JPH06251642A - Production method for coaxial wire for plug-board and plug-board using the wire - Google Patents

Abstract

PURPOSE:To produce a coaxial wire for wiring which has sufficient adhesion between a shield layer and a resin layer when embedded in the resin layer, by forming a wire insulating layer, a copper shield layer and a coarse copper film, in order outside a core wire. CONSTITUTION:A wire insulating layer 2 of fluoride resin such of fluorinated ethylene propylene is formed outside a core wire 1. Them, a shield layer 3 of about 5-10mu, as copper plating, of non-electrolytic copper plating or combined non-electrolytic/electrolytic copper plating, is formed outside the wire insulating layer 2. And further, a coarse copper film 4 of about 1-10mu, using copper sulfate plating solution of about 60-120g/l, is formed outside the shield wire 3. Accordingly, a coaxial wire for a plug-board, which has high adhesion between the shield wire 3. Accordingly, a coaxial wire for wiring, which has high adhesion between the shield layer 3 and the resin layer outside it, is obtained in high productivity and in good economy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coaxial wire for a wiring board and a method for manufacturing a wiring board using the coaxial wire.

[0002]

2. Description of the Related Art With the development of electronic devices, wiring boards with extremely high wiring density are required. As such a wiring board having a high wiring density, there are a wiring board using a wire for a necessary wiring pattern (hereinafter referred to as a multi-wire wiring board) and a multilayer printed wiring board. As disclosed in Japanese Patent Publication No. 45-21434, a multi-wire wiring board has an adhesive resin layer (adhesive insulating layer) formed on an inner layer substrate on which circuits such as a power supply layer and a ground layer are formed. After that, wire the wire covered with polyimide resin etc. with a numerical control wire machine (bond the wire to the adhesive and ultrasonically bond it at the same time) and fix the wire with a press etc. It is manufactured by forming a through hole that crosses and forming an electroless metal layer inside the through hole.

Further, the multilayer printed wiring board is formed by a method of forming the outermost layer of the inner layer circuit board having a plurality of inner layer circuits by etching away unnecessary portions of the copper foil, and plating the necessary portions with copper. There is a method, and as a method for laminating and adhering a plurality of circuit boards, a pin lamination method in which the plurality of circuit boards are laminated by applying heat and pressure, and a copper clad insulating layer is laminated on the circuit board and laminated and integrated. There is a build-up method in which unnecessary portions of the copper foil are removed by etching, and this is repeated.

By the way, recently, while automation of OA, FA, etc. has progressed, accidents due to unwanted radiated electromagnetic interference of robots, control devices, etc. are increasing, and the obstacles are becoming a social problem. In order to reduce this undesired radiated radio wave interference, it is becoming common to use a wiring board that emits radio waves as a shield. However, in a high-density wiring board, further, between conductors on the same wiring board. The influence, that is, crosstalk noise, cannot be ignored for high-speed circuits on the same wiring board.

The same applies to a multi-wire wiring board or a multi-layer printed wiring board, and in order to meet the demand for higher density, a wire core diameter or signal line width of 0.1 mm is used, and the distance is 2.54 mm. 3 wires or 1.27mm
Two wires are provided between them, but in this case, the pitch of the wires and signal lines is 0.3 mm or less, and again, crosstalk between adjacent wires becomes a problem. As a countermeasure against this, a multi-wire wiring board using coaxial wires has been proposed.

[0006]

In a multi-wire wiring board using a coaxial wire, peeling at the resin layer or at the interface between the resin and the metal layer is allowed, as in a general multi-wire wiring board or a multilayer printed wiring board. Not a thing. Conventionally, a shielded layer of a coaxial wire is often made of plated copper or thin copper wire in the form of a mesh or a horizontal winding. However, if these shield layers do not have a roughened surface, it is difficult to obtain sufficient adhesion with the resin. Further, the adhesion between the shield layer of the coaxial wire and the adhesive insulating layer is also required from the viewpoint of manufacturing. In order to obtain a roughened surface, a method of forming a copper oxide film has been proposed so far, but the treatment is complicated and there are problems in productivity and economy.

The present invention provides a coaxial wire for a wiring board, which has a strong adhesion between a shield layer and a resin layer on the outside thereof, and is excellent in productivity and economy, and a method for manufacturing a wiring board using the coaxial wire. To do.

