JPH06286373A - High density packaging semiconductor card and manufacture thereof - Google Patents

Abstract

PURPOSE:To make the high density packaging of semiconductor chips possible and, in addition, facilitate the change of the specified chips, necessitate no abandonment of the whole card main body even when a card get out of order and enhance the durability of the card. CONSTITUTION:A plurality of semiconductor chips 8 are arranged on a substrate. Further, the wiring layer of the semiconductor chip 8 is formed through insulating layer on the semiconductor chip 8. The substrate consists of a plurality of substrate construction units connected with one another. A semiconductor chip 8 is arranged on each substrate construction unit. On the side walls of the substrate construction unit, sliding projected part 4 and sliding grooved parts 6, to which the side wall of other substrate construction unit 2 fits detachablym are formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-density mounting semiconductor card used as a high-density mounting memory card of a non-volatile memory and a method of manufacturing the same, and more specifically to high-density mounting of semiconductor chips. Further, the present invention relates to a high-density packaging semiconductor card which is easy to replace a specific chip, has excellent durability and is easy to manufacture without discarding the entire card body even if a failure occurs, and a manufacturing method thereof.

[0002]

2. Description of the Related Art A non-volatile memory card, which is used as a semiconductor card for data storage, adopts a multi-pin system. It has the advantage that it can be directly connected to the card. A conventional memory card has a plurality of semiconductor chips, such as memory chips, on the same plane of a printed circuit board, together with their wiring,
It is a structure to mount.

In order to increase the memory capacity of the memory card, the number of semiconductor chips arranged on the substrate should be increased. On the other hand, the size of the memory card is JE
IDA (Japan Electric Industry Developement As
It is limited to a certain size by standards such as sociation). Therefore, high-density mounting of semiconductor chips on a memory card is required.

[0004]

However, in the conventional memory card, as described above, since the semiconductor chip and the wiring are planarly mounted on the surface of the memory card substrate of a predetermined size, the area of the wiring is reduced. Therefore, the number of semiconductor chips that can be mounted is limited, and it is not possible to manufacture a high-density mounted memory card.

The present invention has been made in view of the above situation, enables high-density mounting of semiconductor chips, facilitates replacement of specific chips, and does not discard the entire card body even if a failure occurs. It is an object of the present invention to provide a high-density mounted memory card which has excellent durability and is easy to manufacture, and a manufacturing method thereof.

[0006]

In order to achieve the above object, a high density packaging semiconductor card of the present invention has a plurality of semiconductor chips arranged on a substrate, and a wiring layer of the semiconductor chip is
A high-density packaging semiconductor card formed on a semiconductor chip via an insulating layer, wherein the substrate is composed of a plurality of substrate constituent units, and a semiconductor chip is installed on each substrate constituent unit. It is characterized in that a fitting means for detachably fitting the side wall of another board constituting unit is formed on the side wall of the board constituting unit.

The fitting means is slidably fitted into the slide groove portions formed on two adjacent side positions of the rectangular parallelepiped board forming unit and the slide groove portions formed on another board forming unit. It is preferably configured with slide protrusions formed at other two side positions.

The semiconductor chip is composed of, for example, a non-volatile memory chip. In the method for manufacturing a high-density mounted semiconductor card of the present invention, a fitting means for detachably fitting the side wall of another board forming unit is formed on the side wall so as to form a card-shaped board by combining them in the planar direction. A step of preparing a substrate constituting unit, and a step of installing a semiconductor chip on each substrate constituting unit,
A step of connecting a conductive wire protruding in a substantially vertical direction to a pad portion formed on the surface of the semiconductor chip, a step of forming an insulating layer on the surface of the semiconductor chip to which the conductive wire is connected, and a step of protruding from the surface of the insulating layer By combining the step of cutting the tip end of the above-mentioned conductive wire and forming the contact portion on the surface of the semiconductor chip with the substrate constituent unit on which the semiconductor chip having the contact portion is installed in the plane direction, The method has a step of forming a card body and a step of wiring the contact portions arranged on the card body.

