JPH06275925A - Electric circuit board - Google Patents

Electric circuit board

Info

Publication number
JPH06275925A
JPH06275925A JP5060806A JP6080693A JPH06275925A JP H06275925 A JPH06275925 A JP H06275925A JP 5060806 A JP5060806 A JP 5060806A JP 6080693 A JP6080693 A JP 6080693A JP H06275925 A JPH06275925 A JP H06275925A
Authority
JP
Japan
Prior art keywords
circuit board
connector
electronic circuit
board
cable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP5060806A
Other languages
Japanese (ja)
Inventor
Shigefumi Takahashi
茂文 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Casio Electronics Manufacturing Co Ltd
Original Assignee
Casio Computer Co Ltd
Casio Electronics Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd, Casio Electronics Manufacturing Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP5060806A priority Critical patent/JPH06275925A/en
Publication of JPH06275925A publication Critical patent/JPH06275925A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits

Abstract

PURPOSE:To obtain an electric circuit board dispensing with an expensive harness and soldering of a post-processing. CONSTITUTION:A plurality of connector connecting holes are provided in parallel to one outer side of a first circuit board 11, while a plurality of cable connecting holes 11c are provided in parallel to one inner side being opposite thereto. Cable connecting holes 12a are formed in a line at positions being opposite to the cable connecting holes of the first circuit board 11 with a vacant space 13 formed between them. These cable connecting holes are connected to a circuit pattern formed in a second circuit board. Together with a processing of mounting an electronic component, a connector 14 is fixed in such a manner that conductive connecting parts thereof are fitted in the connector connecting holes and that a connecting port for an external connector is directed outside. Moreover, the ends on one side of a joining cable 15 and the ends on the other side thereof are inserted through the cable connecting holes and fixed respectively. Thereby the connector is connected to the circuit pattern of the second base part through the joining cable. Thereafter a base 10 is cut off into the first base part and the second base part at the part of the vacant space.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子回路基板から離し
て組立てるべきコネクタを電子回路基板の電子部品搭載
処理と共に接続できる電子回路基板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board to which a connector to be assembled separately from an electronic circuit board can be connected together with an electronic component mounting process of the electronic circuit board.

【0002】[0002]

【従来の技術】従来より、プリンタのI/F(インタフ
ェース)用PCB(print circuit board:電子回路用プ
リント基板) の実装設計において、セントロニクス・イ
ンターフェースやRS−232C等の外部I/F用コネ
クタは、通常、本体装置のパネル(板金)にビス止めし
て固定される。この場合、図6(a) に示すライトアング
ルタイプ・コネクタ1、又は同図(b) に示すストレート
タイプ・コネクタ2のように、PCB3に直付けされた
コネクタを、そのままパネル4にビス止めすることが望
ましい。しかし、装置の実装設計上の理由から、同図
(c) に示すコネクタ5のように、やむをえずPCB3か
ら離れた位置にビス止めしなければならない場合がしば
しば生ずる。この場合、例えば、同図(d) に示すよう
に、コネクタ5の他に、ケーブル6とボードインコネク
タ7から成るハーネス(専用接続器具)を別途に用意
し、後処理でハーネスのボードインコネクタ7をPCB
3の所定位置に差し込んで仮固定した後、半田付けによ
って回路と接続していた。
2. Description of the Related Art Conventionally, in the packaging design of a printer I / F (interface) PCB (print circuit board), a Centronics interface or an external I / F connector such as RS-232C is used. Usually, it is fixed to the panel (sheet metal) of the main body device with screws. In this case, the right angle connector 1 shown in Fig. 6 (a) or the straight connector 2 shown in Fig. 6 (b), which is directly attached to the PCB 3, should be screwed to the panel 4 as it is. Is desirable. However, because of the mounting design of the device,
In many cases, like the connector 5 shown in (c), it is unavoidable that a screw must be secured at a position away from the PCB 3. In this case, for example, as shown in FIG. 1D, in addition to the connector 5, a harness (dedicated connecting device) consisting of the cable 6 and the board-in connector 7 is separately prepared, and the board-in connector of the harness is post-processed. PCB 7
After being inserted into a predetermined position of 3 and temporarily fixed, it was connected to the circuit by soldering.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、一般に
同図(d) に示すハーネスは高価であるため、これをコネ
クタに用いた場合、同図(a),(b) に示す直付けタイプの
コネクタを用いた場合に比較して部品コストが2〜3倍
に上昇するという問題があった。また、そればかりでな
く、上記ハーネスを用いる場合は後処理による仮固定と
半田付け処理が必要であり、その分、制作処理の工程が
増加し、このためASSY(組立)コストを別途に計上
する必要が生じて、さらに生産コストが上昇するという
問題があった。
However, since the harness shown in FIG. 1 (d) is generally expensive, when this harness is used as a connector, the direct mounting type connector shown in FIGS. 1 (a) and (b) is used. There is a problem that the component cost is increased by 2 to 3 times as compared with the case of using. Not only that, but when the above harness is used, temporary fixing and soldering processing by post-processing are required, and the number of production processing steps is increased accordingly. Therefore, the ASSY (assembly) cost is separately recorded. There was a problem that the production cost increased due to the necessity.

