JPH06278713A - Packing tape, taping package, usage of taping package and tape-packing apparatus and electronic part mounting apparatus - Google Patents

Abstract

PURPOSE:To cause the tape, etc., to maintain a high bond strength at the time of packing and to separate a cover tape by a small force at the time of separating the cover tape when an electronic part is taken out. CONSTITUTION:A taping package 11 is manufactured when a cover tape 4 is bonded to a carrier tape 2 having, in a main surface, a storing part 7 composed of a recess for storing electronic parts 9 via ultraviolet-reactive adhesive 10 lowering in bond strength at the time of applying ultraviolet rays to the adhesive. When the adhesive is used for shipment, conveyance, etc., the separation of the cover tape 4 and coming out of the electronic parts 9 occur difficultly because the adhesive has a prescribed bond strength. At the time of taking out the electronic parts 9, the cover tape 4 is separated after ultraviolet rays are applied to the ultraviolet-reactive adhesive 10 to lower the bond strength of the adhesive. Only a small separating force is sufficient and the parts do not come out by vibration.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a packaging tape, a taping package, a method of using the taping package, a tape packaging device, and an electronic component mounting device.

[0002]

2. Description of the Related Art A taping package is known as one of shipping forms for electronic parts such as semiconductor devices. For example, "Electronic Materials" published by the Industrial Research Institute in September 1984, issued September 1, 1985, P55-P64, describes chipping technology for electronic components (transistor / IC) as a development of automatic chip component mounting technology. Have been described. In this document, as a packaging form of semiconductor electronic components, a mini-mold device, a power mini-mold device, and a mini flat I are provided in a rectangular hole for component insertion provided on a main surface of a carrier tape.
There is disclosed a taping that accommodates a device such as C and is adhesively sealed with a cover tape.

On the other hand, as an adhesive, there is one that is cured by irradiation with ultraviolet rays. For example, “Electronic Materials” published by the Industrial Research Association, August 1986 issue, issued August 1, 1985, P125 to P131 describe UV-curable (UV-curable) adhesives and their effective use. . UV curable adhesives are used for bonding, sealing, potting, fixing and coating.

[0004] In addition, "Electronic Materials" issued by the Industrial Research Committee, August 1987 issue, issued August 1, 1987, P69 to P79 are tapes for attaching wafers (semiconductor thin plates) in dicing and bonding in the semiconductor manufacturing process. As (adhesive tape), a tape whose adhesive strength is reduced by UV irradiation is introduced. The wafer held on the tape is divided vertically and horizontally into semiconductor chips by dicing. When fixing the semiconductor chip to a lead frame or the like, the chip is pushed up from below the tape with a needle and picked up from above with a tool having a vacuum suction structure to carry the chip to a predetermined position. In this document, this point is described, "The adhesive holding force required at the time of dicing and wafer cleaning and the peeling controllability required at the time of picking up are functions that contradict each other in the first place, and there is an adhesive tape that can achieve both. The tape described in this document is a tape that realizes the above-mentioned trade-off required function. "In a normal state, high adhesion is maintained and chip scattering during the dicing process is maximally prevented. It is possible to reduce the adhesive force by irradiating a predetermined amount of UV light after dicing. Therefore, the chip pickup work at the time of bonding becomes smooth. " Further, in this document, a graph showing the correlation between UV irradiation time and peeling adhesive strength is described, in which "the change in adhesive strength before and after UV light irradiation is rapid as shown in FIG. It will be close).
In addition, since it is possible to design the adhesive strength during saturating to some extent, it is possible to set pickup conditions close to ideal. Is stated. "

On the other hand, regarding a device for manufacturing the above-mentioned taping (taping package), "Journal of Semiconductor World" separate volume Buyer's Guide and Directory published on October 20, 1983, P206, It is introduced as a carrier tape sealing machine. This device has a structure in which a chip-type component is inserted into a carrier tape and then a cover tape is used to seal the lid. The chip component is inserted into the insertion port, the carrier tape is fed at a constant pitch, and a heat-sensitive cover tape is bonded with a heater. To do. Also, P291 of the same document
Discloses a carrier tape as a commercial product.

Further, regarding a device using the taping (taping package), that is, an electronic component mounting device, for example, "Electronic Material" issued by the Industrial Research Society, September 1988 issue, September 1, the same year, P69 ~ P73. This document describes a high density surface mount production system, and the standard chip mounter described in this document,
The odd-shaped chip mounting machine can use taping as the packing style of parts. In addition, in the variant chip mounting machine,
EIAJ (Japan Electronic Machinery Manufacturers Association) standard taping of 8 to 56 mm can be mounted.

[0007]

In the conventional taping, the semiconductor devices are placed one by one in the accommodating portion provided on the main surface of the carrier tape, and then thermosetting glue (polyester adhesive is used on one surface). ) Is coated on the carrier tape via an adhesive to cover the accommodating portion, and both sides (both sides) of the cover tape are continuously sealed by a heater. In addition, in this taping (taping package), when the cover tape is automatically peeled off by the component supply unit of the electronic component mounting apparatus, the seal strength of the cover tape to the carrier tape is ensured so as to surely peel off the cover tape ( Adhesive strength) is EIA
40 ± 30g (180 ° peeling force) according to J standard
Stipulated in.

In such taping, the cover tape is often peeled off during shipping and transportation, and the semiconductor device in the accommodating portion often pops out. As a result of examining the cause, the following facts were clarified by the present inventor. That is, since the accommodating portion of the carrier tape is formed by rotating the concave mold and drawing it, unevenness due to drawing occurs on both sides of the carrier tape.
For this reason, when the cover tape is adhered, it becomes difficult to adhere to the cover tape in the concave portion, and desired seal strength (adhesion strength) cannot be obtained. Since the seal strength is set small according to the EIAJ standard, the sealing is also performed so as not to increase. Therefore, if even a small amount of non-bonded surface is generated between the carrier tape and the cover tape, the weakly set adhesive strength becomes weaker and unstable, which may cause the cover tape to be easily peeled off by an external force applied during shipping and transportation. Become.

