JPH06252309A - Bending device of outer lead - Google Patents

Abstract

PURPOSE:To provide the title bending device of outer lead capable of avoiding the distortion etc., of outer lead to be bent with high precision as well as the defective metallic mold operation due to residual resin, etc. CONSTITUTION:The title bending device of outer lead is provided with a fixed bending die 14 abutting against the root part of the outer lead 18 of a semiconductor device 16 supporting the same 16 as well as a knock out 20 provided elastically supporting a movable die 12 to be plunged thereinto 12 while holding the root part of the outer lead 18 furthermore a bending punch 24 pivotally supported in the direction wherein the front end side of the bending punch 24 is connecting and disconnecting to and from the sidewall of a semiconductor- chip sealing part 16a at the root part of the outer lead 18, a bending die holder 30 elastically supporting a fixed die 10 to be plunged thereinto 10 and a bending die 40 pivotally supported in the direction wherein the front end side of the bending die 40 is connecting and disconnecting to and from the sidewall of the semiconductor sealing part 16a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bending device for external leads.

[0002]

2. Description of the Related Art In a semiconductor device of resin encapsulation type, external leads are bent after resin encapsulation. Figures 3 and 4
A conventional example of a bending device used for bending an external lead is shown in FIG. According to the conventional device of FIG. 3, first, the semiconductor device 16
Is clamped by the fixed die 50 and the knockout 52 at the root of the outer lead 18, and the tip of the outer lead 18 is held in a free state. Next, the bending punch 54 presses the external lead 18 against the fixed die 50 to bend it into a predetermined shape. In this bending process, the external lead 18 is formed by the operation of the bending punch 54 and the shape of the fixed die 50. In this conventional apparatus, in order to prevent the plating applied to the surface of the external lead from being damaged, the external lead 18 and the bending punch 54 and the fixed die 50 should be prevented from slipping as much as possible, as shown in FIG.
Is rotating and moving along the arrow. Thus, by devising the trajectory of the bending punch 54 to protect the plating, it is possible to improve the quality of the semiconductor device 16, extend the life of the processing tool, and facilitate maintenance. By the way, in recent semiconductor devices 16, the number of pins is increased and the external leads 18 are miniaturized. Therefore, in order to properly mount the semiconductor device 16 on the substrate, it is necessary to bend the external lead 18 with high accuracy. However, in the above conventional device, the external lead 1 is bent when the external lead 18 is bent.
The tip of 8 is always in a free state, and twisting or the like is likely to occur due to bending due to variations in the cross-sectional shape of the external lead 18.

On the other hand, according to the conventional device of FIG.
The root of the external lead 18 of the semiconductor device 16 is fixed to the fixed die 5
Bending punch 5 sandwiched by 1 and knockout 52
The outer lead 18 is bent by moving along an arcuate trajectory while the outer die 18 and the movable die 58 sandwich the tip side of the outer lead 18. In this way, since the tips of the outer leads 18 can be clamped and forcibly bent, the outer leads 1
8 can be prevented from being twisted. In this external lead bending device, the bending punch 56 and the movable die 58 are generally slid along a guide portion in order to move on a predetermined orbit.

[0004]

However, in the sliding mechanism of the bending punch 56 and the movable die 58 described above, resin scraps or plating scraps generated from the product easily enter the sliding portion, which causes the bending punch 56 and the sliding scraps to move. If the movable die 58 cannot move along a predetermined track, the semiconductor device and the bending device may be damaged.

Therefore, it is an object of the present invention to prevent the occurrence of twisting of the external leads and to perform accurate bending, and to prevent defective operation of the mold due to resin scraps and the like. By providing a bending device.

