JPH0629388A - Method and apparatus for wafer breaking and separation - Google Patents

Abstract

PURPOSE:To protect a chip from damage like a split, a break or a crack when the chips are separated from a wafer in a wafer breaking separation method. CONSTITUTION:In a wafer breaking separation method, a wafer 1 having breaking grooves 1A is made on a tape 2 to separate the wafer 1 using a roller 3. While the tape 2 with the wafer 1 is stretched in a reverse direction to the rotational direction of the roller 3, the wafer 1 is separated into chips 4. Also, a breaking separation apparatus comprises a tape stretching means for stretching the tape 2, to which the wafer 1 is attached, in a reverse direction to the rotational direction of the roller 3, an upward pulling means for pulling the tape 2 upward so that the tape stretching direction is slanted upward with respect to a plane of a work stage, and an upward pulling angel setting means for setting a pulling angle in the upward pulling means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer (hereinafter simply referred to as "wafer") provided with break grooves (scratches) in advance by scribe dicing, laser scribing or the like. The present invention relates to a wafer breaking / separating method and a device for implementing the same.

[0002]

2. Description of the Related Art Conventionally, compound semiconductors including optical devices (Ga
In the wafer breaking technology, which separates a wafer in which break grooves (scratches) have been previously provided in As, InP) and silicon (Si) semiconductors by scribing into chips into chips, cracks and chips do not occur in the separated chips. Break break method is required.

Generally, the break separation method is as follows.
The roller braking method is widely used, and standard equipment is commercially available. This standard equipment consists of a wafer sample holder and a break roller.
(Hereinafter, simply referred to as a roller). Then, the wafer provided with the break groove (scratch) is attached to a tape, and the wafer surface of the tape is set downward and set on a sample table, and the roller pressure load and the roller transfer speed are selected. Next, a switch is operated to rotationally move the roller on the wafer surface to break the roller and separate the chips to obtain chips.

[0004]

DISCLOSURE OF THE INVENTION As a result of examining the conventional wafer breaking method, the present inventor has found out the following problems.

In the conventional wafer breaking method described above, as shown in FIG. 4, when the wafer 101 is broken, the broken chip 101A and the next broken chip 101B collide with each other due to misalignment. They may come into contact with each other and cracks, chips, cracks, etc. may occur. In FIG. 4, 102 is a roller, 103 is an adhesive tape, 104 is a protective sheet, and 105 is a wafer mounting soft material.

For example, as a substrate material for optical devices and compound semiconductors, GaAs and InP crystals are used. Since this material is more fragile than the Si material, the degree of occurrence of cracks, chips, cracks, etc. described above is high. Is high.

In the transistor and integrated circuit (IC) of the Si device, some cracks and cracks do not affect the product characteristics, but in the laser diode of the optical element, the laser is applied from the end of the microchip. Because of the structure that emits light, cracks, chips, cracks, and the like at the end of the chip are fatal defects.

Therefore, the break isolation technology for the laser diode of the optical element is a major factor that affects the manufacturing characteristic yield. That is, it is an important issue to minimize breaks, cracks, cracks and the like during braking and realize more sharp edge break separation.

An object of the present invention is to break wafers.
It is an object of the present invention to provide a separation method capable of preventing damages such as cracks, chips, and cracks that occur when separating a wafer into chips.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

(1) In a wafer breaking / separating method in which a wafer provided with break grooves (scratches) in advance is adhered to a tape, and the break roller breaks the wafer to separate it into chips. In the opposite direction to the direction of rotation, tension is applied to the tape to which the wafer is attached to break the wafer and separate it.

(2) Wafer braking, in which a wafer having a break groove (scratch) formed in advance is adhered to a tape, and the break roller separates the wafer by breaking it.
In the separating device, the tape attached with the wafer is a tape pulling means for pulling the tape in the direction opposite to the direction in which the roller rotates and the pulling direction is upward with respect to the plane of the sample table on which the wafer is arranged, and the tape pulling means. Tension angle setting means is provided for setting the tape tension angle by the means.

(3) Tape pulling force setting means for changing the tape pulling force according to the division pitch of the wafer is provided.

(4) A vacuum suction hole is provided in the sample table, and a wafer suction fixing means for sucking and fixing the wafer by vacuuming is provided.

[0016]

According to the above-described means, tension is applied to the tape on which the wafer is adhered in the direction opposite to the direction in which the roller rotates to break the wafer, and the broken chips are quickly separated and pulled apart. Since the chips are prevented from contacting each other, damage such as cracks, chips and cracks of the separated chips can be prevented.

[0017]

Embodiments of the present invention will now be described in detail with reference to the drawings.

In all the drawings for explaining the embodiments, parts having the same function are designated by the same reference numerals and their repeated description will be omitted.

