JPH06290990A - Metallized polypropylene film for capacitor - Google Patents
Metallized polypropylene film for capacitorInfo
- Publication number
- JPH06290990A JPH06290990A JP7805693A JP7805693A JPH06290990A JP H06290990 A JPH06290990 A JP H06290990A JP 7805693 A JP7805693 A JP 7805693A JP 7805693 A JP7805693 A JP 7805693A JP H06290990 A JPH06290990 A JP H06290990A
- Authority
- JP
- Japan
- Prior art keywords
- film
- metal layer
- polypropylene film
- capacitor
- range
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、コンデンサ用金属化ポ
リプロプレンフイルムに関する。FIELD OF THE INVENTION The present invention relates to a metallized polypropylene film for capacitors.
【0002】[0002]
【従来の技術】ポリプロピレンフイルムは、その優れた
特性から広く工業材料として用いられている。最近で
は、市場要求の変化などに伴いポリプロピレンフイルム
に金属層を設ける用途が急増している。中でもコンデン
サ用は、従来の金属箔と巻回するものに比べ、小型化で
き、自己回復性を付与できるなどの理由から、フイルム
と金属層を一体化する金属化ポリプロピレンフイルムへ
の移行が著しい。2. Description of the Related Art Polypropylene film is widely used as an industrial material because of its excellent properties. Recently, the use of providing a metal layer on a polypropylene film is rapidly increasing due to changes in market demand. Among them, for capacitors, the transition to a metallized polypropylene film in which a film and a metal layer are integrated is remarkable because it can be downsized and can provide self-healing property as compared with a conventional metal foil wound.
【0003】該用途の重要電気特性に耐電圧特性があ
る。この耐電圧は金属層の厚さに依存し、該厚さが薄い
程高耐電圧特性が得られる。このとき、コンデンサ用金
属化誘電体では、金属層の厚さをその膜抵抗(単位:Ω
/□)で表わす(一般に膜抵抗が高い程金属層の厚さは
薄い。)。An important electrical characteristic of the application is a withstand voltage characteristic. This withstand voltage depends on the thickness of the metal layer, and the thinner the thickness, the higher the withstand voltage characteristic. At this time, in the metallized dielectric for capacitors, the thickness of the metal layer is determined by the film resistance (unit: Ω
/ □) (generally, the higher the film resistance, the thinner the metal layer).
【0004】このため、膜抵抗を高くする試みが種々な
されてきたが、膜抵抗を高くすると、金属層のフイルム
への密着力が落ち、均一で強固な金属層の形成が困難に
なる。For this reason, various attempts have been made to increase the film resistance, but when the film resistance is increased, the adhesion of the metal layer to the film is reduced, and it becomes difficult to form a uniform and strong metal layer.
【0005】従って該欠点を補うための検討が種々行な
われており、例えば特開昭58−60521号公報や特
開平3−83312号公報などではコロナ放電手法の選
択によるフィルム表面の改質が提案されている。Therefore, various studies have been carried out to make up for the drawbacks. For example, JP-A-58-60521 and JP-A-3-83312 propose modification of the film surface by selecting a corona discharge method. Has been done.
【0006】[0006]
【発明が解決しようとする課題】しかしながら特開昭5
8−60521号公報ではフイルムの表面に酸素原子を
保有していないため充分な金属付着力が得られず、金属
層に厚さむらが発生し、実用上に支障をきたすという欠
点があった。[Patent Document 1] Japanese Unexamined Patent Application Publication No. Sho 5
In Japanese Patent Laid-Open No. 8-60521, since oxygen atoms are not retained on the surface of the film, sufficient metal adhesion cannot be obtained, and uneven thickness occurs in the metal layer, which is a problem in practical use.
【0007】また特開平3−83312号公報では、コ
ンデンサの耐電圧を向上させるために膜抵抗を高くした
とき、これも均一な金属層厚さが得られないだけでな
く、さらにコンデンサの重要特性のひとつである誘電正
接が高く(悪く)なり、実用上支障をきたすことがあっ
た。Further, in JP-A-3-83312, when the film resistance is increased to improve the withstand voltage of the capacitor, not only a uniform metal layer thickness cannot be obtained, but also important characteristics of the capacitor. The dielectric loss tangent, which is one of the above problems, became high (worse), which sometimes hindered practical use.
【0008】本発明は、かかる課題に鑑み、耐電圧及び
誘電正接に優れたコンデンサを得ることが出来る金属化
ポリプロプレンフイルムを提供せんとするものである。In view of the above problems, the present invention provides a metallized polypropylene film capable of obtaining a capacitor having excellent withstand voltage and dielectric loss tangent.
