JPH06272098A - Electrolytic peeling solution and peeling method of coating film made of tin or tin alloy - Google Patents
Electrolytic peeling solution and peeling method of coating film made of tin or tin alloyInfo
- Publication number
- JPH06272098A JPH06272098A JP8394593A JP8394593A JPH06272098A JP H06272098 A JPH06272098 A JP H06272098A JP 8394593 A JP8394593 A JP 8394593A JP 8394593 A JP8394593 A JP 8394593A JP H06272098 A JPH06272098 A JP H06272098A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- acid
- sulfonic acid
- solution
- peeling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 13
- 239000011248 coating agent Substances 0.000 title claims abstract description 5
- 238000000576 coating method Methods 0.000 title claims abstract description 5
- 238000000034 method Methods 0.000 title claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052742 iron Inorganic materials 0.000 claims abstract description 14
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims abstract description 11
- 150000003839 salts Chemical class 0.000 claims abstract description 9
- 239000002253 acid Substances 0.000 claims description 12
- 239000007864 aqueous solution Substances 0.000 claims description 7
- 239000008151 electrolyte solution Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 11
- 239000010802 sludge Substances 0.000 abstract description 7
- 230000003628 erosive effect Effects 0.000 abstract description 5
- 150000001335 aliphatic alkanes Chemical class 0.000 abstract description 2
- 238000007598 dipping method Methods 0.000 abstract description 2
- 230000001590 oxidative effect Effects 0.000 abstract description 2
- 150000001455 metallic ions Chemical class 0.000 abstract 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 32
- 238000005868 electrolysis reaction Methods 0.000 description 23
- 238000007747 plating Methods 0.000 description 21
- 239000000758 substrate Substances 0.000 description 13
- 150000003460 sulfonic acids Chemical class 0.000 description 9
- 239000002585 base Substances 0.000 description 8
- 229910001432 tin ion Inorganic materials 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 7
- 229910001887 tin oxide Inorganic materials 0.000 description 7
- 150000007513 acids Chemical class 0.000 description 5
- -1 aryl sulfonic acid Chemical compound 0.000 description 5
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 239000007800 oxidant agent Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229940098779 methanesulfonic acid Drugs 0.000 description 2
- 229940044654 phenolsulfonic acid Drugs 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea group Chemical group NC(=S)N UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- KMBRJVMBQNMRDM-UHFFFAOYSA-N 1-hydroxybutane-1-sulfonic acid Chemical compound CCCC(O)S(O)(=O)=O KMBRJVMBQNMRDM-UHFFFAOYSA-N 0.000 description 1
- WLXGQMVCYPUOLM-UHFFFAOYSA-N 1-hydroxyethanesulfonic acid Chemical compound CC(O)S(O)(=O)=O WLXGQMVCYPUOLM-UHFFFAOYSA-N 0.000 description 1
- BZOVBIIWPDQIHF-UHFFFAOYSA-N 3-hydroxy-2-methylbenzenesulfonic acid Chemical compound CC1=C(O)C=CC=C1S(O)(=O)=O BZOVBIIWPDQIHF-UHFFFAOYSA-N 0.000 description 1
- HWTDMFJYBAURQR-UHFFFAOYSA-N 80-82-0 Chemical compound OS(=O)(=O)C1=CC=CC=C1[N+]([O-])=O HWTDMFJYBAURQR-UHFFFAOYSA-N 0.000 description 1
- ONMOULMPIIOVTQ-UHFFFAOYSA-N 98-47-5 Chemical compound OS(=O)(=O)C1=CC=CC([N+]([O-])=O)=C1 ONMOULMPIIOVTQ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 101150000971 SUS3 gene Proteins 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- SUMDYPCJJOFFON-UHFFFAOYSA-N beta-hydroxyethanesulfonic acid Natural products OCCS(O)(=O)=O SUMDYPCJJOFFON-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QDHFHIQKOVNCNC-UHFFFAOYSA-N butane-1-sulfonic acid Chemical compound CCCCS(O)(=O)=O QDHFHIQKOVNCNC-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- RVPVRDXYQKGNMQ-UHFFFAOYSA-N lead(2+) Chemical compound [Pb+2] RVPVRDXYQKGNMQ-UHFFFAOYSA-N 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、鉄製品(鉄合金からな
る製品を含む)の表面にメッキ等により形成された錫ま
たは錫合金の皮膜を電解により剥離する場合に使用する
電解液および上記皮膜を電解剥離する方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrolytic solution used for electrolytically stripping a tin or tin alloy film formed by plating or the like on the surface of iron products (including products made of iron alloys) and the above. The present invention relates to a method of electrolytically peeling a film.
