JPH06254690A - Laser beam welding method - Google Patents

Laser beam welding method

Info

Publication number
JPH06254690A
JPH06254690A JP5044780A JP4478093A JPH06254690A JP H06254690 A JPH06254690 A JP H06254690A JP 5044780 A JP5044780 A JP 5044780A JP 4478093 A JP4478093 A JP 4478093A JP H06254690 A JPH06254690 A JP H06254690A
Authority
JP
Japan
Prior art keywords
welding
laser beam
welded
laser
quality
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5044780A
Other languages
Japanese (ja)
Inventor
Mitsuru Matsuda
満 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seikosha KK
Original Assignee
Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosha KK filed Critical Seikosha KK
Priority to JP5044780A priority Critical patent/JPH06254690A/en
Publication of JPH06254690A publication Critical patent/JPH06254690A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To reduce a laser beam energy input and to stabilize the quality by preheating a welding place by an infrared beam and subsequently, irradiating specified places of materials to be welded located at the preheating place with a laser beam to perform welding. CONSTITUTION:The wider range A than two connecting terminals 3a and 3b of a quartz oscillator 2 is preheated with the infrared beam. Heat energy of the laser beam is then inputted instantaneously to a remarkably converged section toward the terminals 3a and 3b, in other words, the spot range B. Consequently, the respective connecting terminals 3a and 3b of the quartz oscillator 2 are welded to the specified places of lead frames 1a and 1b and the input of the laser beam energy is reduced, hence the fluctuation of the quality at the time of welding can be reduced.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、リードフレーム、プリ
ント基板の導電パターンにコイルのリード線などを含む
微小な電子部品やマイクロメカニカル(微小機械)の機
械部品などをレーザで溶接する方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of welding a minute electronic component including a lead wire of a coil to a conductive pattern of a lead frame or a printed circuit board, a mechanical component of micromechanical (micromechanical) or the like by laser.

【0002】[0002]

【従来の技術】従来からプリント基板に電子部品を溶接
する方法は、一般には古くからハンダ付けの方法や抵抗
(スポット)溶接が利用されている。そして、最近で
は、レーザ溶接が開発され、色々の分野に適用されてい
る。
2. Description of the Related Art Conventionally, as a conventional method for welding electronic parts to a printed circuit board, a soldering method or resistance (spot) welding has been used for a long time. Recently, laser welding has been developed and applied to various fields.

【0003】[0003]

【発明が解決しようとする課題】しかし、前記のハンダ
付け方法では、ハンダ付けの品質の不安定さ、腐食の原
因になるハンダのフラックスを使用するため、後洗浄が
必要で作業が煩雑となり、そのため自動溶接化が困難
で、大量の溶接作業には不向きである。
However, in the above-mentioned soldering method, since the solder flux, which causes instability of soldering quality and corrosion, is used, post-cleaning is required and the work becomes complicated, Therefore, automatic welding is difficult and unsuitable for large-scale welding work.

【0004】また、前記した抵抗溶接によってリードフ
レームに電子部品を溶接するのに抵抗溶接もあるが、電
極状態の経時変化は、抵抗溶接自体の特性によるもので
あるため避けることができず、溶接すべき電気部品の電
気抵抗はその表面の状態で変化し、さらに押圧力の強弱
によっても変化し、そのため溶接の品質の安定には細心
の注意が必要であり、実用性の点で技術的問題がある。
また、プリント基板の導電パターンに対する抵抗溶接の
実施は、現在では困難である。
Although resistance welding is also used to weld electronic parts to the lead frame by the resistance welding described above, the change in the electrode state with time cannot be avoided because it is due to the characteristics of the resistance welding itself. The electrical resistance of the electrical component that should be changed changes depending on the surface condition, and also changes depending on the strength of the pressing force.Therefore, it is necessary to pay close attention to the stability of the welding quality, and it is a technical problem in terms of practicality. There is.
Further, it is currently difficult to perform resistance welding on the conductive pattern of the printed circuit board.

