JPH062822U - Piezoelectric oscillator - Google Patents

Piezoelectric oscillator

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Publication number
JPH062822U
JPH062822U JP4599692U JP4599692U JPH062822U JP H062822 U JPH062822 U JP H062822U JP 4599692 U JP4599692 U JP 4599692U JP 4599692 U JP4599692 U JP 4599692U JP H062822 U JPH062822 U JP H062822U
Authority
JP
Japan
Prior art keywords
piezoelectric ceramic
case
substrate
lead terminal
roughened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4599692U
Other languages
Japanese (ja)
Inventor
泰三 榎本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daishinku Corp
Original Assignee
Daishinku Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daishinku Corp filed Critical Daishinku Corp
Priority to JP4599692U priority Critical patent/JPH062822U/en
Publication of JPH062822U publication Critical patent/JPH062822U/en
Pending legal-status Critical Current

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

(57)【要約】 【目的】 接合強度が高く印刷インクの乗りが良い圧電
磁器振動子を提供する。 【構成】 表裏面に励振電極を形成した圧電磁器板と、
この圧電磁器板に接するとともに外部へ電極を導出する
少なくとも2つのリード端子板21,22と、これら圧
電磁器板とリード端子板とを一体的に収納したケース1
とがあり、前記リード端子板の先端リード部分を基板5
上の電極と電気的接合するとともに、前記ケース1の一
側面を基板5に接合して成る圧電磁器振動子において、
前記ケース1の少なくとも基板接合面11を粗面加工し
た。また、前記ケースの印字面を粗面加工した。
(57) [Summary] [Purpose] To provide a piezoelectric ceramic vibrator having a high bonding strength and having good printing ink coverage. [Structure] A piezoelectric ceramic plate with excitation electrodes formed on the front and back surfaces,
At least two lead terminal plates 21 and 22 which are in contact with the piezoelectric ceramic plate and lead out electrodes to the outside, and a case 1 in which the piezoelectric ceramic plate and the lead terminal plate are integrally housed.
And the tip lead portion of the lead terminal board is connected to the substrate 5
In a piezoelectric ceramic vibrator, which is electrically joined to the upper electrode and one side surface of the case 1 is joined to the substrate 5,
At least the substrate bonding surface 11 of the case 1 was roughened. The printed surface of the case was roughened.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は電子機器のクロック源として用いられる圧電磁器振動子に関するもの である。 The present invention relates to a piezoelectric ceramic vibrator used as a clock source for electronic devices.

【0002】[0002]

【従来の技術】[Prior art]