【0002】[0002]
【従来の技術】集積回路の製造工程においてリードフレ
ームに規格外のメッキを施してしまった場合は、基材の
リードフレームを腐食することなしにメッキ層だけを除
去して再度メッキを施さなければならない。このように
不要メッキ皮膜を剥離する必要が生じた場合、従来は該
メッキ皮膜を溶解する能力を有する剥離液に処理対象物
を浸漬する方法が採用されてきた。このとき使われる剥
離液の代表的なものは、錫および鉛に対して優れた溶解
力を有するホウフッ化水素酸を主剤とし、それにm-ニト
ロベンゼンスルホン酸等の酸化剤およびチオ尿素等の再
付着防止剤と、基材の侵食を防止するためのインヒビタ
ーを添加したものである。2. Description of the Related Art When a lead frame is plated in a non-standard manner in a manufacturing process of an integrated circuit, it is necessary to remove only the plated layer and re-plat without corroding the lead frame of the base material. I won't. When it becomes necessary to peel off the unnecessary plating film in this way, conventionally, a method of immersing the object to be treated in a peeling liquid having the ability to dissolve the plating film has been adopted. A typical example of the stripping solution used at this time is borofluoric acid, which has an excellent dissolving power for tin and lead, as the main agent, and an oxidizer such as m-nitrobenzenesulfonic acid and redeposition of thiourea. An inhibitor and an inhibitor for preventing erosion of the substrate are added.
【0003】また、メッキ用ステンレス製治具の接点部
には錫または錫合金が析出して皮膜を形成するので、そ
れを適当な段階で除去することが必要になるが、そのよ
うな場合には、高濃度硝酸からなる剥離液、または硝酸
を主剤とし錫の錯化剤として有機カルボン酸を添加した
剥離液が使われてきた。Further, tin or a tin alloy deposits on the contact portion of the stainless steel jig for plating to form a film, which must be removed at an appropriate stage. In such a case, As a stripping solution, a stripping solution containing high-concentration nitric acid or a stripping solution containing nitric acid as a main agent and an organic carboxylic acid as a tin complexing agent has been used.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、酸性溶
液中の錫イオンは酸化剤が共存すると容易に酸化されて
不溶性のスズ酸化物を生成する。このようなスズ酸化物
生成条件は上記いずれの浸漬剥離液を用いた場合にも実
現されるから、剥離液は、建浴当初は良好な剥離性能を
示すが、液中に錫イオンが蓄積するにつれてスズ酸化物
のスラッジを生じ且つスズ酸化物層が被処理物表面に形
成されるようになるため、剥離性能が急速に低下してし
まう。However, tin ions in an acidic solution are easily oxidized in the presence of an oxidizing agent to form insoluble tin oxide. Since such tin oxide forming conditions are realized using any of the above-mentioned immersion stripping solutions, the stripping solution shows good stripping performance at the beginning of the bath, but tin ions accumulate in the solution. As a result, sludge of tin oxide is generated and a tin oxide layer is formed on the surface of the object to be treated, so that the peeling performance is rapidly reduced.
【0005】また、フッ化物を含む剥離液は廃液処理に
多大の手間と費用がかかってしまうし、高濃度の硝酸を
含む剥離液は使用中に発生する臭気やミストの拡散防止
対策が必要であり、取り扱いにも危険が伴うという問題
点があった。そこで本発明の目的は、鉄または鉄合金か
らなる基材表面を侵食することなしに付着した錫または
錫合金の皮膜だけを除去することができ、長期間使用し
てもスラッジを発生せず、しかも使用上の安全性の点で
も優れている新規剥離手段を提供することにある。Further, a stripping solution containing a fluoride requires a great deal of labor and cost for waste liquid treatment, and a stripping solution containing a high concentration of nitric acid requires a measure to prevent diffusion of odor and mist generated during use. However, there was a problem that handling was dangerous. Therefore, the object of the present invention is to remove only the film of tin or tin alloy attached without eroding the surface of the base material made of iron or iron alloy, without generating sludge even after long-term use, Moreover, it is to provide a new peeling means which is excellent in safety in use.
