JPH06279879A - Method for removing sb and/or bi from sulfuric acid-acidified aqueous solution containing sb and/or bi - Google Patents

Method for removing sb and/or bi from sulfuric acid-acidified aqueous solution containing sb and/or bi

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Publication number
JPH06279879A
JPH06279879A JP9184893A JP9184893A JPH06279879A JP H06279879 A JPH06279879 A JP H06279879A JP 9184893 A JP9184893 A JP 9184893A JP 9184893 A JP9184893 A JP 9184893A JP H06279879 A JPH06279879 A JP H06279879A
Authority
JP
Japan
Prior art keywords
sulfuric acid
aqueous solution
solution containing
leaching
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9184893A
Other languages
Japanese (ja)
Inventor
Koji Hosaka
広司 保坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikko Kinzoku KK
Original Assignee
Nikko Kinzoku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Kinzoku KK filed Critical Nikko Kinzoku KK
Priority to JP9184893A priority Critical patent/JPH06279879A/en
Publication of JPH06279879A publication Critical patent/JPH06279879A/en
Pending legal-status Critical Current

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Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

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  • Manufacture And Refinement Of Metals (AREA)

Abstract

PURPOSE:To remove Sb and/or Bi from a sulfuric acid-acidified aq. soln. contg. Sb and/or Bi. CONSTITUTION:Sb and/or Bi are removed from a sulfuric acid-acidified aq. soln. contg. Sb and/or Bi. In this case, the aq. soln. is heated at >=100 deg.C, a Pb compd. is added to the aq. soln. which is heated at >=100 deg.C, or a material contg. Pb is added to the aq. soln. which is heated at >=100 deg.C. Consequently, the process is simplified and easily controlled, and Sb and/or Bi, which are hardly separated by the well-known process, are efficiently removed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、Sb及び/又はBiを
含有する硫酸酸性水溶液からのSb及び/又はBiの除
去方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for removing Sb and / or Bi from an acidic aqueous sulfuric acid solution containing Sb and / or Bi.

【0002】[0002]

【従来技術】非鉄製錬においては、種々の鉱石を原料と
して用いているため多くの種類の金属元素が不純物とし
て混入することは避けられず、このような不純物には、
As、Sb、Biも含まれている。特に、銅製錬におい
ては、近年、Sb、Biの含有量が増える傾向にあり、
乾式法によっては完全に除去することは実際上困難であ
り、従って量的には少ないとしても、As、Sb、Bi
が粗銅(銅陽極)に含まれて次の電解精製工程へ持ち込ま
れるようになる。粗銅(銅陽極)に含まれるAs、Sb、
Bi等は電解液に一部溶出し、未溶出分はアノードスラ
イムとして電解槽底部に溜る。溶出したAs、Sb、B
i等の不純物濃度が上昇すると銅陰極に析出するように
なる。そのため不純物濃度が銅陰極に析出しないよう
に、通常電解液中のAsの濃度は5〜10g/l前後
に、また、Sb、Biの濃度は0.3〜0.5g/l前
後に維持されている。
2. Description of the Related Art In non-ferrous smelting, since various ores are used as raw materials, it is unavoidable that many kinds of metal elements are mixed in as impurities.
It also includes As, Sb, and Bi. Especially in copper smelting, the contents of Sb and Bi tend to increase in recent years,
It is practically difficult to completely remove it by the dry method, and therefore, even if it is small in quantity, As, Sb, Bi
Is contained in crude copper (copper anode) and is brought to the next electrolytic refining step. As, Sb, contained in crude copper (copper anode)
Bi and the like are partially eluted in the electrolytic solution, and the uneluted portion is accumulated at the bottom of the electrolytic cell as anode slime. Eluted As, Sb, B
When the concentration of impurities such as i rises, they are deposited on the copper cathode. Therefore, the concentration of As in the electrolytic solution is usually maintained at around 5 to 10 g / l, and the concentrations of Sb and Bi are maintained at around 0.3 to 0.5 g / l so that the impurity concentration is not deposited on the copper cathode. ing.

【0003】これらの不純物濃度を維持する一般的な方
法として、電解液の一部を別の電解槽に抜き出し、いわ
ゆる脱銅電解が行なわれるが、脱銅電解の後期になると
陰極にCuと共にAs、Sb、Bi等が粒状叉は粉状に
析出し、また、電解槽底部に沈澱してくる。電解沈澱銅
とは当業者の呼称であって、上記陰極から掻き取ること
のできるものや槽底に沈澱するものを合わせて一般に電
解沈澱銅と称している。
As a general method for maintaining the concentration of these impurities, a part of the electrolytic solution is taken out into another electrolytic cell to perform so-called decoppering electrolysis. In the latter stage of decoppering electrolysis, Cu is added to the cathode together with As. , Sb, Bi, etc. are deposited in the form of particles or powder, and also at the bottom of the electrolytic cell. Electrolytically precipitated copper is a name of those skilled in the art, and those that can be scraped off from the cathode and those that precipitate on the bottom of the tank are generally referred to as electrolytically precipitated copper.

