JPH06260686A - Layered thermopile and manufacture thereof - Google Patents
Layered thermopile and manufacture thereofInfo
- Publication number
- JPH06260686A JPH06260686A JP4290040A JP29004092A JPH06260686A JP H06260686 A JPH06260686 A JP H06260686A JP 4290040 A JP4290040 A JP 4290040A JP 29004092 A JP29004092 A JP 29004092A JP H06260686 A JPH06260686 A JP H06260686A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thermocouple
- thermocouples
- metal wire
- thermopile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000005259 measurement Methods 0.000 claims description 50
- 239000002184 metal Substances 0.000 claims description 47
- 229910052751 metal Inorganic materials 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 16
- 229910001006 Constantan Inorganic materials 0.000 abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 27
- 229910052802 copper Inorganic materials 0.000 abstract description 14
- 239000010949 copper Substances 0.000 abstract description 14
- 230000035945 sensitivity Effects 0.000 abstract description 8
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910005091 Si3N Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は可視光センサ、赤外線セ
ンサ、紫外線センサ、温度センサ、熱センサ等のように
電磁波のエネルギを検出するために用いられる小型で高
感度な薄膜熱電素子であるサーモパイル及びその製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermopile which is a small and highly sensitive thin film thermoelectric element used for detecting energy of electromagnetic waves such as a visible light sensor, an infrared sensor, an ultraviolet sensor, a temperature sensor and a heat sensor. And a manufacturing method thereof.
【０００２】[0002]
【従来の技術】従来から、可視光センサ、赤外線セン
サ、紫外線センサ、温度センサ、熱センサ等として、薄
膜状の熱電対を多数直列接続させた薄膜熱電素子である
サーモパイルが開発されている。一般に、サーモパイル
は、２種の金属線材料からなる複数の金属線を交互に接
続して、多数の熱電対を直列接続して、温度差から生じ
る熱起電力が加算される構造を有し、大きな熱起電力を
得ようとするものである。これにより高効率の熱電力変
換素子や微少温度差を検知する高感度な可視光センサ、
赤外線センサ、紫外線センサ、温度センサ、熱センサ等
として利用されている。2. Description of the Related Art A thermopile, which is a thin film thermoelectric element in which a large number of thin film thermocouples are connected in series, has been developed as a visible light sensor, an infrared sensor, an ultraviolet sensor, a temperature sensor, a heat sensor, and the like. Generally, a thermopile has a structure in which a plurality of metal wires made of two kinds of metal wire materials are alternately connected and a large number of thermocouples are connected in series, and thermoelectromotive force generated from a temperature difference is added. It is intended to obtain a large thermoelectromotive force. As a result, a highly efficient thermoelectric power conversion element and a highly sensitive visible light sensor that detects a minute temperature difference,
It is used as an infrared sensor, an ultraviolet sensor, a temperature sensor, a heat sensor, and the like.
【０００３】[0003]
【発明が解決しようとする課題】サーモパイルとしての
感度を上げるためには、直列接続された熱電対の数を多
くすればよい。しかしながら、一定の測定領域内に設け
ることができる測定用の接合点の数は限られているた
め、感度をあげようとしても限度があるという問題があ
った。また、高感度のサーモパイルを実現するためには
大面積の測定領域が必要であるため、熱容量が大きくな
り測定応答時間が遅くなるという問題があった。In order to increase the sensitivity as a thermopile, the number of thermocouples connected in series should be increased. However, the number of bonding points for measurement that can be provided in a certain measurement region is limited, and there is a problem that there is a limit in increasing the sensitivity. Further, since a large-area measurement region is required to realize a highly sensitive thermopile, there is a problem that the heat capacity becomes large and the measurement response time becomes slow.
【０００４】本発明の目的は、測定領域の面積が小さく
高感度で応答時間の速いサーモパイル及びその製造方法
を提供することにある。It is an object of the present invention to provide a thermopile having a small measuring area and a high sensitivity and a fast response time, and a method for manufacturing the thermopile.
【０００５】[0005]
【課題を解決するための手段】上記目的は、絶縁性基板
と、前記絶縁性基板上に形成され、第１の金属線と第２
の金属線とを接合した複数の熱電対が直列接続され、前
記複数の熱電対の各測定点が測定領域内に配置された第
１の熱電対層と、前記第１の熱電対層上に形成された第
１の絶縁層と、前記第１の絶縁層上に形成され、前記第
１の金属線材料からなる第３の金属線と前記第２の金属
線材料からなる第４の金属線とを接合した複数の熱電対
が直列接続され、前記複数の熱電対の各測定点が前記測
定領域内に配置され、前記複数の熱電対が前記第１の絶
縁層を介して前記第１の熱電対層の前記複数の熱電対に
直列接続された第２の熱電対層と、前記第２の熱電対層
上に形成された第２の絶縁層とを有することを特徴とす
る積層サーモパイルによって達成される。The above object is to provide an insulating substrate, a first metal wire and a second metal wire formed on the insulating substrate.
A plurality of thermocouples that are joined to the metal wire are connected in series, and a first thermocouple layer in which each measurement point of the plurality of thermocouples is arranged in a measurement region, and on the first thermocouple layer. A formed first insulating layer, and a fourth metal wire formed on the first insulating layer, the third metal wire made of the first metal wire material, and the fourth metal wire made of the second metal wire material. A plurality of thermocouples that are joined to each other are connected in series, each measurement point of the plurality of thermocouples is arranged in the measurement region, and the plurality of thermocouples are connected to each other via the first insulating layer. A laminated thermopile comprising a second thermocouple layer connected in series to the plurality of thermocouples of the thermocouple layer, and a second insulating layer formed on the second thermocouple layer. To be achieved.
