
The same as above can be said only with the opposite direction.

【0009】このような問題に対して従来は、外側のケ
ース1の熱膨張係数の値にできるだけ近い熱膨張係数の
値をもつ充填材4を多くの充填材の中から探していた。
しかし、熱膨張係数については条件を満たしても、その
他の電気的,化学的条件や機械的条件などの諸条件、特
にケース1に入れられる電気部品(フレキシブルサーキ
ット2,3など)との関係での条件が合わず、有効に対
処できないことがしばしばあった。
To solve such a problem, conventionally, a filler 4 having a coefficient of thermal expansion as close as possible to the coefficient of thermal expansion of the outer case 1 has been searched for from many fillers.
However, even if the coefficient of thermal expansion is satisfied, other conditions such as electrical, chemical and mechanical conditions, especially the electrical components (flexible circuits 2, 3 etc.) that can be put into the case 1 Often the conditions were not met and it was not possible to deal effectively.

【0010】本発明の目的は、熱膨張係数の値がケース
の熱膨張係数の値に近い充填材を探し出さなくても、加
熱,冷却(熱膨張,熱収縮)時に生じる無理な力を緩和
でき、ケースの割れやケース内の電気部品間の信号線断
線などを防止することのできる電気装置を提供すること
にある。
The object of the present invention is to alleviate the excessive force generated during heating and cooling (thermal expansion and thermal contraction) without searching for a filler having a coefficient of thermal expansion close to that of the case. An object of the present invention is to provide an electric device that can prevent cracking of the case and disconnection of signal lines between electric components in the case.

【0011】[0011]

【課題を解決するための手段】上記目的は、ケース内に
電気部品を保持部材を介して収納してなる電気装置にお
いて、前記保持部材を前記ケースと同材質の物質の砕片
と充填材との混合物としたことにより達成される。
SUMMARY OF THE INVENTION The above object is to provide an electric device in which an electric component is housed in a case through a holding member, wherein the holding member includes a fragment of a substance of the same material as the case and a filler. This is achieved by using a mixture.

【0012】[0012]

【作用】前記混合物は、ケースと同材質の物質の砕片と
充填材とからなり、ケースとの熱膨張係数の値の差は従
来装置における充填材よりも小さい。充填材のみに着目
した場合、充填材の絶対量が減少し、熱膨張の絶対量が
減少する。
The above mixture is composed of the fragments of the same material as the case and the filler, and the difference in the coefficient of thermal expansion between the case and the case is smaller than that of the filler in the conventional apparatus. When focusing only on the filler, the absolute amount of the filler decreases and the absolute amount of thermal expansion decreases.

【0013】前記混合物は、従来装置における充填材に
代えて電気部品をケース内に保持するものであり、従来
装置における充填材と同様の機能をもつ。しかしこの混
合物は、上記のようにケースとの熱膨張係数の値の差が
従来装置における充填材よりも小さく、したがって、ケ
ースの熱膨張係数の値に近い充填材を探し出さなくて
も、加熱,冷却(熱膨張,熱収縮)時に生じる無理な力
が緩和され、ケースの割れやケース内の電気部品間の信
号線断線などが防止される。
The mixture holds electric parts in the case instead of the filler in the conventional apparatus, and has the same function as the filler in the conventional apparatus. However, this mixture has a smaller difference in the value of the coefficient of thermal expansion from that of the case as described above than the filler in the conventional apparatus, and therefore, even if the filler having a value close to the value of the coefficient of thermal expansion of the case is not searched for, the mixture is heated Unreasonable force generated during cooling (thermal expansion, thermal contraction) is mitigated, and cracking of the case and disconnection of signal lines between electric parts in the case are prevented.