【0004】この電解沈澱銅は、銅製錬工程に繰返され
るのが一般的であるが、製錬工程内を多量の不純物が循
環することになるので好ましい方法ではない。このた
め、従来から電解沈澱銅中の不純物を製錬系外に除去す
るための乾式法叉は湿式法が提案されている。乾式法
は、亜砒酸(As23)を含有する排ガス及びダストの
処理等によりコスト高となるだけでなく、作業環境上か
ら見ても好ましい方法とは言えず、結局、湿式法による
処理を考える必要がある。
This electrolytically precipitated copper is generally repeated in the copper smelting process, but a large amount of impurities circulate in the smelting process, which is not a preferable method. Therefore, conventionally, a dry method or a wet method for removing impurities in electrolytically precipitated copper out of the smelting system has been proposed. The dry method is not only costly due to the treatment of exhaust gas and dust containing arsenous acid (As 2 O 3 ), but is not a preferable method from the working environment. I need to think.

【0005】湿式処理方法としては、例えば、電解沈澱
銅を酸素含有ガスの共存下で硫酸溶液と接触させ、Cu
及びAsを浸出した後、浸出液を冷却により又は浸出液
に硫化砒素と過酸化水素水溶液を添加して、それぞれC
uとAsとを分離する方法(特開昭59−74245、特開昭5
9−83936)等があるが、何れも分離された水溶液中に
は、相当量の不純物(Sb,Bi等)を含有しているも
のであった。得られた水溶液から分離回収されるCu及
びAsの形態は、一般には、丹パン(CuSO4・5H2
O)、或いは、硫化銅(CuS)、及び、亜砒酸(As
23)であるが、上記の不純物が必然的に含有されるこ
とになる。粗硫化銅は銅製錬に繰り返され、粗丹パン、
粗亜砒酸は、それぞれ再精製された後製品となるが、銅
製錬に繰り返される上記不純物量が多い、或いは、粗丹
パン,粗亜砒酸からの上記不純物の除去が難しい等の問
題点があった。
As a wet treatment method, for example, electrolytically precipitated copper is brought into contact with a sulfuric acid solution in the presence of an oxygen-containing gas, and Cu is added.
After leaching As and As, the leaching solution is cooled or arsenic sulfide and an aqueous hydrogen peroxide solution are added to the leaching solution to obtain C, respectively.
A method for separating u from As (Japanese Patent Laid-Open No. 59-74245, Japanese Patent Laid-Open No.
9-83936), etc., but the separated aqueous solutions each contained a considerable amount of impurities (Sb, Bi, etc.). The form of Cu and As separated and recovered from the obtained aqueous solution is generally tanpan (CuSO 4 .5H 2
O) or copper sulfide (CuS) and arsenous acid (As
2 O 3 ) but the above impurities are inevitably contained. Crude copper sulfide is repeated in copper smelting,
Crude arsenous acid becomes a product after being re-refined, but there are problems that the amount of the impurities is repeated in copper smelting or the removal of the impurities from crude tanpan and crude arsenous acid is difficult.

【0006】上記の問題点を解決する方法として、例え
ば、Cu、Asを浸出して得られた硫酸酸性水溶液をp
H1.5〜2.5に保持して亜硫酸ガスを吹き込み、冷
却後生成した沈澱を分離し、Sb、Biの少ないCu、
As含有硫酸酸性水溶液を製造する方法(特開昭61−23
5521)、また、電解沈澱銅を酸素含有ガスの共存下で鉄
イオンを含む硫酸酸性水溶液と接触させ、Sb、Biの
少ないCu、As含有硫酸酸性水溶液を製造する方法
(特開昭61−69930)、あるいは、電解沈澱銅に、硫酸
水溶液を添加して撹拌しながら、5〜15容量%の亜硫
酸ガス及び15容量%以下の酸素含有ガスを吹き込み得
られた浸出液を、活性炭と接触させ、Sb、Biの少な
いCu、As含有硫酸酸性水溶液を製造する方法(特開
昭61−83625)、さらには、酸素含有ガスの共存下で電
解沈澱銅と水酸化アルカリ水溶液を接触させてAsを浸
出し、固液分離によりSb、Biの少ないAs含有アル
カリ水溶液と不溶解残渣を得た後、不溶解残渣と硫酸溶
液を接触させ、Sb、Biの少ないCu含有硫酸酸性水
溶液を製造する方法(特開昭62−77431)等がある。
As a method for solving the above problems, for example, a sulfuric acid acidic aqueous solution obtained by leaching Cu or As is added with p.
Sulfurous acid gas was blown while maintaining H1.5 to 2.5, the precipitate formed after cooling was separated, and Cu containing less Sb and Bi,
Method for producing As-containing sulfuric acid aqueous solution (JP-A-61-23)
5521), and electrolytically precipitated copper is brought into contact with an acidic sulfuric acid aqueous solution containing iron ions in the presence of an oxygen-containing gas to produce an acidic sulfuric acid aqueous solution containing Cu and As with less Sb and Bi (JP-A-61-69930). ) Alternatively, a sulfuric acid aqueous solution is added to the electrolytically precipitated copper, and 5 to 15% by volume of sulfurous acid gas and 15% by volume or less of an oxygen-containing gas are blown into the resulting leachate to bring it into contact with activated carbon. , A method of producing a sulfuric acid aqueous solution containing Cu and As containing less Bi (JP-A-61-83625), and further, leaching As by contacting electrolytically precipitated copper with an aqueous alkali hydroxide solution in the presence of an oxygen-containing gas. A method for producing a Cu-containing sulfuric acid acid aqueous solution containing less Sb and Bi by contacting the insoluble residue and sulfuric acid solution after obtaining an As-containing alkaline aqueous solution containing less Sb and Bi by solid-liquid separation. Sho 6 2-77431) etc.