【0009】[0009]
【課題を解決するための手段】本発明のコンデンサ用金
属化ポリプロピレンフイルムは、表面の原子構成比にお
いて、窒素原子数/炭素原子数(以下N/Cという)が
0.11以上0.22以下の範囲にあり、かつ酸素原子
数/炭素原子数(以下O/Cという)が0.01以上
0.20以下の範囲にあるポリプロピレンフイルムの該
表面に金属層が施され、かつ該金属層の厚さが通常部に
比べリード取り出し側の端部の方が厚い、ヘビーエッジ
構造であることを特徴とする。The metallized polypropylene film for capacitors of the present invention has a surface atomic composition ratio of the number of nitrogen atoms / the number of carbon atoms (hereinafter referred to as N / C) of 0.11 or more and 0.22 or less. And the number of oxygen atoms / the number of carbon atoms (hereinafter referred to as O / C) is in the range of 0.01 or more and 0.20 or less, the metal layer is applied to the surface of the polypropylene film, and It is characterized by having a heavy edge structure in which the end portion on the lead take-out side is thicker than the normal portion.
【0010】ポリプロピレンンフイルムの表面(通常表
面から10nm深さ以内の層)におけるN/Cは、0.
11以上0.22以下であることが好ましく、より好ま
しくは0.12以上0.18以下である。N/Cがこの
下限未満になると、10Ω/□以上の膜抵抗を形成する
場合、均一で強固な金属層を得られない。また逆にN/
Cが上記範囲の上限を越えると、フイルム及び金属化フ
イルムの静電気が高くなり、滑り性が悪くなる。このた
め、ブロッキングによる破れやコンデンサ素子巻などの
作業時にしわが発生するなどの不具合が起こり、実用上
支障をきたす。The N / C at the surface of the polypropylene film (normally within 10 nm depth from the surface) is 0.
It is preferably 11 or more and 0.22 or less, and more preferably 0.12 or more and 0.18 or less. If N / C is less than this lower limit, a uniform and strong metal layer cannot be obtained when a film resistance of 10 Ω / □ or more is formed. Conversely, N /
When C exceeds the upper limit of the above range, the static electricity of the film and the metallized film becomes high and the slipperiness deteriorates. As a result, problems such as breakage due to blocking and wrinkles during work such as winding of capacitor elements occur, which impedes practical use.
【0011】また、O/Cは0.01以上0.20以下
の範囲にあることが好ましく、より好ましくは0.05
以上0.15以下である。この上下限を外れると、N/
Cの場合と同様の支障をきたす。The O / C is preferably in the range of 0.01 or more and 0.20 or less, more preferably 0.05.
It is above 0.15. If the upper and lower limits are exceeded, N /
It causes the same trouble as in the case of C.
【0012】金属層を設ける面が片面であれば、その面
の原子構成比が上述のようになっていればよいし、金属
層を設ける面が両面であれば、両面の原子構成比が上述
のようになっていればよい。尚、金属層が設けられる面
の表層に、酸素原子のみを保有している場合、あるい
は、その逆に窒素原子のみを保有している場合は、いず
れもフイルムと金属層との接着が劣ったものとなり、金
属層の厚さむらなどの欠点が生じる。If the surface on which the metal layer is provided is one side, the atomic composition ratio of that surface may be as described above. If the surface on which the metal layer is provided is both surfaces, the atomic composition ratio on both sides is the above. It should be like. Incidentally, when the surface layer on which the metal layer is provided has only oxygen atoms, or vice versa, the adhesion between the film and the metal layer was poor. As a result, defects such as uneven thickness of the metal layer occur.
【0013】また、本発明のコンデンサ用金属化ポリプ
ロピレンフイルムの金属層の厚さ構成は、コンデンサの
良好な耐電圧と誘電正接を得るため、通常部に比べリー
ド取り出し側の端部の方が厚い、ヘビーエッジ構造であ
ることが必要である。Further, in the metallized polypropylene film for capacitors of the present invention, the thickness of the metal layer is thicker at the lead-out side end than at the normal part in order to obtain good withstand voltage and dielectric loss tangent of the capacitor. , It must be a heavy edge structure.
【0014】即ち、良好な耐電圧特性を得るには膜抵抗
を高くする必要がある一方、良好な誘電正接特性を得る
には膜抵抗(特にリードを取り出す側)を低くすること
が必要となる。膜抵抗が高い程、高い耐電圧が得られる
ことは一般によく知られている。これは、金属化誘電体
特有の自己回復性機能が、金属層が薄い程高まることに
よる。That is, it is necessary to increase the film resistance in order to obtain good withstand voltage characteristics, while it is necessary to decrease the film resistance (in particular, the side from which the leads are taken out) in order to obtain good dielectric loss tangent characteristics. . It is generally well known that the higher the membrane resistance, the higher the withstand voltage. This is because the self-healing function peculiar to the metallized dielectric is enhanced as the metal layer is thinner.