[0008]

DISCLOSURE OF THE INVENTION According to the present invention, a coaxial wire for a wiring board, which has a strong adhesion between a shield layer and a resin layer outside the shield layer, and is excellent in productivity and economy, and a wiring using the coaxial wire. A method of manufacturing a board is provided. The coaxial wire of the present invention will be described with reference to FIGS. In FIG. 1A, a wire insulating layer 2 is provided on the outside of a wire core wire 1, a shield layer 3 made of copper is provided on the outside thereof, and a copper coating layer 4 for providing a roughened surface on the surface of the shield layer 3 is shown. The coaxial wire is characterized by being provided. Since the surface of the shield layer 3 of the coaxial wire is the roughened copper coating 4, when it is embedded in the resin layer, sufficient adhesion between the shield layer and the resin layer can be obtained. In this coaxial wire, the shield layer 3
Does not need to have a uniform film thickness as shown in FIG. 1A, but may be surrounded by a thin line as shown in FIG. 1B. FIG. 2A shows a process for forming a roughened surface on the surface of the shield layer with a copper oxide film. Similarly, FIG. 2B shows a process for forming a roughened surface on the shield layer surface by electroplating with an overcurrent density. The time required for overcurrent density electroplating is 30 seconds to 2 minutes, and it is possible to obtain optimum conditions. The process shown in FIG. 2B is half to 10 minutes of the process shown in FIG. A roughened surface can be obtained in 1 time.

Further, it is possible to do as follows. Figure 3
As shown in (a), the circuit board 6 having the signal lines other than the signal line wired by the coaxial wire, the power supply layer, and the ground layer is produced. This circuit board may be a multilayer printed wiring board or a multi-wire wiring board, and the type of wiring board is not specified. In the outermost layer circuit processing of the circuit board 6, in addition to the patterns necessary for the circuit board 6 electronic part connection pattern, surface layer wiring pattern, etc., the signal pattern 11 for connecting the core wire 1 of the coaxial wire 5 and the shield of the coaxial wire 5 A ground pattern 10 for connecting the layers 3 is also formed. The core wire 1 of the coaxial wire 5 does not need to be a single wire, and may be a stranded wire. Further, the material of the core wire 1 is copper, copper alloy, aluminum alloy or piano wire having a diameter of about 30 to 80 μm, which is clad with copper, or the surface of these wires is gold-plated, silver-plated or tin-plated. Can be used.

As the insulating resin used for the wire insulating layer 2, a fluorine-based resin such as FEO (fluoronated ethylene propylene), ETFE (ethylene-tetrafluoroethylene), PTFE (polytetrafluoroethylene), polyimide or polyamide. An imide resin or the like can be used.

As the shield layer 3, copper plating of about 5 to 10 μm can be used. As the copper plating, electroless copper plating or electroless copper plating and electrolytic copper plating may be used in combination. At this time, when the wire insulating layer 2 is made of polyimide or polyamide-imide resin, NaOH 40 g / l aqueous solution (70
℃) or KMnO ₄ which is an oxidizing solution 60 g / l,
It is desirable to roughen the surface with a 40 g / l NaOH aqueous solution (60 ° C.) or the like to improve the adhesion with the copper plating.
Further, when the wire insulating layer 2 is made of a fluororesin, it is desirable that the tetra-etch (Junko Co., Ltd. trade name) liquid is used for surface modification and adhesion with copper plating to be improved. Further, it is possible to use a thin copper wire having a thickness of about 10 to 30 μm coated in a net shape or a horizontal winding shape.

As a method for obtaining the roughened copper coating 4, 60 g
The method using a copper sulfate plating solution of 1 / l to 120 g / l is generally used, but the method is not particularly limited as long as it is a method capable of obtaining surface irregularities of about 1 μm to 10 μm. Next in FIG.
As shown in (b), an adhesive insulating layer 8 is formed on the surface of the circuit board 6, and the coaxial wire 5 is fixed by a numerical control wiring machine. Next, as shown in FIG.
After further forming an insulating layer 9 on the surface of the substrate on which
At least a portion connecting the core wire 1 of the coaxial wire 5 and the signal pattern 11 of the circuit board 6 and the shield layer 3 of the coaxial wire 5.
The insulating layers 8 and 9 at the locations where the and the ground pattern 10 of the circuit board 6 are connected are removed. A photosensitive resin can be used for the insulating layers 8 and 9 used in the steps described with reference to FIGS. 3B and 3C. When a photosensitive resin is used, it is possible to expose and cure a photographic film having a desired pattern as a light-shielding material after coating, and remove the uncured resin by development. Examples of the method for applying the photosensitive resin include screen printing, a roll coating method, a curtain coating method, and a method of laminating a sheet-shaped material. Commercially available photosensitive resin materials include a photosensitive solder resist film SR-2300 (trade name, manufactured by Hitachi Chemical Co., Ltd.) and CONFORMASK200 series (trade name, manufactured by Dynachem Co.). Examples of the photosensitive material of the insulating resin 10 include alkali development type liquid solder resist HR-6060 (trade name of Hitachi Chemical Co., Ltd.), development type solder resist PSR-4000 series (trade name of Taiyo Ink Manufacturing Co., Ltd.) and the like. There is.