【0007】これらの方法により、Sb、Biの少ない
Cu、As含有水溶液を製造することは可能であるが、
鉄イオン量、亜硫酸ガス量、或いは、水酸化アルカリ量
を制御する必要があり、これらの過不足により、Sb、
Biの浸出率の上昇、或いは、銅、砒素の浸出率の低下
がある。亜硫酸ガス添加の場合、Sb5+のSb3+への還
元だけでなくAs5+の還元も起こり溶解度の小さいAs
3+が生成するため、As濃度の高い液を得ることは難し
く、Asの浸出率が低下する。また、鉄イオン添加の場
合、AsとFeの化合物にSb、Biを共沈させている
ため、As濃度の高い液を得ることは難しく、Asの浸
出率が低下する。鉄イオン量、亜硫酸ガス量、或いは、
水酸化アルカリ量の適量は、電解沈澱銅中のCu量、叉
は、As量によって決定されるが、電解沈澱銅のCu、
As品位が変動するため、Sb、BiとCu、Asとの
分離成績が変動しやすいと言う問題点があった。
Although it is possible to produce an aqueous solution containing Cu and As containing a small amount of Sb and Bi by these methods,
It is necessary to control the amount of iron ions, the amount of sulfurous acid gas, or the amount of alkali hydroxide, and Sb,
There is an increase in the leaching rate of Bi or a decrease in the leaching rate of copper and arsenic. When sulfurous acid gas is added, not only the reduction of Sb 5+ to Sb 3+ but also the reduction of As 5+ takes place and
Since 3+ is generated, it is difficult to obtain a liquid having a high As concentration, and the leaching rate of As decreases. Further, in the case of adding iron ions, since Sb and Bi are co-precipitated in the compound of As and Fe, it is difficult to obtain a liquid having a high As concentration, and the leaching rate of As decreases. Iron ion amount, sulfurous acid gas amount, or
The appropriate amount of the alkali hydroxide is determined by the amount of Cu in the electrolytically precipitated copper, or the amount of As.
There is a problem that the separation quality of Sb, Bi and Cu, As is likely to fluctuate because the As quality varies.

【0008】銅電解液中のSb,Biを除去する他の方
法として、キレート樹脂を用いた吸着による方法(特公
昭62−6751,特公平 5−5901)がある。この方法では、
Sb,Biの除去効率が高いと言う利点はあるが、樹脂
に吸着したSb,Biを溶離するための高価な塩酸,硝
酸等を多量に必要とし、コスト高になると言う欠点があ
った。
As another method for removing Sb and Bi in the copper electrolytic solution, there is a method by adsorption using a chelate resin (Japanese Patent Publication No. 62-6751, Japanese Patent Publication No. 5-5901). in this way,
Although it has an advantage that the removal efficiency of Sb and Bi is high, it has a drawback that it requires a large amount of expensive hydrochloric acid, nitric acid and the like for eluting Sb and Bi adsorbed on the resin, resulting in a high cost.

