JPH06267652A - Vacuum heat treatment device - Google Patents

Vacuum heat treatment device

Info

Publication number
JPH06267652A
JPH06267652A JP5077492A JP7749293A JPH06267652A JP H06267652 A JPH06267652 A JP H06267652A JP 5077492 A JP5077492 A JP 5077492A JP 7749293 A JP7749293 A JP 7749293A JP H06267652 A JPH06267652 A JP H06267652A
Authority
JP
Japan
Prior art keywords
heat
vacuum
heating element
heating unit
insulating cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5077492A
Other languages
Japanese (ja)
Inventor
Koji Akita
浩二 秋田
Toshio Matsumoto
敏夫 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Healthcare Manufacturing Ltd
Original Assignee
Hitachi Medical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Medical Corp filed Critical Hitachi Medical Corp
Priority to JP5077492A priority Critical patent/JPH06267652A/en
Publication of JPH06267652A publication Critical patent/JPH06267652A/en
Pending legal-status Critical Current

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  • General Induction Heating (AREA)

Abstract

PURPOSE:To reduce the high-frequency wave input and to suppress the deterioration of the sealing property, by covering a heating unit with a heat insulating cover which consists of a material of a high electric insulation and a low heat radiating rate. CONSTITUTION:This vacuum heat treatment device is formed of a heating unit 5 housing a heat treating part 9; a vacuum container 2 having a vacuum chamber 1 to cover the heating unit 5; an airtight seal 3 to prevent the leakage of the air in the container 2; and a coil 4 for high-frequency induction heating to heat the heating unit 5. And, in order to prevent the heat radiation from the heating unit 5, a heat insulating cover 6 which consists of material of a high electric insulation and a low heat radiation rate is provided around the heating unit 5, so as to prevent an easy flow of thermoelectric current. As a result, the heat radiation output from the heating unit 5 can be reflected by the cover 6, and the heat is made difficult to conduct to the seal 3, as well as the temperature of the heating unit 5 can be maintained at a high value. Consequently, the high-frequency wave input is reduced, and the deterioration of the sealing property can be suppressed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は真空中で高温加熱して部
材の脱ガス処理を行う真空熱処理装置に係り、発熱体を
高温に保持して、真空室の高真空を保ちながら処理部品
を加熱するのに好適な真空熱処理装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum heat treatment apparatus for heating a high temperature in a vacuum to degas a member, by keeping a heating element at a high temperature and maintaining a high vacuum in a vacuum chamber. The present invention relates to a vacuum heat treatment apparatus suitable for heating.

【0002】[0002]

【従来の技術】従来の装置は特開平5−9568号のように
冷却器の内部に熱反射板を設け、被加熱部材からの熱輻
射を抑制するような構造であった。また、発熱体の冷却
を早めるため従来は特開平5−9567号のように冷し金に
あて冷却させる構造があった。
2. Description of the Related Art A conventional apparatus has a structure in which a heat reflecting plate is provided inside a cooler to suppress heat radiation from a member to be heated, as in Japanese Patent Laid-Open No. 5-9568. Further, in order to accelerate the cooling of the heating element, there has been a conventional structure in which the heating element is cooled by applying it to a cooling die as in JP-A-5-9567.

【0003】[0003]

【発明が解決しようとする課題】上記従来技術では、発
熱体から輻射熱により逃げる熱量が多く、加熱のための
高周波出力のエネルギが多く必要であった。また発熱体
からの輻射熱により、シール面以外の部分が加熱され、
その熱の熱伝導により、シール面が熱せられ、シール性
が劣化することで、空気が漏れ、真空が破れるという問
題があった。
In the above prior art, a large amount of heat escapes from the heating element by radiant heat, and a large amount of high frequency output energy for heating is required. Also, the radiant heat from the heating element heats the parts other than the sealing surface,
Due to the heat conduction of the heat, the sealing surface is heated and the sealing property is deteriorated, so that there is a problem that air leaks and the vacuum breaks.

【0004】本発明の目的は、上記問題点である発熱体
からの逃げる熱量を減少させて、高周波誘導加熱用コイ
ルの入力電流の省エネルギ化を図り、またこの発熱体か
ら発する輻射熱の気密シール部への伝導を抑制して、気
密シール部のシール性の劣化を防ぎ、真空状態を維持す
ることにある。また、上記発熱体を冷却するときには、
この発熱体の熱量を速やかに逃がすことができることに
ある。
An object of the present invention is to reduce the amount of heat escaping from the heating element, which is the above-mentioned problem, to save energy of the input current of the coil for high frequency induction heating, and to hermetically seal the radiant heat emitted from the heating element. The purpose is to suppress the conduction to the part, prevent the deterioration of the sealing property of the airtight seal part, and maintain the vacuum state. When cooling the heating element,
The heat quantity of the heating element can be quickly released.