樹脂等からなるケースに収容され、リード端子板を有する圧電磁器振動子を基 板に搭載する構造として、リード部分を曲げ、基板に寝かし、ケースの一側面を 接着剤で基板に接合して搭載する構造がある。これは、リード部分のみを基板上 のホールに挿入して搭載する方法に比べ、基板搭載時の高さを低くすることがで きるとともに、接合強度が高まるからである。 また、製品として完成すると、印字面に圧電磁器振動子における、製造メーカ ー等の出所表示や周波数等の製品特性や製造ロットナンバー等のマーキングをパ ーツフィーダーで製品がならべられ、リニアフィーダーで整列させ、印刷機に送 られ凸版に不滅インク、UVインク等をつけ、一個ずつ捺印していた。 It is housed in a case made of resin, etc. and has a piezoelectric ceramic resonator with a lead terminal board mounted on a base plate. The lead part is bent, laid on the board, and one side of the case is bonded to the board with an adhesive. There is a structure to do. This is because compared to a method in which only the lead portion is inserted into the hole on the substrate and mounted, the height at the time of mounting the substrate can be made lower and the bonding strength is increased. When the product is completed, markings such as the manufacturer's origin and the product characteristics such as frequency, manufacturing lot number, etc. on the printed surface of the piezoelectric ceramic vibrator are arranged on the printed surface with the parts feeder and aligned with the linear feeder. Then, they were sent to a printing machine, imprinted with immortal ink, UV ink, etc., and stamped one by one.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかし、基板との接合面に相当するケース表面は樹脂材料を用いていることも あり、化学反応を利用した接着剤はケース表面の浸食が起こるなど振動子に悪影 響を及ぼすために使用できず、物理的な接着を行わざるを得ないが、ケース表面 が平面的なので、十分な接合強度を得ることができず、接合強度を高めるため多 量の接着剤を塗布する方法が採られていた。このため、従来の樹脂ケース構造で は、接合強度が弱いため、ケースが剥離するという問題があった。 また、ケース表面が平面的なので、印刷機によりマーキングを印刷してもイン クの乗りが悪い場合があり、印字歩留まりの低下、印字剥がれ等が起こることが あった。そして、印字面を表面として、それに対する接合面を裏面とした場合、 リード端子板のリード部分を曲げ、基板に寝かし、ケースの一側面を接着剤で基 板に接合して搭載する段階において基板に接合する面が裏面でなければならず、 その前の工程においてセンサーにより上面となっている面が表面か裏面を読みと っていたが、ケース表面が平面的なので、表面・裏面のどちらも全面反射してし まい、読み取りミスが多く発生していた。そのため、印字面を基板に接合してし まうことがあった。 However, since the case surface, which corresponds to the bonding surface with the substrate, is made of a resin material, an adhesive that uses a chemical reaction cannot be used to adversely affect the oscillator, such as corrosion of the case surface. However, since the case surface is flat, sufficient bonding strength cannot be obtained, and a method of applying a large amount of adhesive has been adopted to increase the bonding strength. It was For this reason, the conventional resin case structure has a problem that the case peels off due to the weak bonding strength. Further, since the case surface is flat, the marking may not be printed well even if the marking is printed by a printing machine, and the printing yield may decrease and the printing may peel off. When the printed surface is the front surface and the bonding surface is the back surface, the lead part of the lead terminal board is bent, laid on the board, and one side of the case is bonded to the board with an adhesive to mount the board. The surface to be joined to must be the back surface, and in the previous process, the surface that was the upper surface was read by the sensor as the front surface or the back surface, but since the case surface is flat, both the front surface and the back surface Since it was totally reflected, many reading errors occurred. Therefore, the printed surface may be bonded to the substrate.

【0004】[0004]

【課題を解決するための手段】[Means for Solving the Problems]

そこで、本考案の圧電磁器振動子は、表裏面に励振電極を形成した圧電磁器板 と、この圧電磁器板に接するとともに外部へ電極を導出する少なくとも2つのリ ード端子板と、これら圧電磁器板とリード端子板とを一体的に収納したケースと を有し、前記リード端子板の先端リード部分を基板上の電極と電気的接合すると ともに、前記ケースの一側面を基板に接合して成る圧電磁器振動子において、前 記ケースの少なくとも基板接合面を粗面加工した。 また、前記ケースの印字面も粗面加工したことを特徴とする。 Therefore, the piezoelectric ceramic vibrator of the present invention includes a piezoelectric ceramic plate having excitation electrodes formed on the front and back surfaces, at least two lead terminal plates that are in contact with the piezoelectric ceramic plate and lead out the electrodes to the outside, and these piezoelectric ceramic plates. A case in which the plate and the lead terminal plate are integrally housed, and the tip lead portion of the lead terminal plate is electrically joined to an electrode on the substrate, and one side surface of the case is joined to the substrate. In the piezoelectric ceramic vibrator, at least the substrate bonding surface of the case was roughened. Further, the printed surface of the case is also roughened.

【0005】[0005]

【作用】[Action]

これは、ケースの少なくとも基板接合面を粗面加工したことにより、従来にく らべ一定単位当りの表面積が増加するために、少量の接着剤で同様の強度で基板 に接合することが可能となった。 また、ケースの印字面も粗面加工したことにより、同様に従来にくらべ一定単 位当りの表面積が増加するために、印刷インクの乗りが良くなった。そして、印 字面(表面)とそれに対する接合面(裏面)のどちらもが全面反射することがな く、印刷面の印刷インクが部分反射するため、表面・裏面の区別がつきやすくな った。 This is because at least the surface of the case where the board is bonded has been roughened to increase the surface area per fixed unit compared to the conventional method, so it is possible to bond it to the board with the same strength with a small amount of adhesive. became. Further, since the printed surface of the case is also roughened, the surface area per fixed unit is similarly increased as compared with the conventional case, so that the printing ink can be applied well. Moreover, neither the printing surface (front surface) nor the bonding surface (rear surface) to the printing surface is totally reflected, and the printing ink on the printing surface is partially reflected, which makes it easy to distinguish between the front surface and the back surface.