【0006】[0006]
【課題を解決するための手段】上記目的を達成すること
に成功した本発明は、アルカンスルホン酸、アルカノー
ルスルホン酸、およびアリールスルホン酸からなる群か
ら選ばれたスルホン酸類またはその塩の1種以上を合計
量で0.05〜5モル/リットル含有する水溶液である
ことを特徴とする電解剥離液を提供するものである。The present invention, which has succeeded in achieving the above objects, comprises one or more sulfonic acids selected from the group consisting of alkanesulfonic acids, alkanolsulfonic acids, and arylsulfonic acids or salts thereof. The present invention provides an electrolytic stripping solution, which is an aqueous solution containing 0.05 to 5 mol / liter in total.
【0007】本発明はまた、錫または錫合金からなる皮
膜(以下、メッキ皮膜ということがある)を表面に有す
る鉄製品をアルカンスルホン酸、アルカノールスルホン
酸、およびアリールスルホン酸からなる群から選ばれた
スルホン酸類またはその塩の水溶液中に浸漬し、該鉄製
品を陽極にして定電圧で電解することを特徴とする鉄製
品表面の錫または錫合金からなる皮膜を除去する方法を
提供するものである。The present invention also provides an iron product having a coating film of tin or a tin alloy (hereinafter sometimes referred to as a plated coating) selected from the group consisting of alkane sulfonic acid, alkanol sulfonic acid, and aryl sulfonic acid. And a method for removing a film made of tin or a tin alloy on the surface of an iron product, characterized by immersing the iron product in an aqueous solution of sulfonic acid or a salt thereof and electrolyzing the iron product at a constant voltage. is there.
【0008】[0008]
【作用】本発明による電解剥離液に被処理物を浸漬し、
被処理物を陽極にして電解すると、被処理物表面のメッ
キ皮膜は速やかにイオン化して溶解し、溶解した金属の
イオンは陰極表面に達しそこで還元されて金属となり析
出するので、剥離液中の金属イオンの濃度はきわめて低
い水準に維持される。溶存する金属イオンも、剥離液中
に酸化性成分が存在しないからスラッジ状酸化物を生成
することはない。[Function] An object to be treated is immersed in the electrolytic stripping solution according to the present invention,
When electrolysis is performed with the object to be processed as an anode, the plating film on the surface of the object to be processed is rapidly ionized and dissolved, and the dissolved metal ions reach the cathode surface and are reduced there to be deposited as a metal. The metal ion concentration is maintained at a very low level. Dissolved metal ions also do not form sludge-like oxides because there is no oxidizing component in the stripping solution.
【0009】電解剥離液に含有させるスルホン酸類また
はその塩の量(2種以上のスルホン酸類を併用する場合
はそれらの合計量)は0.05〜5モル/リットルが適
当であって、0.05モル/リットル未満では錫や錫合
金の溶解力が低く、完全処理に長時間を要したり、剥離
が不完全になったりする。一方、スルホン酸類の含有量
が5モル/リットルを超えても性能の向上は見られず、
コスト面で不利になるだけである。The amount of sulfonic acids or salts thereof contained in the electrolytic stripping solution (when two or more sulfonic acids are used in combination, the total amount thereof) is preferably 0.05 to 5 mol / liter, If it is less than 05 mol / liter, the dissolving power of tin or a tin alloy is low, and it may take a long time to complete the treatment or the peeling may be incomplete. On the other hand, even if the content of the sulfonic acids exceeds 5 mol / liter, the performance is not improved,
It only comes at a cost disadvantage.