【０００６】上記目的は、絶縁性基板上に、前記絶縁性
基板上に形成され、第１の金属線と第２の金属線とを接
合した複数の熱電対が直列接続され、前記複数の熱電対
の各測定点が測定領域内に配置された第１の熱電対層を
形成する工程と、前記第１の熱電対層上に第１の絶縁層
を形成する工程と、前記第１の絶縁層の、前記複数の熱
電対中のひとつの前記第２の金属線上にコンタクトホー
ルを形成する工程と、前記第１の絶縁層上に、前記第１
の金属線材料からなる第３の金属線と前記第２の金属線
材料からなる第４の金属線とを接合した複数の熱電対が
直列接続され、前記複数の熱電対の各測定点が前記測定
領域内に配置された第２の熱電対層を形成すると共に、
前記複数の熱電対を前記第１の絶縁膜に形成された前記
コンタクトホールを介して前記第１の熱電対層の前記複
数の熱電対に直列接続する工程と、前記第２の熱電対層
上に第２の絶縁層を形成する工程とを有することを特徴
とする積層サーモパイルの製造方法によって達成され
る。The above-mentioned object is to form a plurality of thermocouples, which are formed on the insulating substrate and have a first metal wire and a second metal wire joined together, in series on the insulating substrate. Forming a first thermocouple layer in which each measurement point of the pair is arranged in a measurement region; forming a first insulating layer on the first thermocouple layer; Forming a contact hole on one of the plurality of thermocouples of the second metal wire of the layer; and forming a contact hole on the first insulating layer.
A plurality of thermocouples, in which a third metal wire made of the metal wire material and a fourth metal wire made of the second metal wire material are joined, are connected in series, and the respective measurement points of the plurality of thermocouples are connected to each other. Forming a second thermocouple layer disposed in the measurement region,
Connecting the plurality of thermocouples in series to the plurality of thermocouples of the first thermocouple layer through the contact holes formed in the first insulating film, and on the second thermocouple layer And a step of forming a second insulating layer on the surface of the laminated thermopile.
【０００７】[0007]
【作用】本発明によれば、絶縁性基板と、絶縁性基板上
に形成され、第１の金属線と第２の金属線とを接合した
複数の熱電対が直列接続され、複数の熱電対の各測定点
が測定領域内に配置された第１の熱電対層と、第１の絶
縁層上に形成され、第１の金属線材料からなる第３の金
属線と第２の金属線材料からなる第４の金属線とを接合
した複数の熱電対が直列接続され、複数の熱電対の各測
定点が測定領域内に配置され、複数の熱電対が第１の絶
縁膜を介して第１の熱電対層の複数の熱電対に直列接続
された第２の熱電対層と、第２の熱電対層上に形成され
た第２の絶縁層とを設けたので、一定の測定領域に対し
て多くの測定点を設けることができ、高感度で応答時間
の速い積層サーモパイルを実現することができる。According to the present invention, an insulating substrate and a plurality of thermocouples formed on the insulating substrate and having a first metal wire and a second metal wire joined to each other are connected in series to form a plurality of thermocouples. A first thermocouple layer in which the respective measurement points are arranged in the measurement area, and a third metal wire and a second metal wire material formed of the first metal wire material on the first insulating layer. A plurality of thermocouples that are joined to a fourth metal wire consisting of are connected in series, each measurement point of the plurality of thermocouples is arranged in the measurement region, and the plurality of thermocouples are arranged via the first insulating film. Since a second thermocouple layer connected in series to a plurality of thermocouples of one thermocouple layer and a second insulating layer formed on the second thermocouple layer are provided, a constant measurement area is provided. On the other hand, many measurement points can be provided, and a laminated thermopile with high sensitivity and fast response time can be realized.
【０００８】[0008]
【実施例】本発明の第１の実施例によるサーモパイルに
ついて図１及び図２を用いて説明する。図１（ａ）は本
実施例のサーモパイルの平面図であり、図１（ｂ）は本
実施例のサーモパイルのＡ−Ａ′線断面図、図１（ｃ）
は本実施例のサーモパイルのＢ−Ｂ′線断面図、図１
（ｄ）は本実施例のサーモパイルのＣ−Ｃ′線断面図で
ある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A thermopile according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1A is a plan view of the thermopile of this embodiment, and FIG. 1B is a sectional view taken along the line AA ′ of the thermopile of this embodiment, FIG.
1 is a sectional view taken along line BB ′ of the thermopile of this embodiment, FIG.
FIG. 7D is a sectional view taken along the line CC ′ of the thermopile of this embodiment.
【０００９】本実施例のサーモパイルは熱電対層を二層
化して、測定領域内に多くの測定用の接合点を設けた点
に特徴がある。例えばＡｌ2 Ｏ3 からなる約３００μｍ
厚の絶縁性基板１０上に第１層目の熱電対層１２が形成
されている。第１層目の熱電対層１２は、図２（ａ）に
示すようなパターン形状をしており、銅からなる約２０
μｍ幅で約５００ｎｍ厚の銅線１４（実線により表示）
と、コンスタンタンからなる約２０μｍ幅で約５００ｎ
ｍ厚のコンスタンタン線１６（１点鎖線により表示）と
を接合した複数の熱電対が直列接続されている。複数の
熱電対の測定点はサーモパイルの中心部である測定領域
１８に位置するように配置され、全体として星型のパタ
ーン形状になっている。The thermopile of this embodiment is characterized in that the thermocouple layer is made into two layers and a large number of bonding points for measurement are provided in the measurement region. For example, about 300 μm made of Al 2 O 3
A first thermocouple layer 12 is formed on a thick insulating substrate 10. The first thermocouple layer 12 has a pattern shape as shown in FIG.
