JPH06289977A - Production of input panel - Google Patents

Abstract

PURPOSE:To provide production capable of excluding the influence of an electrically conductive foreign matter inhibiting normal operation by interposing between resistance films concerning an input panel inputting data to an information processor by making an input pen used for a pen input device, etc., touch the input panel. CONSTITUTION:In the producing process of the input panel 1 where the resistance films 14 respectively formed at two substrates 12 and 13 which are made of insulator and at least one of which has flexibility are placed opposite to each other by way of a prescribed clearance formed by a spacer 11, as a means excluding the influence of the electrically conductive foreign matter 16 inhibiting normal operation by interposing between the resistance films 14, the correcting pen 5 is pressurized to a position where the electrically conductive foreign matter 16 of the flexible substrate 12 by force stronger than that at the time of input so as to generate a crack around an area placed opposite to the electrically conductive foreign matter 16 of the resistance films 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an input panel for inputting data to an information processing device by touching an input pen used in a pen input device or the like. The present invention relates to a means for eliminating the influence of a conductive foreign substance that hinders various operations.

When an electrically conductive foreign substance intervenes between the resistive films in an input panel in which two resistive films are opposed to each other via a spacer, the input pen or the like is pressed in the region where the electrically conductive foreign substance intervenes. There is no need to touch the board to enter the input.

The intrusion of such a conductive foreign substance occurs in the manufacturing process from the formation of the resistive film to the integration of the two substrates, and the generation ratio is small in a small input panel, but it becomes large. It increases to B4 type and occurs in most input panels.

Therefore, there is a demand for establishment of a manufacturing method capable of eliminating the influence of a conductive foreign substance which is interposed between the resistance films and impedes normal operation.

[0005]

2. Description of the Related Art FIG. 3 is a schematic diagram showing a pressure-sensitive resistance film type input panel, and FIG. 4 is a diagram for explaining the operating principle of the input panel shown in FIG.

In FIG. 3, the pressure-sensitive resistive film type input panel 1 has a resistive film on two substrates 12 and 13 with a spacer 11 interposed therebetween.
When the flexible substrate 12 is pressed by an input pen such as a stylus pen or a fingertip, the resistive films 14 that face each other are brought into contact with each other.

The resistance film 14 is connected to the electrode 15 by way of switching circuits 2a, 2b and 2c which are interlocked with each other.
The switching circuits 2a, 2b, 2c are sequentially switched to apply a voltage to one resistance film 14 and detect the potential of the pressed point via the other resistance film 14.

The equivalent circuit of such an input panel has a reference voltage V _ref between both terminals of the first resistance film 14 as shown in FIG. 4 (a).
Is applied and is pressed by the input pen etc.
The first resistance film 14 bends and the first resistance film 14 contacts the second resistance film 14 which is opposed to the first resistance film 14 with a space in between.

The first resistance film 14 has resistances R ₁ and R ₂ at the pressing points.
Is divided into two and the reference voltage V _ref is divided into the second resistance film 14
Applied to. The second resistance film 14 is connected to the A / D converter 4, and the voltage V _out corresponding to the pressing point is input to the A / D converter 4.

Here, V _out is the voltage at the pressing point,
When the total length of the resistance film 14 is X and the length from one end of the resistance film 14 to the pressing point is x, the specific resistance of the resistance film 14 is uniform and x / X =
R ₁ / R ₁ + R ₂ = V _out / V _ref , and the coordinates of the pressed point are proportional to the voltage V _out .

The first resistance film 14 and the second resistance film 14 are connected to the power supply 3 and the A / D converter 4 via the switching circuits 2a, 2b and 2c.
Connected to the power source 3 and A as shown in Fig. 4 (b).
The resistance film 14 connected to the / D converter 4 is switched and the potential at the pressing point is detected.

As shown in the figure, when the switching circuits 2a, 2b, 2c are set to the X side, a voltage is applied in the X-axis direction of one resistance film 14 via the switching circuits 2a, 2b, and the X coordinate of the pressed point is shown. The analog signal is input to the A / D converter 4 via the other resistance film 14 and the switching circuit 2c.

Next, when the switching circuits 2a, 2b, 2c are set to the Y side, a voltage is applied in the Y-axis direction of the other resistance film 14 via the switching circuits 2a, 2c, and the analog corresponding to the Y coordinate of the pressed point is obtained. The signal is input to the A / D converter 4 via one resistance film 14 and the switching circuit 2b.

That is, the reference voltage V _ref is applied alternately between the terminals of the resistance film 14 indicating the X direction or the Y direction by a time division method, and the voltage V _out output through the resistance film 14 facing each other is set. By alternately measuring, the coordinates of the pressed position can be detected.