Next, as shown in FIG. 3D, the etching resist resin 14 is printed and dried so as to cover the entire surface of the coaxial wire 5 exposed in the ground connection hole 12, and the signal pattern 11 or the signal pattern 11 is formed. The portion of the shield layer 3 exposed by the chemical that dissolves the shield layer 3 of the coaxial wire 5 is etched without dissolving the material metal covering the entire surface. Further, the etching resist resin 14 applied by printing is removed before etching.

Next, as shown in FIG. 3 (e), the signal connection hole 1
The wire insulating layer 2 of the coaxial wire 5 exposed by removing the shield layer 3 by etching in 3 is irradiated with a laser beam to remove a portion necessary for connecting the core wire 1. As the type of laser used, a YAG laser, an excimer laser, or the like can be used by adjusting the output, but the wire insulating layer 2 made of an organic substance without damaging the metal core wire 1
A carbon dioxide laser with a long wavelength is suitable for efficiently selecting and removing the carbon dioxide.

Next, as shown in FIG. 3 (f), the core wire 1 in the exposed signal connection hole 13 is connected to the signal pattern 11, and the shield layer 3 of the coaxial wire 5 in the ground connection hole 12 is connected to the ground pattern 10. To do. As a connection method, a conductor material is filled by soldering, application of conductive ink 17, or the like. Regarding the connection between the signal pattern 11 and the core wire 1, spot welding may be used in addition to the method described above. In addition, as a method to connect efficiently,
There is also a method of simultaneously soldering the components mounted on the wiring board at the time of soldering, and even better results can be obtained by applying paste solder in advance to improve solderability. Also, if necessary, connect the ground connection hole 1 after connection.
2. The signal connection hole 13 may be sealed with an insulating material.

Further, the method shown in FIGS. 4 (a) to 4 (e) may be used. As shown in FIG. 4A, first, the adhesive insulating layer 3 is formed on the surface of the circuit board 6 having the ground layer 7, and a plurality of coaxial wires are arranged in a desired shape. As the substrate for forming the ground layer, a commercially available copper foil-clad laminate can be used. Also, a copper foil formed on the surface of a polyimide film with good laser processability, or a metal foil coated with a thermosetting or photo-curing resin mixed with organic filler, granular inorganic filler, short fiber inorganic filler, etc. Further, it is preferable to use a copper foil-clad laminate using a resin reinforced with an organic cloth such as aramid fiber. The adhesive insulating layer 8'is not particularly limited as long as it can bond the coaxial wire 6, and a resin composition containing natural rubber / synthetic rubber and an epoxy resin as main components can be used. As a method for obtaining the coaxial wire 6 and the roughened coating 4, there is the method described in the above-mentioned manufacturing method.

Next, as shown in FIG. 4B, an insulating layer 9'is provided to fix the coaxial wire 5. This insulating layer 9
May be formed by press lamination of glass / epoxy prepreg or glass / polyimide prepreg. Alternatively, it may be formed by coating with epoxy or polyimide varnish.

Next, as shown in FIG. 4 (c), the portion of the substrate where the through holes 15 and 16 are formed is irradiated with laser light to remove organic substances, and the shield layer 3 of the coaxial wire 5 is removed. Exposed. At this time, it is preferable to irradiate the laser beam from the front and back of the substrate in order to completely expose the shield layer 3 of the coaxial wire 5 in the portion where the conduction hole 16 is formed. As the laser beam, a carbon dioxide gas laser is preferable because the organic insulating layer 9 and the adhesive insulating layer 8 can be easily removed, and the metal layer of the shield layer 3 of the coaxial wire 5 is difficult to remove. In addition, a YAG laser, an excimer laser, or the like may be used alone or in combination with a carbon dioxide gas laser.