Copper wire 14 with μm width and thickness of about 500 nm (displayed by solid line)
And about 500n with a width of about 20μm made of Constantan
A plurality of thermocouples that are joined to an m-thick constantan wire 16 (indicated by a one-dot chain line) are connected in series. The measurement points of the plurality of thermocouples are arranged so as to be located in the measurement region 18 which is the center of the thermopile, and have a star-shaped pattern shape as a whole.
【００１０】第１層目の熱電対層１２上には、例えばＳ
ｉＯ2 又はＳｉ3 Ｎ4 からなる約μｍ厚の絶縁層２０が
形成され、表面が平坦化されている。絶縁層２０の材料
としては上記した材料の他に、測定すべき電磁波が透過
して電気的に熱電対層同士を絶縁できる材料であればい
かなる材料でもよい。絶縁層２０上に第２層目の熱電対
層２２が形成されている。第２層目の熱電対層２２は、
図２（ｂ）に示すようなパターン形状をしており、銅か
らなる約２０μｍ幅で約５００ｎｍ厚の銅線２４（実線
により表示）と、金属熱電材料であるコンスタンタンか
らなる約２０μｍ幅で約５００ｎｍ厚のコンスタンタン
線２６（１点鎖線により表示）とを接合した複数の熱電
対が直列接続されている。複数の熱電対の測定点はサー
モパイルの中心部である測定領域１８に位置するように
配置され、全体として星型のパターン形状になってい
る。On the first thermocouple layer 12, for example, S
An insulating layer 20 made of iO 2 or Si 3 N 4 and having a thickness of about μm is formed, and the surface is flattened. In addition to the above-mentioned materials, the material of the insulating layer 20 may be any material as long as it can transmit an electromagnetic wave to be measured and electrically insulate the thermocouple layers from each other. A second thermocouple layer 22 is formed on the insulating layer 20. The second thermocouple layer 22 is
It has a pattern shape as shown in FIG. 2B, and is about 20 μm wide and about 500 μm thick copper wire 24 (indicated by a solid line) and about 20 μm wide made of constantan which is a metal thermoelectric material. A plurality of thermocouples joined to a 500 nm thick constantan wire 26 (indicated by a one-dot chain line) are connected in series. The measurement points of the plurality of thermocouples are arranged so as to be located in the measurement region 18 which is the center of the thermopile, and have a star-shaped pattern shape as a whole.
【００１１】しかも、本実施例では第２層目の熱電対層
２２の測定用の接合点を、第１層目の熱電対層１２と重
ねあわせたときに、図１（ａ）に示すように、第１層目
の熱電対層１２の測定用の接合点の間に位置するように
配置している。サーモパイルの銅側の端部は、第１層目
の熱電対層１２の一方の端部１２ａであり、サーモパイ
ルのコンスタンタン側の端部は、第２層目の熱電対層２
２の一方の端部２２ａである。第１層目の熱電対層１２
の他方の端部１２ｂと第２層目の熱電対層２２の他方の
端部２２ｂとは、図１及び図２に示すように、重ねあわ
せたときに同じ位置になるように配置されており、絶縁
層２０を介して電気的に接合されている。Moreover, in this embodiment, when the measuring junction of the second thermocouple layer 22 is superposed on the first thermocouple layer 12, as shown in FIG. 1 (a). In addition, the first thermocouple layer 12 is arranged so as to be located between the junctions for measurement of the thermocouple layer 12. The copper-side end of the thermopile is one end 12a of the first thermocouple layer 12, and the constantan-side end of the thermopile is the second thermocouple layer 2.
2 is one end 22a. First layer thermocouple layer 12
The other end 12b of the second thermocouple layer 22 and the other end 22b of the second thermocouple layer 22 are arranged so as to be in the same position when they are overlapped with each other, as shown in FIGS. 1 and 2. , Are electrically connected via the insulating layer 20.
【００１２】第２層目の熱電対層２２上には、例えばＳ
ｉＯ2 又はＳｉ3 Ｎ4 からなる約３００ｎｍ厚の絶縁層
２８が形成され、表面が平坦化されている。絶縁層２８
の材料としては上記した材料の他に、測定すべき電磁波
が透過して電気的に熱電対層同士を絶縁できる材料であ
ればいかなる材料でもよい。このように本実施例によれ
ば中心部に位置する限られた面積の測定領域に従来のほ
ぼ２倍もの測定用の接合点を配置することができるの
で、ほぼ２倍の熱起電力を得ることができ、高感度で応
答時間の速いサーモパイルを実現することができる。On the second thermocouple layer 22, for example, S
An insulating layer 28 made of iO 2 or Si 3 N 4 and having a thickness of about 300 nm is formed to flatten the surface. Insulation layer 28
In addition to the above-mentioned materials, any material may be used as long as it is a material that can transmit an electromagnetic wave to be measured and electrically insulate the thermocouple layers from each other. As described above, according to the present embodiment, it is possible to arrange almost twice as many junction points for measurement as in the conventional case in the measurement area having a limited area located in the central portion, so that almost twice the thermoelectromotive force is obtained. It is possible to realize a thermopile with high sensitivity and a fast response time.