【0014】[0014]

【実施例】以下、図面を参照して本発明の実施例を説明
するが、具体的実施例の説明に先立ち、まずその原理に
ついて説明する。すなわち、ケース内に電気部品を充填
材で保持収納してなる電気装置において、加熱,冷却
(熱膨張,熱収縮)時のケースと充填材間、ケース内の
電気部品間に生じる力の関係は、ケースや充填材の材
質、ケース内の電気部品の材質や大きさ、それらの配置
位置などによって異なり、単純ではない。しかし充填材
は、補強に用いられたり狭い隙間にも入り込むこと、ま
た、一般にケースに対する体積上の比率も大きいことか
ら、ケースの割れやケース内電気部品間の信号線断線な
どの問題に対する影響が大きい。したがって、充填材の
熱膨張のコントロールは前記ケースの割れ,断線などの
問題に対して効果が大きいと考えられる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below with reference to the drawings, but prior to the description of the specific embodiments, the principle thereof will be described first. That is, in an electric device in which electric parts are held and housed in a case with a filling material, the relationship between forces generated between the case and the filling material during heating and cooling (thermal expansion and contraction) and between the electric parts in the case is It is not simple because it depends on the material of the case and the filler, the material and size of the electric parts in the case, and the position where they are arranged. However, since the filler is used for reinforcement or penetrates into narrow gaps, and generally has a large volume ratio to the case, it has no influence on problems such as cracking of the case and disconnection of signal lines between electric parts in the case. large. Therefore, it is considered that controlling the thermal expansion of the filler has a great effect on the problems such as cracking and disconnection of the case.

【0015】また、加熱のみに晒される電気装置では、
充填材の熱膨張係数の値はケースの熱膨張係数の値と等
しいか、やや小さい位がよいと考えられる。(以上は加
熱の場合についてであるが、冷却時の場合には、力の向
きが逆になるだけで上記と同様なことがいえる。)そこ
で本発明では、従来から使用していた、諸特性を満足す
る充填材の材質は変えずに、その分量を減らすことを考
えた。それは、外側のケース材質と同じ材質の砕片、例
えば外側のケースがプラスチックならばその原料のチッ
プ、を上記充填材に混合したもの(混合物)でケース内
の電気部品を保持することである。上記混合物は、熱膨
張係数の値がケースの熱膨張係数の値と全く同じである
部分を増し、上記のケース割れや断線などの問題となる
充填物の割合を減らす。
Further, in an electric device exposed only to heating,
It is considered that the coefficient of thermal expansion of the filler should be equal to or slightly smaller than the coefficient of thermal expansion of the case. (The above is the case of heating, but in the case of cooling, it can be said that the same as the above except that the direction of the force is reversed.) Therefore, in the present invention, various characteristics conventionally used. It was considered to reduce the amount without changing the material of the filling material that satisfies the above condition. That is, the electric components in the case are held by a mixture (mixture) in which a crushed piece of the same material as the outer case material, for example, a chip of the raw material if the outer case is plastic is mixed with the filler. The mixture increases the portion where the coefficient of thermal expansion is exactly the same as the value of the coefficient of thermal expansion of the case, and reduces the proportion of problematic filling such as case cracking and disconnection.

【0016】これによれば、混合物中の上記チップの熱
膨張係数の値は外側のケース材の熱膨張係数の値と全く
同じである。したがって、上記チップを例えば80%混
合してなる混合物で電気部品をケース内に保持収納した
とすると、加熱又は冷却時に発生する各部分間に働く力
は、単純に見積もって20%に減少すると考えられる。
ここで、充填材はチップ相互の狭い隙間に入ってゆかね
ばならないが、チップを更に細かく砕いたり、元々小さ
く作製しておくことにより対処できる。
According to this, the value of the coefficient of thermal expansion of the chips in the mixture is exactly the same as the value of the coefficient of thermal expansion of the outer case material. Therefore, if an electric component is held and housed in a case with a mixture obtained by mixing the above chips with, for example, 80%, the force acting between each part generated during heating or cooling is simply estimated to be reduced to 20%. To be
Here, the filler has to enter the narrow gap between the chips, but this can be dealt with by further crushing the chips or by making them smaller originally.