Next, as shown in FIG. 4D, a metal plating layer is formed by either electroless metal plating or a combination of electroless metal plating and electric metal plating. And
At the same time as forming the through hole 15 by the tenting method, the coaxial wire metal plating layer in the portion where the through hole 16 is formed is removed by etching.

As shown in FIG. 4 (e), one or more of the above-mentioned substrates and the inner layer plate 17 are superposed on each other via a prepreg, and integrated under pressure and heating. Then, after performing drilling and metal plating, the conductive hole 16 and the surface pattern are formed by a tenting method. The method of forming the conductive hole 15, the conductive hole 16 and the surface pattern is not limited to the tenting method, and any method currently used for wiring boards can be used. For example, the additive method may be used.

[0021]

In the coaxial wire for a wiring board according to the present invention, since the shield layer has the roughened surface, the adhesion between the shield layer and the resin outside the shield layer is high and high reliability can be obtained. Further, the productivity and the economical efficiency are superior to the case where the roughened surface is obtained by the copper oxide film. Further, according to the method for manufacturing a wiring board according to the present invention, since the adhesion between the coaxial wire and the adhesive insulating layer is high, correction errors and defects can be reduced with less mistakes during fixing.

[0022]

[Composition of plating solution]

_{· H 2 SO 4: 100g /} l · CuSO 4 · 5H 2 O: 90g / l · NaCl: 100mg / l · Additives: The resin 300g of small amounts [Compositions of I] following composition, palladium chloride 1g Is mixed with 50 g of N-methyl-2-pyrrolidone. -Ethylene glycol monoethyl cartel acetate: 600 g / l-Epoxy resin: 109 g / l-Acrylonitrile butadiene rubber copolymer rubber: 20 g / l-Phenolic resin: 60 g / l-Acrylonitrile butadiene: 144 g / l-Silicon dioxide: 50 g / l [Composition of composition II] -phenoxy resin phenothote, YP-50 (trade name manufactured by Toto Kasei Co., Ltd.): 100 parts by weight-methylated melamine, melan 523 (trade name manufactured by Hitachi Chemical Co., Ltd.): 15 parts by weight-Short glass fiber, AGP-01BZ (trade name of Asahi Shabel Co., Ltd.): 35 parts by weight-Metabrom benzoic acid: 0.3 parts by weight-Electroless plating catalyst Cat # 11 (product of Hitachi Chemical Co., Ltd.) Name): 2.5 parts by weight ・ Cellosolve acetate: 220 parts by weight