When the heater is operated so as to ensure the sealing at the concave portion in consideration of the irregularities around the accommodating portion of the carrier tape, the sealing strength at the convex portion is within the specified range (70 g). And the peeling failure of the cover tape occurs in the automatic mounting machine (electronic component mounting apparatus) on the printed wiring board. Further, if the sealing strength at the convex portion is suppressed within the prescribed range, the sealing strength at the concave portion does not reach the prescribed (10 g) sealing strength as described above, and the cover tape is peeled off and accommodated during shipping and transportation. The electronic parts used to pop out.

An object of the present invention is that the adhesive constituting the package (taping package) has a strong adhesive force in the state where the article is accommodated, and the adhesive force of the adhesive can be reduced when taking out the accommodated article. To provide a packaging tape and a taping package.

Another object of the present invention is that the adhesive constituting the package (taping package) has a strong adhesive force in the state of containing the article, and the adhesive force of the adhesive is taken out when the article to be contained is taken out. It is an object of the present invention to provide a method of using a packaging tape and a taping package that can be made smaller.

Another object of the present invention is to provide a tape packaging apparatus for producing a taping package in which a cover tape is adhered to a carrier tape with an ultraviolet ray reactive adhesive.

Another object of the present invention is an electronic component mounting apparatus for mounting an electronic component housed by peeling the cover tape from a taping package in which a cover tape is adhered to a carrier tape with an ultraviolet ray reactive adhesive. To provide. The above and other objects and novel features of the present invention will be apparent from the description of the present specification and the accompanying drawings.

[0014]

The outline of the representative ones of the inventions disclosed in the present application will be briefly described as follows. That is, the packaging tape of the present invention,
A carrier tape having an accommodating portion composed of a depression on the main surface;
A packaging tape comprising a cover tape adhered to the main surface of the carrier tape so as to cover the accommodating portion, each tape being wound on a separate reel.
In addition, the adhesive surface of the cover tape is provided with an ultraviolet reactive adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays.

In another packaging tape of the present invention, the cover tape is provided with a UV-reactive adhesive over the entire surface, and the UV-reactive adhesive in the cover tape area facing the accommodating portion of the carrier tape is provided. The adhesive has lost its adhesiveness when irradiated with ultraviolet rays.

In the packaging tape according to another embodiment of the present invention, the UV-reactive adhesive provided on the cover tape is provided along both sides of the area facing the accommodating portion.

The taping package according to the present invention has a carrier tape wound around a reel and having a main surface formed of a recess, an article stored in the storage section, and the main surface of the carrier tape having the article. In a taping package comprising a cover tape adhered so as to cover the carrier tape, the carrier tape and the cover tape are adhered to each other by an ultraviolet ray reactive adhesive whose adhesive strength is reduced by irradiation of ultraviolet rays. Further, the cover tape is provided with a UV-reactive adhesive over the entire surface, and the UV-reactive adhesive in the cover tape area facing the accommodation portion loses its adhesiveness by UV irradiation, Is not attached to the cover tape.

The taping package of the present invention, that is, a carrier tape having an accommodating portion formed by a depression on the main surface, electronic components accommodated in the accommodating portion, and the accommodating portion closed on the principal surface of the carrier tape. In the use, a taping package consisting of a cover tape adhered to the UV-reactive adhesive by means of the UV-reactive adhesive passes through the cover tape before peeling the cover tape from the carrier tape. Is irradiated to reduce the adhesive strength of the ultraviolet-reactive adhesive, and then the cover tape is peeled off.

The tape wrapping device of the present invention is equipped with a reel around which a carrier tape having an accommodation portion consisting of a depression for accommodating an article is wound, is unwound from the reel, and is wound onto a take-up reel. A carrier tape take-up mechanism, an article insertion mechanism for sequentially inserting articles into the accommodating portion of the carrier tape, and a main surface of the carrier tape so as to unwind the cover tape wound around the reel and close the accommodating portion with the cover tape. A cover wrapping device having a cover tape guiding mechanism to be overlapped with a carrier tape and an adhesive mechanism for adhering a cover tape overlapping the carrier tape to the carrier tape, wherein the adhesive surface of the cover tape has adhesive strength by ultraviolet irradiation. The article is provided with a UV-reactive adhesive that decreases Has a structure in which ultraviolet light irradiation unit for emitting ultraviolet light through the cover tape to ultraviolet reactive adhesive cover tape region facing the housing portion of the carrier tape does not adhere to the cover tape is provided. In the taping package manufactured by this tape packaging device, when the cover tape is peeled off from the carrier tape, the adhesive strength of the UV-reactive adhesive that bonds the cover tape to the carrier tape is reduced and then the cover tape is peeled off. Therefore, in the tape packaging device, the cover tape can be adhered to the carrier tape with high adhesive strength.

In the electronic component mounting apparatus of the present invention, a carrier tape having an accommodating portion formed of a depression on the main surface, an electronic component accommodated in the accommodating portion, and a main surface of the carrier tape so as to close the accommodating portion. A set part for mounting a reel, which is formed by winding a taping package consisting of a cover tape adhered to a tape, and a taping package that is unwound from the reel mounted on the set part and peels the cover tape from the carrier tape on the way. An electronic component mounting apparatus comprising: a winding mechanism that winds each tape around a reel or a roll; and a bonding mechanism that holds an electronic component exposed in a housing portion of the carrier tape and fixes it on a mounting substrate. The set part is wrapped with a taping package in which a cover tape is attached to a carrier tape with an ultraviolet-reactive adhesive. Together with the reel is mounted, ultraviolet light irradiation unit for emitting ultraviolet light is in the provided structure ultraviolet reactive adhesive of solving out the tape package from the reel.