【0004】本発明は、上記従来の実情に鑑み、高価な
ハーネスを用いることなく且つ後処理による半田付け等
も不用な電子回路基板を提供することを目的とする。
In view of the above conventional circumstances, it is an object of the present invention to provide an electronic circuit board that does not use an expensive harness and does not require soldering by post-processing.

【0005】[0005]

【課題を解決するための手段】以下に、本発明に係る電
子回路基板の構成を述べる。先ず、コネクタ手段は、電
子回路基板上に固設され、該電子回路基板上に形成され
る回路と該電子回路基板外の外部接続コードとを接続す
る。同手段は、例えば、セントロニクス仕様、又はRS
−232C仕様に準拠したコネクタ等からなる。また、
区切手段は、電子回路基板を上記コネクタ手段が固設さ
れる第1基板部と、電子回路が実装された第2基板部と
を分離可能に区切り、同手段は、例えば、電子回路基板
に形成されるミシン目状の孔、又はV字型溝等からな
る。さらに、連結手段は、上記区切手段により区切られ
る第1基板部に形成されて上記コネクタ手段の導電接続
部と接続する第1の接続部と、第2基板部に形成されて
第1の接続部と一対一に対応して接続するための第2の
接続部とから構成され、同手段は、例えば、請求項2記
載のように、第1の接続部と第2の接続部とを接続する
可撓性導線によりコネクタ手段の導電接続部と電子回路
基板上の回路とを連結する。
The structure of the electronic circuit board according to the present invention will be described below. First, the connector means is fixed on the electronic circuit board and connects the circuit formed on the electronic circuit board and the external connection cord outside the electronic circuit board. The means is, for example, Centronics specification or RS.
It consists of a connector and the like that conforms to the 232C specifications. Also,
The separating means separably separates the electronic circuit board into a first board portion on which the connector means is fixedly mounted and a second board portion on which the electronic circuit is mounted, and the separating means is formed on the electronic circuit board, for example. Perforated holes, V-shaped grooves, or the like. Further, the connecting means is formed on the first board portion divided by the dividing means, and is connected to the conductive connecting portion of the connector means, and the first connecting portion is formed on the second board portion. And a second connecting portion for connecting in a one-to-one correspondence with each other. The means connects the first connecting portion and the second connecting portion, for example, as described in claim 2. A flexible lead connects the conductive connection of the connector means to a circuit on the electronic circuit board.

【0006】これによって、請求項3記載のように、上
記区切部により電子回路基板を分離することにより電子
回路基板の第2基板部と第1基板部に接続されたコネク
タ手段とを可撓性導線の長さの範囲で離間可能となり、
この離間距離内の任意の位置にコネクタを固定するのみ
で回路部分の基板と分離したコネクタの実装が完了す
る。
As a result, as described in claim 3, by separating the electronic circuit board by the partition, the connector means connected to the second board section and the first board section of the electronic circuit board is flexible. Can be separated within the range of the length of the conductor,
Only by fixing the connector at an arbitrary position within this distance, the mounting of the connector separated from the circuit board is completed.