【００１３】次に本発明の第１の実施例によるサーモパ
イルの製造方法について図３及び図４を用いて説明す
る。図３及び図４では、説明の便宜のために、図１
（ｃ）に示すＢ−Ｂ′線断面図を代表図として用いるこ
ととする。まず、Ａｌ2 Ｏ3 からなる約３００μｍ厚の
絶縁性基板１０上に第１層目の熱電対層１２用の銅から
なる約５００ｎｍ厚の銅層３０を蒸着又はスパッタリン
グにより形成する。続いて、銅層３０上にレジスト層３
２を塗布し、銅線１４として残存すべき形状にパターニ
ングする（図３（ａ））。Next, a method for manufacturing a thermopile according to the first embodiment of the present invention will be described with reference to FIGS. 3 and 4. In FIGS. 3 and 4, for convenience of description, FIG.
The cross-sectional view taken along line BB ′ shown in (c) will be used as a representative drawing. First, a copper layer 30 made of copper for the first thermocouple layer 12 and having a thickness of about 500 nm is formed on the insulating substrate 10 made of Al 2 O 3 and having a thickness of about 300 μm by vapor deposition or sputtering. Then, the resist layer 3 is formed on the copper layer 30.
2 is applied and patterned into a shape that should remain as the copper wire 14 (FIG. 3A).
【００１４】次に、パターニングされたレジスト層３２
をマスクとして銅層３０をエッチングして第１層目の熱
電対層１２の銅線１４が形成される（図３（ｂ））。次
に、全面に第１層目の熱電対層１２用のコンスタンタン
からなる約５００ｎｍ厚のコンスタンタン層３４を蒸着
又はスパッタリングにより形成する。続いて、コンスタ
ンタン層３４上にレジスト層３６を塗布し、コンスタン
タン線１６として残存すべき形状にパターニングする
（図３（ｃ））。Next, the patterned resist layer 32 is formed.
Using as a mask, the copper layer 30 is etched to form the copper wire 14 of the first thermocouple layer 12 (FIG. 3B). Next, a constantan layer 34 made of constantan for the first thermocouple layer 12 and having a thickness of about 500 nm is formed on the entire surface by vapor deposition or sputtering. Subsequently, a resist layer 36 is applied on the constantan layer 34 and patterned into a shape that should remain as the constantan line 16 (FIG. 3C).
【００１５】次に、パターニングされたレジスト層３６
をマスクとしてコンスタンタン層３４をエッチングして
第１層目の熱電対層１２のコンスタンタン線１６が形成
され、第１層目の熱電対層１２が形成される（図３
（ｄ））。次に、全面に、例えばＳｉＯ２又はＳｉ３Ｎ
４からなる約１μｍ厚の絶縁層２０を堆積し、表面を平
坦化する。続いて、絶縁層２０上にレジスト層３８を形
成し、第１層目の熱電対層１２と第２層目の熱電対層２
２とを接続部分が開口するようにレジスト層３８をパタ
ーニングする（図３（ｅ））。Next, the patterned resist layer 36.
The constantan layer 34 is etched by using the as a mask to form the constantan wire 16 of the first thermocouple layer 12, and the first thermocouple layer 12 is formed (FIG. 3).
(D)). Next, on the entire surface, for example, SiO2 or Si3N
An insulating layer 20 made of 4 and having a thickness of about 1 μm is deposited to flatten the surface. Subsequently, a resist layer 38 is formed on the insulating layer 20, and the first thermocouple layer 12 and the second thermocouple layer 2 are formed.
The resist layer 38 is patterned so that the connection portion with 2 is opened (FIG. 3E).
【００１６】次に、レジスト層３８をマスクとして絶縁
層２０をエッチングして、接続部分にコンタクトホール
４０を形成する。続いて、全面に第２層目の熱電対層２
２用の銅からなる約５００ｎｍ厚の銅層４２を蒸着又は
スパッタリングにより形成する。このとき、銅層４２
は、コンタクトホール４０を介して第１層目のコンスタ
ンタン線１６と接合される（図３（ｆ））。Next, the insulating layer 20 is etched using the resist layer 38 as a mask to form a contact hole 40 in the connection portion. Then, the second thermocouple layer 2 is formed on the entire surface.
A copper layer 42 of copper having a thickness of about 500 nm is formed by vapor deposition or sputtering. At this time, the copper layer 42
Is bonded to the constantan wire 16 of the first layer through the contact hole 40 (FIG. 3 (f)).
【００１７】続いて、全面にレジスト層４４を塗布し、
銅線２４として残存すべき形状にパターニングする（図
３（ｆ））。次に、パターニングされたレジスト層４４
をマスクとして銅層４２をエッチングして第２層目の熱
電対層２２の銅線２４が形成される（図４（ａ））。続
いて、全面に第２層目の熱電対層２２用のコンスタンタ
ンからなる約５００ｎｍ厚のコンスタンタン層４６を蒸
着又はスパッタリングにより形成する。続いて、コンス
タンタン層４６上にレジスト層４８を塗布し、コンスタ
ンタン線２６として残存すべき形状にパターニングする
（図４（ａ））。Subsequently, a resist layer 44 is applied on the entire surface,
Patterning is performed into a shape that should remain as the copper wire 24 (FIG. 3F). Next, the patterned resist layer 44
The copper layer 42 is etched by using as a mask to form the copper wire 24 of the second thermocouple layer 22 (FIG. 4A). Subsequently, a constantan layer 46 made of constantan for the second thermocouple layer 22 and having a thickness of about 500 nm is formed on the entire surface by vapor deposition or sputtering. Subsequently, a resist layer 48 is applied on the constantan layer 46 and patterned into a shape that should remain as the constantan line 26 (FIG. 4A).