[0009]

In the high-density packaging semiconductor card of the present invention, the wiring layer of the semiconductor chip is formed on the semiconductor chip via the insulating layer, so that the semiconductor chip has a predetermined standard range (for example, JEIDA).
It is possible to secure almost the entire surface of the substrate having the size within the standard) as a mounting area for the semiconductor chip. Further, it is possible to secure almost the entire area of the front and back surfaces of the substrate as a mounting area for the semiconductor chip. Therefore, high-density mounting becomes possible, and when the semiconductor chip is a memory chip, a large capacity memory card can be realized.

Further, since the wiring layer is formed on the semiconductor chip through the insulating layer, the insulating property does not deteriorate due to vibration or shock, and the moisture resistance and mechanical strength of the card are improved, As a result, durability is also improved. Further, according to the present invention, since each semiconductor chip is installed on the substrate constituting unit and the substrate constituting units are detachably connected to each other in a plane to form the substrate, the replacement of a specific semiconductor chip is extremely easy. . In addition, even if a specific semiconductor chip fails, the board component unit with the specific semiconductor chip mounted can be removed from the card and replaced without discarding the entire card. Above all preferred.

According to the method of manufacturing a high-density mounting semiconductor card of the present invention, it is possible to easily manufacture such an excellent high-density mounting semiconductor card.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the embodiments shown in the drawings. 1 is a perspective view of a substrate constituting unit according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line II-II of FIG. 1, and FIG. 3 is a vertical wire bonding in which a semiconductor chip is mounted on the substrate constituting unit. 4 is a perspective view showing a state in which an insulating layer is formed on the semiconductor chip, FIG. 5 is a perspective view showing a state in which vertical wire bonding on the semiconductor chip is cut, and FIG. 6 is a substrate configuration. FIG. 7 is a perspective view showing a state where the unit is assembled in the plane direction to assemble the card body, FIG. 7 is a perspective view showing a state where an output pin board is attached to the card body, and FIG. 8B is a schematic side view thereof, FIGS. 9A and 9B are schematic diagrams showing the size of a semiconductor chip, and FIG. 10 is an exploded view showing a state in which a wiring board is attached to a card body. Fig. 11 is a perspective view FIG. 1 is an exploded perspective view of an essential part showing a connection structure between a wiring board and a semiconductor chip.
It is a principal part sectional view which follows the XII-XII line shown in FIG.

In the embodiments of the present invention shown in FIGS. 1 to 12, a case of manufacturing a high-density mounting memory card as the high-density mounting semiconductor card according to the present invention will be described as an example. Hereinafter, the high-density packaging memory card according to the present embodiment will be described based on its manufacturing method.

In the method of manufacturing a high-density packaging memory card according to this embodiment, first, the board constituent unit 2 shown in FIGS.
To prepare. The board forming unit 2 is made of, for example, an insulating resin. The plate thickness of the substrate constituting unit 2 is not particularly limited, but is, for example, about 2 mm. Also,
The size of the substrate constituting unit 2 is not particularly limited, but is large enough to mount a semiconductor chip described later on the unit 2, and for example, about 180-.
It has an area of 200 mm ² .

In this embodiment, the substrate constituting unit 2 has a quadrangular shape or a rectangular shape when viewed from the plane side, and the slide groove portion 6 is formed on the side portion of the unit corresponding to the adjacent two side positions. is there. In addition, slide protrusions 4 are formed on the side portions of the unit corresponding to the other two side positions so as to be slidably fitted in the slide groove portions 6 formed in the other substrate constituting unit.

In the present embodiment, the slide projection 4 has a T-shaped cross section, and the slide groove 6 has a cross section so that the slide projection 4 can be slidably fitted. It is a T-shaped groove. The slide groove portions 6 are formed along the lengthwise direction of the two adjacent side positions along the longitudinal direction of the sides, but the slide protrusions 4 have the side length L so as to avoid the adjacent slide groove portions 6. _The length L ₂ is smaller than ₁ by the depth of the groove. This is because the board constituting unit 2 is slid-fitted and coupled in a free size along the surface direction.