【0005】[0005]

【課題を解決するための手段】上記目的は、加熱される
処理部品を収納する発熱体と、この発熱体を覆う真空室
を有する真空容器と、この真空容器内に空気が漏洩する
のを防ぐ気密シール部と、この真空容器内にある前記発
熱体を加熱する高周波誘導加熱用コイルとを具備する真
空熱処理装置において、前記発熱体を覆う断熱カバー部
を備えたことにより達成する。また、前記発熱体を覆う
断熱カバー部を備えた真空熱処理装置において、前記発
熱体と前記断熱カバー部とを相対移動して、この断熱カ
バー部を着脱できる機構を備えたことにより達成する。
SUMMARY OF THE INVENTION The above object is to prevent a leakage of air into a vacuum container having a heating element for accommodating a processing component to be heated, a vacuum chamber covering the heating element, and a vacuum chamber. This is achieved by providing a vacuum heat treatment apparatus that includes an airtight seal portion and a high-frequency induction heating coil that heats the heating element in the vacuum container, by providing a heat insulating cover portion that covers the heating element. Further, in the vacuum heat treatment apparatus provided with the heat insulating cover part for covering the heat generating body, the heat generating body and the heat insulating cover part are relatively moved to each other, and the heat insulating cover part is attached and detached.

【0006】[0006]

【作用】発熱体からの熱輻射を防止するため、発熱体の
まわりに熱電流が流れにくいように電気絶縁性が高く、
かつ熱輻射率の低い材料からなる断熱カバー部を囲い、
設置するので、発熱体から出る熱輻射を断熱カバー部で
熱反射することができ、発熱体の温度を高く保持するこ
とができるため,熱輻射における高周波入力エネルギの
浪費を小さくできる。また、気密シール部などの他部分
が輻射熱により加熱されることがないのでシール性の劣
化がなく高真空が保持できる。また速やかに冷却するた
めには、発熱体、もしくは断熱カバー部を相対移動させ
ることにより、熱輻射によって冷却できる。
[Function] In order to prevent heat radiation from the heating element, the electrical insulation is high so that the thermal current does not easily flow around the heating element,
Enclose the heat insulating cover part made of a material with low heat emissivity,
Since it is installed, the heat radiation emitted from the heating element can be reflected by the heat insulating cover and the temperature of the heating element can be kept high, so that the waste of high frequency input energy in the heat radiation can be reduced. Further, since other parts such as the airtight seal portion are not heated by the radiant heat, the sealability is not deteriorated and the high vacuum can be maintained. In addition, in order to cool quickly, the heat generating element or the heat insulating cover portion is moved relative to each other, whereby it can be cooled by heat radiation.

【0007】[0007]

【実施例】以下、本発明の真空熱処理装置について図面
を用いて説明する。図1は本発明の真空熱処理装置の加
熱時の断面図、図2は本発明の真空熱処理装置の冷却時
の断面図、図3は従来の断熱カバー部6を有しない真空
熱処理装置と本発明の真空熱処理装置とにおいて、発熱
体温度を横軸とし、高周波入力(相対比率)を縦軸とし
たグラフである。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A vacuum heat treatment apparatus of the present invention will be described below with reference to the drawings. 1 is a cross-sectional view of the vacuum heat treatment apparatus of the present invention during heating, FIG. 2 is a cross-sectional view of the vacuum heat treatment apparatus of the present invention during cooling, and FIG. 3 is a conventional vacuum heat treatment apparatus having no heat insulating cover 6 and the present invention. 2 is a graph showing the heating element temperature on the horizontal axis and the high frequency input (relative ratio) on the vertical axis in the vacuum heat treatment apparatus of FIG.