【0009】[0009]

【問題点を解決するための手段】上記の問題点を解決す
るために、本発明者等がSb及び/又はBiを含有する
硫酸酸性水溶液から、Sb及び/又はBiを除去する方
法について、鋭意検討を続けた結果、Sb及び/又はB
iを含有する硫酸酸性水溶液を100℃以上で加熱処理
する、或いは、該硫酸酸性水溶液にPb化合物を添加し
100℃以上で加熱処理する、さらには、該硫酸酸性水
溶液にPbを含有する物質を添加し100℃以上で加熱
処理することにより、処理液中のSb、Biが除去され
ることを見い出した。従って、本発明の目的は、Sb及
び/又はBiを含有する硫酸酸性水溶液からのSb及び
/又はBiの除去方法を提供することである。
[Means for Solving the Problems] In order to solve the above-mentioned problems, the present inventors have keenly studied a method for removing Sb and / or Bi from an aqueous sulfuric acid solution containing Sb and / or Bi. As a result of continued examination, Sb and / or B
A sulfuric acid acidic aqueous solution containing i is heat-treated at 100 ° C. or higher, or a Pb compound is added to the sulfuric acid acidic aqueous solution and heat-treated at 100 ° C. or higher. Further, a substance containing Pb in the sulfuric acid acidic aqueous solution is added. It was found that Sb and Bi in the treatment liquid were removed by adding and heating at 100 ° C. or higher. Therefore, an object of the present invention is to provide a method for removing Sb and / or Bi from a sulfuric acid aqueous solution containing Sb and / or Bi.

【0010】[0010]

【発明の構成】即ち、本発明は、 (1)Sb及び/又はBiを含有する硫酸酸性水溶液
を、100℃以上で加熱処理することを特徴とする、S
b及び/又はBiを含有する硫酸酸性水溶液からのSb
及び/又はBiの除去方法。 (2)Sb及び/又はBiを含有する硫酸酸性水溶液
に、Pb化合物を添加することを特徴とする、前記
(1)記載のSb及び/又はBiを含有する硫酸酸性水
溶液からのSb及び/又はBiの除去方法。 (3)Sb及び/又はBiを含有する硫酸酸性水溶液
に、Pbを含有する物質を添加することを特徴とする、
前記(1)記載のSb及び/又はBiを含有する硫酸酸
性水溶液からのSb及び/又はBiの除去方法。 (4)Sb及び/又はBiを含有する硫酸酸性水溶液
が、電解沈殿銅を100℃未満で浸出処理したものであ
ることを特徴とする、前記(1)乃至前記(3)記載の
Sb及び/又はBiを含有する硫酸酸性水溶液からのS
b及び/又はBiの除去方法。 に関する。
That is, the present invention is characterized in that (1) a sulfuric acid acidic aqueous solution containing Sb and / or Bi is heated at 100 ° C. or higher.
Sb from acidic aqueous sulfuric acid solution containing b and / or Bi
And / or a method for removing Bi. (2) Sb and / or Sb and / or Sb and / or Bi from the sulfuric acid aqueous solution containing Sb and / or Bi as described in (1) above, characterized in that a Pb compound is added to the sulfuric acid aqueous solution containing Sb and / or Bi. How to remove Bi. (3) A substance containing Pb is added to an acidic sulfuric acid aqueous solution containing Sb and / or Bi,
The method for removing Sb and / or Bi from an acidic aqueous sulfuric acid solution containing Sb and / or Bi according to (1) above. (4) Sb and / or Sb and / or (3) described above, wherein the sulfuric acid acidic aqueous solution containing Sb and / or Bi is obtained by leaching electrolytically precipitated copper at less than 100 ° C. Or S from an acidic sulfuric acid aqueous solution containing Bi
b and / or Bi removal method. Regarding

【0011】[0011]

【発明の具体的説明】本発明の理解を容易にするため具
体的かつ詳細に説明する。本発明の対象となるSb及び
/又はBiを含有する硫酸酸性水溶液としては、特に制
限はない。銅製錬においては、電解沈殿銅あるいはアノ
ードスライムを硫酸を用いて浸出した水溶液等が例示さ
れる。以下、電解沈殿銅を硫酸を用いて浸出した場合を
例として説明するが、本発明は何らこれに限定されるも
のではない。
DETAILED DESCRIPTION OF THE INVENTION A specific and detailed description will be given to facilitate understanding of the present invention. The sulfuric acid aqueous solution containing Sb and / or Bi, which is the object of the present invention, is not particularly limited. In copper smelting, an aqueous solution or the like obtained by leaching electrolytically precipitated copper or anode slime with sulfuric acid is exemplified. Hereinafter, a case where electrolytically precipitated copper is leached with sulfuric acid will be described as an example, but the present invention is not limited thereto.