【0007】[0007]

【作用】ゆえに、この発明は、コネクタ手段が接続され
た第1基板部と、電子回路が設けられた第2基板部とを
ミシン目状の孔等の区切手段により区分し、予め可撓性
導線等のコネクタ手段により第1基板部と第2基板部と
を電気的に接続し、この電子回路基板を本体装置に取り
付ける際、ミシン目状の孔等(区切手段)を割る等によ
り第1基板部と第2基板部とを分割し、第1基板部と第
2の基板部を装置本体に実装するものである。これによ
り、ハーネス等を用いた従来例に比べ仮固定や後の半田
付け処理が不要となり、電子回路基板の実装が容易にな
る。
Therefore, according to the present invention, the first board portion to which the connector means is connected and the second board portion to which the electronic circuit is provided are divided by the dividing means such as perforated holes so as to be flexible in advance. The first board portion and the second board portion are electrically connected by a connector means such as a lead wire, and when the electronic circuit board is attached to the main body device, a first perforation hole or the like (dividing means) is broken. The board section and the second board section are divided, and the first board section and the second board section are mounted on the apparatus main body. This eliminates the need for temporary fixing and subsequent soldering processing as compared with the conventional example using a harness or the like, and facilitates mounting of the electronic circuit board.

【0008】[0008]

【実施例】以下、本発明の一実施例について図面を参照
しながら詳述する。図1は、一実施例に係る電子回路基
板(以下、単に基板という)の主要部を示す斜視図であ
る。同図において、基板10は、基板10の一隅に位置
するほぼ正方形の第1基板部11、残余の部分全てを占
める第2基板部12、及びそれら第1基板部11と第2
基板部12を区切る空隙13から構成される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a perspective view showing a main part of an electronic circuit board (hereinafter, simply referred to as a board) according to an embodiment. In FIG. 1, the substrate 10 includes a substantially square first substrate portion 11 located at one corner of the substrate 10, a second substrate portion 12 occupying the remaining portion, and the first substrate portion 11 and the second substrate portion 12.
It is composed of a gap 13 that divides the substrate portion 12.

【0009】空隙13は、それぞれ僅かの間隙を置いて
連続して形成された直線状の切り込み、切り込み幅と同
径の丸孔、直角に曲がる鍵型の切り込み、切り込み幅と
同径の丸孔、及び直線状の切り込みからなり、上記第1
基板部11の2辺と第2基板部12とを分別している。
The voids 13 are linear cuts formed continuously with slight gaps, round holes of the same diameter as the cut width, key-shaped cuts bent at right angles, and round holes of the same width as the cut width. , And a linear cut,
The two sides of the substrate portion 11 and the second substrate portion 12 are separated.

【0010】図2に、上記第1基板部11と第2基板部
12とを接続するための連結回路がプリント形成された
基板10を示す。同図に示す第1基板部11には、外側
2隅近くに後述する分離コネクタ14を固定するための
2個の孔11a、11aが設けられる。そして、それら
2個の孔11a、11a間、すなわち第1基板部11の
外側の一辺に平行して、分離コネクタ14の導電接続部
と嵌合して接続するための複数のコネクタ接続孔11
b、11bが2列に形成されている。それら複数のコネ
クタ接続孔11b、11bが形成されている外側の一辺
に対向する内側の一辺には、辺に平行して、後述する連
結ケーブル15の一端を挿通して固着するための複数の
ケーブル接続孔11cが一列に形成されている。そし
て、それら複数のケーブル接続孔11cは、プリントパ
ターンにより上記コネクタ接続孔11b、11bとそれ
ぞれ接続されている。
FIG. 2 shows a substrate 10 on which a connecting circuit for connecting the first substrate portion 11 and the second substrate portion 12 is printed. The first board portion 11 shown in the figure is provided with two holes 11a and 11a near the two outer corners for fixing a separation connector 14 which will be described later. Then, between the two holes 11a, 11a, that is, in parallel to one side on the outside of the first substrate portion 11, a plurality of connector connection holes 11 for fitting and connecting with the conductive connection portion of the separation connector 14 are provided.
b and 11b are formed in two rows. A plurality of cables for inserting and fixing one end of a connecting cable 15, which will be described later, in parallel to the inner side opposite to the outer side where the plurality of connector connection holes 11b and 11b are formed. The connection holes 11c are formed in a line. The plurality of cable connection holes 11c are connected to the connector connection holes 11b and 11b by a printed pattern, respectively.