【0005】さらに、前記のレーザ溶接は、電気的接続
を要しない機械的な溶接の分野では技術の改良が進んで
いるが、電気的な接続を必要とする電子部品では、電気
的な信頼性が確保できないため、厳格な品質管理が必要
であり、特にコイルや水晶発振器など微小電子部品を溶
接する場合は、部分的にスポットをしぼってレーザで加
熱するが、被溶接物の熱容量が小さい場合、レーザ溶接
は熱エネルギ密度が高過ぎて、被溶接物を瞬間的に周囲
に飛散させてしまい、溶接の品質が安定しないため一般
には実施化されていない。そこで本発明者は、小容量の
レーザ溶接の品質が何故安定しないのか、その原因を調
査した結果、被溶接部たる電子部品の熱容量と、レーザ
ビームの局所への瞬間的な熱エネルギの投入による温度
上昇の勾配の高さとのバランスが崩れることにあるとい
う結論に至った。
Further, although the above-mentioned laser welding has been improved in the technical field of mechanical welding which does not require electrical connection, it has electrical reliability in the case of electronic parts which require electrical connection. Therefore, strict quality control is necessary, especially when welding micro electronic parts such as coils and crystal oscillators, the spots are partially narrowed and heated with a laser, but when the heat capacity of the work piece is small. The laser welding is not generally practiced because the heat energy density is too high and the workpiece to be welded is instantly scattered around, and the welding quality is not stable. Therefore, the present inventor investigated why the quality of the small-capacity laser welding is not stable, and as a result, investigated the heat capacity of the electronic parts to be welded and the instantaneous input of thermal energy to the laser beam locally. We came to the conclusion that the balance between the rise in temperature and the height of the gradient was out of balance.

【0006】そこで本発明の目的は、微小な電子部品で
ある被溶着物、例えば径がミクロンオーダのリード線
を、リードフレームやプリント基板などの導電パターン
にレーザ溶接する方法を提供することにある。
It is therefore an object of the present invention to provide a method of laser welding a welded substance which is a minute electronic component, for example, a lead wire having a diameter of the order of microns to a conductive pattern such as a lead frame or a printed circuit board. .

【0007】[0007]

【課題を解決するための手段】本発明の特徴は、リード
フレームなどの溶接個所を赤外線ビームによって予熱
し、その後でこの予熱個所に位置している被溶着物の所
定個所にレーザビームを局所的に照射して溶着させるこ
とにある。
A feature of the present invention is that a welding portion such as a lead frame is preheated by an infrared beam, and then a laser beam is locally applied to a predetermined portion of a welded object located at this preheating portion. Irradiating and welding.

【0008】[0008]

【実施例】以下図面を参照して本発明の実施例を説明す
る。
Embodiments of the present invention will be described below with reference to the drawings.

【0009】図1に、2つのリードフレーム1a,1b
に、水晶発振器2の2つの接続端子3a,3bが、それ
ぞれ接続してある構造を示す。両者の接続は、次に述べ
る方法に従って行なう。初めに、相互に近接している2
つのリードフレーム先端の所定個所において、この端子
の近傍で、この端子よりかなり広い範囲Aを赤外線ビー
ムAaによって予熱する。この時のリードフレーム1
a,1bの加熱温度は、本実施例においては、その溶融
温度(融点)の30%程度で行なった。次に、水晶発振
器2の端子3a,3bに向けて、著しく収束されている
局所、つまりスポット範囲BにレーザビームBaの熱エ
ネルギを瞬間的に投入する。それによって、水晶発振器
2の各接続端子3a,3bは、リードフレーム1a,1
bの所定個所に溶着する。この点を図2を参照して、さ
らに説明すると、赤外線ビームAaとレーザビームBa
との照射法は、この赤外線ビームはリードフレーム1a
(1b)の上面に位置している端子3a(3b)の近傍
の拡大した範囲Aに照射するものであるが、この照射に
よって予熱された後、レーザビームBaは、斜め方向か
らこの端子が位置しているスポット範囲Bに照射する。
FIG. 1 shows two lead frames 1a and 1b.
2 shows a structure in which two connection terminals 3a and 3b of the crystal oscillator 2 are connected to each other. The connection between the two is performed according to the method described below. First, they are close to each other 2
An infrared beam Aa preheats a region A, which is considerably wider than the terminal, at a predetermined position at the tip of one lead frame, near the terminal. Lead frame 1 at this time
In the present embodiment, the heating temperatures of a and 1b were about 30% of the melting temperature (melting point). Next, the thermal energy of the laser beam Ba is momentarily injected toward the terminals 3a and 3b of the crystal oscillator 2 in the locally converged region, that is, the spot range B. Thereby, the connection terminals 3a and 3b of the crystal oscillator 2 are connected to the lead frames 1a and 1b.
It is welded to a predetermined part of b. This point will be further described with reference to FIG. 2. Infrared beam Aa and laser beam Ba
This infrared beam is used for the lead frame 1a
It is intended to irradiate the enlarged area A near the terminal 3a (3b) located on the upper surface of (1b), but after being preheated by this irradiation, the laser beam Ba is obliquely positioned at this terminal. The spot area B that is being irradiated is irradiated.