【0010】本発明の電解剥離液に含有させるスルホン
酸類の好ましい具体例としては、メタンスルホン酸、エ
タンスルホン酸、プロパンスルホン酸、ブタンスルホン
酸等のアルカンスルホン酸;ヒドロキシエタンスルホン
酸、ヒドロキシプロパンスルホン酸、ヒドロキシブタン
スルホン酸等のアルカノールスルホン酸;フェノールス
ルホン酸、クレゾールスルホン酸、ニトロベンゼンスル
ホン酸等のアリールスルホン酸等があり、また、スルホ
ン酸類の塩の中でも特に好ましいのは、アルカリ金属塩
およびアンモニウム塩である。Preferred specific examples of the sulfonic acids contained in the electrolytic stripping solution of the present invention include alkanesulfonic acids such as methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid and butanesulfonic acid; hydroxyethanesulfonic acid, hydroxypropanesulfone. Acids, alkanol sulfonic acids such as hydroxybutane sulfonic acid; aryl sulfonic acids such as phenol sulfonic acid, cresol sulfonic acid, nitrobenzene sulfonic acid, and the like. Among the salts of sulfonic acids, particularly preferred are alkali metal salts and ammonium salts. It is salt.
【0011】スルホン酸類またはその塩の水溶液からな
る電解剥離液を用いるメッキ皮膜の電解剥離は任意の電
源により実施することができるが、定電圧電源を用いて
行うときは特に有利な結果が得られる。すなわち、定電
圧で電解すると、イオン化して溶出し易い錫または錫合
金が剥離されて少なくなるにつれて電流値が低下し、基
材が露出する頃には電流値は激減する。また、露出した
基材表面は酸化されて不動態化する。そのため、電解は
自動的に停止状態になり、基材の溶解は起こらない。The electrolytic stripping of the plating film using the electrolytic stripping solution consisting of an aqueous solution of sulfonic acids or salts thereof can be carried out by any power source, but particularly advantageous results are obtained when using a constant voltage power source. . That is, when electrolysis is carried out at a constant voltage, the current value decreases as the tin or tin alloy, which is easily ionized and eluted, is separated and reduced, and the current value drastically decreases when the base material is exposed. In addition, the exposed substrate surface is oxidized and passivated. Therefore, the electrolysis is automatically stopped and the substrate does not dissolve.
【0012】同じ電解剥離液を用いても、定電流電解を
行なうと、メッキ皮膜が溶けて基材が露出した後も引き
続き大きな電流が強制的に流されるため、なんらかの手
段により剥離完了を感知して電源を遮断するにしても、
基材表面が電解により侵食されるのを免れることは難し
い。Even if the same electrolytic stripping solution is used, if constant current electrolysis is performed, a large current is forcibly applied even after the plating film is melted and the base material is exposed. Therefore, the stripping completion is detected by some means. Even if you turn off the power
It is difficult to avoid the substrate surface from being eroded by electrolysis.
【0013】本発明の剥離液を用いてメッキ皮膜の電解
剥離を行う場合、メッキ皮膜の剥離速度は陽極電流密度
に比例して大きくなるが、陽極電流密度(定電圧電解に
よる場合は電解開始時の陽極電流密度)は約1〜60 A
/dm2が適当である。1 A/dm2未満では剥離速度が遅すぎ
て完全剥離に時間がかかり過ぎ、一方、60 A/dm2を越
えると、基材の侵食を避けるのが難しくなる。特に定電
圧電源によらない場合は、過剰電解による基材表面の侵
食を防ぐため、低めの電流密度を採用することが望まし
い。陰極構成材料としては、通電性があり、かつ電解剥
離液中で溶解しないものであれば何でも使用することが
できるが、好ましい例としては、カーボン、ステンレス
等があげられる。When electrolytically stripping a plating film using the stripping solution of the present invention, the stripping rate of the plating film increases in proportion to the anode current density. Anode current density) is about 1 to 60 A
/ dm 2 is suitable. If it is less than 1 A / dm 2 , the peeling speed is too slow and it takes too much time for complete peeling, while if it exceeds 60 A / dm 2 , it becomes difficult to avoid erosion of the substrate. Especially when not using a constant voltage power source, it is desirable to employ a lower current density in order to prevent erosion of the substrate surface due to excessive electrolysis. As the cathode constituent material, any material can be used as long as it has electrical conductivity and does not dissolve in the electrolytic stripping solution, but preferable examples include carbon, stainless steel and the like.