【0011】一方、第2基板部12には、上記一列に形
成された複数のケーブル接続孔11cと空隙13を挟ん
で対向する位置に、連結ケーブル15の他端を挿通して
固着するための複数のケーブル接続孔12aが一列に形
成されている。これらケーブル接続孔12aは、同図に
は示していないが、第2基板部12に形成される回路パ
ターンに接続している。
On the other hand, the other end of the connecting cable 15 is inserted into and fixed to the second board portion 12 at a position opposed to the plurality of cable connecting holes 11c formed in a row with a gap 13 therebetween. A plurality of cable connection holes 12a are formed in a line. Although not shown in the figure, these cable connection holes 12a are connected to the circuit pattern formed on the second substrate portion 12.

【0012】図3に、上記基板10に分離コネクタ14
及び連結ケーブル15が実装された状態を示す。同図に
おいて、分離コネクタ14は、図6(a) に示した通常の
ライトアングルタイプのコネクタであり、外部コネクタ
との接続口を外側に向け、図には見えない導電接続部と
2個の固定ピンが、図2に示した2列のコネクタ接続孔
11b、11bと2個の固定孔11a、11aにそれぞ
れ嵌入されて第1基板部11に固定されている。一方、
連結ケーブル15は、一端が第1基板部11のケーブル
接続孔11cに挿通され、他端が第2基板部12のケー
ブル接続孔12aに挿通されて夫々固着している。これ
によって、分離コネクタ14は、コネクタ接続孔11
b、11b、プリントパターン、及び連結ケーブル15
を介して、第2基板部12の回路パターンに接続され
る。
Referring to FIG. 3, the connector 10 is attached to the board 10.
And the connection cable 15 is mounted. In the figure, the separation connector 14 is a normal right-angle type connector shown in FIG. 6 (a), with the connection port to the external connector facing outward, and a conductive connection part and two The fixing pins are fitted into the two rows of connector connecting holes 11b and 11b and the two fixing holes 11a and 11a shown in FIG. 2, respectively, and fixed to the first board portion 11. on the other hand,
One end of the connecting cable 15 is inserted into the cable connecting hole 11c of the first board portion 11, and the other end is inserted into the cable connecting hole 12a of the second board portion 12 and fixed to each other. As a result, the separation connector 14 has the connector connection hole 11
b, 11b, print pattern, and connecting cable 15
Is connected to the circuit pattern of the second substrate unit 12 via.

【0013】同図には図示していないが、基板10の第
2基板部12には、抵抗、コンデンサ、IC等多数の電
子部品が実装されており、それらの電子部品と共に上記
分離コネクタ14及び連結ケーブル15が同一処理工程
内で基板10に実装される。
Although not shown in the figure, a large number of electronic components such as resistors, capacitors and ICs are mounted on the second substrate portion 12 of the substrate 10, and together with these electronic components, the separation connector 14 and The connecting cable 15 is mounted on the substrate 10 in the same processing step.

【0014】図4は、上記の電子部品、分離コネクタ1
4、及び連結ケーブル15が実装された基板10を、空
隙13部分によって第1基板部11と第2基板部12と
に切り放してそれぞれ本体装置に取り付けた状態を示す
斜視図であり、図5は、その側面図である。
FIG. 4 shows the electronic component and the separation connector 1 described above.
4 is a perspective view showing a state in which the board 10 on which the connection cable 15 and the connection cable 15 are mounted is cut off into the first board portion 11 and the second board portion 12 by the gap 13 and attached to the main body device, respectively, and FIG. FIG.