[0021]

According to the above-mentioned means, in the packaging tape comprising the carrier tape of the present invention and the cover tape having one surface coated with the ultraviolet-reactive adhesive, the packing tape is formed in the accommodating portion formed by the depression on the main surface of the carrier tape. After inserting the article, the cover tape is adhered with a UV-reactive adhesive, and when the article is taken out of the accommodation section, the adhesive force of the UV-reactive adhesive is lowered by irradiating UV rays before removing the cover tape. You can let them do it. Therefore, when the cover tape is adhered to the carrier tape, it is possible to increase the pressing force at the time of adhering so as to increase the adhesive strength and to increase the adhering area. As a result, the sealing strength (adhesive strength) of the taping package, which is a package, can be increased by the adhesive strength originally possessed by the UV-reactive adhesive, so that the cover tape can be used when the taping package is handled during shipping and transportation. Accidents such as peeling off and internal articles popping out are less likely to occur. Further, when a means for irradiating the ultraviolet ray reactive adhesive with ultraviolet rays through the cover tape is adopted when the article is taken out from the taping package, the adhesive strength of the cover tape is lowered, so that the cover tape can be easily peeled off.

In the case of another wrapping tape of the present invention, that is, in the case of a wrapping tape in which the adhesiveness of the UV-reactive adhesive in the area of the cover tape facing the accommodating portion of the carrier tape is erased by UV irradiation. When the cover tape is attached to the carrier tape, even if the article accommodated in the accommodation section moves and comes into contact with the cover tape, the article does not adhere to the cover tape. Therefore, when the cover tape is peeled off from the carrier tape in order to take out the article, an accident that the article adheres to the cover tape and jumps out of the accommodating portion does not occur.

In the case of the other packaging tape of the present invention, that is, in the case of the packaging tape in which the ultraviolet reactive adhesive is provided only on both sides of the cover tape, it is accommodated in the accommodation portion when the cover tape is attached to the carrier tape. Even if the article moves and comes into contact with the cover tape, the article does not adhere to the cover tape because there is no ultraviolet-reactive adhesive in the cover tape portion where the article comes into contact. Therefore, when the cover tape is peeled off from the carrier tape in order to take out the article, there is no possibility that the article article adheres to the cover tape and jumps out of the accommodating portion.

In the taping package according to the present invention, the cover tape is adhered to the carrier tape by using the ultraviolet-reactive adhesive having high adhesive strength, so that the cover tape is peeled off during handling and the article pops out. And the reliability as a package is improved.

In the taping package of the present invention, prior to taking out an article, the ultraviolet ray reactive adhesive is irradiated with ultraviolet rays through the cover tape to reduce the adhesive strength of the ultraviolet ray reactive adhesive. Easy to peel off. Therefore, when the cover tape is peeled off, it is less likely that an article will pop out due to vibration that occurs when the cover tape must be peeled off with a strong force. In addition, the adhesive strength after irradiation with ultraviolet rays sufficiently satisfies the EIAJ standard.

In the taping package of the present invention, the adhesive surface of the cover tape is provided with a UV-reactive adhesive over the entire surface, but the UV-reactive adhesive in the cover tape area facing the accommodating portion is provided. Since the adhesive property of the mold adhesive is erased by ultraviolet irradiation before the article is stored in the storage portion, the article does not adhere to the cover tape. Therefore, when the cover tape is peeled off, the article does not stick to the cover tape and pop out.

Also in the case of a taping package according to another embodiment of the present invention, that is, a taping package using a packaging tape in which the UV-reactive adhesive is provided only on both sides of the cover tape, the article is a cover tape as described above. When the cover tape is peeled off, the article does not stick to the cover tape and the article does not pop out.

In the tape packaging apparatus of the present invention, after the article (electronic component) is inserted into the accommodating portion of the carrier tape,
Since the cover tape is pressed against the carrier tape by the adhesive mechanism and adhered by the ultraviolet ray reactive adhesive, it is possible to manufacture a taping package having high adhesive strength (seal strength). In addition, in this tape packaging device, before inserting the electronic component into the accommodation portion of the carrier tape, the ultraviolet ray reactive adhesive in the cover tape area facing the accommodation portion of the carrier tape is irradiated with ultraviolet rays to improve the adhesiveness of the surface. Since the electronic components housed in the housing portion are eliminated, they do not adhere to the cover tape.

In the electronic component mounting apparatus of the present invention, a reel formed by winding a taping package in which a cover tape is attached to a carrier tape with an ultraviolet-reactive adhesive is mounted on a set portion, and the taping package is unwound from the reel. The cover tape is peeled off from the carrier tape on the way out and on the way, the respective tapes are wound on separate reels, and the electronic components exposed in the accommodating portion of the carrier tape are fixed on the mounting board by a bonding mechanism. Since the UV-reactive adhesive is irradiated with UV rays through the cover tape before peeling off the adhesive, the sealing strength of the UV-reactive adhesive decreases sharply.
Since the sealing strength is within the IAJ standard, the electronic components can be taken out without popping out.
Stable implementation is possible.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a main part of a taping package according to one embodiment of the present invention, FIG. 2 is a front view showing the same taping package, and FIG. 3 is a plan view showing a part of the taping package. Is a flow chart showing a method of using the packaging tape according to one embodiment of the present invention, FIG. 5 is a front view of the packaging tape according to the present invention, and FIG. 6 is a front view showing essential parts of a tape packaging device according to one embodiment of the present invention. FIG. 7 shows A of FIG.
-A sectional view taken along the line A, FIG. 8 is a sectional view taken along the line B-B in FIG. 6, FIG. 9 is a graph showing fluctuations in the adhesive force of the ultraviolet-reactive adhesive due to the intensity of UV irradiation, and FIG. 11 is a front view showing a main part of a component supply unit in the electronic component mounting apparatus according to the embodiment, and FIG. 11 is a cross-sectional view taken along the line CC of FIG.