[0015]

FIG. 5 is a diagram showing a problem in the input panel. In the input panel in which the two resistance films 14 face each other with the spacer 11 in between, the two resistance films
When the conductive foreign matter 16 is interposed between the areas 14, the area where the conductive foreign matter 16 is present is in an input state only by touching the substrate 12 without pressing it with an input pen or the like.

The conductive foreign matter 16 is formed by the resistance film 14 being swelled up with dust or the like mixed in when the resistance film 14 is formed, or the two substrates 1 on which the resistance film 14 is formed.
There is conductive dust or the like attached to the surface of the resistance film 14 before the two and 13 are opposed to each other and integrated.

Point defects caused by conductive foreign matters increase with the increase in size of the input panel, and occur in most of the input panels in the B4 type. However, the conventional manufacturing method has a problem in that even if an intervening conductive foreign substance is found after the substrates are integrated, it cannot be removed.

An object of the present invention is to provide a manufacturing method capable of eliminating the influence of a conductive foreign substance which is interposed between resistive films and which interferes with normal operation.

[0019]

FIG. 1 is a schematic view showing a method for manufacturing an input panel according to the present invention. Note that the same object is denoted by the same symbol throughout the drawings.

The above-mentioned problem is the input in which the resistance films 14 formed on two substrates 12 and 13 at least one of which is made of an insulating material and have flexibility are opposed to each other through a predetermined gap formed by the spacer 11. In the manufacturing process of the panel 1, a conductive foreign substance 16 which is interposed between the resistive films 14 and interferes with normal operation 16
As a means for eliminating the influence of the above, the correction pen 5 is pressed against the conductive foreign material 16 of the resistance film 14 at a position on the flexible substrate 12 where the conductive foreign material 16 is interposed by a force stronger than that at the time of inputting. This is achieved by the method of manufacturing an input panel according to the present invention, which causes cracks to occur around the area.

[0021]

In FIG. 1, a resistance pen is pressed by a force at the time of inputting or a force less than that on a flexible substrate of an input panel in which a correction pen having a tip equivalent to the tip of the input pen is operated. It is possible to determine the position of the conductive foreign matter interposed between the two.

After the position is fixed, the tip of the correction pen is pressed against the conductive foreign matter on the substrate with a force stronger than that at the time of inputting, so that the substrate bends and the area around the area facing the conductive foreign matter of the resistance film is pressed. A crack is generated, and conduction between the area and the surrounding resistance film is cut off.

As a result, even if the resistive film comes into contact with the conductive foreign substance when the resistive film is pressed down with the input pen, the two resistive films do not become conductive. That is, it is possible to realize a method of manufacturing an input panel that can eliminate the influence of a conductive foreign substance that is interposed between resistive films and interferes with normal operation.

[0024]

Embodiments of the present invention will be described below with reference to the accompanying drawings. 2 is a schematic view showing another embodiment of the manufacturing method according to the present invention.

The manufacturing method of the input panel according to the present invention is shown in FIG.
As shown in Fig. 1, it has a step of determining the position of the conductive foreign matter and a step of eliminating the influence. As shown in Fig. 1 (a), the power source 3 and A / D
The converter 4 is connected and the input panel 1 is put into an operating state to determine the position of the conductive foreign matter.

That is, the substrate 12 of the input panel 1 which is in the operating state is lightly pressed with, for example, a fingertip or the like, so that the conductive foreign matter is removed.
When the presence or absence of 16 is detected and the conductive foreign material 16 interposed between the resistance films 14 is detected, the position is determined by the correction pen 5 having a tip equivalent to that of the input pen.

The force of pressing the input pen at the time of input is about 100 g, and the correction pen 5 is pressed against the substrate 12 by the force at the time of input or less. If the conductive foreign substance 16 is interposed between the resistance films 14, the input state is established even if the conductive foreign substance 16 is pressed with a small force, and the position of the conductive foreign substance 16 can be determined.

If the position of the intervening conductive foreign material 16 can be determined by lightly pressing the substrate 12 of the input panel 1 with a fingertip or the like, the tip of the correction pen 5 to be subsequently pressed is pressed against the substrate 12 and the conductive foreign material 16 is pressed. The step of deciding the position where the is interposed may be omitted.

When the position is determined, as shown in FIG. 1 (b), the tip of the correction pen 5 is pressed against the substrate 12 with a stronger force than at the time of input, for example, a force of 1 kg. Usually, the tip of the correction pen 5 is larger than the conductive foreign substance 16, and when this is pressed against the substrate 12, the conductive foreign substance 16 is fitted into the substrate 12.