【0015】両図に示すように、第2基板部12を本体
装置内の所定位置に配設し、これよりやや離れた本体装
置のハウジング16の側面16aに、第1基板部11に
固定されている分離コネクタ14を配設している。
As shown in both figures, the second substrate portion 12 is arranged at a predetermined position in the main body device, and is fixed to the first substrate portion 11 on the side surface 16a of the housing 16 of the main body device, which is slightly away from this. The separating connector 14 is provided.

【0016】このように、本実施例に示すごとく、電子
部品と共に同一処理工程内でコネクタ(分離コネクタ1
4)及びケーブル(連結ケーブル15)を基板10に実
装した後、組み立て時に基板を2つに切り放すことによ
り、回路基板(第2基板部12)から離れた位置に、こ
の回路基板と接続しているコネクタを配設することがで
きる。そして、コネクタをハウジングの側面等に取り付
けて固定するのみで、ハーネスの半田付けなどの後処理
は全く不用である。
In this way, as shown in this embodiment, the connector (separate connector 1
4) and the cable (connecting cable 15) are mounted on the board 10, and then the board is cut into two pieces at the time of assembly to be connected to the circuit board at a position apart from the circuit board (second board portion 12). A connector can be provided. Then, the connector is simply attached and fixed to the side surface of the housing, and the post-treatment such as soldering of the harness is completely unnecessary.

【0017】なお、本実施例においては、連結ケーブル
15にテープ状の集合線を用いているが、これに限るこ
となく、ケーブル接続孔11cの数に応じた複数のバラ
線(単線)を用いるようにしてもよい。
In this embodiment, the tape-shaped assembly line is used for the connecting cable 15, but the present invention is not limited to this, and a plurality of discrete wires (single wires) corresponding to the number of cable connection holes 11c are used. You may do it.

【0018】[0018]

【発明の効果】以上詳細に説明したように、本発明によ
れば、電子部品の実装と同一処理工程内でコネクタと連
結ケーブルを基板に実装してから、連結ケーブルで接続
された状態のまま回路基板部分とコネクタ部分とを切り
放すことができるので、回路基板から離れた位置にコネ
クタを配設する場合でも、高価なハーネスを用いる必要
がなく、したがって装置の生産価格が低減する。
As described in detail above, according to the present invention, the connector and the connecting cable are mounted on the substrate in the same processing step as the mounting of the electronic component, and then the state of being connected by the connecting cable is maintained. Since the circuit board portion and the connector portion can be separated, it is not necessary to use an expensive harness even when disposing the connector at a position distant from the circuit board, and thus the production cost of the device is reduced.

【0019】また、後処理による半田付け等が不用であ
るため工程が短縮され、したがって、組立コストが低減
する。
Further, since soldering or the like by post-treatment is unnecessary, the process is shortened, and therefore the assembly cost is reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】一実施例に係わる電子回路基板の主要部を示す
斜視図である。
FIG. 1 is a perspective view showing a main part of an electronic circuit board according to an embodiment.

【図2】第1基板部と第2基板部とを接続するための連
結回路が形成された基板を示す図である。
FIG. 2 is a view showing a substrate on which a connection circuit for connecting a first substrate portion and a second substrate portion is formed.

【図3】基板に分離コネクタ及び連結ケーブルが実装さ
れた状態を示す図である。
FIG. 3 is a diagram showing a state in which a separation connector and a connection cable are mounted on a board.

【図4】第1基板部と第2基板部とに切り放してそれぞ
れ本体装置に取り付けた状態を示す斜視図である。
FIG. 4 is a perspective view showing a state in which a first substrate portion and a second substrate portion are cut apart and attached to a main device.

【図5】図4の側面図である。FIG. 5 is a side view of FIG.

【図6】(a),(b) は、直付けタイプのコネクタの取り付
けを説明する図、(c),(d) は従来の分離タイプのコネク
タの取り付けを説明する図である。
6 (a) and 6 (b) are diagrams for explaining the attachment of a direct attachment type connector, and FIGS. 6 (c) and 6 (d) are diagrams for explaining attachment of a conventional separation type connector.