The present invention relates to a packaging body manufacturing technique in which a cover tape is attached to a container body having a partially opened portion through an ultraviolet-reactive adhesive whose adhesive strength decreases when it is irradiated with ultraviolet rays so as to close the opening portion. is there. Further, when the article housed (packaged) in the container body is taken out, the ultraviolet reactive adhesive is irradiated with ultraviolet rays through the cover tape to reduce the adhesive strength of the ultraviolet reactive adhesive, and then the cover tape is removed from the carrier tape. It is a supply technology in which an article is peeled and an article is taken out and supplied. And, in the state of the package, while maintaining the adhesive strength of the ultraviolet-reactive adhesive at a high level to improve the reliability as the package, when removing and supplying the article from the package, the ultraviolet-reactive adhesive Reduce the adhesive strength and peel off the cover tape with a weak force to prevent the articles from popping out of the container body (accommodation part).
It is designed to provide a stable supply of goods.

In this embodiment, an example in which the present invention is applied to a technique for mounting an electronic component such as a semiconductor device on a wiring board will be described. As shown in FIG. 5, the packaging tape 1 of the present invention comprises a reel (carrier tape reel) 3 on which a carrier tape 2 is wound, and a roll 5 on which a cover tape 4 is wound. The carrier tape 2 is
It becomes a tape in which carbon is kneaded into polyvinyl chloride, and as shown in FIG. 3, feed holes 6 are provided at regular intervals on one side thereof. The feed hole 6 is used when the carrier tape 2 is intermittently fed. Further, the main surface of the carrier tape 2 is provided with accommodating portions 7 formed of rectangular depressions at regular intervals along the longitudinal direction thereof. An article, that is, an electronic component 9 such as a semiconductor device is accommodated in the accommodation portion 7. The carrier tape 2
Is manufactured by rotating a tape in which carbon is kneaded into polyvinyl chloride and a concave mold together and sequentially pressing the convex mold.

The cover tape 4 is a polyester tape in which carbon is kneaded, and has a width narrower than that of the carrier tape 2 as shown in FIG. It is designed to block 7. The cover tape 4 has a thickness of, for example, about 40 μm and can transmit ultraviolet rays. An ultraviolet-reactive adhesive (UV adhesive) 10 is provided on one surface of the cover tape 4.

The packaging tape 1 consisting of the carrier tape 2 wound around the reel 3 and the cover tape 4 wound around the roll 5 is used as a package for supplying electronic components to the component supply unit of the electronic component mounting apparatus. In the method of supplying the electronic component, that is, the method of using the packaging tape (including the method of using the taping package), as shown in the flowchart of FIG. 4, carrier tape preparation, electronic component insertion, UV light partial irradiation , Electronic parts are supplied through each step (process) of attaching cover tape, shipping / conveying, UV light irradiation, and peeling cover tape. Then, the electronic components are sequentially taken out from the housing portion and mounted on the wiring board. The electronic component insertion, UV light partial irradiation, and cover tape attachment are performed by the tape packaging device of the present invention to manufacture the taping package of the present invention. Further, the UV light irradiation, the cover tape peeling, and the electronic component mounting are performed by the electronic component mounting apparatus of the present invention. The handling in the steps of shipping / conveying, UV light irradiation, and cover tape peeling corresponds to the usage of the taping package.

Next, a tape wrapping apparatus for manufacturing a taping wrapping body using a wrapping tape will be described with reference to FIGS.
Will be described with reference to. As shown in FIG. 6, the tape packaging device has a carrier tape winding mechanism 15. The carrier tape take-up mechanism 15 includes a support shaft 16 on which a carrier tape reel 3 wound with the carrier tape 2 is mounted, and a take-up reel (reel) for winding the carrier tape 2 unwound from the carrier tape reel 3. ) 17 is mounted on the rotary drive shaft 19. The rotary drive shaft 19 is intermittently rotated by a motor (not shown) to intermittently convey the carrier tape 2.
The rotary drive shaft 19 and the support shaft 16 are arranged at the same height apart from each other. Therefore, the carrier tape 2 unwound from the carrier tape reel 3 moves to the take-up reel 17 side in a horizontal state.

On the other hand, above the moving carrier tape 2, a cover tape guide mechanism 25 for guiding the cover tape.
Is provided. The cover tape guide mechanism 25 includes the support shaft 2 that supports the roll 5 around which the cover tape 4 is wound.
6 and two guide rollers 27, 29 for guiding the cover tape 4 unwound from the roll 5.
One guide roller 27 guides the cover tape 4 unwound horizontally from the roll 5 downward, and the other guide roller 29 is positioned on the upper surface of the carrier tape 2 to make the cover tape 4 horizontal again. invite. Further, the guide roller 29 is adapted to overlap the cover tape 4 with the carrier tape 2. Therefore, the cover tape 4 is wound on the take-up reel 17 while being attached to the carrier tape 2.

The cover tape 4 has one surface (one surface).
An ultraviolet reactive adhesive (UV adhesive) 10 is provided on the entire surface. The UV adhesive 10 serves as an adhesive that attaches the cover tape 4 to the carrier tape 2. However, since the UV adhesive 10 is provided on the entire one surface of the cover tape 4, when the electronic component 9 moves and comes into contact with the cover tape 4 after the electronic component 9 is inserted into the accommodation portion 7 of the carrier tape 2. The electronic component 9 is attached to the cover tape 4. When the electronic component 9 adheres to the cover tape 4, the electronic component 9 remains attached to the cover tape 4 when the cover tape 4 is peeled off from the carrier tape 2, and the electronic component 9 cannot be supplied.

Generally, in the manufacture of a tape, the adhesive is applied to the entire surface of the wide tape and wound on a roll, and then the wide tape wound on the roll is cut into a certain length. A tape having a predetermined width is manufactured. Therefore, in the case of the cover tape 4 manufactured by the conventional method, the UV adhesive 10 is used as the cover tape 4.
Will be provided over the entire area.