【0014】酸化剤を含有しない本発明の電解剥離液で
は、使用中に錫イオンからスズ酸化物のスラッジが生成
することはほとんどないが、クエン酸、リンゴ酸、コハ
ク酸、グルコン酸、乳酸、酢酸、グリコール酸、プロピ
オン酸、酒石酸、シュウ酸、マロン酸等のカルボン酸、
およびそれらのアルカリ金属塩、アルカリ土類金属塩、
アンモニウム塩など、錫イオンの錯化剤となり得る物質
を添加しておくと、錫イオンを安定化しスズ酸化物スラ
ッジの生成をより確実に防止することができる。また、
少量のノニオン系界面活性剤を添加すると、剥離液に溶
け込んだ金属イオンが陰極で析出するのを促進すること
ができる。In the electrolytic stripping solution of the present invention containing no oxidizing agent, tin oxide sludge is hardly produced from tin ions during use, but citric acid, malic acid, succinic acid, gluconic acid, lactic acid, Carboxylic acids such as acetic acid, glycolic acid, propionic acid, tartaric acid, oxalic acid, and malonic acid,
And their alkali metal salts, alkaline earth metal salts,
By adding a substance such as an ammonium salt that can serve as a complexing agent for tin ions, it is possible to stabilize the tin ions and more reliably prevent the formation of tin oxide sludge. Also,
The addition of a small amount of nonionic surfactant can accelerate the precipitation of metal ions dissolved in the stripping solution at the cathode.
【0015】[0015]
実施例1 ステンレス鋼SUS304の線材(3mmφ×80mm)に
厚さ10μmのはんだメッキ(錫:鉛=8:2)を施し
たものを試験片とし、これをメタンスルホン酸2モル/
リットルの剥離液中に浸漬し、試験片を陽極とし、ステ
ンレス鋼SUS304の板材を陰極として、電解開始時
の陽極電流密度が40 A/dm2になるように電圧を選んで
定電圧電解処理を行なった。約30秒で陽極電流密度は
0.1A/dm2に低下し、はんだメッキ皮膜は完全に除去さ
れたので、電解を停止した。処理後の基材表面に損傷は
見られず、基材の減量も全くなかった。Example 1 A stainless steel SUS304 wire rod (3 mmφ × 80 mm) having a thickness of 10 μm solder-plated (tin: lead = 8: 2) was used as a test piece.
Dipping in 1 liter of stripper, using the test piece as the anode, the stainless steel SUS304 plate as the cathode, and selecting the voltage so that the anode current density at the start of electrolysis is 40 A / dm 2, and performing constant voltage electrolysis. I did. The anode current density dropped to 0.1 A / dm 2 in about 30 seconds, and the solder plating film was completely removed, so that the electrolysis was stopped. No damage was observed on the surface of the substrate after the treatment, and the amount of the substrate was not reduced at all.
【0016】実施例2 42アロイリードフレームに実施例1の場合と同様のメ
ッキを施したものを試験片とし、メタンスルホン酸3モ
ル/リットルの剥離液中に浸漬し、試験片を陽極、ステ
ンレス鋼SUS304を陰極として、電解開始時の陽極
電流密度が50A/dm2になるように電圧を選んで定電圧
電解処理を行なった。約25秒で陽極電流密度は0.1A
/dm2に低下し、メッキ皮膜は完全に除去されたので、電
解を停止した。処理後の基材表面には損傷は見られず、
基材の減量も全くなかった。Example 2 A 42 alloy lead frame plated in the same manner as in Example 1 was used as a test piece, and the test piece was immersed in a stripping solution containing 3 mol / l of methanesulfonic acid to make the test piece an anode and stainless steel. A constant voltage electrolysis treatment was performed by using steel SUS304 as a cathode and selecting a voltage so that the anode current density at the start of electrolysis was 50 A / dm 2 . Anode current density is 0.1A in about 25 seconds
/ dm 2 and the plating film was completely removed, so the electrolysis was stopped. No damage is seen on the substrate surface after treatment,
There was no weight loss of the substrate.