[0006]

The present invention has the following constitution in order to achieve the above object. That is, the present invention relates to an external lead bending apparatus for bending an external lead protruding from a side wall of a semiconductor chip encapsulation portion of a semiconductor device into a substantially Z shape by moving a movable die to and from a fixed die,
A fixed bending die that is fixedly provided to the fixed die, abuts on a root portion of an external lead of the semiconductor device, and supports the semiconductor device, and the movable die facing the fixed bending die,
A knockout provided so as to be immersibly received in the movable die and sandwiching a root portion of an external lead of a semiconductor device between the fixed bending die and a side of the knockout. The tip end side of the base is rotatably supported in a direction of coming into contact with and separating from the side wall of the semiconductor chip encapsulation part, the movable die is moved in the fixed die direction, and the root of the external lead of the semiconductor device is fixed to the fixed bending die. After being pinched by the knockout and the movable die, when the movable die further approaches the fixed die, the tip of the bending punch is in contact with the external lead, and the fixed die receives the elastic punch so as to be retractable into the fixed die. In a direction in which a tip end side of the supported bending die holder and a side portion of the fixed bending die is located at a side of the bending die holder so that the tip end side of the bending die holder is in contact with or separated from the sidewall of the semiconductor chip sealing portion. Rotatable Is supported by the bending punch, and when the tip of the bending punch contacts the external lead, the tip holds the external lead with the tip of the bending punch, and the movable die is further moved toward the fixed die. When it is moved, it is provided with a bending die, the tip side of which rotates in the side wall direction of the semiconductor chip encapsulation part together with the bending punch.

[0007]

According to the external lead bending apparatus of the present invention, the root of the external lead of the semiconductor device can be held between the fixed bending die and the knockout by bringing the movable die closer to the fixed die. After the root of the external lead is clamped by the fixed bending die and the knockout, when the movable die further approaches the fixed die, the tip of the bending punch rotatably supported by the movable die contacts the external lead. Contact.
In this way, when the tip of the bending punch comes into contact with the external lead, the tip of the bending die, which is rotatably supported by the bending die holder, clamps the external lead with the tip of the bending punch. To do. When the movable die moves closer to the fixed die, the tip side of the bending punch and the bending die pivots toward the side wall of the semiconductor chip encapsulating portion with the external lead held between them. This allows the outer leads of the semiconductor device to be bent into a substantially Z shape. Since the external lead is bent while the external lead is sandwiched between the bending punch and the bending die, the external lead can be prevented from being twisted. Further, since the bending punch and the bending die only rotate, they do not slide to obtain a predetermined orbit, and it is possible to prevent defective operation of the mold due to resin scraps or the like.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. 1 is a sectional view showing an embodiment of a bending apparatus for an external lead according to the present invention, and FIG.
FIG. 6 is an explanatory view illustrating details of operations of a bending punch and a bending die of the embodiment of FIG. Reference numeral 10 denotes a fixed type, which is fixed to the base of the apparatus body. A movable die 12 is provided so as to be movable toward and away from the fixed die 10. In the present embodiment, the fixed mold 10 is fixed downward and the movable mold 12 is arranged above.
If 2 can be moved in and out, the positional relationship can be set arbitrarily.

Reference numeral 14 denotes a fixed bending die, which is fixedly provided on the fixed die 10 and has a recessed portion which is opened upward so that the semiconductor device 16 can be mounted thereon, and the semiconductor device is provided on the upper surface of the recessed portion. The semiconductor device 16 is supported by coming into contact with the roots of the external leads 18 of the semiconductor device 16 from below.

Reference numeral 20 denotes a knockout, which is supported by a movable die 12 facing the fixed bending die 14 by a spring 22 so that the movable die 12 can be retracted into the movable die 12 so as not to drop from the movable die 12. Is provided.
This knockout 20 moves up and down together with the movable die 12 within a predetermined range, and descends to the position shown in FIG.
On the lower surface of the outer peripheral portion of the concave portion which spreads downward, the lower end is contacted with the root portion of the external lead 18 of the semiconductor device 16 from above,
The outer lead 18 is sandwiched between the fixed bending die 14 and the fixed bending die 14.