Therefore, in this tape packaging apparatus, the cover tape area facing the containing portion 7 of the cover tape 4 is irradiated with ultraviolet rays so as to prevent the electronic component 9 from adhering to the UV adhesive 10 of the cover tape 4. An ultraviolet irradiation device 32 that eliminates the adhesiveness of the UV adhesive in the cover tape area facing the portion 7 is provided. This ultraviolet irradiation device 32
Is disposed between the support shaft 26 and the guide roller 27. The ultraviolet irradiation device 32 is an ultraviolet ray (UV light).
It has a high-pressure ultraviolet lamp (UV lamp) 34 that emits 33. Further, a concave mirror 35 is arranged on the high-pressure ultraviolet lamp 34, and the ultraviolet rays 3 reflected by the concave mirror 35
The UV adhesive 10 of the cover tape 4 located below is irradiated with parallel light 3 as parallel light. At this time, shielding plates 36 are arranged so that the UV adhesive portions on both sides of the cover tape 4 are not irradiated with the ultraviolet rays 33. By this irradiation of ultraviolet rays, as shown by dots, an adhesive force disappearing layer 12 having no adhesive property is formed. As a result, FIG.
As shown in FIG.
The cover tape portion (ceiling forming portion 37) that faces the housing portion 7 and forms the ceiling of the housing portion 7 when attached to the
Since the adhesive disappearance layer 12 is provided, the electronic component 9 does not adhere even if the electronic component 9 comes into contact with the ceiling forming portion 37.

The ultraviolet-reactive adhesive 10 has a high adhesive strength (seal strength) in a state where it is not irradiated with UV light as shown in the graph of FIG. That is, the adhesive strength is equal to or higher than the EIAJ standard. However, when the UV light 33 is irradiated, even if it takes about 1 second, 40 ± 30 g of EIAJ standard
(180 ° peeling force). Also,
By selecting the composition of the UV reactive adhesive,
It is also possible to produce a UV-reactive adhesive whose adhesive strength becomes zero when it is irradiated with UV light.

On the other hand, the carrier tape 2 and the cover tape 4
An article insertion mechanism (component insertion mechanism) 40 is arranged at a position where is not attached. This article insertion mechanism 40
The arm 41 extends from a drive unit (not shown), and a tool 42 that holds the electronic component 9 by vacuum suction is provided at the tip of the arm 41. The arm 41
Moves up, down, left and right. The article insertion mechanism 40 vacuum-holds the electronic component 9 supplied to a predetermined position with the tool 42 and inserts it into the accommodation portion 7 of the carrier tape 2.

On the other hand, the guide roller 29 for superposing the cover tape 4 on the carrier tape 2 and the rotary drive shaft 1
An adhesive mechanism 50 is provided between the contact member 9 and the connector 9, as shown in FIG. As shown in FIG. 8, the bonding mechanism 50 has a pressure bonding block 51 that moves up and down. This crimp block 5
1 has a pressing portion 52 having a constant width on both sides of the lower part, and presses both sides of the cover tape 4 overlapping the main surface of the carrier tape 2 supported on both sides by the support body 53. Since both sides of the cover tape 4 are provided with the UV adhesive 10 that maintains the adhesiveness, the cover tape 4 is adhered to the carrier tape 2. This adhesive strength is high because it is not irradiated with ultraviolet rays. Further, since it is not necessary to consider the adhesive strength when peeling the cover tape 4 from the carrier tape 2 in the state of the taping package 11, the pressure-bonding block 51 and the support body 53 are provided between the carrier tape 2 and the carrier tape 2.
Since the cover tape 4 and the cover tape 4 can be strongly sandwiched, even if irregularities are generated in the carrier tape portion around the accommodation portion 7 in the production of the carrier tape 2, since the sandwiching force is large, the adhesive surface of the recess is also It is possible to manufacture the taping package 11 that is reliably adhered to the cover tape 4 and has high adhesive strength (seal strength).

In such a tape packaging apparatus, the electronic component 9 is inserted into the accommodation portion 7 of the carrier tape 2 unwound from the reel 3 by the article insertion mechanism 40. Further, the cover tape 4 is attached to the carrier tape 2 in which the electronic component 9 is inserted by the adhesive mechanism 50. Further, the cover tape 4, which contains the electronic component 9 and to which the cover tape 4 is attached, that is, the taping package 11, is wound on the winding reel 17. FIG. 2 shows the taping package 11 wound on the take-up reel 17. What is taping package 11?
In this embodiment, the take-up reel 17 may also be included. FIG. 1 is a cross-sectional view of the taping package 11. The electronic component 9 is inserted into the accommodation portion 7 provided on the main surface of the carrier tape 2, and the electronic component 9 is inserted.
Is sealed by a cover tape 4 attached to the main surface of the carrier tape 2. Housing 7 for cover tape 4
UV-reactive adhesive 10 of the ceiling forming portion 37 facing the
Is an adhesive force extinguishing layer 12 as shown by dots, and therefore, even if the electronic component 9 comes into contact with the adhesive force extinguishing layer 12, the electronic component 9 does not adhere to the cover tape 4. Absent. Such a taping package 11 is shipped,
It is transported to the electronic component mounting site. The UV adhesive 10 has a high adhesive strength (seal strength) as shown in the graph of FIG. 9 when it is not irradiated with the UV light 33. Therefore, the cover tape 4 is not peeled off from the carrier tape 2 by an external force applied to the extent of being handled with care during shipping and transportation, and an accident such that the electronic component 9 jumps out does not occur. That is, the taping package 11 of the present invention has high reliability as a package.

Next, an electronic component mounting apparatus for taking out the electronic component 9 from the taping package 11 and mounting the electronic component 9 on a mounting board (wiring board) will be described with reference to FIGS. 10 and 11. FIG. 10 is a diagram showing a part of the component supply unit of the electronic component mounting apparatus. The component supply unit is provided with a setting unit 55 including a shaft for mounting the reel 17 around which the taping package 11 is wound. The taping package 1 wound around the reel 17 manufactured by the tape packaging device is mounted on the setting unit 55.
1 is attached. The taping package 11 is unwound from the reel 17 of the setting section 55, and only the carrier tape 2 is wound on the winding reel (reel) 62 attached to the rotation drive shaft 61 of the winding mechanism 60. There is. The rotary drive shaft 61 is intermittently rotated by a motor (not shown) for intermittent drive.