Next, in this embodiment, as shown in FIG.
The semiconductor chip 8 is installed on the upper surface of the substrate constituting unit 2. The semiconductor chip 8 is not particularly limited, but a 64 Mbit EEPROM memory chip can be used, for example. The size of the semiconductor chip 8 is not particularly limited, but for example, the area per chip is 179.
It is 2 mm ² . The semiconductor chip 8 is bonded to the board constituting unit 2 with an adhesive or the like. Examples of the adhesive that can be used include epoxy-based adhesives.

Next, vertical wire bonding is performed on the pad portion 10 formed on the surface of the semiconductor chip 8.
A conductive wire 12 protruding in a substantially vertical direction is connected to the pad portion 10. In the present invention, the semiconductor chip 8 after vertical wire bonding may be placed on the upper surface of the substrate constituting unit 2.

Next, in this embodiment, as shown in FIG. 4, an insulating layer 14 is formed on the surface of the semiconductor chip 8 to which the conductor wire 12 is connected.
To form. The insulating layer 14 can be formed, for example, by coating the surface of the semiconductor chip 8 with an ultraviolet curable resin or a thermosetting resin and then curing the resin. When forming the insulating layer 14, care should be taken to make the surface flat.

Thereafter, as shown in FIG. 5, the conductor wire 12 is cut, and the contact portion 12a is formed so that the cut surface is exposed from the insulating layer 14, and the card constituting unit 16 is formed. Next, in this embodiment, the card constituent unit 1
6, the slide convex portions 4 and the slide groove portions 6 formed on the substrate constituting unit 2 of 6 are slidably fitted together, and as shown in FIG. 6, for example, a combination of 5 rows in the vertical direction and 6 rows in the horizontal direction is formed into a card shape. Constitute.

Then, as shown in FIG. 7, at one end of the card constituting unit 16 assembled in a card shape,
For example, by mounting the output pin board 18 on which the output pins 22 defined by the JEIDA standard are arranged, the card body 20
To get In order to make the card body 20 function as a memory card, the semiconductor chips arranged in the card body 20 are not all 64 Mbit memory chips 8 as shown in FIG. It is necessary to use the chip 8a. When the memory card conforms to the JEIDA standard, for example, the vertical dimension of the card body is 54 mm and the horizontal dimension is 85.6 mm. The thickness of the card shall be 3.3 mm after wiring.

The size of the semiconductor chips 8 and 8a is, for example, 12.567 mm or more and less than 13.5 mm in the vertical direction and 13.
275 mm or more and less than 14.260 mm, specifically,
As shown in FIG. 9, a memory chip 8 having a length and width of 13.387 mm or a memory chip 8 having a length of 12.92 mm and a width of 13.87 mm can be used.

As shown in FIG. 8, when the semiconductor chips 8 are arranged on both the front and back sides of the board constituent unit 2 (both sides mounted) in order to construct a card conforming to the JEIDA standard, the memory chip 8 is mounted on one side. 20 cards, 40 cards on both sides can be placed, and 8MBytes with one card
It is possible to cover a memory capacity of (one memory chip) to 320 MBytes (40 memory chips).

The card body 20 shown in FIG. 7 cannot function as a high-density mounting semiconductor card by itself,
Predetermined wiring must be provided for the contact portion 12a of each semiconductor chip 8. Therefore, in this embodiment, as shown in FIGS. 10 to 12, for example, the back contact type wiring printed board 26 is mounted on the surface of the card body 20. The printed board 26 has a size corresponding to that of the card body 20.
As shown in FIG. 12, the contact portion 1 of each semiconductor chip 8
The back contact joint portion 32 connected to 2a is formed in a predetermined pattern corresponding to the contact portion 12a.