【0015】一方、誘電正接は膜抵抗が低い程低く(良
く)なることが知られているが、その大部分はリードを
取り出すためにコンデンサ素子の端面に溶射される金属
とフイルム上の金属層との接触抵抗に支配され、この接
触抵抗が低い程誘電正接も低くなる。金属溶射側の金属
層を厚くすることが必要となる所以である。On the other hand, it is known that the dielectric loss tangent is lower (better) as the film resistance is lower, but most of them are metal sprayed on the end face of the capacitor element to take out the lead and the metal layer on the film. It is governed by the contact resistance with and the lower the contact resistance, the lower the dielectric loss tangent. This is the reason why it is necessary to thicken the metal layer on the metal spraying side.
【0016】また、金属層の膜抵抗は、コンデンサの良
好な耐電圧及び誘電正接を得るには、通常部の膜抵抗が
6Ω/□以上50Ω/□以下、ヘビーエッジ部の膜抵抗
が1.0Ω/□以上5.0Ω/□以下の範囲にあること
が必要である。通常部の膜抵抗が50Ω/□を越える
と、誘電正接が高くなり、コンデンサとしての性能が悪
くなる。また、通常部の膜抵抗が6Ω/□未満になると
自己回復性が悪くなり、コンデンサの耐電圧が低くな
る。好ましくは通常部の膜抵抗は8Ω/□以上40Ω/
□以下、さらに好ましくは10Ω/□以上35Ω/□以
下である。また、ヘビーエッジ部の膜抵抗が1.0Ω/
□未満になると、金属層の形成加工時に発生する熱量が
過剰になり、フィルムが熱変形を起こすので、実用に支
障をきたす。一方、5.0Ω/□を越えると、誘電正接
が悪化する。好ましくは、1.5Ω/□以上4.5Ω/
□以下である。Regarding the film resistance of the metal layer, in order to obtain good withstand voltage and dielectric loss tangent of the capacitor, the film resistance of the normal part is 6 Ω / □ or more and 50 Ω / □ or less, and the film resistance of the heavy edge part is 1. It must be in the range of 0Ω / □ to 5.0Ω / □. If the film resistance of the normal part exceeds 50 Ω / □, the dielectric loss tangent becomes high and the performance as a capacitor deteriorates. Further, if the film resistance of the normal portion is less than 6Ω / □, the self-recovery property is deteriorated and the withstand voltage of the capacitor is lowered. Preferably, the membrane resistance of the normal part is 8 Ω / □ or more and 40 Ω /
□ or less, more preferably 10 Ω / □ or more and 35 Ω / □ or less. Also, the film resistance at the heavy edge is 1.0Ω /
If it is less than □, the amount of heat generated at the time of forming and processing the metal layer becomes excessive, causing thermal deformation of the film, which impedes practical use. On the other hand, when it exceeds 5.0 Ω / □, the dielectric loss tangent is deteriorated. Preferably, 1.5Ω / □ or more and 4.5Ω /
□ Below.
【0017】金属層を構成する金属としては亜鉛もしく
はアルミニウム単独または亜鉛とアルミニウムの2種類
併用である。これは、良好なコンデンサ特性を得ること
ができ、かつ金属層形成が比較的容易なためである。ま
た、亜鉛単独という場合にも金属付着力を向上させる目
的で核となる微量の異種金属を同時に設けることが一般
的である。核金属としては、銅、錫、銀、アルミニウ
ム、などが例示されるが、特に限定されるものではな
い。The metal constituting the metal layer is zinc or aluminum alone, or a combination of zinc and aluminum. This is because good capacitor characteristics can be obtained and the metal layer can be formed relatively easily. Also, in the case of using zinc alone, it is general to provide a small amount of a different kind of metal serving as a core at the same time for the purpose of improving the metal adhesion. Examples of the nuclear metal include copper, tin, silver and aluminum, but are not particularly limited.
【0018】また金属層を形成する方法としては、誘導
加熱式真空蒸着法、スパッタリング法、イオンビーム法
などが例示されるが、特に限定されるものではない。As a method for forming the metal layer, an induction heating type vacuum deposition method, a sputtering method, an ion beam method and the like are exemplified, but the method is not particularly limited.