Example 1 First, a method of manufacturing a coaxial wire will be described. PTFE resin Teflon-TFE (trade name, manufactured by Mitsui Fluorochemical Co., Ltd.) as a wire insulating layer around a copper soft wire having a core diameter of 50 μm
Was coated to a thickness of 50 μm and treated in the order of Tetra Etch (trade name of Junkosha Co., Ltd.), isopropyl alcohol, and hot water to improve the wettability of the resin surface. Subsequently, Cleaner Conditioner CLC-201 (trade name of Hitachi Chemical Co., Ltd.), water washing, Predimp PD-201 (trade name of Hitachi Chemical Co., Ltd.) sensitizer HS-201B (product of Hitachi Chemical Co., Ltd.) Name), washing with water, adhesion promoter AD
P-201 (trade name of Hitachi Chemical Co., Ltd.) was treated in the order of water washing, and a plating catalyst was applied to the surface. Subsequently, this wire was dipped in an electroless copper plating solution CUST-201 (trade name, manufactured by Hitachi Chemical Co., Ltd.) to obtain continuity on the surface, and then dipped in the plating solution, and a current of 1 to 5 A / dm ² was applied. And a shield layer of about 20 μm was obtained. Further, roughening plating was performed by passing an excess current of 10 to ²⁰ A / dm ² through this wire. As a result, a coaxial wire having an uneven shape of 5 to 15 μm on the surface could be obtained. Next, a method for manufacturing a wiring board using the coaxial wire will be described. A multi-wiring wiring board with surface circuit having a ground pattern and a signal pattern (trade name of Hitachi Chemical Co., Ltd.) is used as a circuit board, and a 90 μm thick photosensitive solder resist film SR-2300G (Hitachi Chemical Co., Ltd.) The company product name) was laminated using a vacuum laminating device (Hitachi AIC Co., Ltd.). The coaxial wire was laid on the surface of the solder resist in a desired pattern by a numerical control wiring machine according to a wiring rule of a wiring density of 2 wires / 2.54 mm and a wire pitch of 0.4 mm. At this time, the coaxial wire started at a point 1 mm before the signal pattern, passed on the signal pattern, a plurality of ground patterns, and the signal pattern in this order, and ended 1 mm after the last signal pattern. 1m wide on this substrate
m having a pattern along the wiring shape of the coaxial wire 1
Using a 50 mesh Tetron screen printing plate, a liquid solder resist HR-6060 (trade name, manufactured by Hitachi Chemical Co., Ltd.) was applied by printing to cover the entire surface of the coaxial wire. This substrate is heated in an oven at 80 ° C for 30 minutes,
Photosensitive solder resist film SR-2300G and liquid solder using a photographic film that dries the liquid solder resist on the fingers and shields exposed parts of the surface circuits such as ground connection holes, signal connection holes, and electronic component mounting holes. Simultaneously expose resist HR-6060 adhesive layer, then 3
Developed with a% sodium carbonate solution, washed with water,
Ground connection holes, signal connection holes, component mounting holes, etc. are provided. Next, the ground connection holes are printed and filled with a conductive carbon paste CBR-30 (trade name, manufactured by Taiyo Ink Mfg. Co., Ltd.) that also serves as an etching resist, and heated at 80 ° C. for 30 minutes and at 160 ° C. for 20 minutes. Completely hardened, and after connecting the shield layer of the coaxial line and the ground pattern, etch the shield layer of the coaxial line exposed in the core wire connection hole with an ammonia alkaline etching solution, A process (product name of Meltex Co., Ltd.) Removed.
Furthermore, a numerical control laser beam irradiation device was used in the central part of the part where this shield layer was removed, and the spot diameter was 0.5 m.
Carbon dioxide laser light focused on m was irradiated for 100 msec under the conditions of an output of 50 W and a pulse duty of 10% to remove the PTFE resin as the insulating layer of the coaxial wire. next,
Solder paste SS- on the core after removing the wire insulation layer
3210 (trade name, manufactured by Tamura Corporation) was printed, melted by an infrared fusing device, and the signal pattern and the core wire were connected. After fusing, it was completed by cleaning with a trichloroethane spray cleaning device to remove unnecessary flux and clean the entire substrate.

Example 2 A method for manufacturing a wiring board using the coaxial wire shown in Example 1 will be described. Double-sided roughened copper foil-clad glass / polyimide laminate MC
A desired etching resist is formed on the surface of L-I-67 (trade name of Hitachi Chemical Co., Ltd.), and the metal layer 6 for connection is formed.
Unnecessary copper foil was removed by etching at a portion that would become a circuit board having a ground layer. The composition I was formed into a dry film having a thickness of 100 μm, laminated at 150 ° C. for 10 minutes on a surface of a circuit board under a pressing condition of 10 kg / cm ² , and the coaxial wire whose manufacturing method was shown in Example 1 was numerically controlled. Depending on the wiring machine, the wiring density is 2 / 2.54
mm and the wire pitch was 0.4 mm, and wiring was performed in a desired pattern. On the surface of this substrate, the composition II
Is a dry film with a thickness of 180 μm
After laminating under press condition of 10 kg / cm ² for 10 minutes at 0 ° C., 30 kg for 30 minutes at 170 ° C.
The layers were integrated by heating and pressing under the condition of / cm ² . The spot diameter is set to 2 at the place where the connecting metal layer of this substrate is formed.
A carbon dioxide laser focused at 00 μm was irradiated under the condition of an output of 45 W, the resin was removed so that the hole diameter was 4 mm, and the shield layer of the coaxial wire was exposed so that it could be seen from both sides of the substrate. This substrate, an inner layer plate made by the etched foil method, and a glass / polyimide prepreg GI
A-67N (trade name, manufactured by Hitachi Chemical Co., Ltd.) and copper foil were overlaid, and after heating and pressurizing at 180 ° C. for 90 minutes under the condition of 30 kg / cm ² to laminate and integrate them, a desired portion of the substrate,
And a place where the shield layer has been removed and which does not come into contact with the shield layer, is punched with a drill having a diameter of 0.8 mm, washed, catalyst is added, and adhesion is promoted, and then the electroless plating solution Hid- Immerse in 410 (trade name of Hitachi Chemical Co., Ltd.) for 10 hours, and apply about 35
A copper plating layer having a thickness of μm was formed, an etching resist was formed on a necessary portion such as a pad or a component mounting terminal, and unnecessary copper was removed by etching to obtain a wiring board. When the coaxial wire shown here was used, few mistakes occurred during wiring. In addition, the wiring board manufactured in this way is
The variation of the characteristic impedance was remarkably small at ± 2%, and no crosstalk noise was observed. Further, the signal speed was 5.0 ns / m, which was about 20% higher than that of a conventional wiring board such as a multilayer board.