The resistance film 14 has an extremely thin film thickness and is a conductive foreign material 16
A crack is generated around the region facing the conductive foreign substance 16 when the metal is fitted into the substrate 12, and even after the correction pen 5 is removed, the region facing the conductive foreign substance 16 is surrounded by the surrounding resistive film 14 due to the cracks around the region. Is cut off.

As described above, the correction film having a tip equivalent to the tip of the input pen is pressed against the flexible substrate of the input panel, which is in an operating state, by the force at the time of input or a force less than that. It is possible to determine the position of the conductive foreign matter interposed between the two.

After the position is fixed, the tip of the correction pen is pressed against the conductive foreign matter of the substrate with a force stronger than that at the time of inputting, so that the substrate bends and the area around the region of the resistive film facing the conductive foreign matter is deflected. A crack is generated, and conduction between the area and the surrounding resistance film is cut off.

As a result, even if the resistive film comes into contact with the conductive foreign substance when the resistive film is pressed down with the input pen, the conductive film between the two resistive films does not become conductive. That is, it is possible to realize a method of manufacturing an input panel that can eliminate the influence of a conductive foreign substance that is interposed between resistive films and interferes with normal operation.

A voltage V higher than that at the time of input is applied across the resistance film (14).
Is applied and the flexible substrate (12) is pushed down by the roller (6), and the conductive foreign matter (1
A method of manufacturing an input panel, characterized in that the resistance film (14) facing the element (6) is damaged.

Another embodiment of the manufacturing method according to the present invention is shown in FIG.
A voltage V higher than the voltage applied at the time of input is applied between the resistance films 14 as shown in FIG. 3, and the voltage V is applied by the roller 6 made of a flexible material to the flexible substrate 12 of the input panel 1. Apply pressure.

When the conductive foreign matter 16 is interposed between the two resistance films 14, the resistance film 14 and the conductive foreign matter 16 are brought into contact with each other by pressing with the roller 6, and at the time of contact, the resistance is passed through the conductive foreign matter 16. A large current flowing between the films destroys a region of the resistance film 14 facing the conductive foreign matter 16.

As a result, even when the resistive film comes into contact with the conductive foreign substance when the resistive film is pressed down with the input pen, the conductive film between the two resistive films does not become conductive. Moreover, unlike the above-described embodiment, it is not necessary to determine the position where the conductive foreign matter 16 intervenes when eliminating the influence of the conductive foreign matter.

[0038]

As described above, according to the present invention, it is possible to provide a manufacturing method capable of eliminating the influence of the conductive foreign matter which is interposed between the resistance films and interferes with the normal operation.

[Brief description of drawings]

FIG. 1 is a schematic view showing a method for manufacturing an input panel according to the present invention.

FIG. 2 is a schematic view showing another embodiment of the manufacturing method according to the present invention.

FIG. 3 is a schematic diagram showing a pressure-sensitive resistance film type input panel.

FIG. 4 is a diagram illustrating an operation principle of the input panel shown in FIG.

FIG. 5 is a diagram showing a problem in the input panel.

[Explanation of symbols]

 1 Input panel 3 Power supply 4 A / D converter 5 Correction pen 6 Roller 11 Spacer 12, 13 Substrate 14 Resistive film 16 Conductive foreign material

Claims (2)

[Claims] 1. A resistive film (14) formed on two substrates (12, 13) made of an insulating material, at least one of which has flexibility, has a predetermined gap formed by a spacer (11). In the manufacturing process of the input panel (1) facing each other through the resistance film (14), it has flexibility as a means for eliminating the influence of the conductive foreign matter (16) which is interposed between the resistance films (14) and hinders normal operation. By facing the conductive foreign matter (16) of the resistance film (14) by pressing the correction pen (5) with a stronger force at the time of inputting on the position of the conductive foreign matter (16) on the substrate (12) A method for manufacturing an input panel, which comprises causing a crack to occur around a region. 2. A resistive film (14) formed on two substrates (12, 13) made of an insulating material, at least one of which has flexibility, has a predetermined gap formed by a spacer (11). In the manufacturing process of the input panel (1) facing each other through the resistance film (14), the resistance film (14) is used as a means for eliminating the influence of the conductive foreign matter (16) interposed between the resistance films (14) and hindering normal operation. ), A flexible substrate (12) is pressed by a roller (6) while a voltage V higher than that at the time of input is applied, and the resistance film faces the conductive foreign matter (16) by a current flowing at the time of contact. A method for manufacturing an input panel, characterized in that (14) is damaged.