【0008】まず、本発明の真空熱処理装置の構成につ
いて、図1と図2を用いて述べる。本発明の真空熱処理
装置は加熱される処理部品9を収納する発熱体5と、こ
の発熱体5を覆う真空室1を有する真空容器2と、この
真空容器2内に空気が漏洩するのを防ぐ気密シール部3
と、この真空容器2内にある前記発熱体5を加熱する高
周波誘導加熱用コイル4とを具備する真空熱処理装置に
おいて、前記発熱体5を覆う断熱カバー部6を備えて、
構成される。また、上記構成の真空熱処理装置におい
て、本発明の真空熱処理装置は前記発熱体5と前記断熱
カバー部6とを相対移動して、この断熱カバー部6を着
脱できる機構(発熱体5の昇降テーブル10)を備え
て、構成される。
First, the structure of the vacuum heat treatment apparatus of the present invention will be described with reference to FIGS. 1 and 2. The vacuum heat treatment apparatus of the present invention prevents the air from leaking into the vacuum container 2 having the heating element 5 that houses the processing component 9 to be heated, the vacuum chamber 2 that covers the heating element 5, and the vacuum container 2. Airtight seal part 3
And a high-frequency induction heating coil 4 for heating the heating element 5 in the vacuum container 2 in a vacuum heat treatment apparatus, which includes a heat insulating cover portion 6 for covering the heating element 5.
Composed. Further, in the vacuum heat treatment apparatus having the above-mentioned structure, the vacuum heat treatment apparatus of the present invention is a mechanism for moving the heating element 5 and the heat insulating cover portion 6 relative to each other so that the heat insulating cover portion 6 can be attached / detached (a lift table for the heat generating element 5). 10) and is configured.

【0009】次に、本発明の断熱カバー部6を有する真
空熱処理装置と従来の断熱カバー部6のない真空熱処理
装置との発熱体5の加熱工程を実験により、図3を用い
て比較する。なお、実験における条件を以下のように設
定する。本発明の断熱カバー部6を有する真空熱処理装
置を試料A,従来の断熱カバー部6の無い真空熱処理装
置を試料Bとする。次に試料Aと、試料Bとの共通の条
件について述べる。加熱される処理部品9を収納する発
熱体5は、グラファイトなどの熱容量が大きく、かつ高
周波に誘導されやすい材料を用いる。この発熱体5を覆
う真空室1を有する真空容器2は、石英ガラスなどの真
空室1の真空度を高周波誘導などで電圧が印加されても
放電しないように9×10-4Torr以下に保つことがで
き、また高周波に誘導されない絶縁体である材料を用い
る。この真空容器2内に空気が漏洩するのを防ぐ気密シ
ール部3は、バイトンゴムなどの放出ガスが少なく、気
密性が維持できる材料を用いる。この真空容器2内にあ
る前記発熱体5を加熱する高周波誘導コイル4は、一定
巻数だけ真空容器2に設ける。また、発熱体5の温度を
測定するための熱電対8を取り付ける。処理部品9は発
熱体5に接するか、輻射熱によって加熱できるようにし
ておく。
Next, the heating process of the heating element 5 of the vacuum heat treatment apparatus having the heat insulating cover portion 6 of the present invention and the conventional vacuum heat treatment apparatus having no heat insulating cover portion 6 will be compared by experiments with reference to FIG. The conditions in the experiment are set as follows. A vacuum heat treatment apparatus having the heat insulating cover portion 6 of the present invention is referred to as a sample A, and a conventional vacuum heat treatment apparatus having no heat insulating cover portion 6 is referred to as a sample B. Next, conditions common to the sample A and the sample B will be described. The heating element 5 that houses the processing component 9 to be heated is made of a material such as graphite that has a large heat capacity and is easily induced by high frequencies. The vacuum container 2 having the vacuum chamber 1 covering the heating element 5 keeps the vacuum degree of the vacuum chamber 1 such as quartz glass at 9 × 10 −4 Torr or less so as not to be discharged even when a voltage is applied by high frequency induction or the like. A material that is an insulator that can be used and that is not induced by high frequencies is used. The airtight seal portion 3 that prevents air from leaking into the vacuum container 2 is made of a material such as Viton rubber that releases little gas and maintains airtightness. The high frequency induction coil 4 for heating the heating element 5 in the vacuum container 2 is provided in the vacuum container 2 by a certain number of turns. Further, a thermocouple 8 for measuring the temperature of the heating element 5 is attached. The processing part 9 is in contact with the heating element 5 or can be heated by radiant heat.