【0010】また、図3によってビームタイミングを説
明すると、この図は縦軸を温度、横軸を時間とする赤外
線ビームとレーザビームとの複合加工のビームタイミン
グ、および加熱対象、つまり被溶着物である接続端子3
a,3bの温度プロファイルを示すグラフである。
The beam timing will be described with reference to FIG. 3. In this figure, the beam timing of the composite processing of the infrared beam and the laser beam, in which the vertical axis is temperature and the horizontal axis is time, and the heating target, that is, the material to be welded A certain connection terminal 3
It is a graph which shows the temperature profile of a, 3b.

【0011】先ず、1点鎖線にて示す赤外線ビームAa
を照射して範囲A内を所定温度T1まで予熱しておき(t1
=2000〜3000msec)、その後でレーザビームBaを水晶発
振器2の接続端子3a,3bに向けてスポット的に照射
すると(t2=10〜20msec)、この接続端子の温度上昇は、
曲線Cに示すように、融点温度T2を瞬間的に突破するの
である。そのため、溶着に必要なレーザエネルギを著し
く少なくすることができる。従って、接続端子3a,3
bの熱容量とレーザビームBaの局所への瞬間的な熱エ
ネルギの投入による温度上昇の勾配の高さとのバランス
の崩れを抑え、レーザエネルギの投入量が少ないため溶
接時の品質のバラツキを低下させることができる。な
お、溶接される両者の熱容量バランスによって赤外線ビ
ームおよびレーザビームのエネルギ量は調整される。
First, an infrared beam Aa shown by a chain line
To preheat the area A to a predetermined temperature T 1 (t 1
= 2000 to 3000 msec), and then, when the laser beam Ba is irradiated in spots toward the connection terminals 3a and 3b of the crystal oscillator 2 (t 2 = 10 to 20 msec), the temperature rise of this connection terminal is
As shown by the curve C, the melting point temperature T 2 is instantaneously exceeded. Therefore, the laser energy required for welding can be significantly reduced. Therefore, the connection terminals 3a, 3
The balance between the heat capacity of b and the height of the gradient of the temperature rise due to the instantaneous application of heat energy to the laser beam Ba is prevented from being unbalanced, and the variation in quality during welding is reduced because the amount of laser energy input is small. be able to. The energy amounts of the infrared beam and the laser beam are adjusted by balancing the heat capacities of the two to be welded.

【0012】[0012]

【発明の効果】本発明は、リードフレームなどの溶接個
所を赤外線ビームによって予熱し、その後でこの予熱個
所に位置している被溶着物の所定個所にレーサービーム
をスポット的に照射して溶着させるため、溶接に必要な
レーザエネルギの投入量を著しく小さくすることが可能
で、それにより、溶接の品質が安定する。
According to the present invention, a welding portion such as a lead frame is preheated by an infrared beam, and then a predetermined portion of the object to be welded located at this preheating portion is irradiated with a spot of a racer beam for welding. Therefore, it is possible to significantly reduce the amount of laser energy input required for welding, which stabilizes the quality of welding.

【図面の簡単な説明】[Brief description of drawings]

【図1】リードフレームと接続端子との赤外線ビームと
レーザビームの照射範囲を示す斜面図である。
FIG. 1 is a perspective view showing an irradiation range of an infrared beam and a laser beam of a lead frame and a connection terminal.

【図2】リードフレームと接続端子との赤外線ビームと
レーザビームの照射状態を示す正面図である。
FIG. 2 is a front view showing an irradiation state of an infrared beam and a laser beam on a lead frame and a connection terminal.

【図3】赤外線ビームとレーザビームとの複合加工のビ
ームタイミングおよび加熱対象の温度プロファイルを示
すグラフである。
FIG. 3 is a graph showing a beam timing of combined processing of an infrared beam and a laser beam and a temperature profile of a heating target.