【0006】[0006]

【実施例】【Example】

次に、本考案の実施例について図面を参照にして説明する。図1は本考案の実 施例を示し基板に搭載した状態の側面図である。図2は他の実施例の基板接合面 の正面図である。図3は印字面において実施した正面図である。なお、他の実施 例と同様の部分については同番号を付した。 圧電磁器振動子は励振電極の形成された圧電磁器板(図示せず)と、圧電磁器 板に接する部分を有するリード端子板21、22と、これら圧電磁器板とリード 端子板21、22の一部を収納するケース1と、リード端子板21、22のケー ス引き出し部分に充填される樹脂封止材(図示せず)とからなる。圧電磁器板は 輪郭振動を行わしめるよう分極したPZT系磁器板を方形に切り出し、その表裏 面のほぼ全面にわたって銀等の薄膜の金属材からなる励振電極が設けられている 。この圧電磁器板の中央部分に接して電気的機械的接合を行うリード端子板21 、22は金属板からなり、図示していないが、断面でみて前記圧電磁器板との接 点から上方および下方に漸次離隔する湾曲部を有しており、ケース1内の上方お よび下方に接している。ケース1は絶縁性の樹脂材からなり、全体として直方体 形状で中空になっており、前記圧電磁器板とリード端子板21、22とを一体的 に収納するとともに、その下方に切り欠きを設けここからリード端子板21、2 2の一部を引き出すように構成している。ケースに収納することにより、前記リ ード端子板の湾曲部のバネ性により圧電磁器板を狭持することになる。ケースの リード端子板引き出し部分は、封止樹脂材を充填するための凹部(図示せず)が 設けられている。そこで、ケースの基板接合面11は樹脂成形金型を電気加工、 薬品等で加工することで粗面加工できる。また、図2のようにケースの基板接合 面12をシボ加工(粗面を細かくする)にしてもよい。 そして、封止樹脂材を 用いて気密封止する。その後、リード端子板21、22の先端部分を基板5のホ ールに挿入して曲げ、基板5に寝かし、ケースの基板接合面11を接着剤で基板 5に接合して搭載する。 Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view showing an embodiment of the present invention mounted on a substrate. FIG. 2 is a front view of a substrate bonding surface of another embodiment. FIG. 3 is a front view of the printing surface. The same parts as those in the other examples are designated by the same reference numerals. The piezoelectric ceramic oscillator includes a piezoelectric ceramic plate (not shown) on which excitation electrodes are formed, lead terminal plates 21 and 22 having a portion in contact with the piezoelectric ceramic plate, and one of these piezoelectric ceramic plates and the lead terminal plates 21 and 22. It comprises a case 1 for accommodating the parts, and a resin sealing material (not shown) filled in the case lead-out portions of the lead terminal plates 21 and 22. The piezoelectric ceramic plate is obtained by cutting out a PZT type porcelain plate which is polarized so as to cause contour vibration into a rectangular shape, and excitation electrodes made of a thin metal material such as silver are provided on almost the entire front and back surfaces of the plate. Although not shown, the lead terminal plates 21 and 22 that are in contact with the central portion of the piezoelectric ceramic plate and are used for electromechanical joining are made of metal plates, and are not shown in the drawing, but are located above and below the contact point with the piezoelectric ceramic plate. Has a curved portion that is gradually separated from each other, and is in contact with the upper side and the lower side of the case 1. The case 1 is made of an insulating resin material and has a rectangular parallelepiped shape as a whole and is hollow. The piezoelectric ceramic plate and the lead terminal plates 21 and 22 are integrally housed, and a notch is provided below them. The lead terminal plates 21 and 22 are partially pulled out from the above. By housing in the case, the piezoelectric ceramic plate is sandwiched by the spring property of the curved portion of the lead terminal plate. The lead terminal board lead-out portion of the case is provided with a recess (not shown) for filling the sealing resin material. Therefore, the substrate bonding surface 11 of the case can be roughened by processing a resin molding die with electric processing, chemicals or the like. Further, as shown in FIG. 2, the substrate bonding surface 12 of the case may be textured (the rough surface is made fine). Then, airtight sealing is performed using a sealing resin material. After that, the leading end portions of the lead terminal plates 21 and 22 are inserted into the holes of the substrate 5 and bent, and they are laid on the substrate 5, and the substrate bonding surface 11 of the case is bonded to the substrate 5 with an adhesive and mounted.