【0019】本発明に用いるポリプロピレンフイルムの
ポリマーは、ホモポリマーの他にプロピレンと他のα−
オレフィン(例えばエチレン、ブテンなど)との共重合
体であっても、ポリプロピレンと他のα−オレフィン重
合体(例えばポリエチレン、ポリブテンなど)との混合
品であってもかまわない。Polymers of polypropylene film used in the present invention include homopolymers, propylene and other α-
It may be a copolymer with an olefin (eg, ethylene, butene) or a mixture of polypropylene and another α-olefin polymer (eg, polyethylene, polybutene).
【0020】本発明のフイルムとしては、無延伸フイル
ム、一軸延伸フイルム、二軸延伸フイルムのいずれでも
良いが、加工性や高温での寸法安定性が優れている二軸
延伸フイルムを用いるのが好ましい。勿論、延伸方法は
テンター法であっても、インフレーション法であっても
差し支えない。The film of the present invention may be an unstretched film, a uniaxially stretched film or a biaxially stretched film, but it is preferable to use a biaxially stretched film which is excellent in processability and dimensional stability at high temperature. . Of course, the stretching method may be either a tenter method or an inflation method.
【0021】ここで用いるフイルムの表面粗さ(Ra)
は、0.02μm以上0.15μm以下が好ましく、さ
らに好ましくは0.03μm以上0.12μm以下であ
る。この下限未満では、フイルムの滑りが悪くなるた
め、フイルムの加工や素子巻などの作業性が劣り、しわ
や巻ずれなどが発生する。逆にRaがこの上限を越える
場合にはコンデンサ内部のコロナ放電量が増大し、金属
層の飛散消失によりコンデンサの容量低下が大きくな
る。ポリプロピレンフイルムの表面粗さ(Ra)は、原
料の結晶化速度が速い程、溶融ポリマーを冷却固化する
ときの冷却速度が遅い程、延伸温度が高い程、延伸倍率
が低い程、大きくなる傾向にあり、これらを適宜選択
し、組み合せて所望の表面を得ることが出来る。Surface roughness (Ra) of the film used here
Is preferably 0.02 μm or more and 0.15 μm or less, and more preferably 0.03 μm or more and 0.12 μm or less. Below this lower limit, the slipping of the film becomes poor, so the workability of film processing and element winding is poor, and wrinkles and winding misalignment occur. On the other hand, when Ra exceeds this upper limit, the amount of corona discharge inside the capacitor increases, and the capacitance of the capacitor decreases greatly due to the scattering and disappearance of the metal layer. The surface roughness (Ra) of the polypropylene film tends to increase as the crystallization rate of the raw material increases, the cooling rate when cooling and solidifying the molten polymer decreases, the stretching temperature increases, and the stretching ratio decreases. Yes, these can be appropriately selected and combined to obtain a desired surface.
【0022】あるいは、ポリプロピレンに無機、有機の
粒子を添加したり、ポリメチルペンテンなどの多種ポリ
マーを混入させてもよい。一般にこれらの添加物は、そ
の添加量を増す程Raが大きくなる。Alternatively, polypropylene may be added with inorganic or organic particles, or various polymers such as polymethylpentene may be mixed. In general, Ra of these additives increases as the amount of addition increases.
【0023】本発明の金属化フイルムのマージン(電気
絶縁目的などにより金属化面の中に設けられる金属層の
ない部分)仕様は特に限定されるものではなく、通常の
タイプ以外に、例えばTDマージン、T型マージンなど
と呼ばれる島状の金属層を形成するものであっても差し
支えない。勿論、本発明のフイルムを使用するコンデン
サの型式は、特に限定されるものではない。例えば、巻
回型であっても、積層型であっても、あるいは乾式であ
っても、油浸式であってもかまわない。The specifications of the margin of the metallized film of the present invention (the portion without the metal layer provided in the metallized surface for the purpose of electrical insulation) are not particularly limited, and other than the usual type, for example, the TD margin. , An island-shaped metal layer called T-shaped margin may be formed. Of course, the type of capacitor using the film of the present invention is not particularly limited. For example, it may be a wound type, a laminated type, a dry type, or an oil immersion type.
【0024】次に、本発明の金属化フイルムの製造方法
の一例について説明する。但し、本発明は以下の製造方
法に限定されるものではない。Next, an example of the method for producing the metallized film of the present invention will be described. However, the present invention is not limited to the following manufacturing method.