【0012】電解沈殿銅の硫酸溶液での浸出反応は、下
式に従う反応が進行されるものであり、CuはCu2+
で、また、AsはAs5+まで酸化され、Cu、Asの大
部分が浸出される。 Cu + H2SO4 + 1/2・O2 → CuSO4 + H2O ・・・・ (1) 2As + 5/2・O2 + 3H2O → 2H3AsO4 ・・・・ (2) 硫酸使用量は、Cu量に対し好ましくは1.0〜1.2
当量であり、1.0当量未満の場合浸出液が弱酸性にな
り、Cu3AsO4等の沈澱物が生成しCu、Asの浸出
率が低下する。1.2当量を超える場合は、Cu、As
の浸出率に影響しないが、使用硫酸量が多くなるので、
好ましくない。Cu、Asの濃度は特に制限はないが、
溶解度を越えるとCu、Asの浸出率が低下するので、
Cu2+、As5+の溶解度以下が好ましい。
In the leaching reaction of electrolytically precipitated copper with a sulfuric acid solution, the reaction according to the following formula proceeds, Cu is oxidized to Cu 2+ , As is oxidized to As 5+ , and the large amount of Cu and As. The part is leached. Cu + H 2 SO 4 + 1/2 ・ O 2 → CuSO 4 + H 2 O ・ ・ ・ ・ (1) 2As + 5/2 ・ O 2 + 3H 2 O → 2H 3 AsO 4・ ・ ・ ・ (2 ) The amount of sulfuric acid used is preferably 1.0 to 1.2 with respect to the amount of Cu.
When the amount is less than 1.0 equivalent, the leachate becomes weakly acidic, and precipitates such as Cu 3 AsO 4 are formed to reduce the leaching rate of Cu and As. If it exceeds 1.2 equivalents, Cu, As
Although it does not affect the leaching rate of, since the amount of sulfuric acid used increases,
Not preferable. The concentration of Cu and As is not particularly limited,
If the solubility is exceeded, the leaching rate of Cu and As will decrease.
It is preferably not more than the solubility of Cu 2+ and As 5+ .

【0013】酸素含有ガスの共存下で温度100℃未満
で、電解沈澱銅と硫酸酸性溶液とを接触させ浸出処理を
行なった場合には、Cu、Asの共存下ではAsの濃度
が高くなるに従って特にSbの浸出率が高くなり、Bi
もわずかに浸出される。浸出されるSbの形態は、As
濃度が低い場合はほとんどSb3+の形態であるが、As
濃度が高い場合はSb5+の形態で浸出される。この理由
については明確でないが、As濃度の高い浸出液を得よ
うとすると、かかる処理によって得られる浸出液中のS
b濃度が高くなり、Sbの少ないAsの高い浸出液を得
ることは困難である。
When the electrolytically precipitated copper and the sulfuric acid acidic solution are brought into contact with each other at a temperature of less than 100 ° C. in the presence of an oxygen-containing gas to perform leaching treatment, as the concentration of As increases in the presence of Cu and As. In particular, the leaching rate of Sb becomes high and Bi
Is also slightly leached. The form of leached Sb is As
When the concentration is low, the form is Sb 3+ , but As
If the concentration is high, it is leached in the form of Sb 5+ . The reason for this is not clear, but if an attempt is made to obtain a leachate with a high As concentration, the S in the leachate obtained by such treatment will be
It is difficult to obtain a leachate with a high b concentration and a high As content and a low Sb content.

【0014】酸素含有ガスの共存下で100℃未満で、
電解沈澱銅と硫酸溶液とを接触させて得られた浸出液を
100℃以上で加熱処理する場合、或いは、該浸出液に
Pb化合物を添加し100℃以上で加熱処理する場合、
さらには、該浸出液にPbを含有する物質を添加し10
0℃以上で加熱処理する場合、一旦液中に溶解したSb
5+は、下式に従う反応が進行しSbが沈殿するものと想
定される。 2H3SbO4 → Sb2O5↓ + 3H2O ・・・・ (3) 上記反応によるSbの沈殿物は、該浸出液中のBi、P
bやCu、Asのごく一部とともに共沈する。さらに、
該浸出液にPb化合物、あるいは、Pbを含有する物質
を添加した場合は、添加物とも共沈するためSbの沈殿
率が高くなる。
Below 100 ° C. in the presence of an oxygen-containing gas,
When the leachate obtained by contacting electrolytically precipitated copper with a sulfuric acid solution is heat-treated at 100 ° C. or higher, or when a Pb compound is added to the leachate and heat-treated at 100 ° C. or higher,
Furthermore, a substance containing Pb is added to the leachate to obtain 10
When heat-treated at 0 ° C or higher, Sb once dissolved in the liquid
For 5+ , it is assumed that the reaction according to the following formula proceeds and Sb precipitates. 2H 3 SbO 4 → Sb 2 O 5 ↓ + 3H 2 O ··· (3) The precipitate of Sb due to the above reaction is Bi, P in the leachate.
Coprecipitates with a small amount of b, Cu and As. further,
When a Pb compound or a substance containing Pb is added to the leaching solution, the precipitation rate of Sb increases because it coprecipitates with the additive.