A bending punch 24 has a knockout 2
It is located on the side of 0, and the axis of the movable die 12 in the direction in which the tip end side thereof comes in contact with and separates from the side wall of the semiconductor chip sealing portion 16a at the base thereof.
It is rotatably supported about 5. In the bending punch 24, after the movable die 12 is moved toward the fixed die 10 and the root portions of the external leads 18 of the semiconductor device 16 are clamped by the fixed bending die 14 and the knockout 20, the movable die 12 is further fixed. When it comes close to, the tip portion thereof comes into contact with the external lead 18. Also, this bending punch 24
Is urged by a restriction spring 26 in a direction (outward direction) in which the tip end side thereof is separated from the side wall of the semiconductor chip sealing portion 16a, and a stopper 28 projecting from the movable die 12 outwardly moves a predetermined angle or more. It is regulated so that it does not rotate.

Reference numeral 30 denotes a bending die holder, which has a mounting portion 30a for mounting the fixed bending die 14 on the upper portion, and a piston 30c on the lower portion via a rod 30b. The piston 30c is provided in the fixed mold 10. Cylinder 32
It is fitted inside. A piston lowering air passage 36 communicates with an upper portion of the cylinder 32, and a piston raising air passage 38 communicates with a lower portion of the cylinder 32. Compressed air is introduced into the cylinder 32 through these air passages, and the bending die holder 30 is always operated by the piston 30 (piston 30).
biased upwards (via c). As a result, the bending die holder 30 is in a state of being elastically supported by and supported by the fixed die 10 so that the bending die holder 30 can be immersed in the fixed die 10. The packing 31 is a ring-shaped airtight member that is mounted in a groove provided on the outer peripheral surface of the piston 30c and is provided in contact with the inner peripheral surface of the cylinder 32 to be airtight. Further, the cushion 34 is mounted in groove portions formed in a ring shape on the upper end surface and the lower end surface in the cylinder 32, and can cushion the operation of the piston 30c.

Reference numeral 40 denotes a bending die, which is a fixed bending die 14
The tip of the bending die holder 30 is rotatably supported about the shaft 41 in the direction toward and away from the side wall of the semiconductor chip encapsulation portion 16a by the bending die holder 30 so as to be positioned laterally opposite to the bending punch 24. ing. In the bending die 40, when the tip of the bending punch 24 contacts the external lead 18, the tip of the bending die 24 and the tip of the bending punch 24 contact each other.
To pinch. Then, when the movable die 12 further moves in the direction of approaching the fixed die 10, the tip end side of the bending die 40 rotates in the side wall direction of the semiconductor chip sealing portion 16a together with the bending punch 24.

Next, the operation of the above embodiment will be described with reference to FIGS. 1 and 2. First, the movable die 12 is lowered by a pressing device (not shown) and brought close to the fixed die 10, so that the root portion of the outer lead 18 of the semiconductor device 16 is interposed between the fixed bending die 14 and the knockout 20. To pinch. When the movable die 12 further descends and approaches the fixed die 10, the tip end of the bending punch 24 rotatably supported by the movable die 12 contacts the external lead 18 from above. When the tip of the bending punch 24 comes into contact with the external lead 18, the tip of the bending die 40 rotatably supported by the bending die holder 30 as shown by the solid line in FIG. The outer lead 18 is sandwiched between the tip end of 24.

Further, when the movable die 12 moves in the direction of approaching the fixed die 10, the bending punch 24 and the bending die 40 are held with the outer lead 18 sandwiched between the tips of the bending punch 24 and the bending die 40. The tip side is the semiconductor chip sealing part 1
It rotates in the direction of the side wall of 6a. At this time, the external lead 18
Is clamped through the bending punch 24 and the bending die 40 by the pressing force of the pressing device that presses the movable die 12 downward and the pressing force of the compressed air that presses the bending die holder 30 upward. If the pressing force for sandwiching the outer lead 18 is set to a predetermined value or more, the tips of the bending punch 24 and the bending die 40 will not move when the outer lead 18 is bent.
Never slip against. Therefore, when the bending punch 24 and the bending die 40 descend as shown by the chain double-dashed line in FIG. 2A, the outer lead 18 rotates around the root portion sandwiched by the fixed bending die 14 and the knockout 20. While moving, the bending punch 24 and the bending die 40 are pulled in and bent. As a result, the bending punch 2
4 and the tip of the bending die 40 are the semiconductor chip sealing portion 16
By rotating so as to approach the side wall of a, the outer lead 18 of the semiconductor device 16 can be bent into a substantially Z shape as shown in FIG. 2 (B).