[Electrical characteristic measurement conditions] -Characteristic impedance and signal speed measuring instrument: HP54121T (manufactured by Hewlett-Packard Co.)-Crosstalk noise measuring instrument: pulse generator HP8131A (manufactured by Hewlett-Packard Co.): oscilloscope HP54121T (Hewlett-Packard Co.) Made) Wire spacing: 0.4 mm Parallel wire length: 30 cm Induction pulse voltage: 1 V Induction pulse rise time: 1 ns

[0026]

As described above, the present invention provides a method for efficiently manufacturing a wiring board having excellent electrical characteristics such as characteristic impedance, crosstalk noise, and signal speed, and a coaxial wire therefor. be able to.

[Brief description of drawings]

1A and 1B are cross-sectional views of a coaxial wire showing an embodiment of the present invention.

2A and 2B are float charts showing a roughening plating process of a coaxial wire used in an example of the present invention.

3 (a) to 3 (f) are cross-sectional views of relevant parts for explaining each step of one embodiment of the present invention.

4A to 4E are cross-sectional views of a main part for explaining each step of another embodiment of the present invention.

[Explanation of symbols]

1. Wire core wire 2. Wire insulation layer 3. Shield layer 4. Roughened copper film 5. Coaxial wire 6. Circuit board 7. Ground layer 8. Adhesive insulating layer 9. Insulating layer 10. Ground pattern 11. Signal pattern 12. Ground connection hole 13. Signal connection hole 14. Etching resist resin 15. Conduction hole 16. Conduction hole 17. Inner layer plate 18. Laser hole 19. Solder

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Eisaku Ikui 1500 Ogawa, Shimodate City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Shimodate Factory

Claims (4)

[Claims] 1. An electric plating having an overcurrent density, which has a wire insulating layer 2 on the outside of a wire core wire 1 and a shield layer 3 made of copper as the outermost layer, and further provides a roughened surface on the surface of the shield layer 3. A coaxial wire for a wiring board, comprising the copper coating layer 4 provided in 1. 2. A method of manufacturing a wiring board, comprising the following steps. A. The plurality of adhesive insulating layers 8 provided on the surface of the circuit board 6 having at least one or more ground patterns 10 on one side or both sides thereof and a signal pattern 11 not connected to the ground patterns 10 are plural. Step of fixing the coaxial wire 5 in a desired shape. B. The step of providing the insulating layer 9 on the surface on which the coaxial wire 5 is provided. C. A step of removing at least the insulating layers 8 and 9 where the core wire 1 of the coaxial wire 5 and the shield layer 3 are connected. D. A step of connecting the shield layer 3 of the coaxial wire 5 to the ground pattern 10 of the circuit board 6. E. The core wire 1 of the coaxial wire 5 is connected to the signal pattern 1 of the circuit board 6.
A step of removing the shield layer 3 of the coaxial wire 5 at a portion connecting with 1. F. A step of removing the wire insulating layer 2 at the location of the shield layer 3 of the removed coaxial wire 5 until the core wire 1 is exposed. G. A step of connecting the exposed core wire 1 and the signal pattern 11 of the circuit board 6. 3. The method for manufacturing a wiring board according to claim 2, wherein step D is performed before and after step F or after step G. 4. A method of manufacturing a wiring board, comprising the following steps. A. A step of fixing a plurality of coaxial wires 5 according to claim 1 in a desired shape on an adhesive insulating layer 8 provided on a surface of a circuit board 6 having a ground layer 7. B. The step of providing the insulating layer 9 on the surface on which the coaxial wire 5 is provided. C. A step of irradiating the insulating layers 8 and 9 where the conductive holes 15 and 16 are formed with a laser to remove them. D. A step of forming the conduction hole 15 by metal plating. E. A step of removing the shield layer 3 of the coaxial wire 5 in the portion where the conduction hole 16 is formed. F. The substrate obtained in the above process and the inner layer plate 17 are connected to the insulating layer 9 '.
The process of integrating with. G. A step of forming the conduction hole 16 by metal plating after drilling.