【0025】アイソタクチック度95.0%以上のポリ
プロピレン樹脂を200〜290℃の温度で溶融し、ス
リットを施したTダイよりシート状に押出し、これを2
5〜98℃のチルロールで冷却固化する。次に110〜
150℃の温度で長手方向に4〜7倍延伸し、次いで、
幅方向に145〜165℃の温度で6〜12倍延伸し、
さらに150〜165℃の温度で熱処理する。このフイ
ルムを窒素と炭酸ガスの混合ガス雰囲気中に置き、25
00〜7500J/m2 の電気エネルギー量でフイルム
の金属層を設ける面にコロナ放電処理する。N/C及び
O/Cは、混合ガス濃度とコロナ放電処理の電気エネル
ギー量に大きく影響されるが、上記範囲のN/C及びO
/Cを得るには、混合ガスの窒素/炭酸ガスの比は70
/30〜98/2が好ましい。A polypropylene resin having an isotacticity of 95.0% or more is melted at a temperature of 200 to 290 ° C. and extruded into a sheet form from a slit T-die.
It is cooled and solidified with a chill roll at 5 to 98 ° C. Next 110
Stretching 4 to 7 times in the longitudinal direction at a temperature of 150 ° C., then
Stretched 6 to 12 times in the width direction at a temperature of 145 to 165 ° C.,
Further, heat treatment is performed at a temperature of 150 to 165 ° C. This film is placed in a mixed gas atmosphere of nitrogen and carbon dioxide gas,
Corona discharge treatment is performed on the surface of the film on which the metal layer is provided with an electric energy amount of 00 to 7500 J / m 2 . N / C and O / C are greatly influenced by the mixed gas concentration and the electric energy amount of the corona discharge treatment.
In order to obtain / C, the nitrogen / carbon dioxide ratio of the mixed gas is 70
/ 30 to 98/2 is preferable.
【0026】このフイルムを真空蒸着装置にセットし、
フイルムのコロナ放電処理面の上に、亜鉛を通常部が6
〜50Ω/□、ヘビーエッジ部が1.0〜5.0Ω/□
の膜抵抗になるように蒸着する。このとき、ヘビーエッ
ジ部と反対側端に沿ってマージンを設ける。この蒸着フ
イルムをにスリットし、これを2枚重ね巻回してコンデ
ンサ素子を作る。この素子に端面金属溶射を施し、リー
ド線を取り付けた後、外装してコンデンサとする。This film is set in a vacuum vapor deposition device,
On the corona discharge treated surface of the film, the normal part of zinc is 6
~ 50Ω / □, heavy edge 1.0-5.0Ω / □
It is vapor-deposited so as to have the film resistance of. At this time, a margin is provided along the edge opposite to the heavy edge portion. This vapor-deposited film is slit into, and two sheets of this film are stacked and wound to form a capacitor element. This element is subjected to end face metal spraying, attached with lead wires, and then packaged to form a capacitor.
【0027】[0027]
【特性の測定法及び評価法】次に、本発明に用いる測定
法及び評価方法について説明する。[Characteristic Measuring Method and Evaluation Method] Next, the measuring method and evaluation method used in the present invention will be described.
【0028】(1)フイルム表層の原子構成比 国際電気(株)製のESCAスペクトロメーターES2
00型を用い、次の条件でフイルム表面を測定した。(1) Atomic composition ratio of film surface layer ESCA spectrometer ES2 manufactured by Kokusai Electric Co., Ltd.
The film surface was measured under the following conditions using a 00 type.
【0029】 励起X線:Al K線α(1486.6eV) X線出力:10KV、20mA 温 度:20℃ 運動エネルギー補正:中性炭素(>CH2 )の運動エネ
ルギー値を1202.0eVに合わせた。得られたスペ
クトルから、C1SのピークとO1Sのピークの面積比を、
O/Cの値とし、またC1SのピークとN1Sのピークの面
積比を、N/Cの値とした。Excitation X-ray: Al K-ray α (1486.6 eV) X-ray output: 10 KV, 20 mA Temperature: 20 ° C. Kinetic energy correction: The kinetic energy value of neutral carbon (> CH 2 ) was adjusted to 1202.0 eV. It was From the obtained spectrum, the area ratio of the C 1S peak and the O 1S peak was calculated as
The value of O / C was used, and the area ratio of the peak of C 1S and the peak of N 1S was used as the value of N / C.
【0030】(2)膜抵抗 東洋メタライジング(株)製薄膜抵抗測定器を用いて、
通常部はフイルムの幅方向の中央部から、幅50mm長
さ250mm、ヘビーエッジ部はヘビーエッジ側のフイ
ルム端から幅5mm長さ250mmのサンプルを採取
し、測定した。(2) Membrane resistance Using a thin film resistance measuring instrument manufactured by Toyo Metalizing Co., Ltd.,
A sample having a width of 50 mm and a length of 250 mm was taken from the central portion in the width direction of the film for the normal part, and a sample having a width of 5 mm and a length of 250 mm was taken from the film edge on the heavy edge side for the heavy edge part and measured.