According to the external lead bending apparatus of the present invention, since the external lead 18 can be bent while the external lead 18 is held by the bending punch 24 and the bending die 40, the external lead 18 can be prevented from twisting and the like. The lead 18 can be bent. In addition, the bending punch 24 and the bending die 40
Are rotatably supported and have no sliding portion. For this reason, it is possible to prevent the malfunction of the mold caused by the resin residue or the like entering the sliding portion. Furthermore, it has a structure that allows resin scraps to drop easily,
The bending punch 24, without the accumulation of resin scraps,
Maintenance work of the bending die 40 is facilitated.

By the way, the bending punch 24 and the bending die 40 are selected according to the difference in the bending shape and the bending angle of the outer lead 18.
Shape, or the bending punch 24 is movable, the bending die 4
Needless to say, the shaft attachment position for rotatably supporting the 0 bending die holder 30 may be appropriately changed.
Although the present invention has been variously described with reference to the preferred embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the invention. There is no end.

[0018]

According to the external lead bending apparatus of the present invention,
Since the outer lead is bent while the outer lead is sandwiched by the bending punch and the bending die, the outer lead can be bent while preventing the occurrence of twisting. Also, the bending punch and the bending die are rotatably supported,
Since there is no sliding part, it is possible to eliminate the defect of the mold operation caused by the resin scraps entering the sliding part.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing an operation of a main part of the embodiment of FIG.

FIG. 3 is an explanatory diagram showing a conventional technique.

FIG. 4 is an explanatory diagram showing another conventional technique.

[Explanation of symbols]

 10 Fixed Type 12 Movable Type 14 Fixed Bending Die 16 Semiconductor Device 16a Semiconductor Chip Encapsulation Part 18 External Lead 20 Knockout 24 Bending Punch 30 Bending Die Holder 40 Bending Die

Claims (1)

[Claims] 1. An external lead bending apparatus for bending an external lead protruding from a side wall of a semiconductor chip encapsulation portion of a semiconductor device into a substantially Z shape by moving a movable die to and from a stationary die. A fixed bending die, which is fixedly provided to the fixed die, abuts on a root portion of an external lead of the semiconductor device and supports the semiconductor device, and the movable die facing the fixed bending die, and the movable die. A knockout that is provided so as to be immersible in the opposite direction and that clamps the root part of the external lead of the semiconductor device between the fixed bending die and the knockout, is located on the side of the knockout, and is at the base of the movable die. The tip side is rotatably supported in the direction of contacting and separating from the side wall of the semiconductor chip encapsulation portion, the movable die is moved in the fixed die direction, and the root portion of the external lead of the semiconductor device is moved by the fixed bending die and the knockout. After being clamped, when the movable die further approaches the fixed die, the tip end is supported by the bending punch that abuts against the external lead and the fixed die so as to be retractable in the fixed die. A bending die holder and a tip end side of the bending die holder at a base of the fixed bending die, which is opposed to the bending punch and is rotatable in a direction in which a front end side is in contact with or separated from a side wall of the semiconductor chip sealing portion. Is supported by the bending punch, and when the tip of the bending punch contacts the external lead, the tip holds the external lead with the tip of the bending punch, and the movable die is further moved toward the fixed die. A bending device for an external lead, comprising: a bending die, the front end side of which moves in the side wall direction of the semiconductor chip encapsulation portion together with the bending punch when moved.