【0010】次に、試料A特有の条件について述べる。
前記発熱部5を覆う断熱カバー部6は、耐熱セラミック
スなどの化学的に安定して、絶縁体であって、熱反射が
大きく、熱輻射の小さい材料を用いる。この材料の色
は、より熱反射を大きくするため白色であることが望ま
しく、またこの材料の形状は、熱容量を小さくするため
肉薄であることが望ましい。また、この断熱カバー部6
には、処理部品9や発熱体5から微量であるが発生する
ガスを抜く、ガス抜き穴7を設ける。また発熱体5を断
熱カバー部6で覆うとき、発熱体5と断熱カバー部6に
適宜に間隔があるように配置して、断熱カバー部6に発
熱体5の熱が伝導しないようにする。
Next, conditions specific to Sample A will be described.
The heat insulating cover 6 for covering the heat generating portion 5 is made of a material such as heat resistant ceramics that is chemically stable, is an insulator, and has large heat reflection and small heat radiation. The color of this material is preferably white in order to increase the heat reflection, and the shape of this material is preferably thin in order to reduce the heat capacity. Also, this heat insulating cover portion 6
Is provided with a gas vent hole 7 for venting a slight amount of generated gas from the processing component 9 and the heating element 5. Further, when the heat generating body 5 is covered with the heat insulating cover part 6, the heat generating body 5 and the heat insulating cover part 6 are arranged so as to have an appropriate gap so that the heat of the heat generating body 5 is not conducted to the heat insulating cover part 6.

【0011】次に、実験の工程について述べる。 (1)試料Aと試料Bにおいて、発熱体5内に、処理部
品9を入れる。 (2)試料Aと試料Bにおいて、真空引き穴11より上
記条件で規定された圧力まで真空引きをする。 (3)試料Aと試料Bにおいて、高周波誘導加熱用コイ
ル4に電流を流し、発熱体5を加熱する。 (4)試料Aと試料Bにおいて、熱電対8によって発熱
体5の温度を測定する。 (5)試料Aと試料Bにおいて、発熱体5の温度を横軸
とし、高周波誘導加熱用コイル4への入力量の相対比率
を縦軸として、発熱体5を徐々に加熱し、図3のような
グラフを作成する。
Next, the experimental process will be described. (1) In sample A and sample B, the processing component 9 is placed in the heating element 5. (2) With respect to the sample A and the sample B, the evacuation hole 11 is evacuated to the pressure specified under the above conditions. (3) In sample A and sample B, a current is passed through the high frequency induction heating coil 4 to heat the heating element 5. (4) In the samples A and B, the temperature of the heating element 5 is measured by the thermocouple 8. (5) In sample A and sample B, the temperature of the heating element 5 is taken as the horizontal axis, and the relative ratio of the input amount to the high-frequency induction heating coil 4 is taken as the vertical axis. Create a graph like this.

【0012】次に、実験結果について述べる。発熱体5
の加熱の目的温度を800℃としたとき、試料Aは試料
Bの50%の高周波入力で済むことを、図3のグラフは
示している。
Next, experimental results will be described. Heating element 5
The graph of FIG. 3 shows that when the target temperature for heating of the sample A is set to 800 ° C., the sample A requires 50% of the high frequency input of the sample B.

【0013】次に、本発明の真空熱処理装置の発熱体5
の冷却工程について、図2を用いて述べる。真空熱処理
装置の発熱体5を昇降テーブル10の上に載せて、発熱
体5から断熱カバー部6の覆いを外すことで、発熱体を
速やかに冷却する。また、この例では、発熱体5の移動
で、断熱カバー部6の覆いを外すことで述べたが、断熱
カバー部6の移動で行ってもよい。
Next, the heating element 5 of the vacuum heat treatment apparatus of the present invention.
The cooling step of will be described with reference to FIG. By placing the heating element 5 of the vacuum heat treatment apparatus on the elevating table 10 and removing the cover of the heat insulating cover portion 6 from the heating element 5, the heating element is quickly cooled. Further, in this example, the heat-generating body 5 is moved to remove the cover of the heat insulating cover 6, but the heat insulating cover 6 may be moved.

【0014】[0014]

【発明の効果】本発明の真空熱処理装置は以下に示す効
果を奏する。 (1)発熱体5を断熱カバー部6で覆うことにより、高
周波誘導加熱用コイル4の加熱において、発熱体5の目
的温度到達までの高周波入力を小さくすることが可能
で、省エネルギ化できる。 (2)発熱体5を断熱カバー部6で覆うことにより、気
密シール部3に熱が伝導しにくくなるため、シール性の
劣化を抑制して、真空室1の気密性を高めることができ
る。 (3)発熱体5と断熱カバー部6とを相対移動して、こ
の断熱カバー部6が脱着できる機構により、発熱体5か
ら断熱カバー部6の覆いを外して、速やかな発熱体5の
冷却をすることができる。
The vacuum heat treatment apparatus of the present invention has the following effects. (1) By covering the heating element 5 with the heat insulating cover portion 6, in heating the coil 4 for high frequency induction heating, it is possible to reduce the high frequency input until the target temperature of the heating element 5 is reached, and it is possible to save energy. (2) By covering the heating element 5 with the heat insulating cover portion 6, heat is less likely to be conducted to the airtight sealing portion 3, so that deterioration of the sealing property can be suppressed and the airtightness of the vacuum chamber 1 can be enhanced. (3) The heat-generating body 5 and the heat-insulating cover 6 are relatively moved to remove the heat-insulating cover 6 from the heat-generating body 5 by a mechanism capable of removing and attaching the heat-insulating cover 6 to quickly cool the heat-generating body 5. You can