【0017】実施例3 電解剥離液をイソプロパノールスルホン酸3モル/リッ
トルの水溶液に変更したほかは実施例1と同様にして、
試験片表面のメッキ皮膜剥離を行なった。約30秒では
んだメッキ皮膜は完全に除去され、剥離後の基材表面に
は損傷は見られず、基材の減量もまったくなかった。Example 3 In the same manner as in Example 1 except that the electrolytic stripping solution was changed to an aqueous solution of isopropanol sulfonic acid 3 mol / liter,
The plating film on the surface of the test piece was peeled off. The solder plating film was completely removed in about 30 seconds, no damage was found on the surface of the base material after peeling, and the weight of the base material was not reduced at all.
【0018】実施例4 フェノールスルホン酸4モル/リットルの水溶液を剥離
液にして、実施例2と同様の試験片のメッキ皮膜を定電
圧電解により剥離した。陰極にはステンレス鋼SUS3
04を用い、電解開始時の陽極電流密度は30 A/dm2で
あった。約40秒後に陽極電流密度は0.1A/dm2に低下
し、はんだメッキ皮膜は完全に除去されたので、電解を
停止した。メッキ皮膜剥離後の基材表面には損傷は見ら
れず、基材の減量もまったくなかった。Example 4 Using a 4 mol / liter phenolsulfonic acid aqueous solution as a stripping solution, the plating film of a test piece similar to that in Example 2 was stripped by constant voltage electrolysis. Stainless steel SUS3 for the cathode
No. 04 was used, and the anode current density at the start of electrolysis was 30 A / dm 2 . After about 40 seconds, the anode current density dropped to 0.1 A / dm 2 , and the solder plating film was completely removed, so the electrolysis was stopped. No damage was observed on the surface of the substrate after the plating film was peeled off, and the amount of the substrate was not reduced at all.
【0019】実施例5 本発明の電解剥離液の安定性と反復使用可能性を調べる
ため、実施例1で使用した電解剥離液1リットル中では
んだ延べ板(錫:鉛=8:2)を陽極、ステンレス鋼S
US304を陰極にして、直流1Aの定電流電解を50
時間続けた。この電解により、はんだ延べ板は約110
gが溶解したが、剥離液中に溶解した錫イオンおよび鉛
イオンは逐次陰極表面において金属として析出し、液中
の錫イオンおよび鉛イオンの濃度は100mg/リットル
以下に維持されて、スズ酸化物のスラッジはまったく発
生しなかった。上記連続電解を行った後の剥離液をその
まま用いて実施例1および実施例2と同様のメッキ皮膜
剥離試験を行ったところ、実施例1及び2と同様の良好
な結果を得た。Example 5 To examine the stability and reusability of the electrolytic stripping solution of the present invention, a solder strip (tin: lead = 8: 2) was used in 1 liter of the electrolytic stripping solution used in Example 1. Anode, stainless steel S
US304 is used as a cathode, and constant current electrolysis of direct current 1A is 50
I continued for hours. Due to this electrolysis, the solder plate is about 110
g was dissolved, but tin ions and lead ions dissolved in the stripping solution were successively deposited as a metal on the cathode surface, and the tin ion and lead ion concentrations in the solution were maintained at 100 mg / liter or less. Sludge did not occur at all. When the same plating film peeling test as in Examples 1 and 2 was performed using the peeling solution after the above continuous electrolysis as it was, the same good results as in Examples 1 and 2 were obtained.
【0020】比較例 陽極電流密度を30 A/dm2とする定電流電解を行なった
ほかは実施例1と同様にして、試験片のはんだメッキ皮
膜の剥離を行った。約1分ではんだメッキ皮膜が完全に
除去され、直ちに電解を停止したが、約1mgの基材減量
があり、基材表面に荒れも認められた。Comparative Example The solder plating film of the test piece was peeled off in the same manner as in Example 1 except that constant current electrolysis was carried out at an anode current density of 30 A / dm 2 . The solder plating film was completely removed in about 1 minute, and the electrolysis was stopped immediately, but the amount of the base material was reduced by about 1 mg, and the surface of the base material was also roughened.