【００１８】次に、パターニングされたレジスト層４８
をマスクとしてコンスタンタン層４６をエッチングして
第２層目の熱電対層２２のコンスタンタン線２６が形成
され、第２層目の熱電対層２２が形成される（図４
（ｂ））。次に、全面に、例えばＳｉＯ2 又はＳｉ3 Ｎ
4 からなる約３００ｎｍ厚の絶縁層２８を堆積し、表面
を平坦化して、サーモパイルを完成する（図４
（ｃ））。Next, the patterned resist layer 48.
The constantan layer 46 is etched by using the as a mask to form the constantan wire 26 of the second thermocouple layer 22, and the second thermocouple layer 22 is formed (FIG. 4).
(B)). Next, on the entire surface, for example, SiO 2 or Si 3 N
An insulating layer 28 of 4 having a thickness of about 300 nm is deposited and the surface is flattened to complete the thermopile (FIG. 4).
(C)).
【００１９】このように本実施例によれば熱電対層を二
層化したサーモパイルを容易に製造することができる。
本発明の第２の実施例によるサーモパイルについて図５
及び図６を用いて説明する。図５（ａ）は本実施例のサ
ーモパイルの平面図であり、図５（ｂ）は本実施例のサ
ーモパイルのＤ−Ｄ′線断面図、図５（ｃ）は本実施例
のサーモパイルのＥ−Ｅ′線断面図、図５（ｄ）は本実
施例のサーモパイルのＦ−Ｆ′線断面図である。As described above, according to this embodiment, a thermopile having two thermocouple layers can be easily manufactured.
FIG. 5 shows a thermopile according to a second embodiment of the present invention.
And FIG. 6 will be described. 5A is a plan view of the thermopile of the present embodiment, FIG. 5B is a sectional view taken along the line D-D 'of the thermopile of the present embodiment, and FIG. 5C is an E of the thermopile of the present embodiment. -E 'line sectional drawing, FIG.5 (d) is the FF' line sectional drawing of the thermopile of a present Example.
【００２０】本実施例は方形のサーモパイルにおける熱
電対層を二層化して、測定領域内に多くの接合点を設け
た点に特徴がある。例えばＡｌ2 Ｏ3 からなる約３００
μｍ厚の絶縁性基板５０上に第１層目の熱電対層５２が
形成されている。第１層目の熱電対層５２は、図６
（ａ）に示すようなパターン形状をしており、銅からな
る約２０μｍ幅で約５００ｎｍ厚の銅線５４（実線によ
り表示）とを接合した複数の熱電対が直列接続されてい
る。複数の熱電対の測定点はサーモパイルの周辺部であ
る測定領域５８に位置するように配置され、全体として
方形のパターン形状になっている。The present embodiment is characterized in that the thermocouple layer in the rectangular thermopile is made into two layers and many junction points are provided in the measurement region. For example, about 300 made of Al 2 O 3
A first thermocouple layer 52 is formed on an insulating substrate 50 having a thickness of μm. The first thermocouple layer 52 is shown in FIG.
It has a pattern shape as shown in (a), and a plurality of thermocouples that are joined to a copper wire 54 (shown by a solid line) made of copper and having a width of about 20 μm and a thickness of about 500 nm are connected in series. The measurement points of the plurality of thermocouples are arranged so as to be located in the measurement area 58 which is the peripheral portion of the thermopile, and have a rectangular pattern shape as a whole.
【００２１】第１層目の熱電対層５２上には、例えばＳ
ｉＯ2 又はＳｉ3 Ｎ4 からなる約１μｍ厚の絶縁層６０
が形成され、表面が平坦化されている。絶縁層６０の材
料としては上記した材料の他に、測定すべき電磁波が透
過して電気的に熱電対層同士を絶縁できる材料であれば
いかなる材料でもよい。絶縁層６０上に第２層目の熱電
対層６２が形成されている。第２層目の熱電対層６２
は、図６（ｂ）に示すようなパターン形状をしており、
銅からなる約２０μｍ幅で約５００ｎｍ厚の銅線６４
（実線により表示）と、金属熱電材料であるコンスタン
タンからなる約２０μｍ幅で約５００ｎｍ厚のコンスタ
ンタン線６６（１点鎖線により表示）とを接合した複数
の熱電対が直列接続されている。複数の熱電対の測定点
はサーモパイルの周辺部である測定領域５８に位置する
ように配置され、第１層目の熱電対層５２と同様に全体
として方形のパターン形状になっている。On the first thermocouple layer 52, for example, S
Insulating layer 60 made of iO 2 or Si 3 N 4 and having a thickness of about 1 μm
Are formed and the surface is flattened. In addition to the above-mentioned materials, the material of the insulating layer 60 may be any material as long as it can transmit an electromagnetic wave to be measured and electrically insulate the thermocouple layers from each other. A second thermocouple layer 62 is formed on the insulating layer 60. Second thermocouple layer 62
Has a pattern shape as shown in FIG.