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の真空熱処理装置の加熱時の構造を示す
図である。
FIG. 1 is a diagram showing a structure of a vacuum heat treatment apparatus of the present invention during heating.

【図2】本発明の真空熱処理装置の冷却時の構造を示す
図である。
FIG. 2 is a diagram showing the structure of the vacuum heat treatment apparatus of the present invention during cooling.

【図3】断熱部の有無により、高周波誘導時の入力量の
差を示すグラフである。
FIG. 3 is a graph showing a difference in input amount during high frequency induction depending on the presence or absence of a heat insulating unit.

【符号の説明】[Explanation of symbols]

1 真空室 2 真空容器 3 気密シール部 4 高周波誘導加熱用コイル 5 発熱体 6 断熱カバー部 7 ガス抜き穴 8 熱電対 9 処理部品 10 昇降テーブル 11 真空引き穴 1 Vacuum Chamber 2 Vacuum Container 3 Airtight Seal Part 4 High Frequency Induction Heating Coil 5 Heating Element 6 Insulation Cover Part 7 Gas Venting Hole 8 Thermocouple 9 Processing Parts 10 Lifting Table 11 Vacuum Pulling Hole

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】加熱される処理部品を収納する発熱体と、
この発熱体を覆う真空室を有する真空容器と、この真空
容器内に空気が漏洩するのを防ぐ気密シール部と、この
真空容器内にある前記発熱体を加熱する高周波誘導加熱
用コイルとを具備する真空熱処理装置において、 前記発熱体を覆う断熱カバー部を備えたことを特徴とす
る真空熱処理装置。
1. A heating element for housing a processing component to be heated,
A vacuum container having a vacuum chamber for covering the heating element, an airtight seal portion for preventing air from leaking into the vacuum container, and a high-frequency induction heating coil for heating the heating element in the vacuum container. The vacuum heat treatment apparatus according to claim 1, further comprising a heat insulating cover portion that covers the heating element.
【請求項2】請求項1記載の真空熱処理装置において、 前記発熱体と前記断熱カバー部とを相対移動して、この
断熱カバー部を着脱できる機構を備えたことを特徴とす
る真空熱処理装置。
2. The vacuum heat treatment apparatus according to claim 1, further comprising a mechanism for relatively moving the heating element and the heat insulating cover portion to attach and detach the heat insulating cover portion.
JP5077492A 1993-03-12 1993-03-12 Vacuum heat treatment device Pending JPH06267652A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5077492A JPH06267652A (en) 1993-03-12 1993-03-12 Vacuum heat treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5077492A JPH06267652A (en) 1993-03-12 1993-03-12 Vacuum heat treatment device

Publications (1)

Publication Number Publication Date
JPH06267652A true JPH06267652A (en) 1994-09-22

Family

ID=13635491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5077492A Pending JPH06267652A (en) 1993-03-12 1993-03-12 Vacuum heat treatment device

Country Status (1)

Country Link
JP (1) JPH06267652A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
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JP2014067652A (en) * 2012-09-27 2014-04-17 Sinfonia Technology Co Ltd Induction heating furnace
WO2023219032A1 (en) * 2022-05-12 2023-11-16 国立研究開発法人理化学研究所 Atom beam generation device, physics package, physics package for optical lattice clock, physics package for atomic clock, physics package for atomic interfererometer, physics package for quantum information processing device, and physics package system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067652A (en) * 2012-09-27 2014-04-17 Sinfonia Technology Co Ltd Induction heating furnace
WO2023219032A1 (en) * 2022-05-12 2023-11-16 国立研究開発法人理化学研究所 Atom beam generation device, physics package, physics package for optical lattice clock, physics package for atomic clock, physics package for atomic interfererometer, physics package for quantum information processing device, and physics package system

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