【0031】(3)誘電正接 安藤電気(株)製LCRメーター(タイプAG−431
1)を用いて、25℃の雰囲気中で、電圧1V、周波数
1KHzの条件での誘電正接を測定した。(3) Dielectric loss tangent LCR meter (Type AG-431) manufactured by Ando Electric Co., Ltd.
Using 1), the dielectric loss tangent was measured under the conditions of a voltage of 1 V and a frequency of 1 KHz in an atmosphere of 25 ° C.
【0032】(4)耐電圧 コンデンサに100V/秒の昇圧速度で交流電圧を課電
し、コンデンサが破壊するときの電圧を測定した。(4) Withstand voltage An AC voltage was applied to the capacitor at a boosting rate of 100 V / sec, and the voltage at which the capacitor was broken was measured.
【0033】(5)素子巻性 通常のコンデンサ作成工程同様の素子巻きを行ない、工
程中の挙動及び仕上がり素子の状態を調べた。このとき
の主要素子巻条件は次の通り。(5) Element winding property An element winding was carried out in the same manner as in the usual capacitor manufacturing process, and the behavior during the process and the state of the finished element were investigated. The main element winding conditions at this time are as follows.
【0034】素子巻機 :皆藤製作所製KMW−2HC 素子巻速度:2000rpm 張 力:700g また、判定は次によった。Element winding machine: KMW-2HC manufactured by Minato Manufacturing Co., Ltd. Element winding speed: 2000 rpm Tensile force: 700 g The determination was as follows.
【0035】○:良好 ×:しわ、ずれの少なくともいずれかが発生◯: Good ×: At least one of wrinkles and shifts
【0036】(6)金属厚さの均一性 ウチダ製カラービュアーの上に金属化フイルム1枚を乗
せ、透過光にて2m2の面積を目視観察した。(6) Uniformity of Metal Thickness One metallized film was placed on a color viewer made by Uchida, and an area of 2 m 2 was visually observed by transmitted light.
【0037】判定基準は次の通り。The judgment criteria are as follows.
【0038】○:良好 ×:金属膜に濃淡むらがある◯: Good ×: Metallic film has uneven density
【0039】(7)表面粗さ JIS−B−0601に準じた。尚、カットオフは0.
25mmとした。(7) Surface roughness According to JIS-B-0601. The cutoff is 0.
It was set to 25 mm.
【0040】[0040]
【実施例】次に、本発明を実施例に基づいて説明する。EXAMPLES Next, the present invention will be explained based on examples.
【0041】実施例1 アイソタクティックインデックス(II)97.0%の
ポリプロピレン樹脂を、押出機温度255℃の温度で溶
融し、スリットを施したTダイより押出し、50℃のチ
ルロールで冷却固化した後、該シートを長さ方向に13
0℃の温度で4.7倍に延伸し、次いで幅方向に155
℃の温度で9倍に延伸し、さらに160℃の温度で熱処
理し、厚さ6μmのポリプロピレンフイルムを得た。こ
のフイルムの片面を、窒素/炭酸ガスの容積比が90/
10の混合ガス雰囲気中で、5000J/m2 の電気エ
ネルギー量でコロナ放電処理した。このフイルムを真空
蒸着機中にセットし、コロナ放電処理を施した面に、銅
を核付け金属とし、通常部の膜抵抗が15Ω/□、ヘビ
ーエッジ部の膜抵抗が2.5Ω/□になるよう亜鉛を蒸
着した。このフイルムをスリットした後、素子巻してコ
ンデンサ素子を作り、該素子の端面に金属溶射を施し、
この溶射金属からリードを取り出した。次にエポキシ樹
脂にてポッティングし、コンデンサとした。このとき、
コンデンサの容量は10μFであった。Example 1 A polypropylene resin having an isotactic index (II) of 97.0% was melted at an extruder temperature of 255 ° C., extruded through a slit T-die, and cooled and solidified by a chill roll at 50 ° C. After that, the sheet is lengthwise 13
Stretched 4.7 times at a temperature of 0 ° C., then 155 in the width direction
The film was stretched 9 times at a temperature of ° C and further heat-treated at a temperature of 160 ° C to obtain a polypropylene film having a thickness of 6 µm. The nitrogen / carbon dioxide volume ratio on one side of this film is 90 /
In a mixed gas atmosphere of 10, corona discharge treatment was performed with an electric energy amount of 5000 J / m 2 . This film was set in a vacuum vapor deposition machine, and copper was used as a nucleating metal on the surface that had been subjected to corona discharge treatment, and the film resistance of the normal part was 15Ω / □ and the film resistance of the heavy edge part was 2.5Ω / □. Zinc was vapor-deposited so that After slitting this film, the element is wound to make a capacitor element, and the end face of the element is subjected to metal spraying,
The lead was taken out from this sprayed metal. Next, potting was performed with an epoxy resin to obtain a capacitor. At this time,
The capacitance of the capacitor was 10 μF.