Copper wire 64 made of copper and having a width of about 20 μm and a thickness of about 500 nm
A plurality of thermocouples in which a constantan wire (indicated by a solid line) and a constantan wire 66 (indicated by a chain line) having a width of about 20 μm and a thickness of about 500 nm made of constantan which is a metal thermoelectric material are joined are connected in series. The measurement points of the plurality of thermocouples are arranged so as to be located in the measurement region 58 which is the peripheral portion of the thermopile, and like the first thermocouple layer 52, have a rectangular pattern shape as a whole.
【００２２】しかも、本実施例では第２層目の熱電対層
６２の測定用の接合点を、第１層目の熱電対層５２と重
ねあわせたときに、図５（ａ）に示すように、第１層目
の熱電対層５２の測定用の接合点の間に位置するように
配置している。サーモパイルの銅側の端部は、第１層目
の熱電対層５２の一方の端部５２ａであり、サーモパイ
ルのコンスタンタン側の端部は、第２層目の熱電対層６
２の一方の端部６２ａである。第１層目の熱電対層５２
の他方の端部５２ｂと第２層目の熱電対層６２の他方の
端部６２ｂとは、図５及び図６に示すように、重ねあわ
せたときに同じ位置になるように配置されており、絶縁
層６０を介して電気的に接合されている。Moreover, in this embodiment, when the measuring junction of the second thermocouple layer 62 is superposed on the first thermocouple layer 52, as shown in FIG. 5 (a). In addition, the first thermocouple layer 52 is arranged so as to be located between the measuring junction points. The copper-side end of the thermopile is one end 52a of the first thermocouple layer 52, and the constantan-side end of the thermopile is the second thermocouple layer 6.
2 is one end 62a. First layer thermocouple layer 52
The other end portion 52b of the second thermocouple layer 62 and the other end portion 62b of the second thermocouple layer 62 are arranged so as to be in the same position when superposed, as shown in FIGS. 5 and 6. , And electrically connected via the insulating layer 60.
【００２３】第２層目の熱電対層６２上には、例えばＳ
ｉＯ2 又はＳｉ3 Ｎ4 からなる約３００ｎｍ厚の絶縁層
６８が形成され、表面が平坦化されている。絶縁層６８
の材料としては上記した材料の他に、測定すべき電磁波
が透過して電気的に熱電対層同士を絶縁できる材料であ
ればいかなる材料でもよい。このように本実施例によれ
ば周辺部における限られた面積の測定領域に従来のほぼ
２倍もの測定用の接合点を配置することができるので、
ほぼ２倍の熱起電力を得ることができ、高感度で応答時
間の速いサーモパイルを実現することができる。On the second thermocouple layer 62, for example, S
An insulating layer 68 made of iO 2 or Si 3 N 4 and having a thickness of about 300 nm is formed to flatten the surface. Insulating layer 68
In addition to the above-mentioned materials, any material may be used as long as it is a material that can transmit an electromagnetic wave to be measured and electrically insulate the thermocouple layers from each other. As described above, according to this embodiment, it is possible to arrange almost twice as many bonding points for measurement as in the conventional case in the measurement area having a limited area in the peripheral portion.
It is possible to obtain almost double the thermoelectromotive force, and to realize a thermopile with high sensitivity and fast response time.
【００２４】本発明は上記実施例にかぎらず種々の変形
が可能である。例えば、上記実施例では星型又は方形の
サーモパイルに本発明を適用したが、他の形状のサーモ
パイルにも本発明を適用することができる。また、上記
実施例では２つの熱電対層を重ねあわせたが、２つ以上
の多くの熱電対層を重ねあわせてもよい。The present invention is not limited to the above embodiment, and various modifications can be made. For example, although the present invention is applied to the star-shaped or square-shaped thermopiles in the above-mentioned embodiments, the present invention can be applied to thermopiles of other shapes. Further, in the above-mentioned embodiment, two thermocouple layers are superposed, but two or more thermocouple layers may be superposed.
【００２５】さらに、上記実施例では銅線とコンスタン
タン線により熱電対を形成したが、他の金属熱電材料に
より熱電対を形成するようにしてもよい。また、上記実
施例では絶縁層に形成したコンタクトホール上に金属層
を堆積することにより第１層目の熱電対層と第２層目の
熱電対層を接続したが、メッキにより接続してもよい
し、ビアホールにより接続してもよい。Further, although the thermocouple is formed of the copper wire and the constantan wire in the above embodiment, the thermocouple may be formed of other metal thermoelectric material. Further, in the above embodiment, the first thermocouple layer and the second thermocouple layer are connected by depositing a metal layer on the contact holes formed in the insulating layer, but even if they are connected by plating. Alternatively, via holes may be used for connection.
【００２６】[0026]
【発明の効果】以上の通り、本発明によれば、絶縁性基
板と、絶縁性基板上に形成され、第１の金属線と第２の
金属線とを接合した複数の熱電対が直列接続され、複数
の熱電対の各測定点が測定領域内に配置された第１の熱
電対層と、第１の絶縁層上に形成され、第１の金属線材
料からなる第３の金属線と第２の金属線材料からなる第
４の金属線とを接合した複数の熱電対が直列接続され、
複数の熱電対の各測定点が測定領域内に配置され、複数
の熱電対が第１の絶縁層を介して第１の熱電対層の複数
の熱電対に直列接続された第２の熱電対層と、第２の熱
電対層上に形成された第２の絶縁層とを設けたので、一
定の測定領域に対して多くの測定点を設けることがで
き、高感度で応答時間の速いサーモパイルを実現するこ
とができる。As described above, according to the present invention, an insulating substrate and a plurality of thermocouples formed on the insulating substrate and having the first metal wire and the second metal wire joined together are connected in series. And a first thermocouple layer in which each measurement point of the plurality of thermocouples is arranged in the measurement region, and a third metal wire made of the first metal wire material and formed on the first insulating layer. A plurality of thermocouples joined to a fourth metal wire made of a second metal wire material are connected in series,
A second thermocouple in which each measurement point of the plurality of thermocouples is arranged in the measurement region, and the plurality of thermocouples are connected in series to the plurality of thermocouples of the first thermocouple layer via the first insulating layer. Since the layer and the second insulating layer formed on the second thermocouple layer are provided, many measurement points can be provided in a certain measurement region, and the thermopile with high sensitivity and fast response time is provided. Can be realized.