【0017】図1は、本発明による電気装置の一実施例
を示す一部切断側面図である。この図1において、1〜
3は各々図3と同様である。4も図3と同様に充填材を
示すが、図3とは以下のように異なる。すなわち図1
中、5はケース1と同材質の砕片であるが、本発明では
充填材4は図示するように多数の砕片5と共に混合物8
をなすものである。
FIG. 1 is a partially cutaway side view showing an embodiment of an electric device according to the present invention. In FIG. 1, 1 to
3 is the same as in FIG. 4 also shows a filler like FIG. 3, but differs from FIG. 3 as follows. That is, FIG.
Medium 5 is a fragment of the same material as case 1, but in the present invention, the filler 4 is a mixture 8 together with a large number of fragments 5 as shown in the figure.
It is what makes up.

【0018】そして、この混合物8にてケース1とそこ
に収納された電気部品であるフレキシブルサーキット
2,3との間が埋められるもので、これによりケース1
及びフレキシブルサーキット2,3相互間の絶縁とケー
ス1内におけるフレキシブルサーキット2,3の位置決
めとがなされる。
The mixture 8 fills the space between the case 1 and the flexible circuits 2 and 3 which are the electric parts housed therein, whereby the case 1 is formed.
Insulation between the flexible circuits 2 and 3 and positioning of the flexible circuits 2 and 3 in the case 1 are performed.

【0019】なお、矢印6a,6b及び7a,7bも図
3と同様である。すなわち、矢印6aは本装置加熱時
(主にケース1の滅菌などのための加熱の際)の充填材
4の熱膨張の大きさ、矢印6bは同じくケース1の熱膨
張の大きさを示す。また矢印7aは、同上加熱時、フレ
キシブルサーキット2,3間の信号線半田付け部分にお
いてフレキシブルサーキット2が充填材4から受ける力
の大きさ、矢印7bは、同じくフレキシブルサーキット
3が充填材4から受ける力の大きさを示す。
The arrows 6a, 6b and 7a, 7b are the same as in FIG. That is, the arrow 6a indicates the amount of thermal expansion of the filler 4 when the apparatus is heated (mainly when heating the case 1 for sterilization, etc.), and the arrow 6b also indicates the amount of thermal expansion of the case 1. Further, the arrow 7a indicates the magnitude of the force that the flexible circuit 2 receives from the filling material 4 in the signal line soldering portion between the flexible circuits 2 and 3 during heating, and the arrow 7b indicates that the flexible circuit 3 also receives the same from the filling material 4 during heating. Indicates the magnitude of force.

【0020】上述構成において、砕片5、ここでは小豆
状に形成された砕片5相互の隙間は充填材4で埋められ
ている。小豆状の砕片5は材質がケース1と同じである
ため、砕片5相互の隙間に相当する体積分の充填材4だ
けが加熱時に力を生じることになる。すなわち、矢印6
a,6b及び7a,7bに示すようにケース1やフレキ
シブルサーキット2,3間の信号線半田付け部分などに
加わる力は大幅に減ることになる。したがって、ケース
1の熱膨張係数の値に近い充填材4を探し出さなくて
も、換言すれば、現在使用している充填材4を変更せず
にそのまま用いても、加熱,冷却(熱膨張,熱収縮)時
に生じる無理な力を緩和でき、ケース1の割れやケース
1内のフレキシブルサーキット2,3間の信号線断線な
どが防止できる。
In the above-mentioned structure, the crushed pieces 5, here the gaps between the crushed pieces 5 formed like adzuki beans, are filled with the filler 4. Since the material of the adzuki bean crushed pieces 5 is the same as that of the case 1, only the filling material 4 having a volume corresponding to the gap between the crushed pieces 5 produces a force during heating. That is, arrow 6
As shown in a, 6b and 7a, 7b, the force applied to the case 1 and the signal wire soldering portion between the flexible circuits 2 and 3 is greatly reduced. Therefore, even if the filler 4 close to the value of the coefficient of thermal expansion of the case 1 is not searched for, that is, even if the filler 4 currently used is used as it is without being changed, heating, cooling (thermal expansion) , Heat contraction) can be alleviated, and cracking of the case 1 and disconnection of signal lines between the flexible circuits 2 and 3 in the case 1 can be prevented.