【0021】[0021]
【発明の効果】上述のように、スルホン酸類を主剤とし
酸化剤を含有しない本発明の電解剥離液を用いれば、き
わめて能率的にメッキ皮膜を剥離することができる。特
に、定電圧電解を行うときはメッキ皮膜の剥離完了後電
流密度が急減して実質的に電解停止状態になるから、過
剰電解により基材表面を損傷する恐れがないだけでな
く、工程管理が容易である。また、電解剥離されて剥離
液中に溶解した錫イオンは酸化されることなく速やかに
金属として陰極に析出するため、本発明の剥離液は長期
間使用してもスズ酸化物のスラッジを生じることなく安
定した処理能力を発揮する。取り扱いが容易で安全な作
業ができることも、本発明の電解剥離液の特長である。As described above, when the electrolytic stripping solution of the present invention containing sulfonic acids as a main component and containing no oxidizing agent is used, the plating film can be stripped very efficiently. In particular, when constant voltage electrolysis is performed, the current density is sharply reduced after the peeling of the plating film is completed and the electrolysis is substantially stopped.Therefore, there is no risk of damage to the substrate surface due to excessive electrolysis, and process control is also possible. It's easy. Further, since tin ions that have been electrolytically stripped and dissolved in the stripping solution are rapidly oxidized and are deposited on the cathode as a metal without being oxidized, the stripping solution of the present invention may generate sludge of tin oxide even after long-term use. Demonstrate stable processing capacity without. It is also a feature of the electrolytic stripping solution of the present invention that it is easy to handle and can perform safe work.
Claims (2)
ホン酸、およびアリールスルホン酸からなる群から選ば
れたスルホン酸類またはその塩を合計量で0.05〜5モ
ル/リットル含有する水溶液であることを特徴とする鉄
製品表面の錫または錫合金からなる皮膜を電解剥離する
ための電解液。1. An aqueous solution containing a total of 0.05 to 5 mol / liter of a sulfonic acid selected from the group consisting of alkanesulfonic acid, alkanolsulfonic acid, and arylsulfonic acid or a salt thereof. An electrolytic solution for electrolytically stripping a film made of tin or tin alloy on the surface of iron products.
する鉄製品をアルカンスルホン酸、アルカノールスルホ
ン酸、およびアリールスルホン酸からなる群から選ばれ
たスルホン酸類またはその塩の水溶液中に浸漬し、該鉄
製品を陽極にして定電圧で電解することを特徴とする鉄
製品表面の錫または錫合金からなる皮膜を剥離する方
法。2. An iron product having a coating film made of tin or a tin alloy on its surface is dipped in an aqueous solution of a sulfonic acid selected from the group consisting of alkanesulfonic acid, alkanolsulfonic acid, and arylsulfonic acid, or a salt thereof, A method of stripping a film made of tin or a tin alloy on the surface of an iron product, which comprises electrolyzing at a constant voltage using the iron product as an anode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8394593A JPH06272098A (en) | 1993-03-19 | 1993-03-19 | Electrolytic peeling solution and peeling method of coating film made of tin or tin alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8394593A JPH06272098A (en) | 1993-03-19 | 1993-03-19 | Electrolytic peeling solution and peeling method of coating film made of tin or tin alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06272098A true JPH06272098A (en) | 1994-09-27 |
Family
ID=13816730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8394593A Pending JPH06272098A (en) | 1993-03-19 | 1993-03-19 | Electrolytic peeling solution and peeling method of coating film made of tin or tin alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06272098A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6126800A (en) * | 1984-07-18 | 1986-02-06 | Mitsubishi Metal Corp | Method for recovering valuable metal from metal scrap |
JPS62257000A (en) * | 1986-04-22 | 1987-11-09 | ペンウオルト・コ−ポレ−シヨン | Selective electrolytic release of metal coating from base metal base material |
-
1993
- 1993-03-19 JP JP8394593A patent/JPH06272098A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6126800A (en) * | 1984-07-18 | 1986-02-06 | Mitsubishi Metal Corp | Method for recovering valuable metal from metal scrap |
JPS62257000A (en) * | 1986-04-22 | 1987-11-09 | ペンウオルト・コ−ポレ−シヨン | Selective electrolytic release of metal coating from base metal base material |
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