【図１】本発明の第１の実施例によるサーモパイルを示
す図である。FIG. 1 is a diagram showing a thermopile according to a first embodiment of the present invention.
【図２】本発明の第１の実施例によるサーモパイルの各
熱電対層を示す図である。FIG. 2 is a view showing each thermocouple layer of the thermopile according to the first embodiment of the present invention.
【図３】本発明の第１の実施例によるサーモパイルの製
造方法を示す工程断面図（その１）である。FIG. 3 is a process sectional view (1) showing the method for manufacturing a thermopile according to the first embodiment of the present invention.
【図４】本発明の第１の実施例によるサーモパイルの製
造方法を示す工程断面図（その２）である。FIG. 4 is a process sectional view (2) showing the method for manufacturing a thermopile according to the first embodiment of the present invention.
【図５】本発明の第２の実施例によるサーモパイルを示
す図である。FIG. 5 is a diagram showing a thermopile according to a second embodiment of the present invention.
【図６】本発明の第２の実施例によるサーモパイルの各
熱電対層を示す図である。FIG. 6 is a diagram showing thermocouple layers of a thermopile according to a second embodiment of the present invention.
１０…絶縁性基板 １２…第１層目の熱電対層 １４…銅線 １６…コンスタンタン線 １８…測定領域 ２０…絶縁層 ２２…第２層目の熱電対層 ２４…銅線 ２６…コンスタンタン線 ２８…絶縁層 ３０…銅層 ３２…レジスト層 ３４…コンスタンタン層 ３６…レジスト層 ３８…レジスト層 ４０…コンタクトホール ４２…銅層 ４４…レジスト層 ４６…コンスタンタン層 ４８…レジスト層 ５０…絶縁性基板 ５２…第１層目の熱電対層 ５４…銅線 ５６…コンスタンタン線 ５８…測定領域 ６０…絶縁層 ６２…第２層目の熱電対層 ６４…銅線 ６６…コンスタンタン線 ６８…絶縁層 DESCRIPTION OF SYMBOLS 10 ... Insulating board 12 ... 1st thermocouple layer 14 ... Copper wire 16 ... Constantan wire 18 ... Measurement area 20 ... Insulating layer 22 ... 2nd thermocouple layer 24 ... Copper wire 26 ... Constantan wire 28 Insulating layer 30 ... Copper layer 32 ... Resist layer 34 ... Constantan layer 36 ... Resist layer 38 ... Resist layer 40 ... Contact hole 42 ... Copper layer 44 ... Resist layer 46 ... Constantan layer 48 ... Resist layer 50 ... Insulating substrate 52 ... First layer thermocouple layer 54 ... Copper wire 56 ... Constantan wire 58 ... Measurement area 60 ... Insulating layer 62 ... Second layer thermocouple layer 64 ... Copper wire 66 ... Constantan wire 68 ... Insulating layer
Claims (2)
属線とを接合した複数の熱電対が直列接続され、前記複
数の熱電対の各測定点が測定領域内に配置された第１の
熱電対層と、 前記第１の熱電対層上に形成された第１の絶縁層と、 前記第１の絶縁層上に形成され、前記第１の金属線材料
からなる第３の金属線と前記第２の金属線材料からなる
第４の金属線とを接合した複数の熱電対が直列接続さ
れ、前記複数の熱電対の各測定点が前記測定領域内に配
置され、前記複数の熱電対が前記第１の絶縁層を介して
前記第１の熱電対層の前記複数の熱電対に直列接続され
た第２の熱電対層と、 前記第２の熱電対層上に形成された第２の絶縁層とを有
することを特徴とする積層サーモパイル。1. An insulative substrate, and a plurality of thermocouples formed on the insulative substrate, in which a first metal wire and a second metal wire are joined, are connected in series, and each of the plurality of thermocouples is connected in series. A first thermocouple layer in which a measurement point is arranged in a measurement region, a first insulating layer formed on the first thermocouple layer, and a first insulating layer formed on the first insulating layer, A plurality of thermocouples in which a third metal wire made of one metal wire material and a fourth metal wire made of the second metal wire material are joined are connected in series, and each measurement point of the plurality of thermocouples is connected. A second thermocouple layer disposed in the measurement region, wherein the plurality of thermocouples are connected in series to the plurality of thermocouples of the first thermocouple layer via the first insulating layer; A laminated thermopile having a second insulating layer formed on a second thermocouple layer.