【0007】 そして、図3より以上のように構成される圧電磁器振動子の印字面13におい ても粗面加工することにより、印刷機で凸版に不滅インク、UVインク等をつけ 、製造メーカー、周波数、製造ロットナンバー等のマーキング3を捺印した場合 、従来くらべて印刷インクの乗りが良くなる。そして、マーキングされた圧電磁 器振動子をセンサーにかけると印刷面の印刷インクのみが部分反射するため、上 面となっている面が印刷面13か基板接合面12かを読みと取り、印刷面が上面 にきていれば、リード端子板21、22の先端部分を基板のホールに挿入して曲 げ、基板に寝かし、ケースの基板接合面11を接着剤で基板に接合して搭載する 。Then, the printing surface 13 of the piezoelectric ceramic vibrator configured as shown in FIG. 3 is also roughened to attach immortal ink, UV ink, etc. to the letterpress in the printing machine, When the marking 3 such as the frequency and the manufacturing lot number is imprinted, the printing ink can be applied more easily than before. Then, when the marked piezoelectric ceramic vibrator is applied to the sensor, only the printing ink on the printing surface is partially reflected, so read whether the upper surface is the printing surface 13 or the substrate bonding surface 12, and print. If the surface is on the upper side, the tip portions of the lead terminal plates 21 and 22 are inserted into the holes of the board, bent, laid on the board, and the board bonding surface 11 of the case is bonded to the board with an adhesive for mounting. .

【0008】 また、本考案では基板接合面と印字面にのみ粗面加工したことを述べたが、ケ ース1の全ての面において粗面加工してもよく、ケース1の全ての面を粗面加工 することにより、接着方向及び印字方向といった方向性がなくなるため、粗面加 工するうえでの作業性が良くなる。Further, in the present invention, it has been described that only the substrate bonding surface and the printing surface are roughened, but all the surfaces of the case 1 may be roughened, and all the surfaces of the case 1 may be roughened. By roughening the surface, there is no directionality such as the adhesive direction and the printing direction, so workability in rough surface processing is improved.

【0009】[0009]

【考案の効果】[Effect of device]