Further, the setting portion 55 and the rotary drive shaft 6
A guide roller 63 is disposed between the guide roller 63 and the roller 1, and a take-up roller 64 is disposed above the guide roller 63. The guide roller 63 and the winding roller 64 form a winding mechanism 60.
The take-up roller 64 is rotationally controlled by a motor (not shown), and the motor drives the rotary drive shaft 6.
1 is driven in synchronization with a motor for controlling rotation. First, the taping package 11 is manually unwound from the reel 17 and the carrier tape 2
And the cover tape 4 are peeled off from each other. Then, the tip of the carrier tape 2 is attached to the reel 62, the cover tape 4 is pulled upward as guided by the guide roller 63, and attached to the winding roller 64. As a result, by intermittently driving the reel 62, the taping package 11 is unwound from the reel 17, and the cover tape 4 is forcibly peeled from the carrier tape 2 at the portion where the guide roller 63 is located.

On the other hand, the setting portion 55 and the guide roller 6
An ultraviolet irradiation device 70 is disposed above the taping package 11 between the ultraviolet ray irradiation device 3 and the taping package 11. This ultraviolet irradiation device 70
Has a high-pressure ultraviolet lamp (UV lamp) 72 that emits ultraviolet rays (UV light) 71. Also, as shown in FIG. 11, a concave mirror 73 is provided on the high-pressure ultraviolet lamp 72.
Is arranged so that the ultraviolet ray 71 reflected by the concave mirror 73 is applied to the taping package 11 located below. The upper surface of the taping package 11 is a cover tape 4
However, as a result of the ultraviolet rays 71 passing through the cover tape 4 and reaching the UV adhesive 10, the UV adhesive 10
The adhesive strength of is reduced. UV adhesive 1 shown with dots
0 becomes the adhesive strength extinguishing layer 12, and is 40 ± 3 of the EIAJ standard.
It comes to satisfy 0g. As a result, even if the cover tape 4 is peeled off from the carrier tape 2, the cover tape 4
Since the peeling force is small, the carrier tape 2 does not generate a large vibration, and the electronic component 9 housed in the housing portion 7 of the carrier tape 2 pops out (bounces) out of the housing portion 7. Therefore, the peeling operation of the cover tape 4 can be stably performed.

On the other hand, the arm 76 of the bonding mechanism 75 is located above the carrier tape 2 between the guide roller 63 and the rotary drive shaft 61. The arm 76 has a tool 77 for holding the electronic component 9 at its lower end by vacuum suction at its tip. Further, the arm 76 is
The drive unit (not shown) moves up and down, left and right or forward and backward, the cover tape 4 is peeled off, and the electronic component 9 is moved onto the exposed carrier tape 2 to suck the electronic component 9 by vacuum. Then, the electronic component 9 is carried and supplied onto a mounting board (wiring board) not shown. For example, the electronic component 9 is temporarily fixed at the time of being placed and supplied on the mounting board, and the leads protruding from both sides of the electronic component 9 are attached to a wiring layer such as a footprint of the mounting board by a subsequent reflow process or the like. It is fixed and the implementation ends. The UV adhesive 10 for adhering the cover tape 4 to the carrier tape 2 by the ultraviolet irradiation device 70 becomes the adhesive force disappearing layer 12 having a reduced adhesive strength. Since the electronic component 9 accommodated therein is accommodated in the accommodating portion 7 without protruding from the accommodating portion 7, the electronic component 9 in the accommodating portion 7 is held by the tool 77 of the bonding mechanism 75 (pickup). Since the electronic component 9 can be stably picked up when the above step is performed, mounting workability is improved.

[0048]

【The invention's effect】

(1) In the packaging tape of the present invention, a cover tape is adhered to a carrier tape with an ultraviolet ray reactive adhesive to form a taping package. Further, in the method of using the packaging tape, after putting the article in the accommodation portion of the carrier tape, the cover tape is adhered to form a taping package, and then when the article is taken out from the taping package, an ultraviolet reaction is caused through the cover tape. The mold adhesive is irradiated with ultraviolet rays to reduce the adhesive strength of the ultraviolet reactive adhesive, and then the cover tape is peeled off. Therefore, when the cover tape is adhered to the carrier tape, it is possible to increase the pressure applied at the time of adhering so as to increase the adhesive strength or to widen the adhesive area, and thus the sealing strength of the taping package, which is a package. The effect that the (adhesive strength) can be increased is obtained. Further, when the article is taken out from the taping package, it is possible to reduce the adhesive strength of the ultraviolet ray reactive adhesive, so that if the means for irradiating the ultraviolet ray is adopted, the cover tape can be easily peeled off. Is obtained.

(2) In the taping package of the present invention, since the cover tape is adhered to the carrier tape by using the UV-reactive adhesive having high adhesive strength, the cover tape peels off during handling and the article is removed from the outside. It is possible to obtain the effect that the reliability as a package is improved because it does not pop out.

(3) In the taping package of the present invention, prior to taking out an article, the ultraviolet ray reactive adhesive is irradiated with ultraviolet rays through the cover tape to reduce the adhesive strength of the ultraviolet ray reactive adhesive. The adhesive strength satisfies the EIAJ standard, and the cover tape can be peeled off with a weak force. Therefore, when peeling off the cover tape, it is possible to obtain an effect that an accident that the article pops out due to the vibration generated when the cover tape has to be peeled off with a strong force is less likely to occur.

(4) In the taping package of the present invention, the adhesive surface of the cover tape is provided with a UV-reactive adhesive over the entire surface, but the cover tape region facing the accommodating portion is provided. Since the adhesiveness of the ultraviolet-reactive adhesive is eliminated by irradiation with ultraviolet rays before the article is stored in the storage portion, the article does not adhere to the cover tape. Therefore, when the cover tape is peeled off, the article does not stick to the cover tape and pop out.

(5) In the tape packaging apparatus of the present invention, after inserting the article (electronic component) into the accommodating portion of the carrier tape, the cover tape is pressed against the carrier tape by the adhering mechanism and adhered by the ultraviolet reactive adhesive. However, since it is not necessary to pay attention to the adhesive strength of the UV-reactive adhesive 10, it is possible to achieve high adhesive strength,
An effect that a taping package having high adhesive strength (seal strength) can be manufactured can be obtained.