【0021】なお上述実施例では、砕片5を小豆状に形
成したがこれのみに限定されることはない。ケース1が
例えば熱可塑性プラスチックである場合、原料であるチ
ップをそのまま砕片5として用いることもでき、また、
ケース1内に収納する電気部品(フレキシブルサーキッ
ト2,3など)が小形で、ケース1との隙間が狭くなる
場合には、更に細かく砕いた砕片5を用いればよい。
In the above-mentioned embodiment, the crushed pieces 5 are formed in a red bean shape, but the invention is not limited to this. When the case 1 is, for example, a thermoplastic, the raw material chips can be directly used as the crushed pieces 5, and
When the electric components (flexible circuits 2, 3 etc.) housed in the case 1 are small and the gap between the case 1 and the case 1 becomes narrow, the finely crushed pieces 5 may be used.

【0022】図2は本発明電気装置における電気部品、
ここでは前記フレキシブルサーキット2,3の実装方法
を示す。図2中、(A)は、装置ヘッド部101と本体
部102の組立て後、ケース1に設けられた孔21から
ケース1と同材質の砕片5を先に入れ、同じ孔21を用
いて充填材4を後から注入する例を示す。
FIG. 2 shows an electric component in the electric device of the present invention,
Here, a mounting method of the flexible circuits 2 and 3 will be described. In FIG. 2, (A) shows that after assembling the apparatus head part 101 and the main body part 102, the crushed pieces 5 of the same material as the case 1 are put in first from the hole 21 provided in the case 1 and the same hole 21 is used for filling. An example in which the material 4 is injected later is shown.

【0023】(B)は、装置ヘッド部101と本体部1
02の組立ての段階で、密閉前のケース1開口部(図示
せず)から砕片5をケース1内に入れ、組み立て後、充
填材4のみ前記孔21から注入する例を示す。孔21が
砕片5を通すには小さかったり、上記(A)に示す方法
を採ると、充填材4,砕片5相互の比重や粘度の関係か
ら、砕片5が充填材4の液面側に浮遊して団塊をなし、
均等に混合されないような場合に適している。
(B) shows the apparatus head portion 101 and the main body portion 1.
An example is shown in which, at the stage of assembling 02, the fragments 5 are put into the case 1 from the opening (not shown) of the case 1 before sealing, and after the assembly, only the filler 4 is injected from the hole 21. If the hole 21 is too small to pass the fragment 5, or if the method shown in (A) above is adopted, the fragment 5 floats on the liquid surface side of the filler 4 due to the relationship between the specific gravity and the viscosity of the filler 4 and the fragment 5. And make a baby boom,
Suitable for cases where they are not mixed evenly.

【0024】(C)は大型の電気装置に適用されるもの
で、ケース1も孔21も十分大きい場合の例である。こ
の場合には、予め充填材4に砕片5を混合したもの(混
合物8)をそのまま孔21よりケース1内に流し込めば
よい。
(C) is applied to a large electric device, and is an example in which both the case 1 and the hole 21 are sufficiently large. In this case, the mixture (the mixture 8) in which the crushed pieces 5 are mixed in advance with the filler 4 may be poured into the case 1 through the hole 21 as it is.

【0025】(A)〜(C)のいずれの例にあっても、
ケース1とそこに収納された電気部品(ここではフレキ
シブルサーキット2,3)との隙間が狭い場合や、孔2
1が小さい場合などには、砕片5を51に示すように更
に細かく砕いて用いればよい。
In any of the examples (A) to (C),
If the gap between the case 1 and the electric parts (here, the flexible circuits 2 and 3) housed therein is narrow, or if the hole 2
When 1 is small, the fragment 5 may be further finely crushed and used as shown by 51.