The back contact joint 32 is shown in FIG.
As shown in FIG. 12, the contact portion 12 a, which is the cut portion of the conductive wire 12, is formed so as to project from the bottom portion of the first recess 30 into which the contact portion 12 a is fitted. The first recess 30 is the pad portion 1 of the semiconductor chip 8.
It is formed at the bottom of the second recess 28 into which 0 is fitted. The back contact joint portion 32 is connected to a wiring layer 34 formed on the front surface (back surface) of the printed board 26 on the card body side. The wiring layer 34 is insulated from a contact with an unnecessary portion by the insulating layer formed on the surface of the semiconductor chip 8. The wiring layer 34 can also be formed on the surface (front surface) of the board 26 opposite to the card body. In addition, the wiring layer 34
Can be formed on both the front and back surfaces of the board 26.
By the wiring layer 34, the contact portion 1 of each semiconductor chip 8
2a is connected to the output pin 22 shown in FIG. 10 in a predetermined pattern.

In this embodiment, since the wiring layer 34 of the semiconductor chips 8 and 8a is formed on the semiconductor chip with the insulating layer 14 interposed therebetween, almost the entire surface of the substrate having a size conforming to the JEIDA standard is covered with the semiconductor. It can be secured as a mounting area for the chips 8 and 8a. In addition, it is possible to secure almost the entire area as the mounting area of the semiconductor chips 8 and 8a on both the front and back surfaces of the substrate formed by combining the substrate constituent units 2. Therefore, high-density mounting becomes possible, and when the semiconductor chip 8 is a memory chip, a large capacity memory card can be realized. For example, as shown in FIG. 8, it becomes possible to arrange 20 memory chips 8 on one side and 40 memory chips 8 on both sides.
8 MBytes (one memory chip) with one card
The memory capacity of 320 MBytes (40 memory chips) can be covered.

Further, since the wiring layer 34 is formed on the semiconductor chip 8 via the insulating layer 14, the insulating property does not deteriorate due to vibration or shock, and the moisture resistance and mechanical strength of the card are improved. As a result, the durability is also improved as a result.
Further, in the present embodiment, each semiconductor chip 8 is installed on the board forming unit 2 and the board forming unit 2
Since they are detachably connected in a plane to form a substrate, it is extremely easy to replace the specific semiconductor chips 8 and 8a. Further, even if the specific semiconductor chip 8 or 8a fails, the card component unit 16 on which the specific semiconductor chip 8 or 8a is mounted can be removed from the card and replaced without discarding the entire card. There are few things, which is good for the global environment.

According to the method of manufacturing a high-density mounting semiconductor card of the present embodiment, it is possible to easily manufacture such an excellent high-density mounting semiconductor card. The present invention is not limited to the above-mentioned embodiments, but can be modified in various ways within the scope of the present invention.

For example, in the above-described embodiment, the fitting means formed on the side portion of the board constituting unit 2 are the slide convex portion 4 and the slide groove portion having a substantially T-shaped cross section. The shape and the structure are not particularly limited, and any structure may be used as long as it is a structure that allows the substrate constituent unit 2 to be detachably connected in a free size along the surface direction.

Further, in the present invention, the means for connecting the wiring layer 34 to the contact portion 12a of each semiconductor chip 8 is not limited to the embodiment shown in FIGS. For example, without using the printed board 26, a pocket-type (packaging-type) printed wiring film with wiring patterning is used, and after the backing solder portion of the film and the contact portion 12a are aligned, the film backing solder portion and the contact portion are It is also conceivable to mount the print film on the surface of the card body so that it is soldered. Besides the pocket-type wiring print film, one-sided wiring film, U-shaped wiring film, other wiring film or wiring board can be used.

[0031]

As described above, according to the present invention, since the wiring layer of the semiconductor chip is formed on the semiconductor chip via the insulating layer, it is within a predetermined standard range (for example, JEIDA standard). It is possible to secure almost the entire surface of the substrate having the size of 1) as the mounting area of the semiconductor chip. Further, it is possible to secure almost the entire area of the front and back surfaces of the substrate as a mounting area for the semiconductor chip. Therefore, high-density mounting becomes possible, and when the semiconductor chip is a memory chip, a large capacity memory card can be realized.