[Embodiment 1] FIG. 1 is a schematic view showing a schematic configuration of a wafer breaking / separating apparatus according to Embodiment 1 of the present invention. Reference numeral 1 denotes a break groove (scratch) previously formed by scribing or dicing. The provided wafer 1A is a break groove for dividing the wafer 1 into a plurality of chips by scribing or dicing with a diamond cutter or the like, and 2 is a surface of the wafer 1 on which the break groove 1A is provided. Adhesive tape affixed to the opposite surface, 3 rollers, 4 separated chips, 5 a sample table on which the wafer 1 is placed, and 6 a wafer table provided on the upper surface of the sample table 5. Soft material, 7 is a protective tape provided on the surface of the wafer 1 on which the break groove 1A is provided, 8
Is a vacuum suction hole, 9A is an arrow indicating the rotation direction of the roller 3, 9B is an arrow indicating the moving direction of the roller 3, and 10 is an arrow indicating the pulling direction of the adhesive tape 2.

The adhesive tape 2 has elasticity, and has a characteristic that it does not break even if it is applied with a tension above the elastic limit.

For example, a resin tape having the characteristic values shown in Table 1 is used.

[0022]

[Table 1]

Alternatively, a resin tape with an adhesive having the characteristic values shown in Table 2 is used.

[0024]

[Table 2]

The diameter of the roller 3, the moving speed of the roller 3, and the pressure at which the roller 3 presses the wafer 1 and breaks can be varied according to the division pitch size of the wafer 1 to be broken. Similarly, the tensile force of the adhesive tape 2 and the hardness of the wafer mounting soft material 6 can be selected according to the division pitch size of the wafer 1. The load of the roller 3 and the pulling force of the adhesive tape 2 may be selected optimally by air driving, driving by a motor, or directly applying a load.

Next, the operation of the first embodiment will be described with reference to FIG.

The surface of the wafer 1 on which the break groove 1A is formed is adhered to the protective tape 7, the surface opposite to that surface is adhered to the adhesive tape 2, and the break groove 1A of the wafer 1 is placed downward. For placing wafer on sample table 5
The wafer 1 is mounted on the upper surface and vacuumed through the vacuum suction hole 8 to remove air bubbles existing between the adhesive tape 2 and the wafer mounting soft material 6 and fix the wafer 1 to the sample table 5. next,
The roller 3 is set in accordance with the break position of the wafer 1. Then, one end of the adhesive tape 2 is fixed to a pulling device (not shown), pulled in the direction of arrow 10 to apply tension to the adhesive tape 2, and the roller 3 is rotated on the wafer 1 in the direction of arrow 9A. Then, a constant load is applied from above while moving in the direction of arrow 9B. This allows
As the roller 3 moves, the adhesive tape 2 moves in the direction of the arrow 10.
Wafer 1 is stretched in the direction of
The chip is broken (broken) from A and separated into a plurality of chips 4. At the same time, the protective tape 7 is pressure-bonded to the wafer mounting soft material 6 on the sample table 5 and peeled off.

By doing so, the divided chips 4 are separated from the wafer 1 at break positions,
Since the separated chips 4 do not come into contact with each other, cracks, chips, cracks and the like can be prevented from occurring.

[Embodiment 2] FIG. 2 is a schematic view showing a schematic structure of a wafer breaking / separating apparatus according to Embodiment 2 of the present invention, and 11 is a break plate (dividing plate) having a knife edge.

In the second embodiment, as shown in FIG. 2, a break plate 11 having a sharp tip is provided instead of the roller 3 of the first embodiment.
As shown by an arrow 12, the wafer 1 moves in the direction of the arrow 9B while being moved in the vertical direction at the same time as being moved upward.
It is designed to move by the division pitch size of. This division pitch can be changed according to the division pitch size of the wafer 1 to be broken. Further, the vertical movement speed and the load when descending can also be changed.

Next, the operation of the wafer breaking device of the second embodiment will be described.

In FIG. 2, the wafer 1 placed on the sample table 5 is broken by lowering the break plate 11 in the direction of the arrow 12 at a position aligned with the break groove 1A and applying pressure. At the same time, the adhesive tape 2 can be pulled in the direction of the arrow 10 to separate the chip 4 from the wafer 1.

Although the method of pitch-feeding the break plate 11 is applied in the second embodiment, the same effect can be obtained by fixing the break plate 11 and pitch-feeding the sample table 5.

[Embodiment 3] FIG. 3 is a schematic view showing a schematic structure of a wafer breaking / separating apparatus according to Embodiment 3 of the present invention. Reference numeral 13 is a pulling force of an adhesive tape 2 for separating a roller-breaked chip 4. Adhesive tape pulling roller for keeping the direction constant, 14 is an adhesive tape pulling roller 13
Is an arrow indicating the rotation direction of the.

As shown in FIG. 3, the wafer breaking / separating apparatus according to the third embodiment is different from the wafer breaking / separating apparatus in the first embodiment in that the adhesive tape for separating the roller-breaked chips 4 is fixed in the pulling direction. Pulling roller 14
Is provided, and the adhesive tape 2 is pulled in a fixed direction in the direction of arrow 10 via the adhesive tape pulling roller 14.