【0015】本発明で用いるPb化合物としては特に制
限はないが、代表的にはPbSO4,PbO,PbCO3
等が例示される。又、Pbを含有する物質も特に制限は
ないが、銅製錬においては、電解沈殿銅又はアノードス
ライムを硫酸で浸出した場合の浸出残渣等が例示され
る。Pb化合物又はPbを含有する物質の添加量は、特
に制限はないが、添加量が少ないとSbの沈殿率が低く
なり、また、多量に添加すると沈殿物中のSb品位が低
くなりSbの回収原料として不適となる。処理温度は、
100℃以上であれば特に制限はないが、好ましくは、
160℃〜240℃であり、温度が低いとSbの析出率
が低くなり、また、温度が高いと加熱コストが高くな
る。なお、酸素含有ガスの共存下で100℃以上で、電
解沈澱銅と硫酸溶液とを接触して処理する(電解沈殿銅
浸出残渣が共存する)方法も可能であり、本発明の実施
態様である。なお、本発明で酸性とはpH2.5以下を
意味する。pH2.5を越えるとCu3AsO4等が析出
するため好ましくない。
The Pb compound used in the present invention is not particularly limited, but is typically PbSO 4 , PbO, PbCO 3
Etc. are illustrated. The substance containing Pb is also not particularly limited, but in copper smelting, examples include leaching residues when electrolytically precipitated copper or anode slime is leached with sulfuric acid. The addition amount of the Pb compound or the substance containing Pb is not particularly limited, but if the addition amount is small, the precipitation rate of Sb will be low, and if added in a large amount, the Sb quality in the precipitate will be low and the recovery of Sb will be Not suitable as a raw material. The processing temperature is
There is no particular limitation as long as it is 100 ° C. or higher, but preferably,
The temperature is 160 ° C. to 240 ° C. When the temperature is low, the Sb precipitation rate is low, and when the temperature is high, the heating cost is high. A method of treating electrolytically precipitated copper with a sulfuric acid solution in contact with an oxygen-containing gas at 100 ° C. or higher (the electrolytically precipitated copper leaching residue coexists) is also possible, which is an embodiment of the present invention. . In addition, in this invention, acidic means pH 2.5 or less. When the pH exceeds 2.5, Cu 3 AsO 4 and the like are precipitated, which is not preferable.

【0016】本発明に従えば、Cu、Asを含有し、S
b及び/又はBiを含有する硫酸酸性水溶液から、C
u、Asの濃度を確保し、Sb及び/又はBiを除去さ
せることができる。本発明法により得られるCu、As
含有硫酸酸性水溶液は、公知の方法によるCu、Asの
分離、回収に好適なものである。
According to the present invention, Cu, As are contained, and S
From a sulfuric acid acidic aqueous solution containing b and / or Bi, C
It is possible to secure the concentrations of u and As and remove Sb and / or Bi. Cu and As obtained by the method of the present invention
The contained sulfuric acid acidic aqueous solution is suitable for separation and recovery of Cu and As by a known method.

【0017】以下、本発明の実施例について説明する。Examples of the present invention will be described below.

【実施例1】Cu 48.2%、As 41.2%、Sb 4.14
%、Bi 0.57%、Pb 2.73%を含む電解沈澱銅280
gを用い、100g/l硫酸溶液2.8lに入れ、温度
を60〜65℃に保持してプロペラ式撹拌機で撹拌しな
がら、空気1l/分を吹き込み13時間浸出処理した
後、固液分離し浸出液2.77lと浸出不溶解残渣を得
た。該浸出液0.4l(Cu 49.9g/l、T-As 45.
2g/l、As5+44.3g/l、T-Sb 2.73g/l、S
5+2.71g/l、Bi 0.06g/l、Pb 0.02g/l)
をオートクレーブで撹拌しながら200℃で1時間加熱
保持し、冷却後固液分離・水洗浄し、加熱処理後液0.
4lと殿物を得た。
Example 1 Cu 48.2%, As 41.2%, Sb 4.14
%, Bi 0.57%, Pb 2.73%, electrolytically precipitated copper 280
100 g / l sulfuric acid solution (2.8 l) was used, and the temperature was maintained at 60 to 65 ° C., while stirring with a propeller stirrer, air (1 l / min) was blown in for 13 hours for leaching treatment, and then solid-liquid separation was performed. Then, 2.77 l of the leaching solution and a leaching-insoluble residue were obtained. The leachate 0.4 l (Cu 49.9 g / l, T-As 45.
2 g / l, As 5+ 44.3 g / l, T-Sb 2.73 g / l, S
b 5+ 2.71 g / l, Bi 0.06 g / l, Pb 0.02 g / l)
Was heated and held at 200 ° C. for 1 hour while being stirred in an autoclave, and after cooling, solid-liquid separation and water washing were performed, and after the heat treatment, the liquid of 0.
I got 4l and the item.

【0018】この実施例1による加熱処理後液の定量
値、及び沈殿率を表1に示す。
Table 1 shows the quantitative values and the precipitation rate of the liquid after the heat treatment according to Example 1.