Further, since the wiring layer is formed on the semiconductor chip via the insulating layer, the insulating property does not deteriorate due to vibration or shock, and the moisture resistance and mechanical strength of the card are improved, As a result, durability is also improved. Further, according to the present invention, since each semiconductor chip is installed on the respective substrate constituting units and the respective substrate constituting units are detachably connected to each other to form a substrate, it is extremely easy to replace a specific semiconductor chip. Is. In addition, even if a specific semiconductor chip fails, the board component unit with the specific semiconductor chip mounted can be removed from the card and replaced without discarding the entire card. Above all preferred.

According to the method of manufacturing a high-density mounting semiconductor card of the present invention, such an excellent high-density mounting semiconductor card can be easily manufactured.

[Brief description of drawings]

FIG. 1 is a perspective view of a substrate constituting unit according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line II-II in FIG.

FIG. 3 is a perspective view showing a state in which a semiconductor chip is mounted on a substrate constituent unit and vertical wire bonding is performed.

FIG. 4 is a perspective view showing a state in which an insulating layer is formed on a semiconductor chip.

FIG. 5 is a perspective view showing a state in which vertical wire bonding on a semiconductor chip is cut.

FIG. 6 is a perspective view showing a state where the card main body is assembled by assembling the board constituting unit in the plane direction.

FIG. 7 is a perspective view showing a state in which an output pin board is attached to the card body.

FIG. 8A is a schematic plan view of a double-sided high-density mounting memory card, and FIG. 8B is a schematic side view thereof.

9A and 9B are schematic diagrams showing the size of a semiconductor chip.

FIG. 10 is an exploded perspective view showing a state where the wiring board is attached to the card body.

FIG. 11 is an exploded perspective view of essential parts showing a connection structure between a wiring board and a semiconductor chip.

12 is a cross-sectional view of a main part taken along line XII-XII shown in FIG.

[Explanation of symbols]

 2 ... Board constituting unit 4 ... Sliding convex portion 6 ... Sliding groove portion 8 ... Semiconductor chip 10 ... Pad portion 12 ... Conducting wire 12a ... Contact portion 14 ... Insulating layer 16 ... Card constituting unit 18 ... Output pin board 20 ... Card body 22 ... Output Pins 26 ... Back contact type wiring printed board 28 ... Second recess 30 ... First recess 32 ... Back contact joint 34 ... Wiring layer

Claims (4)

[Claims] 1. A high-density packaging semiconductor card in which a plurality of semiconductor chips are disposed on a substrate, and a wiring layer of the semiconductor chip is formed on the semiconductor chip via an insulating layer, wherein the substrate comprises: A plurality of board constituent units are formed, a semiconductor chip is installed on each board constituent unit, and a side wall of each board constituent unit is formed with a fitting means for detachably fitting the side wall of another board constituent unit. High-density packaging semiconductor card. 2. The fitting means slide-fits into a slide groove portion formed on two adjacent side positions of a rectangular parallelepiped board forming unit and a slide groove portion formed on another board forming unit. The high-density mounting semiconductor card according to claim 1, wherein the high-density mounting semiconductor card comprises a slide protrusion formed on the other two sides. 3. The high-density packaging semiconductor card according to claim 1, wherein the semiconductor chip is a memory chip. 4. A method for manufacturing a high-density packaging semiconductor card in which a plurality of semiconductor chips are arranged on a substrate, wherein another substrate forming unit is provided so as to form a card-like substrate by combining them in a planar direction. The step of preparing a substrate constituting unit in which a side wall of the substrate is detachably fitted with a fitting means, a step of placing a semiconductor chip on each substrate constituting unit, and a step of forming a semiconductor chip on the surface of the semiconductor chip The step of connecting a conductor wire that protrudes in a substantially vertical direction to the pad portion that is formed, the step of forming an insulating layer on the surface of the semiconductor chip to which the conductor wire is connected, and the tip of the conductor wire that protrudes from the surface of the insulating layer Disconnect the
A step of forming a contact portion on the surface of a semiconductor chip, a step of combining a substrate constituting unit on which a semiconductor chip having a contact portion is installed in a plane direction to form a card body within a predetermined standard dimension, and a card A method for manufacturing a high-density packaging semiconductor card, comprising: wiring contact parts arranged on a main body.