【0026】[0026]

【発明の効果】以上説明したように本発明によれば、熱
膨張係数の値がケースの熱膨張係数の値に近い充填材を
探し出さなくても、加熱,冷却(熱膨張,熱収縮)時に
生じる無理な力を緩和でき、ケースの割れやケース内の
電気部品間の信号線断線などが防止できるという効果が
ある。また、その構成も簡易で、混合物の物性が推定し
やすく(体積分率で考えればよく)、容易に設計できる
という効果もある。
As described above, according to the present invention, heating and cooling (thermal expansion, thermal contraction) can be performed without searching for a filler having a coefficient of thermal expansion close to that of the case. There is an effect that unnecessarily generated force can be relieved, and cracking of the case and disconnection of signal lines between electric parts in the case can be prevented. In addition, the structure is simple, the physical properties of the mixture can be easily estimated (it should be considered in terms of volume fraction), and there is an effect that it can be easily designed.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明装置の一実施例を示す一部切断側面図で
ある。
FIG. 1 is a partially cut side view showing an embodiment of the device of the present invention.

【図2】本発明装置における電気部品の実装方法を説明
するための図である。
FIG. 2 is a diagram for explaining a method of mounting an electric component in the device of the present invention.

【図3】従来装置の一部切断側面図である。FIG. 3 is a partially cut side view of a conventional device.

【符号の説明】[Explanation of symbols]

1 ケース 2 フレキシブルサーキット(電気部品) 3 フレキシブルサーキット(電気部品) 4 充填材 5 ケースと同材質の砕片 8 混合物 1 Case 2 Flexible circuit (electrical part) 3 Flexible circuit (electrical part) 4 Filler 5 Fragment of the same material as the case 8 Mixture

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 ケース内に電気部品を保持部材を介して
収納してなる電気装置において、前記保持部材を前記ケ
ースと同材質の物質の砕片と充填材との混合物としたこ
とを特徴とする電気装置。
1. An electric device in which an electric component is housed in a case via a holding member, wherein the holding member is a mixture of a fragment of a substance of the same material as the case and a filler. Electrical equipment.
JP8083693A 1993-04-07 1993-04-07 Electric equipment Pending JPH06296089A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8083693A JPH06296089A (en) 1993-04-07 1993-04-07 Electric equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8083693A JPH06296089A (en) 1993-04-07 1993-04-07 Electric equipment

Publications (1)

Publication Number Publication Date
JPH06296089A true JPH06296089A (en) 1994-10-21

Family

ID=13729473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8083693A Pending JPH06296089A (en) 1993-04-07 1993-04-07 Electric equipment

Country Status (1)

Country Link
JP (1) JPH06296089A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013187062A1 (en) * 2012-06-14 2013-12-19 パナソニック株式会社 Ultrasonic probe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013187062A1 (en) * 2012-06-14 2013-12-19 パナソニック株式会社 Ultrasonic probe
JPWO2013187062A1 (en) * 2012-06-14 2016-02-04 コニカミノルタ株式会社 Ultrasonic probe

Similar Documents

Publication Publication Date Title
US6392890B1 (en) Method and device for heat dissipation in an electronics system
AU649139B2 (en) Arrangement for encasing a functional device, and a process for the production of same
EP0602298B1 (en) Support for a semiconductor package
US5834835A (en) Semiconductor device having an improved structure for storing a semiconductor chip
KR0139389B1 (en) Semiconductor device capable of preventing occurrence of a shearing
DE102018210855B4 (en) semiconductor device
US6700073B2 (en) Semiconductor device
JPH1154662A (en) Flip-chip resin-sealed structure and resin-sealing method
US20200008292A1 (en) Electronic unit and method of making the same
MXPA02002649A (en) A method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple.
JPH06296089A (en) Electric equipment
Blanks The temperature dependence of component failure rate
US3066248A (en) Semiconductor device
JPS59177951A (en) Semiconductor device
US20200194341A1 (en) Semiconductor Package and Fabricating Method thereof
KR20010021214A (en) Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package
US5270573A (en) Resin mold field effect semiconductor device
JPH11354575A (en) Mounting method for semiconductor unit and semiconductor element
JPH10335533A (en) Reinforcement type solder ball arrangement structure device
JPH02237141A (en) Semiconductor device
JPH1084009A (en) Semiconductor device
JPH09260432A (en) Manufacture of semiconductor device
JPH09191064A (en) Resin sealed power module device and manufacture thereof
JP3656690B2 (en) Manufacturing method of electronic parts
JPH07249714A (en) Composite semiconductor device