【表1】 [Table 1]

【0019】[0019]

【実施例2】実施例1で用いた浸出液0.4lにPbS
4を10g添加し、オートクレーブで撹拌しながら2
00℃で1時間加熱保持し、冷却後固液分離・水洗浄
し、加熱処理後液0.4lと殿物を得た。
[Example 2] PbS was added to 0.4 l of the leachate used in Example 1.
Add 10 g of O 4 and stir in the autoclave to 2
After heating and holding at 00 ° C. for 1 hour, solid-liquid separation and water washing were carried out after cooling, and 0.4 liter of liquid and a liquid were obtained after heat treatment.

【0020】この実施例2による加熱処理後液の定量
値、及び沈殿率を表1に示す。
Table 1 shows the quantitative values and the precipitation rate of the solution after the heat treatment according to Example 2.

【0021】[0021]

【実施例3】実施例1で用いた浸出液0.4lにPbO
を10g添加し、オートクレーブで撹拌しながら200
℃で1時間加熱保持し、冷却後固液分離・水洗浄し、加
熱処理後液0.4lと殿物を得た。
Example 3 PbO was added to 0.4 l of the leachate used in Example 1.
Of 10 g was added, and the mixture was stirred for 200 minutes in an autoclave.
After heating and holding at 1 ° C. for 1 hour, cooling and solid-liquid separation and water washing were performed, and 0.4 liters of liquid and a substance were obtained after the heat treatment.

【0022】この実施例3による加熱処理後液の定量
値、及び沈殿率を表1に示す。
Table 1 shows the quantitative values and the precipitation rate of the liquid after the heat treatment according to Example 3.

【0023】[0023]

【実施例4】実施例1で用いた浸出液0.4lにPbC
3を10g添加し、オートクレーブで撹拌しながら2
00℃で1時間加熱保持し、冷却後固液分離・水洗浄
し、加熱処理後液0.4lと殿物を得た。
Example 4 PbC was added to 0.4 l of the leachate used in Example 1.
Add 10 g of O 3 and stir in an autoclave for 2
After heating and holding at 00 ° C. for 1 hour, solid-liquid separation and water washing were carried out after cooling, and 0.4 liter of liquid and a liquid were obtained after heat treatment.

【0024】この実施例4による加熱処理後液の定量
値、及び沈殿率を表1に示す。
Table 1 shows the quantitative values and the precipitation rate of the solution after the heat treatment according to Example 4.

【0025】[0025]

【実施例5】Cu 48.2%、As 41.2%、Sb 4.14
%、Bi 0.57%、Pb 2.73%を含む電解沈澱銅300
0gを用い、100g/l硫酸溶液3.0lに入れ、温
度を60〜65℃に保持してプロペラ式撹拌機で撹拌し
ながら、空気1l/分を吹き込み15時間浸出処理した
後、固液分離し浸出液2.97lと浸出不溶解残渣を得
た。該浸出液0.4l(Cu 50.4g/l、T−As 4
4.7g/l、As5+43.5g/l、T−Sb 2.72g/l、
Sb5+2.70g/l、Bi 0.05g/l、Pb 0.02g/
l)に該浸出不溶解残渣(Cu 4.0%、As 10.7%、
Sb 22.9%、Bi 6.56%、Pb 29.2%)を3g添加
し、オートクレーブで撹拌しながら、100℃、120
℃、140℃、160℃、180℃、200℃、240
℃と変えてそれぞれ1時間加熱処理し、冷却後固液分離
・水洗浄し、加熱処理後液0.4lと殿物を得た。
Example 5 Cu 48.2%, As 41.2%, Sb 4.14
%, Bi 0.57%, Pb 2.73%, electrolytically precipitated copper 300
0 g was added to 3.0 g of a 100 g / l sulfuric acid solution, the temperature was kept at 60 to 65 ° C., while stirring with a propeller stirrer, 1 l / min of air was blown into the solution for 15 hours for leaching treatment, and then solid-liquid separation was performed. Then, 2.97 l of the leaching solution and a leaching-insoluble residue were obtained. 0.4 l of the exudate (Cu 50.4 g / l, T-As 4
4.7 g / l, As 5+ 43.5 g / l, T-Sb 2.72 g / l,
Sb 5+ 2.70 g / l, Bi 0.05 g / l, Pb 0.02 g /
l) the leaching insoluble residue (Cu 4.0%, As 10.7%,
Sb 22.9%, Bi 6.56%, Pb 29.2%) 3 g, and while stirring in an autoclave, 100 ° C, 120
℃, 140 ℃, 160 ℃, 180 ℃, 200 ℃, 240
The temperature was changed to 0 ° C., and the mixture was heat-treated for 1 hour, cooled, and solid-liquid separated and washed with water.

【0026】この実施例5による加熱処理後液の定量
値、及び沈殿率を表2に示す。
Table 2 shows the quantitative values and the precipitation rate of the liquid after the heat treatment according to Example 5.