(6) In the tape packaging apparatus of the present invention, before inserting the electronic component into the accommodation portion of the carrier tape, the ultraviolet ray reactive adhesive in the cover tape area facing the accommodation portion of the carrier tape is irradiated with ultraviolet rays. Since the adhesiveness of the surface is eliminated by this, it is possible to obtain an effect that the electronic component housed in the housing portion does not adhere to the cover tape during and after the bonding of the cover tape.

(7) In the tape wrapping device of the present invention, it is not necessary to consider the adhesive strength when peeling the cover tape from the carrier tape in the state of the taping wrapping body. Since the carrier tape and the cover tape can be strongly sandwiched, even if irregularities are generated in the carrier tape portion around the accommodating portion in the production of the carrier tape, the sandwiching force is large, so that the adhesive surface of the recess is The adhesive tape is surely adhered to the cover tape, and an effect that a taping package having high adhesive strength (seal strength) can be manufactured is obtained.

(8) In the electronic component mounting apparatus of the present invention, after peeling the cover tape from the carrier tape, the electronic component accommodated in the accommodating portion of the carrier tape is exposed, and then the tool of the bonding mechanism is used. The electronic component is held and transferred onto a mounting board for mounting, and an ultraviolet ray reactive type in which the carrier tape and the cover tape are bonded through the carrier tape before the cover tape is peeled from the carrier tape. Since the adhesive is irradiated with ultraviolet rays to reduce the adhesive strength of the ultraviolet-reactive adhesive, the adhesive strength of the ultraviolet-reactive adhesive is sharply reduced, for example, the adhesive strength satisfies the EIAJ standard. Therefore, when the cover tape is peeled off from the carrier tape, the cover tape is peeled off with a small force, so that the carrier tape is not subjected to a large impact or vibration, and the electronic component housed in the carrier tape housing portion pops out. There is no such thing. As a result, in the electronic component mounting apparatus of the present invention, it is possible to obtain the effect that stable extraction and mounting of electronic components can be performed.

(9) From the above (1) to (8), according to the present invention, since the force of the adhesive for adhering the cover tape to the carrier tape can be controlled by the presence or absence of irradiation of ultraviolet rays, the taping for accommodating the article is carried out. In the case of packaging, increase the adhesive strength of the adhesive to make it a highly reliable packaging,
In the operation of peeling the cover tape from the carrier tape before removing the article from the taping package,
Since the adhesive strength of the adhesive can be lowered by irradiating it with ultraviolet rays, the cover tape can be peeled off without dropping the article from the carrier tape, and if applied to the mounting of electronic parts, a high yield mounting can be achieved. To be

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say, for example,
In the packaging tape of the above-mentioned embodiment, the UV adhesive 10 is provided on the entire one surface of the cover tape 4, but the UV adhesive 10 in the cover tape area facing the accommodation portion 7 of the carrier tape 2 is previously exposed to ultraviolet rays. When the adhesive force extinguishing layer 12 whose irradiation property is erased by irradiating 33 is used, the tape can be packaged without using a tape packaging device having an ultraviolet irradiation device. Further, in this case, if the ultraviolet rays are irradiated along the center of the cover tape 4,
Even if the length of the accommodating portion 7 along the longitudinal direction of the carrier tape 2 changes, the effect that the cover tape 4 can be commonly used can be obtained.

12 to 14 are views showing a tape wrapping device according to another embodiment of the present invention, FIG. 12 is a front view showing a main part of the tape wrapping device, and FIG. 13 is a DD line of FIG. 14 is a sectional view taken along line EE of FIG. In this embodiment, unlike the case of the tape wrapping device shown in FIG. 6, after the electronic component 9 is inserted into the accommodating portion 7 of the carrier tape 2, as shown in FIG.
Adhere the cover tape 4 to the carrier tape 2 by
Thereafter, as also shown in FIG. 14, the UV irradiation device 32 partially irradiates the UV light 33 to the UV adhesive 10 through the cover tape 4. Also in the case of this tape packaging apparatus, the portion of the UV adhesive 10 serving as the ceiling forming portion 37 of the accommodation portion 7 of the carrier tape 2 becomes the adhesive force extinguishing layer 12 and the surface on which the electronic component 9 is not adhered, and when the cover tape 4 is peeled The accident that the electronic component 9 adheres to the cover tape 4 and is removed does not occur.

FIG. 15 is a perspective view showing a part of a cover tape according to another embodiment of the present invention. In the above-described embodiment, the UV-reactive adhesive 10 is provided on the entire one surface of the cover tape 4 in order to prevent the contained electronic components from being adhered to the cover tape 4, but in this embodiment, the accommodating portion for the carrier tape 2 is provided. Cover tape 4 that is removed from the area facing 7
The ultraviolet-reactive adhesive 10 is provided in a strip shape on both sides of the sheet to prevent the electronic components from adhering to the cover tape. In the case of the cover tape 4 of this embodiment, the UV-reactive adhesive 10 is applied to the portion facing the housing portion 7, that is, the ceiling surface of the housing portion 7 even if it is attached to the main surface of the carrier tape 2. Since the electronic component 9 does not exist, the electronic component 9 does not adhere to the inner surface of the cover tape 4 even if the electronic component 9 contacts the cover tape 4.

In the above description, the case where the invention made by the present inventor is mainly applied to a technique of mounting an electronic component such as a semiconductor device on a wiring board, which is a field of application which is the background of the invention, has been described. It is not something that will be done. INDUSTRIAL APPLICABILITY The present invention can be applied to at least a technique of packaging an article and then removing the article from the package for use.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a main part of a taping package according to an embodiment of the present invention.

FIG. 2 is a front view showing a taping package according to an embodiment of the present invention.

FIG. 3 is a plan view showing a part of a taping package according to an embodiment of the present invention.

FIG. 4 is a flowchart showing a method of using a packaging tape according to an embodiment of the present invention.