【符号の説明】[Explanation of symbols]

1a リードフレーム 1b リードフレーム 3a 被溶着物(接続端子) 3b 被溶着物(接続端子) A 赤外線ビームの照射による予熱範囲 Aa 赤外線ビーム B レーザビームの照射範囲 Ba レーザビーム 1a Lead frame 1b Lead frame 3a Welding object (connection terminal) 3b Welding object (connection terminal) A Preheating range by irradiation of infrared beam Aa Infrared beam B Laser beam irradiation range Ba Laser beam

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 被溶着物をリードフレームなどに溶着さ
せるに際し、このリードフレームなどの溶接個所を赤外
線ビームによって予熱し、その後でこの予熱個所に位置
している被溶着物の所定個所にレーザビームを局所的に
照射することを特徴とするレーザ溶接方法。
1. When welding a material to be welded to a lead frame or the like, a welding portion of the lead frame or the like is preheated by an infrared beam, and then a laser beam is applied to a predetermined portion of the material to be welded located at the preheating portion. A laser welding method characterized by locally irradiating a laser beam.
JP5044780A 1993-03-05 1993-03-05 Laser beam welding method Pending JPH06254690A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5044780A JPH06254690A (en) 1993-03-05 1993-03-05 Laser beam welding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5044780A JPH06254690A (en) 1993-03-05 1993-03-05 Laser beam welding method

Publications (1)

Publication Number Publication Date
JPH06254690A true JPH06254690A (en) 1994-09-13

Family

ID=12700929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5044780A Pending JPH06254690A (en) 1993-03-05 1993-03-05 Laser beam welding method

Country Status (1)

Country Link
JP (1) JPH06254690A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10103084A1 (en) * 2001-01-24 2002-08-01 Eupec Gmbh & Co Kg Semiconductor module and method for its production
JP2009248184A (en) * 2008-04-11 2009-10-29 Mitsubishi Electric Corp Welded joint, and method for producing the same
CN102259238A (en) * 2010-05-31 2011-11-30 株式会社电装 Laser welding method, pipe joint product, and injector using the product
CN104551398A (en) * 2015-01-05 2015-04-29 惠州市杰普特电子技术有限公司 Welding machine
CN104551399A (en) * 2015-01-05 2015-04-29 惠州市杰普特电子技术有限公司 Laser welding device
CN104551401A (en) * 2015-01-05 2015-04-29 惠州市杰普特电子技术有限公司 LED lamp spot welding machine
CN107335916A (en) * 2017-06-29 2017-11-10 大族激光科技产业集团股份有限公司 A kind of cylindrical battery pole ear welding method
JP2018017545A (en) * 2016-07-26 2018-02-01 山里産業株式会社 Connecting method of element wire of temperature sensor and extension lead wire, and connecting structure

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10103084A1 (en) * 2001-01-24 2002-08-01 Eupec Gmbh & Co Kg Semiconductor module and method for its production
US6853088B2 (en) 2001-01-24 2005-02-08 Eupec Gmbh Semiconductor module and method for fabricating the semiconductor module
DE10103084B4 (en) * 2001-01-24 2006-08-03 Infineon Technologies Ag Semiconductor module and method for its production
JP2009248184A (en) * 2008-04-11 2009-10-29 Mitsubishi Electric Corp Welded joint, and method for producing the same
CN102259238A (en) * 2010-05-31 2011-11-30 株式会社电装 Laser welding method, pipe joint product, and injector using the product
JP2011245546A (en) * 2010-05-31 2011-12-08 Denso Corp Laser welding method, pipe joint product, and fuel injection valve using the product
CN104551398A (en) * 2015-01-05 2015-04-29 惠州市杰普特电子技术有限公司 Welding machine
CN104551399A (en) * 2015-01-05 2015-04-29 惠州市杰普特电子技术有限公司 Laser welding device
CN104551401A (en) * 2015-01-05 2015-04-29 惠州市杰普特电子技术有限公司 LED lamp spot welding machine
JP2018017545A (en) * 2016-07-26 2018-02-01 山里産業株式会社 Connecting method of element wire of temperature sensor and extension lead wire, and connecting structure
CN107335916A (en) * 2017-06-29 2017-11-10 大族激光科技产业集团股份有限公司 A kind of cylindrical battery pole ear welding method

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