JPH06254842A - Apparatus for fixing ingot slicer metal - Google Patents

Abstract

PURPOSE:To fix a metal ingot without bonding it on a base or adsorbing a vacuum chuck on a wafer during cutting. CONSTITUTION:A rod A 6 and a rod B 7 positioned on one side of a rotating blade 3 and performing reciprocating motion in the radial direction and the axial direction of an ingot by a reverse phase around the metal ingot 1 are alternatively provided and a rod A1 8 and a rod B1 9 positioned on another side of a rotating blade 3 and facing to each rod and performing reciprocating motion in the radial direction and the axial direction of a reverse phase to the facing rod are provided. Cutting and feeding of the metal ingot 1 and recovery of the wafer can be automatically performed by synchronizing and linking each reciprocating motion of these rods with the movement of the blade 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for slicing a semiconductor ingot to obtain a semiconductor wafer, and it is possible to obtain a high-quality wafer that can be sliced without causing deformation, and a recovery device is also provided. The present invention relates to an ingot slicer metal fixing device that can also serve as a fixing device.

[0002]

2. Description of the Related Art FIG. 4 is a schematic view of an example of a conventional metal fixing means, and FIG. 5 is a schematic view of another example. In the fixing means shown in FIG. 4, the metal ingot 1 is appropriately fixed to the base 2 made of carbon by an adhesive. In this way, the base 2 to which the metal ingot is fixed is held by the workpiece holder of the slicer (not shown), and the metal ingot is cut by the rotary blade 3. In this case, the cutting by the rotary blade 3 is performed on the entire cross section of the ingot 1 to form the wafer 4, but the base 2 is cut off only a part of its thickness, and the base 2 is cut off. It will not be done.

In the fixing means shown in FIG. 5, the metal ingot 1 is supported by a chuck (not shown), the vacuum chuck 5 is brought into contact with the tip surface of the ingot 1, and the metal ingot 1 is held by the rotating blade 3 near the tip surface. Make a cut. According to this fixing means, the wafer 4 formed by the cutting is adsorbed by the vacuum chuck 5 and does not fall or scatter randomly. After cutting, the vacuum chuck 5 can be moved to a pool of wafers, where the vacuum can be released to drop and accumulate.

[0004]

When the fixing means for adhering the metal ingot to the carbon base 2 shown in FIG. 4 is adopted, the cutting by the rotary blade 3 does not cut the base 2, and The wafer 4 formed by cutting is fixed to the base 2. Therefore,
In order to separate the individual wafers 4 from the base 2, cleaning must be performed after slicing. Further, when the fixing means using the vacuum chuck 5 shown in FIG. 5 is adopted, the wafer 4 is not scattered, but is deformed by the suction force of the vacuum chuck, which may cause warping or other shape defects. The present invention has been made based on the above circumstances, it is possible to obtain a high-quality wafer by a metal slicer without adhering a metal ingot to a carbon base or adsorbing the metal ingot with a vacuum chuck. A slicer metal fixing device is provided.

[0005]

The ingot slicer metal fixing device of the present invention is located on one side of a rotary blade of a slicer and is arranged circumferentially around the metal ingot 1 in a radial direction of the ingot. A rods and B rods, which perform axial reciprocating motions in opposite phases to each other, are alternately provided, and the rods located on the other side of the rotary blade are opposed to the rods and face each other in the opposite radial direction and the axial direction. A ₁ rod and B ₁ rod that reciprocate in the direction are provided, and by synchronizing and interlocking the reciprocating motions of these rods with the motion of the rotating blade, the cutting and feeding of the metal ingot and the wafer recovery can be performed. The feature is that it can be done automatically.

[0006]

In the ingot slicer metal fixing device of the present invention having the above-mentioned structure, each rod performs a radial reciprocating motion and an axial reciprocating motion in synchronism with the movement of the rotary blade of the slicer, and cuts the metal when cutting. The ingot is fixed, the wafer is collected when cutting is completed, and the metal ingot is automatically fed.

[0007]

1 is a schematic plan view of an embodiment of the present invention, and FIG. 2 is a schematic view for explaining the movement of the main parts thereof. FIG. 3 is a perspective view, and FIG. 3 is a schematic view showing a state where the wafer is moved by the movement of the main part. In FIG. 1, a plurality of A rods 6 located on one side of the rotating blade 3 around the metal ingot 1 and performing the same operation described later, and other same operation described later that is different from the same operation. A plurality of B rods 7 (only one in FIG. 1) are provided alternately on the circumference. Further, it is located on the other side of the rotary blade 3 and faces the A rod 6 to perform an operation described later. A ₁ rod 8 faces the B rod 7 to perform an operation described later.
_One rod 9 is provided.

The operations of the A rod 6, the B rod 7, the A ₁ rod 8 and the B ₁ rod 9 are performed as follows. That is, the A rod 6 and the B rod 7 reciprocate in the radial direction of the ingot 1 by a mechanism (not shown) (arrow X _{A in} FIG. 2,
X _B ) and a reciprocating motion in the axial direction (arrows Y _A , Y _{B in} FIG. 1). Then, the axial reciprocating motion of the A rod 7 and that of the B rod are the B rod retracting when the A rod advances,
The phase is different by 170 ° when the A rod retreats, like the B rod advances. Further, in the radial reciprocating motion as well as the axial reciprocating motion, when the A rod approaches the ingot 1, it separates from the B rod ingot, and when the A rod separates from the ingot, the phase approaches 180 ° so that it approaches the B rod 1.
It's different. Also in the radial reciprocating motion, similar to the above axial reciprocating motion, when the A rod is close to the ingot 1, the B rod is separated from the ingot 1, and when the A lot is separated from the ingot 1, the B lot is close to the ingot 1. The phases are different by 180 °.