成され、第１の金属線と第２の金属線とを接合した複数
の熱電対が直列接続され、前記複数の熱電対の各測定点
が測定領域内に配置された第１の熱電対層を形成する工
程と、 前記第１の熱電対層上に第１の絶縁層を形成する工程
と、 前記第１の絶縁層の、前記複数の熱電対中のひとつの前
記第２の金属線上にコンタクトホールを形成する工程
と、 前記第１の絶縁層上に、前記第１の金属線材料からなる
第３の金属線と前記第２の金属線材料からなる第４の金
属線とを接合した複数の熱電対が直列接続され、前記複
数の熱電対の各測定点が前記測定領域内に配置された第
２の熱電対層を形成すると共に、前記複数の熱電対を前
記第１の絶縁膜に形成された前記コンタクトホールを介
して前記第１の熱電対層の前記複数の熱電対に直列接続
する工程と、 前記第２の熱電対層上に第２の絶縁層を形成する工程と
を有することを特徴とする積層サーモパイルの製造方
法。2. A plurality of thermocouples, which are formed on the insulating substrate and have a first metal wire and a second metal wire joined to each other, are connected in series on an insulating substrate. A step of forming a first thermocouple layer in which each measurement point is arranged in a measurement area; a step of forming a first insulating layer on the first thermocouple layer; and a step of forming the first insulating layer Forming a contact hole on one of the plurality of thermocouples on the second metal wire; and on the first insulating layer, a third metal wire made of the first metal wire material and the third metal wire. A second thermocouple layer in which a plurality of thermocouples that are joined to a fourth metal wire made of a second metal wire material are connected in series, and each measurement point of the plurality of thermocouples is arranged in the measurement region. And forming a plurality of thermocouples through the contact holes formed in the first insulating film. Note Manufacturing of a laminated thermopile, comprising: connecting in series to the plurality of thermocouples of the first thermocouple layer; and forming a second insulating layer on the second thermocouple layer. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4290040A JPH06260686A (en) | 1992-10-28 | 1992-10-28 | Layered thermopile and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4290040A JPH06260686A (en) | 1992-10-28 | 1992-10-28 | Layered thermopile and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06260686A true JPH06260686A (en) | 1994-09-16 |
Family
ID=17751007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4290040A Pending JPH06260686A (en) | 1992-10-28 | 1992-10-28 | Layered thermopile and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06260686A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011136203A1 (en) * | 2010-04-26 | 2011-11-03 | 株式会社エッチ．エム．イー． | Temperature sensor device and radiation thermometer using same, method for producing temperature sensor device, multilayered thin film thermopile using photoresist film and radiation thermometer using same, and method for producing multilayered thin film thermopile |
| WO2018180131A1 (en) * | 2017-03-28 | 2018-10-04 | 国立研究開発法人物質・材料研究機構 | Thermoelectric power generation cell and thermoelectric power generation module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51120767A (en) * | 1975-04-16 | 1976-10-22 | Yoshio Furusawa | Stas type film thermocouple radiation detictor and its manufacturing m ethod |
| JPS57200828A (en) * | 1981-06-04 | 1982-12-09 | Showa Denko Kk | Manufacture of thermopile |
| JPH02165025A (en) * | 1988-12-20 | 1990-06-26 | New Japan Radio Co Ltd | Thermopile |
-
1992
- 1992-10-28 JP JP4290040A patent/JPH06260686A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51120767A (en) * | 1975-04-16 | 1976-10-22 | Yoshio Furusawa | Stas type film thermocouple radiation detictor and its manufacturing m ethod |
| JPS57200828A (en) * | 1981-06-04 | 1982-12-09 | Showa Denko Kk | Manufacture of thermopile |
| JPH02165025A (en) * | 1988-12-20 | 1990-06-26 | New Japan Radio Co Ltd | Thermopile |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011136203A1 (en) * | 2010-04-26 | 2011-11-03 | 株式会社エッチ．エム．イー． | Temperature sensor device and radiation thermometer using same, method for producing temperature sensor device, multilayered thin film thermopile using photoresist film and radiation thermometer using same, and method for producing multilayered thin film thermopile |
| CN102947683A (en) * | 2010-04-26 | 2013-02-27 | Hme有限公司 | Temperature sensor device and radiation thermometer using same, method for producing temperature sensor device, multilayered thin film thermopile using photoresist film and radiation thermometer using same, and method for producing multilayered thin |
| JP5824690B2 (en) * | 2010-04-26 | 2015-11-25 | 株式会社エッチ．エム．イー | Temperature sensor element and radiation thermometer using the same |
| JP2015227880A (en) * | 2010-04-26 | 2015-12-17 | 株式会社エッチ．エム．イー | Temperature sensor element and radiation thermometer using the same, method for manufacturing temperature sensor element, multilayer thin film thermopile using photoresist film, radiation thermometer using the thermopile, and method for manufacturing multilayer thin film thermopile |
| US9759613B2 (en) | 2010-04-26 | 2017-09-12 | Hme Co., Ltd. | Temperature sensor device and radiation thermometer using this device, production method of temperature sensor device, multi-layered thin film thermopile using photo-resist film and radiation thermometer using this thermopile, and production method of multi-layered thin film thermopile |
| WO2018180131A1 (en) * | 2017-03-28 | 2018-10-04 | 国立研究開発法人物質・材料研究機構 | Thermoelectric power generation cell and thermoelectric power generation module |
| JPWO2018180131A1 (en) * | 2017-03-28 | 2019-11-07 | 国立研究開発法人物質・材料研究機構 | Thermoelectric generation cell and thermoelectric generation module |
| US11393969B2 (en) | 2017-03-28 | 2022-07-19 | National Institute For Materials Science | Thermoelectric generation cell and thermoelectric generation module |
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