【0042】この金属化ポリプロピレンフイルムとコン
デンサについて評価を行なった。The metallized polypropylene film and the capacitor were evaluated.
【0043】実施例2 蒸着金属を亜鉛とアルミニウムの混合とした以外は、実
施例1と同様に実施した。このときの金属層の亜鉛重量
比率は、95%であった。Example 2 The same procedure as in Example 1 was carried out except that the vapor deposition metal was a mixture of zinc and aluminum. The zinc weight ratio of the metal layer at this time was 95%.
【0044】実施例3 コロナ放電処理の電気エネルギー量を3000J/m2
とした以外は、実施例1と同様に実施した。Example 3 The electric energy amount of corona discharge treatment was 3000 J / m 2.
Example 1 was repeated except that
【0045】実施例4 通常部の膜抵抗を10Ω/□とした以外は、実施例1と
同様に実施した。Example 4 Example 4 was carried out in the same manner as in Example 1 except that the film resistance of the normal part was 10 Ω / □.
【0046】実施例5 蒸着金属をアルミニウム単独とした以外は、実施例1と
同様に実施した。Example 5 Example 5 was carried out in the same manner as in Example 1 except that aluminum was used as the vapor deposition metal.
【0047】比較例1 コロナ放電処理における電気エネルギー量を800J/
m2 とし、空気雰囲気下で処理した以外は、実施例1と
同様に実施した。Comparative Example 1 The amount of electric energy in corona discharge treatment was 800 J /
It was carried out in the same manner as in Example 1 except that m 2 was used and the treatment was performed in an air atmosphere.
【0048】比較例2 コロナ放電処理の電気エネルギー量を8000J/m2
とした以外は、実施例1と同様に実施した。Comparative Example 2 The amount of electric energy of corona discharge treatment was 8000 J / m 2.
Example 1 was repeated except that
【0049】比較例3 通常部の膜抵抗を55Ω/□とし、ヘビーエッジ部の膜
抵抗を6.5Ω/□とした以外は、実施例1と同様に実
施した。Comparative Example 3 The procedure of Example 1 was repeated except that the film resistance of the normal part was 55 Ω / □ and the film resistance of the heavy edge part was 6.5 Ω / □.
【0050】比較例4 通常部の膜抵抗を5Ω/□とし、ヘビーエッジ部の膜抵
抗を0.8Ω/□とした以外は、実施例1と同様に実施
した。Comparative Example 4 The procedure of Example 1 was repeated except that the film resistance of the normal part was 5Ω / □ and the film resistance of the heavy edge part was 0.8Ω / □.
【0051】比較例5 通常部の膜抵抗及びヘビーエッジ部の膜抵抗を共に10
Ω/□とした以外は、実施例1と同様に実施した。Comparative Example 5 Both the film resistance of the normal part and the film resistance of the heavy edge part were 10
The same procedure as in Example 1 was carried out except that Ω / □ was used.
【0052】実施例1〜実施例5、比較例1〜比較例5
の結果を表1に示す。Examples 1 to 5, Comparative Examples 1 to 5
The results are shown in Table 1.
【0053】[0053]
【表1】 [Table 1]
【0054】[0054]
【発明の効果】本発明により、耐電圧特性、誘電正接特
性及び容量変化率共に良好なコンデンサを達成出来るコ
ンデンサ用金属化ポリプロピレンフイルムを得ることが
出来た。本発明の金属化ポリプロピレンフイルムは、金
属層の均一性や素子巻などの作業性も良好である。According to the present invention, it is possible to obtain a metallized polypropylene film for a capacitor which can achieve a capacitor having good withstand voltage characteristics, dielectric loss tangent characteristics, and capacity change rate. The metallized polypropylene film of the present invention is excellent in the uniformity of the metal layer and the workability such as element winding.
【図1】本発明のコンデンサ用金属化ポリプロピレンフ
イルムの断面の一例を示した概略図である。FIG. 1 is a schematic view showing an example of a cross section of a metallized polypropylene film for capacitors of the present invention.