Roller 3 and adhesive tape pulling roller 1
Reference numeral 4 denotes a predetermined fixed positional relationship, which is adapted to move in the direction of arrow 9B parallel to the surface of the sample table 5 while rotating.

Roller 3 and adhesive tape pulling roller 1
The positions of 4 and 4 can be changed, and can be easily changed according to the division pitch size of the wafer 1 for braking them. Further, as a result, the angle θ between the surface of the sample table 5 and the adhesive tape 2 can be changed, so that the pulling angle (= θ) of the adhesive tape 2 can be changed.

The load of the break roller 3, the moving speed,
Various conditions such as the pulling angle (= θ) of the adhesive tape 2 can be changed according to the division pitch size of the wafer 1 to be broken.

Next, the operation of the wafer breaking device of the third embodiment will be described.

In FIG. 3, the wafer 1 placed on the sample table 5 is braked by lowering the roller 3 in the direction of the arrow 9A at a position aligned with the dividing groove 1A and applying pressure. At the same time, the adhesive chip 2 can be pulled in the direction of the arrow 10 to separate the chip 4 from the wafer 1.
Then, the roller 3 and the adhesive tape pulling roller 14 rotate and move in a fixed positional relationship, so that the pulling direction of the adhesive tape 2 for separating the roller-broken chip 4 can be made constant.

As can be seen from the above description, according to the first, second, and third embodiments, when the wafer 1 is broken,
The wafer 1 before the break and the chip 4 after the break are completely separated, and the broken chips 4 do not come into contact with each other. Therefore, cracks, chips, cracks or the like at the ends of the separated chips 4 and the like. Etc. can be prevented. This effect is particularly remarkable in compound semiconductors.

As a result, it is possible to reduce the probability of causing characteristic defects due to cracks, chips, cracks, adherence of foreign matter, etc., so that it is possible to improve quality and yield.

As described above, the invention made by the present inventor is
Although the present invention has been specifically described based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

[0044]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

That is, tension is applied to the tape on which the wafer is adhered in the direction opposite to the direction in which the roller rotates to break the wafer, the broken chips are quickly separated and separated, and the separated chips are separated from each other. Since there is no contact, damage such as cracks, chips, and cracks of the separated chips can be prevented.

As a result, the probability of causing characteristic defects due to cracks, chips, cracks, adhesion of foreign matter, etc. can be reduced, so that the quality and yield can be improved.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a wafer breaking according to a first embodiment of the present invention.
A schematic diagram showing a schematic configuration of the separation device,

[FIG. 2] Wafer braking of Embodiment 2 of the present invention
A schematic diagram showing a schematic configuration of the separation device,

[FIG. 3] Wafer braking of Embodiment 3 of the present invention
A schematic diagram showing a schematic configuration of the separation device,

FIG. 4 is a schematic diagram for explaining a schematic configuration of a conventional wafer breaking / separating device.

[Explanation of symbols]

1 ... Wafer, 1A ... Break groove, 2 ... Adhesive tape,
3 ... Break roller, 4 ... Chip, 5 ... Sample stand, 6 ...
Wafer mounting soft material, 7 ... Protective tape, 8 ... Vacuum suction hole, 9A ... Arrow indicating direction of rotation of break roller, 9
B ... Arrow indicating movement direction of break roller, 10 ... Arrow indicating tape pulling direction, 11 ... Break plate (separation plate), 12 ... Arrow indicating movement direction of break plate, 13 ...
Adhesive tape pulling roller, 14 ... Arrow indicating the direction of rotation of the adhesive tape pulling roller.

Claims (4)

[Claims] 1. A wafer breaking / separating method in which a wafer provided with a break groove in advance is attached to a tape, and the break roller breaks the wafer to separate it into chips. In the opposite direction to the above, a method of breaking and separating the wafer is characterized in that the wafer is separated by breaking the wafer by applying tension to the tape to which the wafer is attached. 2. A wafer breaking / separating device in which a wafer having a break groove provided in advance is attached to a tape, and a break roller is used to break and separate the wafer, and the tape to which the wafer is attached is attached to the roller. The tape pulling means for pulling upward in the direction opposite to the rotating traveling direction of the wafer and the pulling direction is upward with respect to the plane of the sample table on which the wafer is arranged, and the pulling angle setting means for setting the tape pulling angle by the tape pulling means are provided. Wafer breaking / separating device. 3. The wafer breaking / separating apparatus according to claim 2, further comprising tape pulling force setting means for changing the tape pulling force according to a division pitch of the wafer. 4. The sample stage is provided with a vacuum suction hole, and is provided with a wafer suction fixing means for sucking and fixing the wafer by vacuuming.
Alternatively, the wafer breaking / separating device according to claim 3.