The A ₁ rod 8 and the B ₁ rod 9 provided on the other side of the rotary blade 3 are also reciprocally moved in the radial direction of the ingot 1 (arrows X _A1 , X _{B1 in} FIG. 2). Axial motion (arrows Y _A1 , Y _{B1 in} FIG. 1) is given. The axial reciprocating motion of the A ₁ rod 8 and the B ₁ rod 9 is
A rod and a B rod are arranged so as to approach or separate from the opposing A rod and B rod, respectively, and the reciprocal movement in the radial direction is opposite to the approaching and spacing of the opposing rod with respect to the metal ingot 1. The phase of each reciprocating motion is different by 180 °.

The reciprocating motions described above are performed as follows in synchronization with the operation of the rotary blade 3 of the slicer.

During cutting, the A rod 6 on the right side of the rotary blade 3 in FIG. 2 is in the forward position and contacts the metal ingot 1 to clamp and fix it. On the other hand, the A ₁ rod 8 on the left side is in the forward position and holds and holds the tip of the metal ingot 1. Also, B on the right
The rod 7 is in the retracted position and is separated from the metal ingot 1. The B ₁ rod 9 on the left side is also in the retracted position and is separated from the tip of the metal ingot 1.

When the rotary blade 3 completes the preceding cutting and is separated from the metal ingot 1, a rod driving mechanism (not shown) interlocks with the movement of the rotary blade,
The B rod 7 is driven in the radial direction so as to be brought into contact with the metal ingot 1 so as to be pinched, and the A rod 6 is separated from the metal ingot 1. At the same time, the A ₁ rod 8 is driven in the radial direction of the wafer 4 formed by the above cutting and holds it. The B ₁ rods 9 are located at positions separated from each other in the radial direction.

Here, the A rod 6 is retracted and the B rod 7 is advanced. Also, the A ₁ rod 8 is retracted and the B ₁
The rod 9 is advanced. While the A rod 6 is being retracted, the B rod 7 is advanced to feed the metal ingot 1. On the other hand, the A ₁ rod 8 is retracted in synchronism with the axial movements of the rods 6 and 7, and conveys the sandwiched wafer 4 to a recovery place. Further, since the B ₁ rod 9 is located at a position separated in the radial direction, it does not hinder the transfer of the wafer 4.

When the feeding of the metal ingot 1 and the collection of the wafer 4 are completed as described above, the metal ingot 1 is clamped by the B rod 7, and the tip portion thereof is B.
It is clamped by _one rod 9. Here, the rotary blade 3 is brought into contact with the metal ingot 1 and the next cutting is performed. From the time of completion of this cutting, the rods 6, 7, 8 and 9 move in the opposite direction to the above to fix the metal ingot 1 in the same manner as the preceding previous cutting.

As described above, in the drinking ingot fixing device of the present invention, the rods 6, 7, 8 and 9 are actuated in synchronization with the movement of the rotary blade 3 of the slicer, and the metal ingot 1 at the time of cutting. Fixing the wafer, collecting the wafer when cutting is completed, and feeding the metal ingot automatically, so that the slicing work can be performed efficiently.
Further, since the metal ingot is not fixed to the base by the adhesive and the wafer is not sucked by the vacuum chuck, the problems associated therewith do not occur.

[0016]

As is apparent from the above, according to the ingot slicer metal fixing device of the present invention, since the metal ingot is not adhesively fixed to the base, it is not necessary to wash the wafer for peeling from the base. Further, since the wafer is not fixed by the vacuum chuck, the shape defect due to the deformation of the wafer due to the suction force of the vacuum chuck does not occur. That is, a high-quality wafer can be manufactured with high efficiency.

[Brief description of drawings]

FIG. 1 is a schematic plan view of an embodiment of the present invention.

FIG. 2 is a schematic perspective view for explaining the movement of the main part thereof.

3A and 3B are schematic diagrams showing a state in which a wafer is moved by the movement of the main part of FIG.

FIG. 4 is a schematic view of an example of a conventional metal fixing means.

FIG. 5 is a schematic view of another example of conventional metal fixing means.

[Explanation of symbols]

1 ... Metal ingot 2 ... Base 3 ... Rotating blade 4 ... Wafer 5 ... Vacuum chuck 6 ... A rod 7 ... B rod 8 ... A ₁ rod 9 ... B ₁ rod

Claims (1)

[Claims] 1. An A rod, which is located on one side of a rotary blade of a slicer and is arranged circumferentially around a metal ingot 1 to perform radial and axial reciprocating motions of the ingot in opposite phases. B rods are provided alternately, and are located on the other side of the rotary blade and face and face each rod, and perform a reciprocating motion in the radial and axial directions in opposite phase to the rods. A ₁ rod, B ₁ rod Is provided, by synchronizing and interlocking the reciprocating motions of these rods with the motion of the rotary blade, cutting of the metal ingot,
An ingot slicer metal fixing device characterized by being able to automatically feed and collect wafers.