FIG. 5 is a front view of a packaging tape according to the present invention.

FIG. 6 is a front view showing a main part of the tape packaging device according to the embodiment of the present invention.

7 is a sectional view taken along the line AA of FIG.

8 is a sectional view taken along the line BB of FIG.

FIG. 9 is a graph showing a change in adhesive strength of a UV-reactive adhesive in a taping package according to an embodiment of the present invention depending on the intensity of UV irradiation.

FIG. 10 is a front view showing a main part of a component supply unit in the electronic component mounting apparatus according to the embodiment of the present invention.

11 is a cross-sectional view taken along the line CC of FIG.

FIG. 12 is a front view showing a main part of a tape packaging device according to another embodiment of the present invention.

13 is a cross-sectional view taken along the line DD of FIG.

14 is a cross-sectional view taken along the line EE of FIG.

FIG. 15 is a perspective view showing a part of a cover tape according to another embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Packaging tape, 2 ... Carrier tape, 3 ... Reel (reel for carrier tape), 4 ... Cover tape, 5 ... Roll, 6 ... Feed hole, 7 ... Storage part, 9 ... Electronic component, 10 ... Ultraviolet reactive adhesive Agent (UV adhesive), 11 ... Taping package, 12 ... Adhesive force disappearing layer, 15 ... Carrier tape winding mechanism, 16 ... Spindle, 17 ... Winding reel, 19 ...
Rotational drive shaft, 25 ... Cover tape guide mechanism, 26 ... Support shaft, 27, 29 ... Guide rollers, 32 ... Ultraviolet irradiation device, 33 ... Ultraviolet light (UV light), 34 ... High-pressure ultraviolet lamp (UV lamp), 35 ... Concave mirror , 36 ... Shielding plate, 37 ...
Ceiling forming part, 40 ... Article insertion mechanism, 41 ... Arm, 4
2 ... Tool, 50 ... Adhesive mechanism, 51 ... Crimping block, 5
2 ... Pressing part, 53 ... Support, 55 ... Setting part, 60 ... Winding mechanism, 61 ... Rotation drive shaft, 62 ... Reel, 63 ...
Guide roller, 64 ... Winding roller, 70 ... UV irradiation device, 71 ... UV light, 72 ... High-pressure UV lamp, 73
... concave mirror, 75 ... bonding mechanism, 76 ... arm, 7
7 ... Tool.

Claims (9)

[Claims] 1. A packaging tape comprising: a carrier tape having a housing portion formed of a depression on a main surface thereof; and a cover tape adhered to a main surface of the carrier tape so as to cover the housing portion. A packaging tape, wherein the adhesive surface of the tape is provided with an ultraviolet-reactive adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays. 2. The cover tape is provided with a UV-reactive adhesive over the entire surface, and the UV-reactive adhesive in the area of the cover tape facing the accommodation portion loses its adhesiveness due to UV irradiation. The packaging tape according to claim 1, wherein 3. The packaging tape according to claim 1, wherein the ultraviolet-reactive adhesive provided on the cover tape is provided along both sides of the area facing the accommodation portion. 4. The packaging tape according to claim 1, wherein the carrier tape and the cover tape are respectively wound around different reels. 5. A carrier tape wound on a reel and having an accommodating portion having a depression on the main surface, an article accommodated in the accommodating section, and a main surface of the carrier tape bonded to cover the article. And a cover tape, wherein the carrier tape and the cover tape are adhered to each other by an ultraviolet-reactive adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays. 6. The cover tape is provided with a UV-reactive adhesive over the entire surface, and the UV-reactive adhesive in the area of the cover tape facing the accommodation portion loses its adhesiveness due to UV irradiation. The taping package according to claim 5, wherein 7. A carrier tape having an accommodating portion formed of a depression on the main surface, an electronic component accommodated in the accommodating portion, and an ultraviolet reactive adhesive so as to close the accommodating portion on the main surface of the carrier tape. A method of using a taping package comprising a bonded cover tape, which comprises irradiating the ultraviolet reactive adhesive with ultraviolet rays through the cover tape to reduce the adhesive strength of the ultraviolet reactive adhesive, and then peeling the cover tape. A method of using a taping package, comprising: 8. A carrier tape take-up mechanism for mounting a reel having a carrier tape wound on a main surface thereof, the carrier tape having an accommodating portion for accommodating articles, unwinding the carrier tape from the reel and winding the carrier tape on a take-up reel. An article insertion mechanism for sequentially inserting articles into the accommodation portion of the carrier tape, and a cover tape guide mechanism for unwinding the cover tape wound around the reel and overlapping the cover tape on the main surface of the carrier tape so as to close the accommodation portion. And an adhesive mechanism for adhering a cover tape that overlaps the carrier tape to the carrier tape, wherein the adhesive surface of the cover tape is an ultraviolet reactive adhesive whose adhesive strength is reduced by irradiation of ultraviolet rays. Agent is provided and the article does not adhere to the cover tape A tape wrapping device is provided with an ultraviolet irradiating device for irradiating ultraviolet light through the cover tape to the ultraviolet reactive adhesive in the area of the cover tape facing the accommodating portion of the carrier tape. 9. A carrier tape having an accommodating portion formed of a recess on the main surface, an electronic component accommodated in the accommodating portion, and a cover tape adhered to the main surface of the carrier tape so as to close the accommodating portion. A set part for mounting a reel formed by winding a taping package consisting of the tape, a taping package is unwound from the reel mounted on the set part, and the cover tape is peeled off from the carrier tape on the way to reel each tape. An electronic component mounting apparatus having a winding mechanism for winding on a roll or a roll, and a bonding mechanism for holding an electronic component exposed in the accommodating portion of the carrier tape and fixing the electronic component on a mounting substrate, wherein the setting portion is an ultraviolet ray. When a reel is wrapped around a taping package in which a cover tape is attached to a carrier tape with a reactive adhesive. Both are equipped with an ultraviolet ray irradiating device for irradiating the ultraviolet ray reactive adhesive of the taping package unwound from the reel with ultraviolet rays.