本考案により、従来にくらべケースの少なくとも基板接合面における一定単位 当りの表面積が増加するために、少量の接着剤で同様の強度で基板に接合するこ とが可能となった。そのため、接着剤を多量に用いることによる接着剤のコスト 高を削減できるとともに、接着作業時間の短縮が行える。また、耐衝撃性による 電気的特性の安定がはかれるため信頼性の高い圧電磁器振動子が得られる。 また、ケースの印字面も粗面加工したことにより、同様に従来にくらべ一定単 位当りの表面積が増加するために、印刷インクの乗りが良くるため、印字歩留ま りの低下、印字剥がれ等が起こることがなくなった。そして、印字面(表面)と それに対する接合面(裏面)のどちらもが全面反射することがなく、印刷面の印 刷インクが部分反射するため、表面・裏面の区別がつきやすくなり、読み取りミ スがなく、そのため、印字面を基板に接合してしまうことがなくなった。 また、ケースの全ての面において粗面加工した場合、基板接合面、印字面とい った限定がなくなり粗面加工するうえでの作業性が良くなる。 According to the present invention, since the surface area per unit of at least the substrate bonding surface of the case is increased as compared with the conventional case, it is possible to bond the same strength to the substrate with a small amount of adhesive. Therefore, it is possible to reduce the cost of the adhesive due to the use of a large amount of the adhesive and to shorten the bonding work time. Moreover, since the electrical characteristics are stable due to impact resistance, a highly reliable piezoelectric ceramic resonator can be obtained. In addition, the printed surface of the case has also been roughened, so that the surface area per fixed unit is also increased compared to the conventional case, so that the printing ink can ride well, resulting in a decrease in the printing yield and peeling of the printing. And so on. Moreover, neither the printing surface (front surface) nor the joining surface (rear surface) is totally reflected, and the printing ink on the printing surface is partially reflected. Since there is no space, the printed surface is no longer bonded to the substrate. Further, when roughening is performed on all the surfaces of the case, the workability in roughening is improved because there is no limitation such as the substrate bonding surface and the printing surface.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の実施例を示す側面図である。FIG. 1 is a side view showing an embodiment of the present invention.

【図2】他の実施例の基板接合面の正面図である。FIG. 2 is a front view of a substrate bonding surface of another embodiment.

【図3】本考案の実施例を示す印字面の正面図である。FIG. 3 is a front view of a printing surface showing an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 ケース 11、12 基板接合面 13 印字面 21、22 リード端子板 3 マーキング 4 接着剤 5 基板 1 Case 11, 12 Board Bonding Surface 13 Printing Surface 21, 22 Lead Terminal Board 3 Marking 4 Adhesive 5 Board

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 表裏面に励振電極を形成した圧電磁器板
と、この圧電磁器板に接するとともに外部へ電極を導出
する少なくとも2つのリード端子板と、これら圧電磁器
板とリード端子板とを一体的に収納したケースとを有
し、前記リード端子板の先端リード部分を基板上の電極
と電気的接合するとともに、前記ケースの一側面を基板
に接合して成る圧電磁器振動子において、前記ケースの
少なくとも基板接合面を粗面加工したことを特徴とする
圧電磁器振動子。
1. A piezoelectric ceramic plate having excitation electrodes formed on the front and back surfaces, at least two lead terminal plates which are in contact with the piezoelectric ceramic plate and lead out the electrodes to the outside, and the piezoelectric ceramic plate and the lead terminal plate are integrated. In a piezoelectric ceramic oscillator, wherein a tip lead portion of the lead terminal plate is electrically joined to an electrode on a substrate, and one side surface of the case is joined to the substrate. Of at least the substrate bonding surface is roughened, and a piezoelectric ceramic resonator.
【請求項2】 前記ケースの印字面を粗面加工したこと
を特徴とする実用新案請求項1項記載の圧電磁器振動
子。
2. The piezoelectric ceramic vibrator according to claim 1, wherein the printed surface of the case is roughened.
JP4599692U 1992-06-08 1992-06-08 Piezoelectric oscillator Pending JPH062822U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4599692U JPH062822U (en) 1992-06-08 1992-06-08 Piezoelectric oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4599692U JPH062822U (en) 1992-06-08 1992-06-08 Piezoelectric oscillator

Publications (1)

Publication Number Publication Date
JPH062822U true JPH062822U (en) 1994-01-14

Family

ID=12734721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4599692U Pending JPH062822U (en) 1992-06-08 1992-06-08 Piezoelectric oscillator

Country Status (1)

Country Link
JP (1) JPH062822U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019130861A1 (en) * 2017-12-27 2019-07-04 株式会社松尾製作所 Three-dimensional resin-molded circuit component, production method therefor, and intermediate part for plating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019130861A1 (en) * 2017-12-27 2019-07-04 株式会社松尾製作所 Three-dimensional resin-molded circuit component, production method therefor, and intermediate part for plating
JP2019117903A (en) * 2017-12-27 2019-07-18 株式会社松尾製作所 Three-dimensional resin molded circuit component, manufacturing method thereof, and intermediate component for plating

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