【符号の説明】[Explanation of symbols]

10 電子回路用プリント基板(PCB) 14 分離コネクタ 11 第1基板部 11a 孔 11b コネクタ接続孔 11c、12a ケーブル接続孔 12 第2基板部 13 空隙 15 連結ケーブル 16 本体装置のハウジング 16a ハウジング側面 10 Electronic Circuit Printed Circuit Board (PCB) 14 Separation Connector 11 First Board Part 11a Hole 11b Connector Connection Hole 11c, 12a Cable Connection Hole 12 Second Board Part 13 Void 15 Connection Cable 16 Main Unit Housing 16a Housing Side

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 電子回路基板上に固設され、該電子回路
基板上に形成される回路と該電子回路基板外の外部接続
コードとを接続するコネクタ手段と、 該コネクタ手段が固設される第1基板部と前記回路が形
成される第2基板部とを分離可能に区切る区切手段と、 該区切手段により区切られる前記第1基板部に形成され
て前記コネクタ手段の導電接続部と接続する第1の接続
部と、前記第2基板部に形成されて前記第1の接続部と
一対一に対応して接続するための第2の接続部とからな
る連結手段と、 を有することを特徴とする電子回路基板。
1. A connector means fixedly mounted on an electronic circuit board for connecting a circuit formed on the electronic circuit board and an external connection cord outside the electronic circuit board, and the connector means are fixedly mounted. Separating means that separably separates the first board part and the second board part on which the circuit is formed, and the first board part formed by the partitioning means and connected to the conductive connection part of the connector means. A first connecting portion and a connecting means formed on the second substrate portion and having a second connecting portion for connecting in a one-to-one correspondence with the first connecting portion. And electronic circuit board.
【請求項2】 前記連結手段は、前記第1の接続部と前
記第2の接続部とを接続する可撓性導線により前記コネ
クタ手段の導電接続部と前記電子回路基板上の回路とを
連結することを特徴とする請求項1記載の電子回路基
板。
2. The connecting means connects a conductive connecting portion of the connector means and a circuit on the electronic circuit board by a flexible conductor connecting the first connecting portion and the second connecting portion. The electronic circuit board according to claim 1, wherein:
【請求項3】 前記区切部により前記電子回路基板を分
離することにより前記電子回路基板の第2基板部と前記
コネクタ手段とを前記可撓性導線の長さの範囲で離間可
能に構成されることを特徴とする請求項1及び2記載の
電子回路基板。
3. The second circuit board portion of the electronic circuit board and the connector means can be separated from each other within the range of the length of the flexible conductor by separating the electronic circuit board by the partition portion. The electronic circuit board according to claim 1 or 2, wherein:
JP5060806A 1993-03-22 1993-03-22 Electric circuit board Withdrawn JPH06275925A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5060806A JPH06275925A (en) 1993-03-22 1993-03-22 Electric circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5060806A JPH06275925A (en) 1993-03-22 1993-03-22 Electric circuit board

Publications (1)

Publication Number Publication Date
JPH06275925A true JPH06275925A (en) 1994-09-30

Family

ID=13152960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5060806A Withdrawn JPH06275925A (en) 1993-03-22 1993-03-22 Electric circuit board

Country Status (1)

Country Link
JP (1) JPH06275925A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1223794A1 (en) * 1999-10-01 2002-07-17 Rohm Co., Ltd. Wiring board having connector and method of manufacturing the same
JP2007301822A (en) * 2006-05-10 2007-11-22 Brother Ind Ltd Electronic instrument, and manufacturing method for electronic instrument
KR101372235B1 (en) * 2012-06-29 2014-03-11 (주)휴티스 wafer transfer device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1223794A1 (en) * 1999-10-01 2002-07-17 Rohm Co., Ltd. Wiring board having connector and method of manufacturing the same
EP1223794A4 (en) * 1999-10-01 2006-08-16 Rohm Co Ltd Wiring board having connector and method of manufacturing the same
JP2007301822A (en) * 2006-05-10 2007-11-22 Brother Ind Ltd Electronic instrument, and manufacturing method for electronic instrument
KR101372235B1 (en) * 2012-06-29 2014-03-11 (주)휴티스 wafer transfer device

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