【表2】 [Table 2]

【0027】表から判るように、本発明の実施例では、
Cu、Asの濃度を高く保ちつつ、Sb、Biを大幅に
低下させることができる。
As can be seen from the table, in the embodiment of the present invention,
It is possible to significantly reduce Sb and Bi while maintaining high Cu and As concentrations.

【0028】これは該処理液を公知の方法で処理して、
Sb、Bi含有量の低いCu、及びAsを回収できるこ
とを示している。
This is obtained by treating the treatment liquid by a known method,
It shows that Sb, Cu having a low Bi content, and As can be recovered.

【0029】[0029]

【発明の効果】以上説明したように、本発明のSb及び
/又はBiを含有する硫酸酸性水溶液からのSb及び/
又はBiの除去方法によれば、工程が簡単で難しいコン
トロールも不要であり、公知の方法では分離が困難なS
b及び/又はBiを効率的に除去することができる。
As described above, Sb and / or Sb and / or Bi from the aqueous sulfuric acid solution containing Sb and / or Bi of the present invention is used.
Alternatively, according to the method of removing Bi, the process is simple and difficult control is not required, and S which is difficult to separate by the known method.
b and / or Bi can be removed efficiently.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 Sb及び/又はBiを含有する硫酸酸性
水溶液を、100℃以上で加熱処理することを特徴とす
る、Sb及び/又はBiを含有する硫酸酸性水溶液から
のSb及び/又はBiの除去方法。
1. A sulfuric acid aqueous solution containing Sb and / or Bi is heat-treated at 100 ° C. or higher to obtain Sb and / or Bi from the sulfuric acid aqueous solution containing Sb and / or Bi. Removal method.
【請求項2】 Sb及び/又はBiを含有する硫酸酸性
水溶液に、Pb化合物を添加することを特徴とする、請
求項1記載のSb及び/又はBiを含有する硫酸酸性水
溶液からのSb及び/又はBiの除去方法。
2. The Sb and / or Sb and / or Bi from the sulfuric acid aqueous solution containing Sb and / or Bi according to claim 1, wherein a Pb compound is added to the sulfuric acid acidic aqueous solution containing Sb and / or Bi. Or a method of removing Bi.
【請求項3】 Sb及び/又はBiを含有する硫酸酸性
水溶液に、Pbを含有する物質を添加することを特徴と
する、請求項1記載のSb及び/又はBiを含有する硫
酸酸性水溶液からのSb及び/又はBiの除去方法。
3. A sulfuric acid aqueous solution containing Sb and / or Bi according to claim 1, wherein a substance containing Pb is added to the sulfuric acid aqueous solution containing Sb and / or Bi. A method for removing Sb and / or Bi.
【請求項4】 Sb及び/又はBiを含有する硫酸酸性
水溶液が、電解沈殿銅を100℃未満で浸出処理したも
のであることを特徴とする、請求項1乃至請求項3記載
のSb及び/又はBiを含有する硫酸酸性水溶液からの
Sb及び/又はBiの除去方法。
4. Sb and / or Sb and / or Sb according to claim 3, wherein the sulfuric acid acidic aqueous solution containing Sb and / or Bi is electrolytically precipitated copper leached at a temperature of less than 100 ° C. Alternatively, a method for removing Sb and / or Bi from a sulfuric acid aqueous solution containing Bi.
JP9184893A 1993-03-29 1993-03-29 Method for removing sb and/or bi from sulfuric acid-acidified aqueous solution containing sb and/or bi Pending JPH06279879A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9184893A JPH06279879A (en) 1993-03-29 1993-03-29 Method for removing sb and/or bi from sulfuric acid-acidified aqueous solution containing sb and/or bi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9184893A JPH06279879A (en) 1993-03-29 1993-03-29 Method for removing sb and/or bi from sulfuric acid-acidified aqueous solution containing sb and/or bi

Publications (1)

Publication Number Publication Date
JPH06279879A true JPH06279879A (en) 1994-10-04

Family

ID=14037998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9184893A Pending JPH06279879A (en) 1993-03-29 1993-03-29 Method for removing sb and/or bi from sulfuric acid-acidified aqueous solution containing sb and/or bi

Country Status (1)

Country Link
JP (1) JPH06279879A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010059035A (en) * 2008-09-08 2010-03-18 Sumitomo Metal Mining Co Ltd Method for producing aqueous arsenous acid solution of high purity from copper removal slime
US7935328B2 (en) 2007-03-19 2011-05-03 Jx Nippon Mining & Metals Corporation Method for manufacturing scorodite

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7935328B2 (en) 2007-03-19 2011-05-03 Jx Nippon Mining & Metals Corporation Method for manufacturing scorodite
JP2010059035A (en) * 2008-09-08 2010-03-18 Sumitomo Metal Mining Co Ltd Method for producing aqueous arsenous acid solution of high purity from copper removal slime

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