1:ポリプロピレンフイルム 2:金属層 3:通常部 4:ヘビーエッジ部 5:マージン 1: Polypropylene film 2: Metal layer 3: Normal part 4: Heavy edge part 5: Margin
Claims (1)
/炭素原子数が0.11以上0.22以下の範囲にあ
り、かつ酸素原子数/炭素原子数が0.01以上0.2
0以下の範囲にあるポリプロピレンフイルムの該表面に
亜鉛もしくはアルミニウム単独または亜鉛とアルミニウ
ムの2種類からなる金属層が施され、かつ該金属層の厚
さが通常部に比べリード取り出し側の端部の方が厚いヘ
ビーエッジ構造であって、かつ該金属層の通常部の膜抵
抗が6Ω/□以上50Ω/□以下、ヘビーエッジ部の膜
抵抗が1.0Ω/□以上5.0Ω/□以下の範囲にある
ことを特徴とするコンデンサ用金属化ポリプロピレンフ
イルム。1. The surface atomic composition ratio is such that the number of nitrogen atoms / the number of carbon atoms is in the range of 0.11 to 0.22 and the number of oxygen atoms / the number of carbon atoms is 0.01 to 0.2.
The surface of the polypropylene film in the range of 0 or less is coated with a metal layer consisting of zinc or aluminum alone or two kinds of zinc and aluminum, and the thickness of the metal layer is larger than that of the normal portion at the end on the lead take-out side. A thicker edge structure, and the film resistance of the normal part of the metal layer is 6Ω / □ or more and 50Ω / □ or less, and the film resistance of the heavy edge part is 1.0Ω / □ or more and 5.0Ω / □ or less. Metallized polypropylene film for capacitors, which is in the range.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7805693A JPH06290990A (en) | 1993-04-05 | 1993-04-05 | Metallized polypropylene film for capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7805693A JPH06290990A (en) | 1993-04-05 | 1993-04-05 | Metallized polypropylene film for capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06290990A true JPH06290990A (en) | 1994-10-18 |
Family
ID=13651202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7805693A Pending JPH06290990A (en) | 1993-04-05 | 1993-04-05 | Metallized polypropylene film for capacitor |
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JP (1) | JPH06290990A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0789371A1 (en) * | 1996-02-09 | 1997-08-13 | ICAR S.p.A.-Industria Condensatori Applicazioni Elettroelettroniche | Metallized dielectric film of variable resistance and relative capacitor |
EP0880153A1 (en) * | 1997-04-25 | 1998-11-25 | Toray Industries, Inc. | A metallized film, a production method thereof, and a capacitor using it |
CN102290128A (en) * | 2011-05-25 | 2011-12-21 | 扬州英利新材料有限公司 | Transparent conductive oxide film and production method thereof |
CN102915836A (en) * | 2012-08-15 | 2013-02-06 | 芜湖市金诚电子有限责任公司 | Core structure of DC (Direct Current) bus supporting capacitor applied to electric vehicle |
CN103578765A (en) * | 2013-10-15 | 2014-02-12 | 铜陵其利电子材料有限公司 | Metallized film for small-sized capacitor |
CN103578755A (en) * | 2013-10-15 | 2014-02-12 | 铜陵其利电子材料有限公司 | High-sheet-resistance metalized film for filter capacitor |
-
1993
- 1993-04-05 JP JP7805693A patent/JPH06290990A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0789371A1 (en) * | 1996-02-09 | 1997-08-13 | ICAR S.p.A.-Industria Condensatori Applicazioni Elettroelettroniche | Metallized dielectric film of variable resistance and relative capacitor |
US5757607A (en) * | 1996-02-09 | 1998-05-26 | Icar S.P.A.-Industria-Condensatori Applicazioni Elettroelettroniche | Metallized dielectric film of variable resistance and relative capacitor |
EP0880153A1 (en) * | 1997-04-25 | 1998-11-25 | Toray Industries, Inc. | A metallized film, a production method thereof, and a capacitor using it |
KR100557751B1 (en) * | 1997-04-25 | 2006-05-16 | 도레이 가부시끼가이샤 | Metal Deposition Film, Manufacturing Method and Condenser Using It |
CN102290128A (en) * | 2011-05-25 | 2011-12-21 | 扬州英利新材料有限公司 | Transparent conductive oxide film and production method thereof |
CN102915836A (en) * | 2012-08-15 | 2013-02-06 | 芜湖市金诚电子有限责任公司 | Core structure of DC (Direct Current) bus supporting capacitor applied to electric vehicle |
CN103578765A (en) * | 2013-10-15 | 2014-02-12 | 铜陵其利电子材料有限公司 | Metallized film for small-sized capacitor |
CN103578755A (en) * | 2013-10-15 | 2014-02-12 | 铜陵其利电子材料有限公司 | High-sheet-resistance metalized film for filter capacitor |
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